Intelligent heat dissipation device and method for static frequency converter, and static frequency converter system

Abstract

The application provides an intelligent heat dissipation device and method for a static frequency converter, and a static frequency converter system, and relates to the technical field of heat dissipation equipment. The intelligent heat dissipation device comprises a composite heat dissipation unit, a water-cooled heat dissipation mechanism for water-cooled heat dissipation of a thyristor, a variable-speed air-cooled mechanism for air-cooled heat dissipation of a copper bar and a connecting cable, a temperature and humidity acquisition unit for acquiring the temperature of a power module and the environmental humidity inside a cabinet body of the static frequency converter, the temperature and humidity acquisition unit comprising a temperature acquisition element and a humidity acquisition element, and a temperature and humidity control unit for receiving a temperature signal and a humidity signal to output a control signal to the water-cooled heat dissipation mechanism and the variable-speed air-cooled mechanism, matching the heat dissipation demand, and completing temperature and humidity linkage heat dissipation control mainly based on the device temperature and supplemented by the air duct humidity. The application realizes fan step speed regulation and dehumidification linkage through differential heat dissipation and cooperation with an embedded high-precision temperature measurement structure, and improves the heat dissipation effect and the equipment operation safety.

Description

Technical Field

[0001] This application relates to the field of heat dissipation equipment technology, and more specifically, to an intelligent heat dissipation device and method for static frequency inverters, and a static frequency inverter system. Background Technology

[0002] The core heat-generating component of the power module in a high-power static inverter is the thyristor. The power module is also equipped with conductive copper busbars and connecting cables. Existing traditional heat dissipation solutions have many shortcomings in practical use, making it difficult to balance heat dissipation efficiency, temperature measurement accuracy, and equipment operational safety. The specific technical problems are as follows: First, the heat dissipation mode is singular, failing to achieve differentiated heat dissipation matching. Existing equipment mostly adopts a uniform air-cooling or uniform water-cooling method for the entire machine, without differentiating heat dissipation paths for the heat characteristics of thyristors, copper busbars, and connecting cables. Thyristors have high operating losses and high temperature rise, and air cooling alone is insufficient to meet their heat dissipation needs, easily leading to device overheating. Copper busbars and connecting cables generate less heat, but are exposed inside the cabinet, and are prone to condensation and short circuits in high humidity environments. Water cooling alone cannot achieve the necessary ventilation and dehumidification for the cabinet. The heat dissipation needs of these two types of heat-generating components cannot be met simultaneously, resulting in either wasted water cooling energy or potential insulation safety hazards.

[0003] Secondly, in existing engineering solutions, temperature sensing elements are only temporarily attached to the outer surface of the heat sink for short-term temperature measurement during the product's performance testing phase. This cannot serve as a stable data acquisition method for long-term online temperature control of the equipment. Furthermore, this adhesive-based temperature sensing solution suffers from multiple layers of thermal resistance: the heat sink's metal substrate and air gap separate the temperature probe from the thyristor's heat-conducting surface, resulting in a stable temperature difference of 5-10°C between the measured temperature and the thyristor's actual case temperature. Additionally, equipment vibration can easily cause the attached probe to loosen or detach, further amplifying the temperature measurement distortion. The controller's reliance on this distorted temperature signal for heat dissipation adjustment leads to two types of problems: under light load conditions, the measured temperature is too low, causing the fan to run at high speed for extended periods, significantly increasing overall energy consumption and operating noise; under heavy load and short-term overload conditions, the acquired temperature is lower than the device's actual temperature, preventing timely increases in water cooling flow and fan airflow, leading to continuous heat accumulation in the thyristor and a high risk of thermal breakdown and permanent device damage.

[0004] Third, there is a lack of a coordinated temperature and humidity control mechanism. Traditional heat dissipation controllers adjust fan speed based solely on the temperature of a single component, without considering the humidity level inside the cabinet. When the humidity inside the cabinet is too high, the controller cannot actively increase ventilation to accelerate moisture removal, causing condensation to continuously form on the copper busbars and connecting cables, leading to creepage and phase-to-phase short circuit faults, resulting in poor equipment reliability.

[0005] Fourth, the control unit has a limited function, only providing basic fan speed regulation and lacking supporting fault monitoring and maintenance alerts. Abnormal conditions such as water cooling circuit leaks, fan malfunctions, and filter blockages cannot be identified and alerted by the control unit, and the continued escalation of faults can easily lead to a complete unit shutdown. Furthermore, when water cooling pipes leak, there is no dedicated shut-off structure to quickly isolate the water circuit; cooling water leaking into the electrical circuit will directly cause a short circuit and burnout. Summary of the Invention

[0006] To address the problems of inconsistent heat dissipation in existing inverter power modules, inaccurate temperature measurement, lack of temperature and humidity linkage control, easy accumulation of dirt in water-cooled pipes, and lack of fault warning, this application provides an intelligent heat dissipation device and method for static inverters, as well as a static inverter system. Through differentiated heat dissipation in water-cooled and air-cooled zones, combined with an embedded high-precision temperature measurement structure, the temperature and humidity control unit realizes graded speed regulation and dehumidification linkage of water cooling and fans. At the same time, it is equipped with water-cooled pipes without dead water, a quick water circuit cut-off structure, and has leakage and fan abnormality monitoring and reminder functions, thereby improving heat dissipation effect and equipment operation safety.

[0007] According to a first aspect of this application, at least one embodiment of this application provides an intelligent heat dissipation device for a static frequency inverter, the static frequency inverter including a power module, a copper busbar, and connecting cables, the power module including thyristors, the intelligent heat dissipation device including: a composite heat dissipation unit, employing a layered heat dissipation architecture with dual physical isolation of water and air channels, providing differentiated heat dissipation for the power module, the copper busbar, and the connecting cables, the composite heat dissipation unit including: a water-cooled heat dissipation mechanism, the water-cooled heat dissipation mechanism including a water-cooled radiator, the water-cooled radiator and the... The thyristor's heat-conducting surface is fitted together, and the mating surface is filled with thermally conductive silicone grease for dedicated water cooling of the thyristor. The water-cooled heat sink has a recessed closed groove on the plane of the thyristor. A variable-speed air-cooling mechanism includes a closed air duct. The inner cavity of the closed air duct only accommodates the copper busbar and the connecting cable, and air cooling of the copper busbar and connecting cable is achieved by circulating airflow within the air duct. A temperature and humidity acquisition unit is used to collect the temperature of the power module and the ambient humidity inside the cabinet of the static inverter in real time. The temperature and humidity acquisition unit includes: a temperature acquisition element embedded in the concave sealed groove, the opening of which is in close contact with the heat-conducting surface of the thyristor for acquiring the temperature of the thyristor; a humidity acquisition element positioned at the bottom of the variable speed air-cooling mechanism, facing the area where airflow converges inside the duct, for acquiring the ambient humidity in areas with high condensation rates inside the cabinet of the static inverter; and a temperature and humidity control unit for receiving the temperature signal transmitted by the temperature acquisition element and comparing the temperature signal with a preset temperature threshold. The system outputs a corresponding flow rate control signal to the water-cooling heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and outputs a corresponding speed control signal to the variable speed air-cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and the connecting cable. It is also used to receive the humidity signal transmitted by the humidity acquisition element, compare the humidity signal with a preset humidity threshold, and correct the fan speed of the variable speed air-cooling mechanism. When the humidity exceeds the standard, it actively increases the fan air volume to quickly expel water vapor from the air duct, thus completing the temperature and humidity linkage heat dissipation control based on device temperature and air duct humidity.

[0008] For example, in some embodiments of this application, the water-cooled heat dissipation mechanism further includes: a circulation pipeline connected to the inlet and outlet of the water-cooled radiator, wherein the circulation pipeline is fixed to the cabinet of the static inverter by segmented pipe clamps, and the installation position of the pipe clamps gradually decreases from the inlet to the outlet.

[0009] For example, in some embodiments of this application, the circulation pipeline has a dead water-free layout, including: the circulation pipeline is inclined as a whole, wherein the circulation pipeline is inclined at a continuous downward slope of 3°-8° along the medium flow direction, so that after the water cooling heat dissipation mechanism stops, the water accumulated in the circulation pipeline can flow back by gravity.

[0010] For example, in some embodiments of this application, the water cooling mechanism further includes: a two-way check valve, which is respectively installed at the inlet and outlet of the water cooling radiator, for use in the event of maintenance of a single power module and / or the water cooling radiator, and / or water leakage fault of the water cooling radiator, to close only the two-way check valve of the corresponding water cooling branch, to isolate the water circuit of the corresponding water cooling branch, while the water cooling branches of the other power modules maintain water circulation.

[0011] For example, in some embodiments of this application, the water-cooled heat dissipation mechanism further includes: a detachable water collection tray, disposed below the water-cooled radiator, the outline of the detachable water collection tray completely covering the projected area of ​​the water-cooled radiator and the circulation pipe joint, for collecting leaked liquid from the water-cooled radiator and the circulation pipe; and a leakage sensor, disposed at the lowest water accumulation point of the detachable water collection tray, for real-time acquisition of the water level inside the detachable water collection tray, and when the water level reaches the trigger level, the leakage sensor transmits a water-cooled leakage fault electrical signal to the temperature and humidity control unit, which then outputs a fault reminder signal.

