An integrated circuit and motor system

Abstract

The embodiment of the application provides an integrated circuit and a motor system, the integrated circuit is used for driving a motor, and the integrated circuit comprises: a wafer module and a power module electrically connected with a port of the motor, the wafer module comprises a wafer and a power supply circuit, a digital circuit, a driving module and a monitoring circuit integrated on the wafer, the power supply circuit and the power module are electrically connected with a power supply access end, the power supply circuit is electrically connected with a power supply interface of the digital circuit, a power supply interface of the driving module and a power supply interface of the monitoring circuit respectively; the monitoring circuit is electrically connected with the digital circuit, and the digital circuit is electrically connected with the driving module. The technical scheme can improve the integration of the motor driving chip and reduce the manufacturing cost.

Description

[0001] This application claims priority and benefit to Chinese Patent Application No. 202511258144.1, filed with the China National Intellectual Property Administration on September 4, 2025, entitled "A Highly Flexible High-Power Motor Drive Circuit and Integrated Circuit Chip", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of integrated circuit technology, and in particular to an integrated circuit and motor system. Background Technology

[0003] Motor driver chips are used to control the rotation direction, speed, and protection functions of DC motors, stepper motors, and brushless motors. However, these motor driver chips have low integration and high cost. Summary of the Invention

[0004] This application provides an integrated circuit and a motor system to improve the integration of motor driver chips and reduce manufacturing costs.

[0005] In a first aspect, embodiments of this application provide an integrated circuit for driving a motor. The integrated circuit includes: a wafer module and a power module electrically connected to the port of the motor. The wafer module includes a wafer and a power circuit, a digital circuit, a drive module, and a monitoring circuit integrated on the wafer. The power circuit and the power module are both electrically connected to a power input terminal. The power circuit is electrically connected to the power interface of the digital circuit, the power interface of the drive module, and the power interface of the monitoring circuit, respectively. The monitoring circuit is electrically connected to the digital circuit and is used to monitor the port electrical parameters of the motor and send the port electrical parameters to the digital circuit. The digital circuit is electrically connected to the drive module and is used to obtain digital drive signals based on port electrical parameters and send the digital drive signals to the drive module. The drive module is used to control the power module to output pulse signals based on digital drive signals, so that the motor works under the action of the pulse signals.

[0006] Optionally, the power module, power supply circuit, digital circuit, and drive module can be integrated on the same wafer.

[0007] Optionally, the integrated circuit may also include a heat dissipation module, which is at least located on the power module.

[0008] Optionally, the power supply circuit includes a first voltage regulator circuit and a second voltage regulator circuit. The input terminal of the first voltage regulator circuit is used to be electrically connected to the power supply terminal. The first voltage regulator circuit and the second voltage regulator circuit have a step-down function. The output terminal of the first voltage regulator circuit is electrically connected to the input terminal of the second voltage regulator circuit, the power interface of the drive module, and the power interface of the monitoring circuit, respectively. The output terminal of the second voltage regulator circuit is electrically connected to the power interface of the digital circuit.

[0009] Optionally, the power module includes a half-bridge circuit, which includes an upper power switch and a lower power switch. The drive module is electrically connected to the control terminal of the upper power switch and the control terminal of the lower power switch, respectively. The input terminal of the upper power switch is electrically connected to the power supply terminal, the input terminal of the lower power switch is electrically connected to the ground terminal, and the output terminals of both the upper and lower power switches are electrically connected to the input terminal of the motor.

[0010] Optionally, both the first and second voltage regulator circuits include low-dropout linear regulators, with the upper power switch being a P-type power switch and the lower power switch being an N-type power switch.

[0011] Optionally, the first voltage regulator circuit includes a buck switching power supply circuit, and the second voltage regulator circuit includes a low dropout linear regulator, with both the upper and lower power switching transistors being N-type power switching transistors.

[0012] Optionally, the step-down switching power supply circuit includes a voltage conversion circuit and a high-voltage side control circuit and a low-voltage side control circuit that are electrically connected to the voltage conversion circuit respectively. The voltage conversion circuit is electrically connected to the power input terminal. The drive module includes a high-voltage side drive circuit and a low-voltage side drive circuit. The high-voltage side control circuit is electrically connected to the power interface of the high-voltage side drive circuit, and the low-voltage side control circuit is electrically connected to the power interface of the low-voltage side drive circuit. The wafer includes a P-type substrate, an N-type doped layer formed in the P-type substrate, and a P-type well formed in the N-type doped layer. The voltage conversion circuit and the high-voltage side control circuit are both located in the P-type well, while the low-voltage side control circuit is formed on the P-type substrate.

[0013] Optionally, the high-voltage side control circuit includes: an RS trigger, an oscillator, a control circuit, an undervoltage detection circuit, and peripheral circuits. The input terminal of the voltage conversion circuit is electrically connected to the power supply input terminal, and the output terminal of the voltage conversion circuit is electrically connected to the input terminal of the undervoltage detection circuit and the charging terminal of the control circuit, respectively. The oscillator is electrically connected to the set terminal of the RS flip-flop, the output terminal of the undervoltage detection circuit is electrically connected to the first reset terminal of the RS flip-flop, the input terminal of the control circuit is electrically connected to the output terminal of the RS flip-flop, the output terminal of the control circuit is electrically connected to the control terminal of the peripheral circuit, and the power interface of the peripheral circuit is electrically connected to the high-voltage side drive circuit.

[0014] Optionally, the high-voltage side control circuit also includes a reference voltage and current source, a current detection circuit, and a voltage detection circuit. The power supply ports of the reference voltage and current source and the peripheral circuit are all electrically connected to the input terminal of the voltage detection circuit. The output of the voltage detection circuit is electrically connected to the second reset terminal of the RS flip-flop. The operating power supply port and the current sampling port of the peripheral circuit are both electrically connected to the input terminal of the current detection circuit. The output of the current detection circuit is connected to the third reset terminal of the RS flip-flop.

[0015] Optionally, the drive module includes a charge pump and two drive circuits. The output of the first voltage regulator circuit is electrically connected to the input of the charge pump, and the output of the charge pump is electrically connected to the power supply terminals of the two drive circuits. The digital circuit is electrically connected to the input terminals of the two drive circuits. One of the output terminals of the two drive circuits is electrically connected to the control terminal of the upper power switch, and the other of the two drive circuits is electrically connected to the control terminal of the lower power switch.

[0016] Optionally, the driving circuit includes a push-pull circuit, a first decoder, a second decoder, a first programmable current source, and a second programmable current source. The output terminal of the digital circuit is electrically connected to the input terminal of the first decoder, the input terminal of the second decoder, and the input terminal of the push-pull circuit, respectively. The output terminal of the push-pull circuit is electrically connected to the control terminal of the upper power switch or the control terminal of the lower power switch. The power interfaces of the first decoder, the second decoder, the first programmable current source, and the second programmable current source are all electrically connected to the output terminal of the charge pump. The output terminal of the first decoder is electrically connected to the control terminal of the first programmable current source. The first programmable current source is electrically connected to the first power supply terminal of the push-pull circuit. The output terminal of the second decoder is electrically connected to the control terminal of the second programmable current source. The output terminal of the second programmable current source is electrically connected to the second power supply terminal of the push-pull circuit. The digital circuit is also used to send a first current adjustment indication to a first decoder based on port electrical parameters. The first decoder is used to adjust the output current of the first programmable current source based on the first current adjustment indication, so that the push-pull circuit can output a conduction control signal using the output current of the first programmable current source. The digital circuit is also used to send a second current adjustment indication to a second decoder based on port electrical parameters. The second decoder is used to adjust the output current of the second programmable current source based on the second current adjustment indication, so that the push-pull circuit can output a turn-off control signal using the output current of the second programmable current source.

[0017] Optionally, the power module also includes a sampling resistor, through which the input terminal of the lower power switch is electrically connected to the ground terminal.

[0018] Secondly, embodiments of this application also provide a motor system, characterized in that it includes a motor and an integrated circuit as described in the first aspect or any one of the first aspects, wherein the output terminal of the power module included in the integrated circuit is electrically connected to the port of the motor.