[0012] For example, in some embodiments of this application, a component mounting bracket is provided at the bottom of the closed air duct of the variable speed air-cooling mechanism, and an elastic snap-fit ​​groove is provided on the component mounting bracket, and the humidity collection element is fixed to the elastic snap-fit ​​groove by snap-fit.

[0013] For example, in some embodiments of this application, the variable speed air-cooling mechanism includes: a detachable filter screen installed at the air inlet of the closed air duct; and a pressure acquisition component for real-time acquisition of the static pressure value inside the air duct behind the detachable filter screen to determine the filter screen blockage status.

[0014] For example, in some embodiments of this application, the temperature acquisition element includes: a temperature-sensing optical fiber, an NTC thermistor, and / or a PT100 platinum resistance probe.

[0015] For example, in some embodiments of this application, the temperature and humidity control unit is also used to: monitor the water leakage fault signal of the water cooling heat dissipation mechanism, and output a fault reminder signal in the event of a water leakage fault in the water cooling heat dissipation mechanism, so as to cut off the water circuit of the corresponding water cooling branch of the water cooling heat dissipation mechanism; monitor the fan operation status of the variable speed air cooling mechanism and the blockage status of the removable filter, and output a maintenance reminder signal in the event of a fan fault and / or blockage of the removable filter.

[0016] According to a second aspect of this application, at least one embodiment of this application provides an intelligent heat dissipation method for a static frequency inverter. The intelligent heat dissipation method is executed by an intelligent heat dissipation device as described in any one of the first aspects. The intelligent heat dissipation method includes: acquiring a real-time temperature signal of the thyristor of the power module through a temperature acquisition element embedded in the concave closed groove of the water-cooled heat sink; acquiring an ambient humidity signal of the high condensation area inside the static frequency inverter cabinet through a humidity acquisition element disposed in the closed air duct; comparing the temperature signal with a preset temperature threshold, outputting a corresponding flow rate control signal to the water-cooled heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and outputting a corresponding speed control signal to the variable speed air-cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and the connecting cable; comparing the ambient humidity signal with a preset humidity threshold, and correcting the fan speed of the variable speed air-cooling mechanism according to the comparison result, forming a temperature and humidity linkage heat dissipation control mode with device temperature as the main factor and air duct humidity as the secondary factor.

[0017] For example, in some embodiments of this application, the step of comparing the temperature signal with a preset temperature threshold and outputting a corresponding flow rate control signal to the water-cooling heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and outputting a corresponding speed control signal to the variable-speed air-cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and the connecting cable, includes: when the temperature signal is less than or equal to a first preset temperature threshold, outputting a low flow rate control signal to the water-cooling heat dissipation mechanism and a low-speed speed control signal to the variable-speed air-cooling mechanism; when the temperature signal is greater than the first preset temperature threshold and less than or equal to a second preset temperature threshold, outputting a rated flow rate control signal to the water-cooling heat dissipation mechanism and a medium-speed speed control signal to the variable-speed air-cooling mechanism; when the temperature signal is greater than the second preset temperature threshold, outputting a high flow rate control signal to the water-cooling heat dissipation mechanism and a high-speed speed control signal to the variable-speed air-cooling mechanism.

[0018] For example, in some embodiments of this application, comparing the ambient humidity signal with a preset humidity threshold and adjusting the fan speed of the variable speed air-cooling mechanism according to the comparison result to form a temperature and humidity linkage heat dissipation control method with device temperature as the main factor and air duct humidity as the secondary factor includes: maintaining the variable speed air-cooling mechanism in stable operation at the current gear when the ambient humidity signal is less than or equal to the preset humidity threshold; and increasing the operating speed of the variable speed air-cooling mechanism when the ambient humidity signal is greater than the preset humidity threshold to quickly expel water vapor from inside the static inverter cabinet.

[0019] For example, in some embodiments of this application, it further includes: performing online monitoring of water cooling leakage, online monitoring of fan operation status, and online monitoring of filter blockage status, and outputting corresponding fault reminders and / or equipment maintenance prompts based on various sensor signals.

[0020] For example, in some embodiments of this application, the online monitoring of water-cooled leakage includes: real-time acquisition of water-cooled branch leakage signals of the water-cooled heat dissipation mechanism; and outputting a fault reminder signal when a water-cooled heat dissipation mechanism leaks, prompting the disconnection of the water circuit of the corresponding water-cooled branch of the water-cooled heat dissipation mechanism. The online monitoring of fan operation status and filter blockage status includes: real-time reading of static pressure values ​​inside the air duct, fan speed, and fan current acquisition signals; and outputting a device maintenance reminder signal when the fan operation of the variable speed air-cooling mechanism is abnormal or the collected static pressure values ​​inside the air duct exceed a preset blockage threshold.

[0021] According to a third aspect of this application, at least one embodiment of this application provides a static inverter system, comprising: a static inverter, the static inverter including at least one set of power modules, copper busbars and connecting cables, the power modules including thyristors; and an intelligent heat dissipation device as described in any one of the first aspects, used for differentiated heat dissipation, temperature and humidity linked heat dissipation control and online monitoring of water cooling and air cooling faults for the thyristors, copper busbars and connecting cables in each set of power modules.

[0022] Through the above embodiments, the intelligent heat dissipation device and method for static frequency inverters and the static frequency inverter system provided in this application have at least one of the following beneficial effects: Independent isolation heat dissipation architecture of the module: The static inverter is equipped with two sets of physically isolated heat dissipation branches: water cooling and air duct. The water cooling separately cools the thyristors, and the air cooling is dedicated to dehumidifying and dissipating heat for the copper bus cables. The hot and cold airflows do not interfere with each other, resulting in high heat dissipation matching and lower energy consumption. Embedded groove high-precision temperature measurement: The water-cooled radiator has an embedded groove to fix the temperature sensing element, which is in close contact with the thyristor to eliminate air thermal resistance. It is also equipped with multiple limiters to prevent vibration and fall off. It supports the combination of multiple temperature sensing elements for more accurate temperature control. Graded variable frequency water cooling flow rate control: Set three levels of cooling water circulation flow rate: low, medium and high. The water cooling flow rate is dynamically matched according to the real-time temperature of the thyristor. The low flow rate under light load reduces water pump energy consumption, and the high flow rate under heavy load enhances heat exchange and cooling of the thyristor. Anti-stagnant water cooling and single-branch isolation valves: The pipelines are uniformly inclined at 3°-8°, and the accumulated water automatically flows back when the machine is stopped to avoid scale blockage; the branch is equipped with an external handle two-way check valve, and when a single-branch fault is repaired, only the corresponding water circuit is isolated, while the water cooling of the other modules continues to operate. Leakage monitoring and zoned alarm: The full-coverage water collection tray under the radiator is equipped with a liquid level sensor, and each water-cooling branch has an independent audible and visual alarm, which can intuitively locate the leakage point and prevent the cooling water from short-circuiting the components. Shock-absorbing buckle for fixed-point humidity acquisition: The humidity element is fixed by buckle at the bottom of the air duct, which buffers the vibration of the fan and prevents the probe from shifting; it directly collects the local humidity of the condensation area in the air duct, making dehumidification control more targeted. Air-cooled online monitoring and non-stop maintenance: Real-time monitoring of static pressure inside the air duct, fan speed and current; the air duct is equipped with tool-free disassembly and maintenance ports, so the main power circuit does not need to be disconnected when replacing the filter or fan, reducing downtime losses; Temperature and humidity weighted linkage and coordinated control: Based on the thyristor temperature, the water cooling flow rate and fan speed are adjusted in three levels simultaneously. When the humidity is too high, the air volume is automatically added to compensate for the air volume, taking into account the heat dissipation of the device and the anti-condensation of conductive components. Integrated control logic: All functions such as temperature measurement, water cooling flow rate regulation, fan speed regulation, dehumidification, and fault monitoring are executed by the same temperature and humidity control unit. The hardware integration is high, the control logic is unified, and it is convenient for mass production and later debugging and maintenance.

[0023] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0024] The above and other objects, features, and advantages of this application will become more apparent from the detailed description of exemplary embodiments with reference to the accompanying drawings. The drawings described below are merely some embodiments of this application and are not intended to limit the scope of this application.

[0025] Figure 1 This is a schematic diagram of the structure of an intelligent heat dissipation device for a static frequency converter according to an embodiment of this application; Figure 2 This is a flowchart of an intelligent heat dissipation method for a static frequency inverter according to an embodiment of this application. Figure 3 This is a schematic diagram of a static inverter system according to an embodiment of this application; Figure 4 This is a schematic diagram of a temperature acquisition element according to an embodiment of this application. Detailed Implementation

[0026] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0027] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0028] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0029] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0030] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of exemplary embodiments, and the modules or processes in the drawings are not necessarily essential for implementing this application, and therefore cannot be used to limit the scope of protection of this application.