[0019] By employing one or more technical solutions in the embodiments of this application, the power supply circuit is electrically connected to the power interface of the digital circuit, the power interface of the drive module, and the power interface of the monitoring circuit, respectively. The power supply circuit is also electrically connected to the power input terminal, enabling it to utilize the electrical energy provided by the power input terminal to power the digital circuit, drive module, and monitoring circuit. Therefore, the monitoring circuit can monitor the port electrical parameters of the motor, send these parameters to the digital circuit, and then use the digital circuit to quickly send digital drive signals to the drive module. Furthermore, the power module is electrically connected to the power input terminal, allowing the drive module to control the power module to output pulse signals based on the digital drive signals. This causes the motor to operate under the influence of the pulse signals, thereby achieving the purpose of driving the motor. Moreover, since the power supply circuit, digital circuit, drive module, and monitoring circuit are integrated on the same wafer, the integration density of integrated circuits (such as motor drive chips) can be effectively improved, manufacturing costs reduced, and motor drive speed increased. Attached Figure Description

[0020] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The accompanying drawings are used to provide a further understanding of the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0021] Figure 1 A schematic diagram of the basic structure of the integrated circuit according to an embodiment of this application is shown; Figure 2 A schematic diagram of an example structure of an integrated circuit according to an embodiment of this application is shown; Figure 3 This application illustrates another example structural diagram of an integrated circuit according to an embodiment of the present application. Figure 4 A schematic diagram of a driving circuit according to an embodiment of this application is shown; Figure 5 A schematic diagram of the buck switching power supply circuit according to an embodiment of this application is shown; Figure 6 An example structural block diagram of a high-voltage side control circuit according to an embodiment of this application is shown. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application more apparent, exemplary embodiments according to this application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein.

[0023] A motor driver chip can integrate motor logic control, motor power topology, analog front-end, and power supply. The analog front-end can amplify and convert the acquired analog signals into digital signals and provide them to the motor logic control. The motor logic can perform complex mathematical operations such as three-level functions on the acquired signals. The motor power topology not only needs to drive the motor to run but also needs to ensure reliability in high-speed switching environments. The power supply provides a stable power supply for the motor under a wide range of power supply conditions.

[0024] Motor logic control typically uses digital logic technology, motor power topology uses discrete device technology, analog front-end typically uses digital logic technology or BCD technology, and power supply chips typically use BCD technology or bipolar technology. Therefore, motor driver chips require extensive and comprehensive technical support, and there are at least four types of chips, such as motor logic control chips, motor power topology chips, analog front-end chips, and power supply chips. Motors often only run normally under the joint debugging of hardware and software engineers. This results in relatively low integration and high cost of motor driver chips.

[0025] Among them, BCD process, short for Bipolar-CMOS-DMOS, is a semiconductor manufacturing technology that integrates Bipolar (bipolar transistor), CMOS (complementary metal-oxide semiconductor), and DMOS (double-diffused metal-oxide semiconductor) onto the same chip.

[0026] To address the aforementioned issues, this application provides a motor system that may include an integrated circuit and a motor. The integrated circuit may be a motor driver chip, and the output terminal of its included power module is electrically connected to the motor's port. For example, the motor's port may be the three-phase winding terminals of the motor. The integrated circuit in this application has a high degree of integration, which can effectively reduce the manufacturing cost of the integrated circuit and improve the motor drive speed.

[0027] This application provides an integrated circuit that can be used to drive a motor. Figure 1 This application shows a schematic diagram of the basic structure of an integrated circuit according to an embodiment of the present application. Figure 2 This paper illustrates an example structural diagram of an integrated circuit according to an embodiment of the present application. Figure 3 This illustration shows another example structural diagram of an integrated circuit according to an embodiment of this application. (See diagram below.) Figures 1-3As shown, the integrated circuit 100 in this embodiment includes a wafer module. The wafer module includes a wafer and power supply circuit 101, digital circuit 102, monitoring circuit 103, and driving module 104 integrated on the wafer.

[0028] The integrated circuit 100 may also include a power module 105 electrically connected to the port of the motor 200. Both the power circuit 101 and the power module 105 are electrically connected to the power input terminal VIN, so that the power input terminal VIN can provide power to the power circuit 101 and the power module.

[0029] The power supply circuit 101 is electrically connected to the power interface of the digital circuit 102, the power interface of the drive module 104, and the power interface of the monitoring circuit, respectively, so that the power supply circuit 101 can supply power to the digital circuit 102, the drive module, and the detection module. In this way, the power supply circuit 101 is used to supply power to the digital circuit 102, the drive module 104, and the monitoring circuit 103 using the electrical energy provided by the power input terminal VIN.

[0030] Monitoring circuit 103 is electrically connected to digital circuit 102 and is used to monitor the port electrical parameters of motor 200 and send the port electrical parameters to digital circuit 102. Digital circuit 102 is electrically connected to drive module 104 and is used to obtain digital drive signals based on port electrical parameters and send the digital drive signals to drive module 104. Drive module 104 is used to control power module 105 to output pulse signals using electrical energy based on digital drive signals, so that motor 200 works under the action of pulse signals.

[0031] The power supply circuit 101 is electrically connected to the power interfaces of the digital circuit 102, the drive module 104, and the monitoring circuit, respectively. The power supply circuit 101 is also electrically connected to the power input terminal VIN, allowing it to use the power supplied by VIN to power the digital circuit 102, drive module 104, and monitoring circuit 103. Therefore, the monitoring circuit 103 can monitor the port electrical parameters of the motor 200, send these parameters to the digital circuit 102, and then the digital circuit 102 quickly sends a digital drive signal to the drive module 104. Furthermore, the power module 105 is electrically connected to the power input terminal VIN. Based on this digital drive signal, the drive module 104 can control the power module 105 to output pulse signals using electrical energy, causing the motor 200 to operate under the influence of the pulse signals, thereby achieving the purpose of driving the motor 200. Moreover, since the power supply circuit 101, digital circuit 102, drive module 104 and monitoring circuit 103 are integrated on the same wafer, the integration level of integrated circuit 100 (such as motor drive chip) can be effectively improved, manufacturing costs can be reduced, and the driving speed of motor 200 can be increased.

[0032] Optionally, a sampling resistor RS can be connected in series at the grounding terminal of the power module 105. The monitoring circuit 103 can be electrically connected to both ends of the sampling resistor RS to obtain the port electrical parameters of the motor 200, such as the three-phase current and three-phase voltage of the motor 200. Taking the three-phase current of the motor 200 as an example, the power module can include three power modules, which are respectively connected to the three-phase winding terminals of the motor 200.

[0033] Optionally, the power module 105 may include three half-bridge circuits, each with its output terminal connected to one of the three winding terminals of the motor 200. For example, a sampling resistor RS can be connected in series with the ground terminal of each half-bridge circuit, allowing the monitoring circuit to obtain the three-phase current of the motor 200 through the sampling resistor RS connected in series with the ground terminals of the three half-bridge circuits. This current is then converted into a digital signal and sent to the digital circuit 102. The digital circuit 102 can perform a field-oriented control (FOC) algorithm on the digital signal to obtain the angle of the motor 200 rotor and determine the digital drive signal based on the rotor angle. For example, the digital drive signal may include the duty cycle of the three-phase drive signal of the motor 200. The drive module 104 can drive the three power modules based on the duty cycle of the three-phase drive signal to provide pulse signals to the three-phase windings of the motor 200.

[0034] In this embodiment, BCD technology is a semiconductor manufacturing technique that integrates Bipolar Transistor, CMOS (Complementary Metal-Oxide-Semiconductor), and DMOS (Double-Diffused Metal-Oxide-Semiconductor) onto the same chip. Using a 90nm BCD process, the power supply circuit 101, digital circuit 102, drive module 104, and monitoring circuit 103 can be integrated onto the same wafer. This effectively ensures the integration density of the integrated circuit 100 and reduces manufacturing costs. Furthermore, because the power supply circuit 101, digital circuit 102, drive module 104, and monitoring circuit 103 can be integrated onto the same wafer, the signal transmission speed between different modules is relatively fast, the circuit design is simple, and the motor 200 can be driven relatively quickly.

[0035] In one alternative approach, such as Figures 1-3As shown, in this embodiment of the application, the power module 105 and the wafer module are packaged in the same package structure. For example, the power module 105, the power supply circuit 101, the digital circuit 102, and the driver module 104 are integrated on the same wafer; or, for another example, the power module 105 and the wafer module can be directly packaged in the same housing using a SiP (System-in-Package) packaging process. Considering that the power module 105 is prone to heat generation, in order to ensure the safety of the integrated circuit 100, the integrated circuit 100 may also include a heat dissipation module. This heat dissipation module may be provided at least on the power module 105 to cool the power module 105 in a timely manner. Optionally, the heat dissipation module may also be provided on the power supply circuit 101 to reduce the possibility of heat generation in the power supply circuit 101, thereby further improving the safety of the integrated circuit 100.

[0036] In one alternative embodiment, considering the large voltage range of the various chips included in the motor drive chip, the power supply circuit 101 includes a first voltage regulator circuit 1011 and a second voltage regulator circuit 1012, both of which have a step-down function.