[0031] Figure 1 This is a schematic diagram of the structure of an intelligent heat dissipation device for a static frequency inverter according to an embodiment of this application.

[0032] like Figure 1 As shown, the intelligent heat dissipation device for the static frequency converter includes: a composite heat dissipation unit 1, a temperature and humidity acquisition unit 2, and a temperature and humidity control unit 3.

[0033] A static inverter consists of multiple power modules, copper busbars (prone to condensation), and connecting cables. Each power module includes a thyristor. The thyristor is the core heat-generating component of the module, while the copper busbars and connecting cables are conductive current-carrying components.

[0034] Among them, the composite heat dissipation unit 1 adopts a layered heat dissipation architecture with dual physical isolation of water and air channels, and implements differentiated heat dissipation for power modules, copper busbars and connecting cables. The composite heat dissipation unit 1 includes: water cooling heat dissipation mechanism 11 and variable speed air cooling mechanism 12.

[0035] The water-cooling heat dissipation mechanism 11 is arranged in close contact with the thyristor and is used to continuously cool and heat the high-heat-loss thyristor with water. The variable-speed air-cooling mechanism 12 is arranged towards the copper busbar and connecting cable and is used to cool and dissipate heat from the conductive components with air, while driving the air circulation in the cabinet to expel water vapor.

[0036] Furthermore, the water-cooled heat dissipation mechanism 11 includes: a water-cooled radiator 111, a circulation pipeline 112, and a two-way check valve 113.

[0037] The water-cooled heat sink 111 is fitted to the heat-conducting surface of the thyristor, and the mating surfaces are uniformly filled with thermally conductive silicone grease. There are no heat-insulating pads to block heat conduction, which is specifically designed for point-to-point water cooling of the thyristor. The metal mating surface of the water-cooled heat sink 111 facing the thyristor has a recessed closed groove machined to accommodate the temperature acquisition element.

[0038] According to some embodiments, a recessed, enclosed groove is machined on the base surface of the water-cooled radiator 111 that is attached to the thyristor. The recessed, enclosed groove has a depth of 2mm-5mm, and its wall intersects perpendicularly with the heat-conducting surface of the thyristor. This groove is used to embed a temperature acquisition element. The inside of the groove is filled with thermally conductive gel to encapsulate the temperature acquisition element. A thin metal pressure plate is fitted on the opening side of the groove to press and fix the temperature acquisition element, ensuring that the outer wall of the temperature acquisition element is completely attached to the heat-conducting surface of the thyristor without any air gaps. At the same time, limit blocks are set at both ends of the groove to restrict the lateral displacement of the temperature acquisition element, avoiding problems such as loosening, misalignment, and poor contact.

[0039] The water-cooled radiator 111 has a plate structure with a serpentine water channel inside. Inlet and outlet connectors are set on both sides. The radiator includes a multi-layer substrate structure. The bottom layer is a metal thermally conductive layer for bonding thyristor power devices. The inside is set with a concave closed groove for placing temperature acquisition elements. Insulation isolation structure is set between the layers. A pressure plate is set on the top. Cooling water flows into the serpentine water channel from the inlet and flows out from the outlet to realize the continuous conduction and replacement of heat from the power devices.

[0040] The circulation pipe 112 connects to the inlet and outlet of the water-cooled radiator 111. The circulation pipe 112 is fixed to the inverter cabinet by segmented pipe clamps, with the clamp positions gradually decreasing from the inlet to the outlet. The circulation pipe 112 adopts an overall inclined, dead-water-free layout, with a uniform downward slope of 3°-8° along the medium flow direction. This ensures that after the water-cooled radiator stops, all accumulated water in the circulation pipe can flow back to the cooling water storage tank by gravity, eliminating dead zones and preventing scale buildup and blockage.

[0041] The two-way check valve 113 is respectively installed at the inlet and outlet of the water-cooled radiator 111. In the event of a water leakage fault in the water-cooled radiator 111, and / or during maintenance of the water-cooled radiator 111 and / or a single power module, the water circuit of the corresponding water-cooled branch can be isolated by closing the two-way check valve of the corresponding branch, while the water-cooled branches of the other power modules continue to maintain water circulation.

[0042] According to some embodiments, the two ends of the bidirectional check valve are respectively sealed by threaded tightening of the mating interface.

[0043] According to some embodiments, the valve body of the two-way check valve is equipped with a rotary operating handle, which can extend to the outside of the cabinet side panel, so that the water circuit shut-off operation of a single water-cooled branch can be completed without disassembling the cabinet.

[0044] Optionally, the water-cooled heat dissipation mechanism 11 also includes a removable water collection tray 114 and a leakage sensor 115.

[0045] A removable water collection tray 114 is located directly below the water-cooled radiator 111. The outline of the removable water collection tray 114 completely covers the projected area of ​​the water-cooled radiator 111 and the connection of the circulation pipe 112, so as to receive all the leaked liquid from the water-cooled radiator 111 and the circulation pipe 112.

[0046] According to some embodiments, the detachable water collection tray 114 is detachably hoisted and fixed by a snap-fit ​​mechanism.

[0047] The water leakage sensor 115 is installed at the lowest water accumulation point of the removable water collection tray 114 to collect the water level inside the removable water collection tray in real time. When the water level reaches the trigger level, the water leakage sensor 115 transmits a water-cooled water leakage fault electrical signal to the temperature and humidity control unit 3, and the temperature and humidity control unit 3 outputs a fault reminder signal.

[0048] Optionally, the temperature and humidity control unit is equipped with an independent audible and visual alarm circuit for each water-cooled branch. After the leakage sensing component of a single water-cooled branch transmits a fault signal, it only activates the alarm circuit corresponding to that branch, while the alarm circuits of other branches remain disconnected. The alarm panel is divided into zones and labeled with the numbers of each power module to achieve visual differentiation of faulty branches.

[0049] The variable-speed air-cooling mechanism 12 includes a variable-speed fan 123 or a speed-regulating structure. The variable-speed fan includes a DC variable-speed fan. The speed-regulating structure includes a frequency converter and a constant-speed fan unit. This application uses this as an example only, but is not limited thereto.

[0050] Both the DC variable speed fan and the frequency converter can receive speed control signals from the temperature and humidity control unit 3 and switch between low speed, medium speed and high speed operating modes.

[0051] Furthermore, the variable speed air-cooling mechanism 12 is equipped with an independent closed air duct. The inner cavity of a single closed air duct only accommodates the copper busbar and the connecting cable. The copper busbar and the connecting cable are cooled and dehumidified by the circulating airflow inside the air duct.

[0052] Optionally, the enclosed air duct is formed by splicing together multiple detachable sheet metal panels, with quick-lock buckles at the four corners of the panels, thus enabling tool-free assembly and disassembly.

[0053] Optionally, a pull-out filter access port is provided on the outside of the duct enclosure. The access port is equipped with an electromagnetic latch, which is not electrically linked to the main power supply circuit of the power module. The filter and fan assembly can be removed and replaced separately through the access port. During disassembly and assembly, the contactor of the main power supply circuit remains continuously engaged and conducting, and the water-cooled branch circulation pump continues to run, enabling uninterrupted operation and maintenance of the air-cooled components.

[0054] The bottom of the enclosed air duct is equipped with a component mounting bracket, which has an elastic buckle groove. The humidity collection element is fixed to the elastic buckle groove by the buckle. The anti-slip ribs on the inner wall of the elastic buckle groove form a multi-point clamping constraint on the humidity collection element, effectively avoiding the problem of the humidity collection element shifting, shaking or even falling off under the continuous vibration of the fan.

[0055] Optionally, the variable-speed air-cooling mechanism 12 further includes a removable filter 121 and a pressure acquisition component 122. The removable filter is installed at the air inlet of the enclosed air duct. The pressure acquisition component 122 is located at the air inlet of the enclosed air duct and is used to collect the static pressure value inside the air duct behind the removable filter 121 in real time to determine the filter's blockage status.

[0056] Temperature and humidity acquisition unit 2 is used to collect the operating temperature of the power module and the ambient humidity inside the cabinet of the static inverter in real time.

[0057] Furthermore, the temperature and humidity acquisition unit 2 includes: a temperature acquisition element 21 and a humidity acquisition element 22.

[0058] Among them, such as Figure 4 As shown, the water-cooled radiator 111 has a recessed closed groove on the plane that is in contact with the thyristor. The temperature acquisition element 21 is embedded in the recessed closed groove, and the opening of the recessed closed groove is in close contact with the heat-conducting surface of the thyristor for acquiring the temperature of the thyristor.

[0059] Due to the limited surface space of the thyristor body, it is difficult to directly slot and install the temperature acquisition element. Furthermore, directly mounting the temperature acquisition element to the thyristor surface can easily lead to detachment or poor contact during equipment vibration, assembly, and disassembly. Therefore, this application addresses this issue by adding a water-cooled heat sink with an embedded mounting groove to stably embed and fix the temperature acquisition element. This ensures a tight fit between the temperature acquisition element and the thyristor's heat-conducting surface, significantly reducing contact thermal resistance caused by air gaps and improving the accuracy of thyristor temperature acquisition. Simultaneously, the temperature acquisition element itself can assist in conducting localized heat from the thyristor, further equalizing the temperature in the measurement area, avoiding distortion of single-point temperature measurement data, and ensuring that the temperature and humidity control unit performs graded speed control based on accurate temperature signals.