[0037] The input terminal of the first voltage regulator circuit 1011 is electrically connected to the power input terminal VIN. The output terminal of the first voltage regulator circuit 1011 is electrically connected to the input terminal of the second voltage regulator circuit 1012, the power interface of the drive module 104, and the power interface of the monitoring circuit 103, respectively. The output terminal of the second voltage regulator circuit 1012 is electrically connected to the power interface of the digital circuit 102. Therefore, the first voltage regulator circuit 1011 can step down the power energy provided by the power input terminal VIN, such as high-power high-voltage power energy, and then provide it to the drive module 104, the second voltage regulator circuit 1012, and the monitoring circuit 103. The second voltage regulator circuit 1012 can further step down the power energy stepped down by the first voltage regulator circuit 1011 and then provide it to the digital circuit 102.

[0038] In one alternative approach, such as Figures 1-3 As shown, the half-bridge circuit includes an upper power switch 1051 and a lower power switch 1052. The drive module 104 is electrically connected to the control terminals of the upper power switch 1051 and the lower power switch 1052, respectively. The input terminal of the upper power switch 1051 is electrically connected to the power input terminal VIN, the input terminal of the lower power switch 1052 is electrically connected to the ground terminal, and the output terminals of both the upper power switch 1051 and the lower power switch 1052 are electrically connected to the input terminal of the motor.

[0039] For example, such as Figures 1-3As shown, the drive module 104 may include two drive circuits, such as a first drive circuit 104A and a second drive circuit 104B. The digital circuit 102 is electrically connected to the input terminals of the two drive circuits respectively. The output terminal of the first voltage regulator circuit 1011 is electrically connected to the power interface of the first drive circuit 104A and the power interface of the second drive circuit 104B to supply power to the first drive circuit 104A and the second drive circuit 104B.

[0040] The output terminal of the first driving circuit 104A can be electrically connected to the control terminal of the upper power switch, and the output terminal of the second driving circuit 104B can be electrically connected to the control terminal of the lower power switch. This allows the first driving circuit 104A to provide a first control signal to the upper power switch based on a digital driving signal under the power supply of the first voltage regulator circuit 1011, and the second driving circuit 104B to provide a second control signal to the lower power switch 1052 based on a digital driving signal under the power supply of the first voltage regulator circuit 1011.

[0041] When the drive module 104 inputs a control signal to the half-bridge circuit, the lower power switch 1052 and the upper power switch 1051 switch alternately under the action of the first and second control signals. When the lower power switch 1052 is on, the upper power switch 1051 is off, and the pulse signal output from the output terminal of the half-bridge circuit is low; when the lower power switch 1052 is off, the upper power switch 1051 is on, and the pulse signal output from the output terminal of the half-bridge circuit is high.

[0042] In some embodiments, such as Figure 1 and Figure 2 As shown, the upper power switch 1051 is a P-type power switch, and the lower power switch 1052 is an N-type power switch. Both the first voltage regulator circuit 1011 and the second voltage regulator circuit 1012 include a low dropout regulator (LDO). For example, the first voltage regulator circuit includes a first LDO circuit 1011A, and the second voltage regulator circuit includes a second LDO circuit 1012A. In this case, the half-bridge circuit can be a PN-type half-bridge, which can include a P-type upper power switch P1 and a first N-type lower power switch N1.

[0043] Because the carrier migration speed of the P-type upper power switch P1 is slow, the switching efficiency of the P-type upper power switch P1P1 is lower than that of the first N-type lower power switch N1. Under the same chip (die area, die size), the internal resistance is greater, so the voltage of the power input terminal VIN is usually below 40V.

[0044] For example, the first voltage regulator circuit 1011 can step down the 40V voltage provided by the power input terminal VIN to a voltage range suitable for the drive module 104 (e.g., 5V) and the monitoring circuit 103 (e.g., 5V), and the second voltage regulator circuit 1012 can further step down the 5V voltage to the voltage range of the digital circuit 102 (e.g., 3.3V).

[0045] When the first control signal is high, the second control signal is also high, the upper power switch 1051 is off, and the lower power switch 1052 is on. When the first control signal is low, the second control signal is also low, the upper power switch 1051 is on, and the lower power switch 1052 is off.