[0060] According to some embodiments, the temperature acquisition element 21 includes one or more combinations of temperature-sensing optical fiber, NTC thermistor, and PT100 platinum resistance probe.

[0061] The humidity sensing element 22 is located at the bottom of the variable speed air-cooling mechanism 12, directly facing the area where the airflow sinks and converges inside the air duct, to collect the ambient humidity in the high-condensation area inside the cabinet of the stationary frequency inverter, which is different from the traditional coarse humidity collection method that covers the entire cabinet. The humidity sensing element 22 is fixed to the elastic clip slot by a snap-fit.

[0062] The temperature and humidity control unit 3 is connected to all sensing components, the bidirectional check valve of the water-cooled branch, each group of variable speed fans, and the water-cooled radiator. It is used to receive temperature and humidity signals transmitted by the temperature and humidity acquisition unit 2 and output control commands to schedule all acquired signals and control outputs. It integrates all control functions such as temperature control, dehumidification, water circuit protection, and air-cooled operation and maintenance monitoring. It can uniformly complete fan speed regulation, humidity-linked ventilation, water-cooled leakage monitoring, and fan and filter abnormality reminders, realizing integrated intelligent control of the entire heat dissipation device.

[0063] According to some embodiments, the temperature acquisition element 21 and the humidity acquisition element 22 are each configured with independent signal transmission lines, and use multiple modes such as wired, digital bus and / or wireless to transmit the real-time acquired analog or digital sensor data to the temperature and humidity control unit 3, shielding electromagnetic interference, ensuring that the temperature and humidity signals are stably and accurately uploaded to the temperature and humidity control unit, and improving the reliability of linkage control.

[0064] For example, the temperature acquisition element is equipped with a multi-core signal cable with a metal shield, while the humidity acquisition element is equipped with a double-core shielded cable. The signal cables are neatly routed along the outside of the enclosed air duct and the side of the water-cooled radiator. All cables are eventually connected to the signal acquisition terminal built into the temperature and humidity control unit. The temperature and humidity control unit filters and converts the received raw sensor signals to analog-to-digital conversion to obtain real-time thyristor temperature and humidity values ​​at the bottom of the air duct, which are used for graded speed regulation and dehumidification linkage control.

[0065] For example, both temperature and humidity acquisition elements integrate RS485 digital signal output modules, and all sensing elements are connected in parallel to the bus. A terminating resistor at the end of the bus suppresses signal reflection interference, and each sensing element is assigned an independent device address. The sensing elements upload temperature and humidity digitally encoded signals to the temperature and humidity control unit according to a preset acquisition cycle (e.g., 200ms). The temperature and humidity control unit reads the data from each sensing element through time-division polling.

[0066] For example, the humidity and temperature sensing elements have built-in LoRa low-power wireless transmission modules, while the temperature and humidity control unit is equipped with a wireless receiving module. The sensing elements are powered by built-in lithium batteries, eliminating the need for wiring and making them suitable for retrofitted models with narrow air ducts and difficult-to-lay cables. Temperature and humidity data are encrypted and packaged before being periodically transmitted wirelessly. The receiving module parses the data and sends it to the temperature and humidity control unit for processing.

[0067] The temperature and humidity control unit 3 is configured as follows: The system executes graded temperature control speed regulation logic: It receives the thyristor temperature signal transmitted by the temperature acquisition element, compares the temperature signal value with the preset temperature threshold, outputs the corresponding flow rate control signal to the water cooling heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and outputs the corresponding speed regulation control signal to the variable speed air cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and connecting cables. When the thyristor temperature is less than or equal to the first preset temperature threshold, a low-flow-rate control signal is output to the water-cooling mechanism, and a low-speed control signal is output to the variable-speed air-cooling mechanism. When the thyristor temperature is greater than the first preset temperature threshold but less than or equal to the second preset temperature threshold, a rated flow-rate control signal is output to the water-cooling mechanism, and a medium-speed control signal is output to the variable-speed air-cooling mechanism. When the thyristor temperature is greater than the second preset temperature threshold, a high-flow-rate control signal is output to the water-cooling mechanism, and a high-speed control signal is output to the variable-speed air-cooling mechanism, matching the real-time heat dissipation requirements of the power module.

[0068] The system implements temperature and humidity linkage anti-condensation logic: It receives the ambient humidity signal inside the cabinet of the static inverter transmitted by the humidity acquisition element, compares the humidity signal value with the preset humidity threshold, adjusts the operating conditions of the variable speed air-cooling mechanism, corrects the fan speed, and actively increases the fan air volume to quickly expel water vapor from the air duct when the humidity exceeds the standard, preventing condensation and short circuits in the copper busbars and connecting cables, and completing temperature and humidity linkage heat dissipation control based on device temperature and air duct humidity.

[0069] Implement water-cooled leakage monitoring and early warning logic: monitor water-cooled heat dissipation mechanism leakage fault signals in real time, and output fault reminder signal when water-cooled heat dissipation mechanism leakage fault occurs, prompting the operator to close the two-way check valve to cut off the water circuit of the corresponding water-cooled branch of the water-cooled heat dissipation mechanism and avoid the risk of cooling water leakage and short circuit.

[0070] The system executes the air-cooled status monitoring and maintenance prompt logic: It monitors the fan operating status and removable filter blockage status of the variable-speed air-cooled mechanism in real time. Upon detecting fan failure and / or removable filter blockage, it outputs a maintenance prompt signal. During air-cooled maintenance operations, the main power circuit operates continuously.

[0071] This application can determine the fan speed of the variable-speed air-cooling mechanism simply by collecting the thyristor temperature. The reason is that the thyristor, copper busbar, and connecting cable carry the current and voltage of the same power circuit. The higher the operating current and voltage of the circuit, the greater the heat loss of the thyristor itself. Simultaneously, the heat loss of the copper busbar and connecting cable also increases. There is a clear positive correlation between the thyristor temperature and the temperatures of the copper busbar and connecting cable. The thyristor temperature directly reflects the overall current-carrying and heat-generating level of the entire power module. Therefore, the measured thyristor temperature can be used as the basis for graded adjustment of the airflow of the variable-speed air-cooling mechanism. This can be further compensated and corrected by combining the humidity signal at the bottom of the air duct, achieving matched control of heat dissipation and dehumidification for the copper busbar and connecting cable. Furthermore, this application can achieve graded control of the basic airflow of the air-cooling mechanism by collecting only the thyristor temperature, eliminating the need for temperature sensors on the copper busbar and cables, simplifying hardware wiring and data acquisition circuits. It relies on the linkage between the thyristor's main heat source radiation heat and the humidity in the air duct, balancing heat dissipation and dehumidification accuracy with equipment cost.

[0072] Furthermore, in this application, one set of intelligent heat dissipation devices corresponds to one static inverter. The water-cooled radiator is individually attached to the thyristor of the corresponding power module, and the variable-speed air-cooling mechanism is arranged towards the copper busbar and connecting cable of the corresponding power module. When inspecting a single power module or its water-cooling mechanism, only the bidirectional check valves corresponding to the inlet and outlet of the water-cooled radiator of that module need to be closed, without interfering with the normal operation of the water-cooling circuits of other power modules. The humidity acquisition element is arranged inside the static inverter cabinet, allowing all power modules in the cabinet to share the cabinet's ambient humidity detection signal. The temperature and humidity control unit can be configured independently for each module or centrally for the entire unit. When centrally configured, it can uniformly collect the thyristor temperature signals and cabinet humidity signals of all power modules, and centrally complete all heat dissipation control logic, including graded speed regulation of the fans in each module, water-cooling leakage warning, and air-cooling maintenance prompts.

[0073] This application also provides an intelligent heat dissipation method for power modules of static frequency converters.

[0074] like Figure 2 As shown, this intelligent heat dissipation method is executed by the intelligent heat dissipation device described above, and includes the following steps: S201. The real-time temperature signal of the thyristor of the power module is collected by the temperature acquisition element embedded in the concave closed groove of the water-cooled heat sink, and the ambient humidity signal of the high condensation area inside the static inverter cabinet is collected by the humidity acquisition element set in the closed air duct.

[0075] The temperature and humidity acquisition unit synchronously collects the thyristor operating temperature and the ambient humidity inside the static inverter cabinet, and transmits the collected temperature and humidity signals to the temperature and humidity control unit. The temperature is acquired by a temperature acquisition element embedded in a recessed, enclosed slot within the water-cooled radiator, while the humidity is acquired by a humidity acquisition element inside the cabinet.

[0076] S202. Compare the temperature signal with the preset temperature threshold, output the corresponding flow rate control signal to the water cooling heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and output the corresponding speed control signal to the variable speed air cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and connecting cable.

[0077] The temperature and humidity control unit compares the temperature of the thyristor with a first preset temperature threshold and a second preset temperature threshold, respectively: when the temperature signal is less than or equal to the first preset temperature threshold, it outputs a low-flow rate control signal to the water-cooling mechanism and a low-speed speed control signal to the variable-speed air-cooling mechanism; when the temperature signal is greater than the first preset temperature threshold and less than or equal to the second preset temperature threshold, it outputs a rated flow rate control signal to the water-cooling mechanism and a medium-speed speed control signal to the variable-speed air-cooling mechanism; when the temperature signal is greater than the second preset temperature threshold, it outputs a high-flow rate control signal to the water-cooling mechanism and a high-speed speed control signal to the variable-speed air-cooling mechanism.

[0078] According to some embodiments, the water-cooled heat dissipation mechanism is equipped with a variable frequency circulating water pump. The variable frequency circulating water pump is connected to a temperature and humidity control unit. The temperature and humidity control unit outputs flow rate control signals at different levels to the variable frequency circulating water pump. By changing the output frequency of the water pump, the circulation flow rate of the medium in the water-cooled pipeline is adjusted to match the heat dissipation requirements of the thyristor under different loads: when a low flow rate control signal is received, the variable frequency circulating water pump reduces its operating frequency, and the circulation flow rate of the medium in the water-cooled pipeline decreases; when a rated flow rate control signal is received, the variable frequency circulating water pump operates stably at the rated frequency, and the water-cooled pipeline maintains a standard circulation flow rate; when a high flow rate control signal is received, the variable frequency circulating water pump increases its operating frequency, and the circulation flow rate of the medium in the water-cooled pipeline increases, thereby enhancing the heat exchange efficiency between the water-cooled radiator and the thyristor.

[0079] S203. Compare the ambient humidity signal with the preset humidity threshold, and adjust the fan speed of the variable speed air-cooling mechanism according to the comparison result to form a temperature and humidity linkage heat dissipation control method with device temperature as the main factor and air duct humidity as the auxiliary factor.

[0080] The temperature and humidity control unit compares the collected humidity signal with the preset humidity threshold and adjusts the operating conditions of the variable speed air-cooling mechanism according to the humidity judgment result: when the ambient humidity signal is less than or equal to the preset humidity threshold, the variable speed air-cooling mechanism is kept running stably at the current gear; when the ambient humidity signal is greater than the preset humidity threshold, the operating speed of the variable speed air-cooling mechanism is increased to increase the air circulation of the cabinet, so as to quickly expel the water vapor inside the static inverter cabinet, prevent condensation from forming on the surface of copper busbars and connecting cables, and realize temperature and humidity linkage heat dissipation control.

[0081] When the variable-speed air-cooling mechanism is working, the fan continuously drives the airflow to circulate directionally within the enclosed duct. The bottom of the duct is a water vapor settling and accumulating area, where humidity sensors are positioned to capture the high-humidity air. The continuous airflow generated by the fan continuously draws in the saturated humid air accumulated at the bottom of the duct and discharges it outwards. Simultaneously, dry, low-temperature fresh air is continuously introduced from outside the cabinet to replenish the duct, forming an air exchange cycle. After the high-humidity airflow is quickly carried out of the duct by the fan, the relative humidity around the copper busbars and connecting cables continuously decreases, preventing water vapor from condensing on the surface of conductive components and inhibiting condensation from the airflow perspective. Furthermore, the higher the thyristor load and the greater the heat generated, the more water vapor evaporates within the duct. At this time, the system simultaneously increases the fan speed, increasing the airflow rate and quickly removing a large amount of humid air, further enhancing the dehumidification effect.

[0082] According to some embodiments, the temperature and humidity control unit also performs online monitoring of water cooling leakage: real-time acquisition of water cooling branch leakage signals of the water cooling heat dissipation mechanism, and outputting a fault reminder signal when a water cooling fault signal is detected in the water cooling heat dissipation mechanism to prompt the disconnection of the water circuit of the corresponding water cooling branch of the water cooling heat dissipation mechanism.

[0083] According to some embodiments, the temperature and humidity control unit also performs online monitoring of fan operation status and filter blockage status: real-time reading of static pressure values ​​inside the duct, fan speed, and fan current acquisition signals; by comparing the actual fan speed with the rated speed range and the actual fan current with the rated current range, the abnormal operation of the fan is comprehensively determined; when an abnormal operation of the variable speed fan is detected or the collected static pressure inside the duct exceeds the preset blockage threshold, a device maintenance prompt signal is output.

[0084] According to some embodiments, during air-cooled maintenance operations such as fan replacement and filter cleaning, the power transmission circuit inside the static inverter, which is used for power conversion and carries high-power current, remains continuously powered and operates without the need to shut down the entire machine, thus reducing equipment downtime losses.

[0085] The following provides detailed examples illustrating this application, using specific parameters and operating conditions: Example 1 An intelligent heat dissipation device for a static frequency inverter includes a composite heat dissipation unit, a temperature and humidity acquisition unit, and a temperature and humidity control unit. The static frequency inverter is equipped with multiple independent power modules, silver-plated copper busbars, and multi-strand power connection cables. Each power module is equipped with a high-power thyristor, which is the core main heat source with a rated operating loss of 1200W. The copper busbars and connection cables are current-carrying conductive components, and condensation is prone to occur on their surfaces in a long-term sealed, high-humidity environment.

[0086] The composite heat dissipation unit adopts a layered heat dissipation architecture with dual physical isolation of water and air channels, achieving differentiated heat dissipation for thyristors, copper busbars, and connecting cables. The specific structure and operating condition configuration are as follows: The water-cooling mechanism employs a composite water-cooled radiator. The radiator's flat metal base is fitted to the heat-conducting surface of the thyristor's back. The mating surfaces are evenly filled with a thin layer of thermally conductive silicone grease, without any heat-insulating pads, ensuring efficient heat transfer and providing dedicated, point-to-point water cooling for the thyristor. The metal mating surface of the radiator facing the thyristor has a recessed, closed groove for embedding a temperature acquisition element, avoiding damage from slotting the thyristor body and issues such as surface mount detachment and poor contact.

[0087] The circulating pipes of the water-cooled heat dissipation mechanism are uniformly sloped downwards at a continuous gradient of 3°-8° along the direction of medium flow. They are fixed to the inverter cabinet beams using segmented pipe clamps, with the clamp installation elevation gradually decreasing from the inlet to the outlet, creating a completely water-free layout without any concave bends or stagnant water. After the equipment stops, any residual water inside the pipes can flow back completely into the water-cooled radiator by gravity, completely eliminating dead zones and effectively preventing problems such as stagnant water accumulation, scale growth, and blockages caused by impurities.

[0088] Both the inlet and outlet of the water-cooled radiator are independently equipped with manual two-way check valves. When a single power module, water-cooled radiator, or water-cooled piping leaks, only the two-way check valve of the corresponding branch needs to be closed to isolate the faulty water circuit. The water-cooled branches corresponding to the remaining power modules can maintain uninterrupted water circulation without requiring a complete system shutdown. During normal operation, the water-cooling circuit maintains a constant circulation flow rate of 8L / min, and the circulating water temperature remains stable at around 25℃ under normal operating conditions, providing a continuous and stable water-cooled heat exchange foundation for the thyristors.

[0089] A detachable, fully covered water collection tray is installed directly below the water-cooled radiator. The tray's outline completely covers the projected area of ​​the water-cooled radiator and the circulation pipe joint, and can completely catch all leaked liquid. A leak sensor is fixedly installed at the lowest water accumulation point of the water collection tray to sense the water level inside the tray in real time. When the water level reaches the trigger level, it transmits a water-cooled leak fault electrical signal to the temperature and humidity control unit.

[0090] The variable-speed air-cooling mechanism is equipped with an independent, enclosed air duct, with each duct's inner cavity only accommodating copper busbars and connecting cables. The variable-speed air-cooling mechanism can be configured in two ways: one is with a DC variable-speed fan; the other is with a speed-regulating structure using a frequency converter and a fixed-speed fan. This embodiment preferably uses a DC variable-speed fan as the speed-regulating actuator, providing three adjustable operating modes: low, medium, and high speed. The fan's working airflow can range from 500-2200 m³ / h. 3 Adaptive adjustment within the / h range.

[0091] The bottom of the enclosed air duct is equipped with a component mounting bracket, which features elastic clip slots. The humidity sensing element is secured to these slots via clips, and the anti-slip ribs on the inner wall of the slots create multi-point clamping restraint. Combined with the cushioning effect of the shock-absorbing pads, this effectively prevents the humidity sensing element from shifting, shaking, or falling off due to continuous fan vibration. The humidity sensing element is positioned at the bottom of the variable-speed air-cooling mechanism, directly facing the area where airflow converges and sinks within the air duct. This allows for precise collection of localized humidity in areas of high condensation incidence, such as those containing copper busbars and cables. Unlike traditional cabinet-based, generalized humidity collection, this provides more targeted dehumidification control.