[0046] In other embodiments, such as Figure 1 and Figure 3 As shown, the first voltage regulator circuit 1011 includes a buck switching power supply circuit (Buck circuit) 1011B, and the second voltage regulator circuit 1012 includes a low dropout linear regulator, such as a second LDO circuit 1012A. Both the upper power switch 1051 and the lower power switch 1052 are N-type power switches. In this case, the half-bridge circuit is an N-type half-bridge, which may include an N-type upper power switch N21 and an N-type lower power switch N22. For example, when the first control signal is high and the second control signal is low, the upper power switch 1051 is turned on, and the lower power switch 1052 is turned off. Conversely, when the first control signal is high and the second control signal is low, the upper power switch 1051 is turned on, and the lower power switch 1052 is turned off.

[0047] Compared to the PN type half-bridge, the NN type half-bridge has lower internal resistance for the same die area and better matching between the high and low sides of the half-bridge. Therefore, the NN type half-bridge is not only suitable for motor drive systems with lower power consumption than the PN type half-bridge, but also for motor drive systems with higher power consumption than the PN system.

[0048] Considering that the high side of the NN-type half-bridge requires a higher supply voltage, the drive module 104 may also include a charge pump 1043. The output of the first voltage regulator circuit 1011 can be electrically connected to the input of the charge pump 1043, and the output of the charge pump 1043 can be electrically connected to the power supply terminals of the first drive circuit 104A and the second drive circuit 104B. In this case, the first voltage regulator circuit 1011 can pre-regulate the high-power high-voltage energy at the power input terminal VIN and output it to the charge pump 1043. The charge pump 1043 can boost the voltage of the energy input to the first voltage regulator circuit 1011. This achieves both voltage boosting to increase the power supply range at low voltages and long-term conduction (100% duty cycle) control of the first voltage regulator circuit 1011. In addition, the first voltage regulator circuit 1011 can also pre-regulate the voltage of the second voltage regulator circuit 1012, reduce the voltage drop of the second voltage regulator circuit 1012, thereby reducing the heat generation of the second voltage regulator circuit 1012. This can improve the stability and efficiency of motor drive. Therefore, through the coordinated cooperation of the first voltage regulator circuit 1011 and the second voltage regulator circuit 1012, a wider voltage range is provided for the integrated circuit 100.

[0049] As can be seen, in the integrated circuit 100 of this application embodiment, the power input terminal VIN can provide high voltage to the power module 105 to drive the motor, low voltage to support the digital circuit 102 for large-scale logic operations, and high-precision voltage to the monitoring circuit 103 and voltage to the drive module 104.

[0050] For the upper power switch 1051 and the lower power switch 1052, as long as they are N-type power switches, the switching speed can be controlled by designing the driver switch's drive circuit, thereby reducing electromagnetic interference caused by electrostatic discharge due to inappropriate switching speed.

[0051] Figure 4 A schematic diagram of a driving circuit according to an embodiment of this application is shown. Figures 1-4 As shown, the driving circuit includes a push-pull circuit 1041, a first decoder 1042A, a second decoder 1042B, a first programmable current source 1043A, and a second programmable current source 1043B. The output terminal of the digital circuit 102 is electrically connected to the input terminal of the first decoder 1042A, the input terminal of the second decoder 1042B, and the input terminal of the push-pull circuit 1041, respectively. The output terminal of the push-pull circuit 1041 is electrically connected to the control terminal of the upper power switch 1051 or the control terminal of the lower power switch 1052.

[0052] The power interface of the first decoder 1042A, the power interface of the second decoder 1042B, the first programmable current source 1043A, and the second programmable current source 1043B are all electrically connected to the output terminal of the first voltage regulator circuit 1011. The output terminal of the first decoder 1042A is electrically connected to the control terminal of the first programmable current source 1043A. The first programmable current source 1043A is electrically connected to the first power supply terminal of the push-pull circuit 1041. The output terminal of the second decoder 1042B is electrically connected to the control terminal of the second programmable current source 1043B. The output terminal of the second programmable current source 1043B is electrically connected to the second power supply terminal of the push-pull circuit 1041.

[0053] When both the upper power switch 1051 and the lower power switch 1052 are N-type power switches, the drive current may also include a charge pump 1043. In this case, the output of the first voltage regulator circuit 1011 can be electrically connected to the power interface of the first decoder 1042A, the power interface of the second decoder 1042B, the first programmable current source 1043A, and the second programmable current source 1043B through the charge pump 1043.

[0054] Digital circuit 102 is also used to send a first current adjustment instruction to the first decoder 1042A based on port electrical parameters. The first decoder 1042A is used to adjust the output current of the first programmable current source 1043A based on the first current adjustment instruction, so that the push-pull circuit 1041 outputs a conduction control signal using the output current of the first programmable current source 1043A. Digital circuit 102 is also used to send a second current adjustment indication to the second decoder 1042B based on port electrical parameters. The second decoder 1042B is used to adjust the output current of the second programmable current source 1043B based on the second current adjustment indication, so that the push-pull circuit 1041 outputs a turn-off control signal using the output current of the second programmable current source 1043B.

[0055] Since the output terminal of the digital circuit 102 is electrically connected to the input terminal of the first decoder 1042A, the input terminal of the second decoder 1042B, and the input terminal of the push-pull circuit 1041, the digital circuit 102 can send the digital drive signal to the push-pull circuit 1041, send the first current adjustment indication to the first decoder 1042A, and send the second current adjustment indication to the second decoder 1042B.

[0056] In one example, the digital circuit 102 can obtain the rate of change of the port electrical parameters based on the port electrical parameters within a preset time period. For example, the port electrical parameters may include at least one of the three-phase current and three-phase voltage of the motor, and the rate of change of the port electrical parameters may include the rate of change of the three-phase current di / dt (current slope) and the rate of change of the three-phase voltage dV / dt (voltage slope).

[0057] If the rate of change of current in any phase current is greater than the preset rate of change of current, a first current adjustment indication and a second current adjustment indication can be determined based on the rate of change of current in that phase current and the preset rate of change of current; if the rate of change of voltage in any phase voltage is greater than the preset rate of change of voltage, a first current adjustment indication and a second current adjustment indication can be determined based on the rate of change of current in that phase voltage and the preset rate of change of current. After receiving the first current adjustment indication, the first decoder 1042A can parse the indication to obtain the first current parameter. Based on this parameter, it can control the current input to the push-pull circuit 1041 from the first programmable current source 1043A, thereby controlling the conduction capability of the push-pull circuit 1041's output turn-on control signal and the turn-on speed of the N-type power switch. Similarly, after receiving the second current adjustment indication, the second decoder 1042B can parse the indication to obtain the second current parameter. Based on this parameter, it can control the current input to the push-pull circuit 1041 from the second programmable current source 1043B, thereby controlling the turn-off capability of the push-pull circuit 1041's output turn-off control signal and the turn-off speed of the N-type power switch.

[0058] In one example, both the first programmable current source 1043A and the second programmable current source 1043B include an array of multiple current sources connected in parallel. The output terminal of the first decoder 1042A can be electrically connected to the control terminal of the multiple current sources included in the first programmable current source 1043A. The input terminals of the multiple current sources included in the first programmable current source 1043A are electrically connected to the output terminal of the first voltage regulator circuit 1011. The output terminal of the second decoder 1042B can be electrically connected to the control terminal of the multiple current sources included in the second programmable current source 1043B. The input terminals of the multiple current sources included in the second programmable current source 1043B are electrically connected to the output terminal of the second voltage regulator circuit 1012.

[0059] As can be seen, the digital circuit 102 of this application embodiment can output a turn-on control signal and a turn-off control signal according to at least one of di / dt and dV / dt. By introducing a decoder and a programmable current source into the drive circuit corresponding to the N-type power switch, the current of the push-pull circuit 1041 can be adjusted. This can change the charging and discharging speed of the gate capacitance of the N-type power switch, thereby precisely controlling the switching speed of the N-type power switch, realizing intelligent slew rate control, suppressing the electromagnetic interference caused by electrostatic discharge generated by the N-type power switch, and thus achieving precise control of the N-type power switch. Therefore, this application embodiment can realize closed-loop calibration of the switching slope of the N-type power switch, suppressing electrostatic discharge spikes while minimizing unnecessary switching losses.

[0060] Tests revealed that when the upper power switch 1051 is a P-type power switch and the lower power switch 1052 is an N-type power switch, the power module can easily achieve a current output of up to 3A; when both the upper power switch 1051 and the lower power switch 1052 are N-type power switches, the power module can easily achieve a power output of 5A or more.