[0092] A removable filter mounting frame is installed at the air inlet of the enclosed duct, and the removable filter is snapped into place inside the mounting frame. A pressure acquisition component is located at the air inlet of the enclosed duct to collect the static pressure value inside the duct behind the removable filter in real time, so as to accurately determine the degree of dust accumulation and blockage of the filter.

[0093] The temperature and humidity acquisition unit is used to simultaneously acquire the case temperature of the thyristor and the humidity of the local condensation area in the air duct. The temperature acquisition element is a PT100 platinum resistance probe, which is completely embedded in the concave closed groove of the water-cooled heat sink. The groove opening is close to the heat-conducting surface of the thyristor, eliminating the thermal resistance of the multi-layer air gap and greatly improving the temperature measurement accuracy. It can be equipped with NTC thermistors and temperature-sensing optical fibers to achieve cross-verification of multi-element data as needed.

[0094] The temperature and humidity control unit has preset graded control thresholds, including a first preset temperature threshold of 50℃, a second preset temperature threshold of 75℃, and a preset humidity threshold of 65%RH. The fan speed control channels of each power module are independent and do not interfere with each other.

[0095] The temperature and humidity control unit is configured to execute temperature-grade speed regulation logic: receive the thyristor temperature signal transmitted by the temperature acquisition element in real time, compare the acquired temperature with the two-level temperature thresholds respectively, and match the real-time heat dissipation requirements of the thyristor, copper busbar and connecting cable.

[0096] When the thyristor temperature is no higher than 50℃, a low-flow-rate control signal is output to the water-cooling mechanism to control the cooling water in the water-cooling pipeline to circulate at a low flow rate of 4L / min. Simultaneously, a low-speed control signal is output to the variable-speed air-cooling mechanism to control it to operate at a low speed with an airflow of 500m³ / h. When the thyristor temperature is higher than 50℃ but no higher than 75℃, a rated flow-rate control signal is output to the water-cooling mechanism to control the cooling water in the water-cooling pipeline to circulate at a low flow rate of 8L / min. The system circulates at the rated standard flow rate and simultaneously outputs a medium-speed control signal to the variable-speed air-cooling mechanism, controlling it to operate at a medium speed with an air volume of 1300 m³ / h. When the thyristor temperature exceeds 75°C, the system outputs a high-flow-rate control signal to the water-cooling mechanism, controlling the cooling water in the water-cooling pipeline to circulate at a high flow rate of 12 L / min to enhance heat exchange. At the same time, the system outputs a high-speed control signal to the variable-speed air-cooling mechanism, controlling it to operate at a high speed with an air volume of 2200 m³ / h.

[0097] Meanwhile, the temperature and humidity control unit executes a temperature and humidity linkage anti-condensation logic: it compares the collected local humidity in the air duct with a preset humidity threshold of 65%RH, forming a linkage heat dissipation control mode based primarily on thyristor device temperature and secondarily on local air duct humidity. When the air duct humidity is less than or equal to 65%RH, the fan maintains stable operation at the current temperature matching setting; when the air duct humidity is greater than 65%RH, it actively adjusts the fan speed to increase the airflow in the air duct, quickly expelling moisture from inside the air duct and preventing problems such as condensation on copper busbars and connecting cables, insulation degradation, and short circuit faults.

[0098] In addition, the temperature and humidity control unit executes multi-dimensional online monitoring and early warning logic: it receives water leakage sensor signals in real time, and outputs audible and visual fault reminder signals after identifying water-cooled leakage faults, prompting maintenance personnel to close the corresponding branch's bidirectional check valve to isolate the faulty water circuit; it also reads the static pressure value inside the air duct, fan speed, and fan current acquisition signals in real time, and outputs equipment maintenance prompt signals when the static pressure value inside the air duct exceeds 120Pa or the fan operating parameters are abnormal. Furthermore, during air-cooled maintenance operations such as fan replacement and filter cleaning, the main power supply circuit of the static inverter power module remains powered, and the remaining water-cooled branches maintain uninterrupted water circulation for heat dissipation, eliminating the need for complete machine shutdown and water supply interruption, significantly reducing equipment downtime losses.

[0099] This embodiment sets up various actual operating conditions to verify the device performance: During light-load operation, the measured temperature of the thyristor was 42℃, and the local humidity in the air duct was 52%RH. Both temperature and humidity were within the safe range. The cooling water in the water-cooled circuit circulated at a low flow rate of 4L / min, and the fan operated at 500m / min. 3 Operating at low speeds, the equipment is low-noise and energy-efficient, and is suitable for light-load and low-loss working conditions.

[0100] When the equipment is running at rated load, the measured temperature of the thyristor is 63℃, the local humidity in the air duct is 60%RH, the temperature is within the two-stage temperature threshold range, the cooling water in the water-cooled circuit maintains a rated standard flow rate of 8L / min, and the fan operates at 1300m... 3 Operating at a medium speed of / h, it stably ventilates and dissipates heat from the copper busbars and connecting cables, balancing heat dissipation efficiency and equipment energy consumption.

[0101] During heavy-load, high-humidity operation of the equipment, the measured temperature of the thyristor was 81℃, and the local humidity in the air duct was 70%RH. Both temperature and humidity exceeded the preset thresholds. The cooling water in the water-cooling circuit was switched to a high flow rate of 12L / min to enhance the heat exchange of the thyristor, and the fan was switched to 2200m. 3 The system operates at high speed, which quickly suppresses the temperature rise of the thyristor while rapidly replacing and expelling the high humidity moisture in the air duct, reducing the risk of short circuit due to condensation on conductive components.

[0102] When a minor leak occurs in the water-cooled pipes or radiator, the water collection tray catches the leaking liquid. Once the water level reaches the trigger level, the leak sensor uploads a fault signal, and the temperature and humidity control unit triggers an audible and visual alarm. Maintenance personnel only need to close the corresponding branch's two-way check valve to isolate the faulty water circuit. A single branch fault does not affect the normal heat dissipation of the remaining power modules. After maintenance, restarting the valve will restore the equipment to normal operation.

[0103] When the fan filter is clogged with dust for a long time, and the static pressure inside the air duct reaches 145Pa and exceeds the warning threshold, the temperature and humidity control unit triggers an operation and maintenance reminder. Operation and maintenance personnel can complete the filter cleaning or fan replacement work while the power module is running continuously and the water cooling is running continuously, ensuring the continuous and stable operation of the equipment.

[0104] The specific execution process of the corresponding graded temperature control heat dissipation method is as follows: (1) The real-time temperature of the thyristor is collected by the temperature acquisition element embedded in the concave closed groove of the water-cooled radiator, and the local environmental humidity of the high condensation area of ​​the air duct is collected by the humidity acquisition element at the bottom of the air duct. All the acquisition signals are synchronously transmitted to the temperature and humidity control unit. (2) The temperature and humidity control unit compares the collected temperature with the two preset temperature thresholds, and outputs the corresponding water cooling flow rate control signal and fan speed control signal according to the temperature range. It adjusts the water cooling circulation flow rate and fan air volume in stages to achieve precise heat dissipation of thyristor temperature and match the heat dissipation requirements of copper busbar and connecting cable. (3) Based on the comparison results of the real-time humidity of the air duct and the preset humidity threshold, the fan speed is adaptively superimposed and corrected to form a temperature and humidity linkage control mechanism. The cooling water circulation speed of the water cooling heat dissipation mechanism is dynamically adjusted by the variable frequency water pump. The water cooling heat dissipation mechanism is used to continuously dissipate heat from the thyristor at a constant temperature, so as to realize the differentiated intelligent heat dissipation of the thyristor, copper busbar and connecting cable. At the same time, the air duct anti-condensation control, water cooling leakage fault monitoring and air-cooled equipment online operation and maintenance protection are completed.

[0105] In the alternative embodiments of this application, a water-free layout with any inclination slope within the range of 3°-8° can be adapted according to the cabinet size and pipe length. The pipe maintains a stable drainage slope throughout the entire process and there are no local low-lying dead corners where water accumulates. It can adapt to different installation conditions such as narrow cabinets, long pipes, and large flow rates. The remaining structural configurations, parameter thresholds, and control logic are completely consistent with the above embodiments.

[0106] Through the above-described examples, the intelligent heat dissipation device and method for static inverters provided in this application adopts a modular independent isolation heat dissipation architecture. Each power module is equipped with a physically isolated dedicated water cooler, with the water cooler cooling the thyristor separately. The air duct is specifically designed for dehumidifying and dissipating heat from the copper busbars and cables, ensuring that hot and cold airflows do not interfere with each other, resulting in higher heat dissipation matching and effectively reducing the overall energy consumption of the machine. An embedded groove high-precision temperature measurement structure is set up, with the water cooler having an embedded groove to fix the temperature acquisition element. The element is in close contact with the thyristor to eliminate air temperature measurement thermal resistance, and multiple limiting structures prevent vibration and detachment. It also supports the combination of multiple temperature measurement elements for precise and stable temperature control. Equipped with independent bidirectional check valves for the 3°-8° tilted anti-stagnant water cooling pipes and branches, accumulated water can automatically flow back during shutdown to prevent scale blockage. The valves have external operating handles, allowing isolation of only the corresponding water circuit during single-branch faults and maintenance, while the water cooling of other modules can continue to circulate. A leakage monitoring and zone alarm structure is set up, with a fully covered water collection tray with a liquid level sensor arranged below the water cooler, and each water cooling branch equipped with independent audible and visual alarms. The alarm circuit can quickly locate the leakage point and avoid the risk of short circuits in cooling water components. It adopts a duct clamp-type humidity acquisition structure, with shock-absorbing brackets to buffer fan vibration and anti-slip clamps to prevent humidity components from shifting or falling off. It directly collects local humidity in high-condensity areas of the duct, making dehumidification control more targeted. It achieves multi-dimensional online monitoring of air cooling and non-stop maintenance, collecting real-time static pressure values, fan speed, and current signals inside the duct to determine faults. The duct has tool-less disassembly and maintenance ports, allowing filter and fan replacements without disconnecting the main power circuit, significantly reducing downtime losses. It features a dual-coordinated temperature and humidity weighted speed control logic for water cooling flow rate and fan airflow, dividing the water cooling flow rate and fan speed into three levels based on thyristor temperature. When humidity exceeds the standard, it automatically adds compensation airflow, while also considering device heat dissipation and the need to prevent condensation and creepage of conductive components. It adopts an integrated centralized control architecture, with all functions such as temperature measurement, speed control, dehumidification, and fault monitoring processed by the same temperature and humidity control unit. It supports centralized management of the entire unit, with high hardware integration, facilitating mass production, on-site debugging, and subsequent maintenance.

[0107] This application also provides a static inverter system equipped with the aforementioned intelligent heat dissipation device, which can simultaneously achieve one-to-one isolated differentiated heat dissipation of power modules, high-precision temperature and humidity linkage temperature control and dehumidification, independent fault alarm for water-cooled branches, online monitoring of all air-cooled parameters, and full-function intelligent management and control for non-stop operation and maintenance. Figure 3 As shown, the system includes a static frequency converter and multiple sets of intelligent heat dissipation devices as described above. The frequency converter integrates multiple independent power modules, easily condensing conductive copper busbars, and connecting cables. Each power module integrates a high-heat-loss thyristor, where the thyristor is the core heat-generating component. The copper busbars and connecting cables are current-carrying conductive parts, which are prone to condensation and creepage short-circuit faults in the high-humidity, enclosed cabinet. To make the schematic diagram concise and clear... Figure 3Only one water-cooled heat dissipation mechanism 11 and one variable-speed air-cooled mechanism 12 are shown in the figure. The left side of the dotted line is the location of the closed air duct. In order to show the intelligent heat dissipation device of this application more clearly, the closed air duct is not shown in its entirety.

[0108] This static inverter system adopts a module-level dedicated heat dissipation matching architecture, with each module's heat dissipation structure being independent and non-interfering with each other. Each intelligent heat dissipation device's composite heat dissipation unit adopts a layered heat dissipation design with dual physical isolation of water and air channels, and is equipped with a dedicated water-cooling heat dissipation mechanism and a variable-speed air-cooling mechanism: the water-cooling heat dissipation mechanism is rigidly attached to the flat heat-conducting surface on the back of the thyristor by bolts and clamps, and the contact surface is filled with a thin layer of thermally conductive silicone grease without heat insulation pads, achieving precise water-cooled heat exchange of the thyristor at a fixed point; at the same time, the water-cooled radiator base is machined with a 2mm-5mm recessed closed groove, and the temperature acquisition element is fixed by an embedded assembly structure wrapped with thermally conductive gel and pressed by metal plates, eliminating the problems of temperature measurement air gaps and vibration offset, and accurately acquiring the true temperature of the thyristor.

[0109] The variable-speed air-cooling mechanism features an independent, enclosed air duct. The duct is assembled from detachable sheet metal panels using quick-locking mechanisms. Each duct's inner cavity only accommodates copper busbars and connecting cables, specifically targeting the heat dissipation and dehumidification of conductive components. A component mounting bracket with shock-absorbing rubber pads is installed at the bottom of the duct. A humidity sensing element is suspended and secured in place by a non-slip elastic clip at the top, ensuring stable positioning at the bottom of the variable-speed air-cooling mechanism, directly facing the area where airflow converges within the duct. This allows for accurate collection of localized humidity in high-condensation areas, avoiding temperature measurement deviations and detachment issues caused by fan vibration. The air inlet of the duct is equipped with a detachable filter mounting frame with pressure measurement holes on both sides. This, along with a pressure sensing component, monitors the filter's clogging status in real time. Simultaneously, the fan assembly includes speed and current sensing structures, enabling comprehensive monitoring of the air-cooling operation.

[0110] All water-cooled branch circuits in the system adopt continuously downward-sloping, dead-water circulation pipes 112 with a 3°-8° angle. The pipe clamp elevation decreases progressively, ensuring automatic backflow of accumulated water during shutdown and preventing stagnation and blockage. Each water-cooled branch circuit is equipped with an integrated two-way check valve 113 with an external operating handle on the cabinet at both the inlet and outlet, allowing for single-branch water circuit switching without disassembling the cabinet. Meanwhile, the water-cooled radiator 111 has a fully covered water collection tray (not shown in the figure) mounted on its bottom with clips, and is equipped with a low-level leakage sensor (not shown in the figure) for real-time leakage monitoring. Furthermore, the temperature and humidity control unit provides each water-cooled branch circuit with an independent audible and visual alarm circuit, enabling precise location of faulty branches and mitigating the risk of short circuits due to cooling water leakage.

[0111] This system adopts a centralized integrated control architecture. The temperature and humidity control unit uniformly receives independent temperature signals from all power modules and a common humidity signal within the cabinet. Relying on built-in hardware registers and an addition module, it achieves intelligent dual-parameter control: based on the thyristor temperature threshold, it divides the water cooling flow rate and fan output into three levels: low, medium, and high. This enables low-temperature operation by matching low water cooling flow rate and low fan air volume to achieve low noise and energy saving, while high-temperature operation by matching high water cooling flow rate and high fan air volume to enhance thyristor heat exchange and duct ventilation. When the local humidity in the duct exceeds the preset threshold, it automatically adds humidity compensation air volume to the temperature-based speed to quickly expel water vapor from the duct and prevent condensation and creepage faults in copper busbars and cables.

[0112] Furthermore, this system possesses independent fault handling capabilities for individual branch circuits and uninterrupted operation and maintenance. Leakage in a single water-cooled branch circuit only triggers an independent alarm for that branch, without affecting the water circulation of other modules. Abnormalities in fans or filters can generate independent maintenance alerts, and the electromagnetic latch inspection port on the outside of the air duct supports tool-less replacement of filters and fans. During maintenance, the main power circuit of the power module remains continuously energized, and the water-cooling system operates uninterruptedly, completely avoiding losses from system downtime. Through integrated hardware and software design, this system achieves comprehensive intelligent management and control of module-level differentiated heat dissipation, high-precision data acquisition, temperature and humidity linkage control, accurate fault early warning, and online operation and maintenance, significantly improving the stability and reliability of high-power static inverters during long-term continuous operation.

[0113] It should be clearly understood that this application describes how specific examples are formed and used, but this application is not limited to any details of these examples. Rather, based on the teachings of the disclosure of this application, these principles can be applied to many other embodiments.

[0114] Furthermore, it should be noted that the above figures are merely illustrative representations of the processes included in the method according to exemplary embodiments of this application, and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0115] Exemplary embodiments of this application have been specifically shown and described above. It should be understood that this application is not limited to the detailed structures, arrangements, or implementation methods described herein; rather, this application is intended to cover various modifications and equivalent arrangements that fall within the objectives and scope of the appended claims.

Claims

1. An intelligent heat dissipation device for a static frequency inverter, characterized in that, The static inverter includes a power module, copper busbars, and connecting cables. The power module includes thyristors. The intelligent heat dissipation device includes: The composite heat dissipation unit adopts a layered heat dissipation architecture with dual physical isolation of water and air channels, and provides differentiated heat dissipation for the power module, the copper busbar, and the connecting cables. The composite heat dissipation unit includes: A water-cooled heat dissipation mechanism includes a water-cooled heat sink, which is attached to the heat-conducting surface of the thyristor. The contact surface is filled with thermally conductive silicone grease to provide dedicated water-cooled heat dissipation for the thyristor. The water-cooled heat sink has a concave closed groove on the plane attached to the thyristor. A variable speed air-cooling mechanism includes a closed air duct, the inner cavity of which only accommodates the copper busbar and the connecting cable, and relies on the circulating airflow within the air duct to perform air cooling and heat dissipation on the copper busbar and the connecting cable; A temperature and humidity acquisition unit is used to collect the temperature of the power module and the ambient humidity inside the cabinet of the static inverter in real time. The temperature and humidity acquisition unit includes: A temperature acquisition element is embedded in the concave closed groove, the opening of which is in close contact with the heat-conducting surface of the thyristor, for acquiring the temperature of the thyristor. A humidity acquisition element is installed at the bottom of the variable speed air-cooling mechanism, facing the area where the airflow sinks and converges inside the air duct, in order to collect the ambient humidity in the high condensation area inside the cabinet of the static inverter. The temperature and humidity control unit is used to receive the temperature signal transmitted by the temperature acquisition element, compare the temperature signal with a preset temperature threshold, output a corresponding flow rate control signal to the water-cooled heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and output a corresponding speed control signal to the variable-speed air-cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and the connecting cable. It is also used to receive the humidity signal transmitted by the humidity acquisition element, compare the humidity signal with a preset humidity threshold, and adjust the fan speed of the variable-speed air-cooling mechanism. When the humidity exceeds the limit, it actively increases the fan airflow to quickly expel water vapor from the air duct, completing a temperature and humidity-linked heat dissipation control system with device temperature as the primary factor and air duct humidity as a secondary factor. This includes: When the temperature signal is less than or equal to the first preset temperature threshold, a low flow rate control signal is output to the water cooling heat dissipation mechanism, and a low speed control signal is output to the variable speed air cooling mechanism. When the temperature signal is greater than the first preset temperature threshold and less than or equal to the second preset temperature threshold, a flow rate control signal of the rated flow rate level is output to the water cooling heat dissipation mechanism, and a speed adjustment control signal of the medium speed level is output to the variable speed air cooling mechanism. When the temperature signal is greater than the second preset temperature threshold, a high flow rate control signal is output to the water cooling heat dissipation mechanism, and when the ambient humidity signal is less than or equal to the preset humidity threshold, the variable speed air cooling mechanism is kept running stably at the current speed. When the ambient humidity signal is greater than the preset humidity threshold, the operating speed of the variable speed air-cooling mechanism is increased to quickly expel the water vapor inside the static inverter cabinet and activate the speed control signal at the high speed setting.

2. The intelligent heat dissipation device as described in claim 1, characterized in that, The water-cooling heat dissipation mechanism also includes: The circulation pipeline is connected to the inlet and outlet of the water-cooled radiator. The circulation pipeline is fixed to the cabinet of the static inverter by segmented pipe clamps. The installation position of the pipe clamps gradually decreases from the inlet to the outlet.

3. The intelligent heat dissipation device as described in claim 2, characterized in that, The circulation pipeline has a stagnant water-free layout, including: The circulation pipeline is inclined as a whole, wherein the circulation pipeline is inclined at a continuous downward slope of 3°-8° along the direction of medium flow, so that the water accumulated in the circulation pipeline can flow back by gravity after the water cooling heat dissipation mechanism stops.

4. The intelligent heat dissipation device as described in claim 2, characterized in that, The water-cooling heat dissipation mechanism also includes: A two-way check valve is installed at the inlet and outlet of the water-cooled radiator, respectively. It is used to close the two-way check valve of the corresponding water-cooled branch when a single power module and / or the water-cooled radiator is under maintenance and / or when the water-cooled radiator is leaking. This isolates the water circuit of the corresponding water-cooled branch, while the water-cooled branches of the other power modules maintain water circulation.

5. The intelligent heat dissipation device as described in claim 2, characterized in that, The water-cooling heat dissipation mechanism also includes: A detachable water collection tray is provided below the water-cooled radiator. The outline of the detachable water collection tray completely covers the projected area of ​​the water-cooled radiator and the circulation pipe joint, and is used to collect the leaked liquid from the water-cooled radiator and the circulation pipe. A water leakage sensor is installed at the lowest water accumulation point of the removable water collection tray to collect the water level inside the removable water collection tray in real time. When the water level reaches the trigger level, the water leakage sensor transmits a water-cooled water leakage fault electrical signal to the temperature and humidity control unit, which then outputs a fault reminder signal.

6. The intelligent heat dissipation device as described in claim 1, characterized in that, The bottom of the enclosed air duct of the variable speed air-cooling mechanism is provided with a component mounting bracket, and the component mounting bracket is provided with an elastic buckle groove. The humidity collection element is fixed to the elastic buckle groove by the buckle.

7. The intelligent heat dissipation device as described in claim 1, characterized in that, The variable speed air-cooling mechanism also includes: A removable filter screen is installed at the air inlet of the enclosed air duct; The pressure acquisition component is used to acquire the static pressure value inside the air duct behind the removable filter in real time to determine the filter blockage status.

8. The intelligent heat dissipation device as described in claim 1, characterized in that, The temperature acquisition element includes: a temperature-sensing optical fiber, an NTC thermistor, and / or a PT100 platinum resistance probe.

9. The intelligent heat dissipation device as described in claim 7, characterized in that, The temperature and humidity control unit is also used for: Monitor the water cooling heat dissipation mechanism for leakage fault signals, and output a fault reminder signal in the event of a water cooling heat dissipation mechanism leakage fault, so as to cut off the water circuit of the corresponding water cooling branch of the water cooling heat dissipation mechanism. Monitor the operating status of the fan in the variable speed air-cooling mechanism and the clogging status of the removable filter. If a fan failure and / or clogging of the removable filter is detected, output a maintenance prompt signal.

10. A smart heat dissipation method for a static frequency inverter, characterized in that, The intelligent heat dissipation method is performed by the intelligent heat dissipation device as described in any one of claims 1-9, and the intelligent heat dissipation method includes: The real-time temperature signal of the thyristor of the power module is collected by the temperature acquisition element embedded in the concave closed groove of the water-cooled heat sink, and the environmental humidity signal of the high condensation area inside the static inverter cabinet is collected by the humidity acquisition element set in the closed air duct. The temperature signal is compared with a preset temperature threshold, and a corresponding flow rate control signal is output to the water cooling heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor. A corresponding speed control signal is also output to the variable speed air cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and the connecting cable. The ambient humidity signal is compared with a preset humidity threshold, and the fan speed of the variable speed air-cooling mechanism is adjusted according to the comparison result, forming a temperature and humidity linkage heat dissipation control method with device temperature as the main factor and air duct humidity as the secondary factor.

11. The intelligent heat dissipation method as described in claim 10, characterized in that, The step of comparing the temperature signal with a preset temperature threshold and outputting a corresponding flow rate control signal to the water-cooling heat dissipation mechanism to match the real-time heat dissipation requirements of the thyristor, and outputting a corresponding speed control signal to the variable-speed air-cooling mechanism to match the real-time heat dissipation requirements of the copper busbar and the connecting cable, includes: When the temperature signal is less than or equal to the first preset temperature threshold, a low flow rate control signal is output to the water cooling heat dissipation mechanism, and a low speed control signal is output to the variable speed air cooling mechanism. When the temperature signal is greater than the first preset temperature threshold and less than or equal to the second preset temperature threshold, a flow rate control signal of the rated flow rate level is output to the water cooling heat dissipation mechanism, and a speed adjustment control signal of the medium speed level is output to the variable speed air cooling mechanism. When the temperature signal is greater than the second preset temperature threshold, a high flow rate control signal is output to the water cooling heat dissipation mechanism, and a high speed control signal is output to the variable speed air cooling mechanism.

12. The intelligent heat dissipation method as described in claim 10, characterized in that, The step of comparing the ambient humidity signal with a preset humidity threshold and adjusting the fan speed of the variable-speed air-cooling mechanism based on the comparison result to form a temperature and humidity-linked heat dissipation control method with device temperature as the primary factor and air duct humidity as a secondary factor includes: When the ambient humidity signal is less than or equal to the preset humidity threshold, the variable speed air-cooling mechanism is kept running stably at the current speed. When the ambient humidity signal is greater than the preset humidity threshold, the operating speed of the variable speed air-cooling mechanism is increased to quickly expel the water vapor inside the static inverter cabinet.

13. The intelligent heat dissipation method as described in claim 10, characterized in that, Also includes: Perform online monitoring of water cooling leakage, fan operation status, and filter clogging status, and output corresponding fault reminders and / or equipment maintenance prompts based on various sensor signals.

14. The intelligent heat dissipation method as described in claim 13, characterized in that, The implementation of online water-cooled water leakage monitoring includes: Real-time acquisition of water leakage signals from the water-cooling branch of the water-cooling heat dissipation mechanism; If a water leakage fault signal is detected in the water cooling heat dissipation mechanism, a fault reminder signal is output to prompt the water circuit of the corresponding water cooling branch of the water cooling heat dissipation mechanism to be cut off. The online monitoring of the fan operating status and the online monitoring of the filter clogging status include: Real-time reading of static pressure values ​​inside the air duct, fan speed, and fan current acquisition signals; If the fan of the variable speed air-cooling mechanism is found to be operating abnormally or the static pressure value inside the air duct exceeds the preset blockage threshold, a device maintenance prompt signal will be output.

15. A static frequency converter system, characterized in that, include: A static frequency converter, the static frequency converter including at least one set of power modules, copper busbars and connecting cables, the power modules including thyristors; The intelligent heat dissipation device as described in any one of claims 1-9 is used to implement differentiated heat dissipation, temperature and humidity linkage heat dissipation control, and online monitoring of water cooling and air cooling faults for the thyristors, copper busbars, and connecting cables in each group of power modules.

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