[0061] In one possible implementation, when the power module 105, power supply circuit 101, digital circuit 102, and drive module 104 are integrated on the same wafer, if both the upper power switch 1051 and the lower power switch 1052 are N-type power switches... Figure 5 A basic structural block diagram of a buck switching power supply circuit according to an embodiment of this application is shown. Figure 5 As shown, the buck switching power supply circuit includes a voltage conversion circuit 2011, and a high-voltage side control circuit 2012 and a low-voltage side control circuit 2013, which are electrically connected to the voltage conversion circuit 2011, respectively. The voltage conversion circuit 2011 is connected to the power input terminal VIN. The drive module includes a high-voltage side drive circuit 2021 and a low-voltage side drive circuit 2022. The high-voltage side control circuit 2012 is electrically connected to the power interface of the high-voltage side drive circuit 2021, and the low-voltage side control circuit 2013 is electrically connected to the power interface of the low-voltage side drive circuit 2022.

[0062] The voltage conversion circuit 2011 can obtain high-voltage power from the power input terminal VIN through the high-voltage port, and then convert it into low-voltage power within 20V, and provide power to the low-voltage side control circuit 2013 (…). Figure 5 (Not shown) and the control circuit of the high-voltage side control circuit 2012 are powered so that the high-voltage side control circuit 2012 can control the high-voltage side drive circuit 2021 to drive the upper power switch 1051 to work, and the low-voltage side control circuit 2013 can control the low-voltage side drive circuit 2022 to drive the lower power switch 1052 to work.

[0063] When a wafer includes a P-type substrate, an N-type doped layer is formed within the P-type substrate, and a P-type well is formed within the N-type doped layer, a high-side control circuit 2012 is disposed within the P-type well, and a low-side control circuit 2013 is formed on the P-type substrate. For example, high-energy ions can be implanted into the P-type substrate to form a deeply buried N-type doped layer, and a P-type well can be fabricated within the N-type doped layer. Finally, the high-side control circuit 2012 is formed within the P-type well. In this way, the high-side control circuit 2012 is completely enclosed in an independent P-type well, forming a reverse-biased isolation PN junction with the P-type substrate, completely cutting off parasitic conduction paths. Moreover, the N-type doped layer can also break the parasitic PNPN path in traditional CMOS structures, increasing the latch-up trigger current threshold several times, and fundamentally avoiding the latch-up breakdown risk when high-side and low-side circuits share a substrate.

[0064] Optionally, the P-type well set in the N-type doped layer can also be configured with an independent floating bias potential to fully match the potential fluctuation requirements of the high-voltage side control circuit 2012 and completely isolate it from the common ground of the low-voltage side control circuit 2013. This avoids grounding conflicts and significantly reduces isolation parasitic capacitance, enabling the high-voltage side control circuit 2012 and the low-voltage side control circuit 2013 to be integrated on the same P-type substrate. It also alleviates the risk of parasitic PN junction conduction and eliminates latch-up effects and grounding conflicts.

[0065] The high-voltage side control circuit of this application embodiment includes a core circuit and peripheral circuits. The core circuit can drive the peripheral circuits to provide power to the high-voltage side drive circuit 2021. Figure 6 An example structural block diagram of a high-voltage side control circuit according to an embodiment of this application is shown. Figure 6 As shown, the high-voltage side control circuit includes: an RS trigger 301, an undervoltage detection circuit 302, an oscillator 303, a control circuit 304, and peripheral circuits ( Figure 6 (Not shown). The input terminal of the voltage conversion circuit 2011 is electrically connected to the power input terminal VIN, and the output terminal of the voltage conversion circuit 2011 is electrically connected to the input terminal of the undervoltage detection circuit 302 and the charging terminal of the control circuit 304, respectively.

[0066] The output of the undervoltage detection circuit 302 is electrically connected to the first reset terminal R1 of the RS flip-flop 301. The oscillator 303 is electrically connected to the set terminal of the RS flip-flop 301. The input of the control circuit 304 is electrically connected to the output of the RS flip-flop 301. The output of the control circuit 304 is electrically connected to the control terminal of the peripheral circuit. The peripheral circuit is electrically connected to the power interface of the high-voltage side drive circuit. Optionally, when the drive module includes a charge pump, the peripheral circuit is electrically connected to the power interface of the high-voltage side drive circuit via the charge pump.

[0067] The undervoltage detection circuit 302 can also detect the voltage of low-voltage power. If the voltage of the low-voltage power is detected to be lower than the voltage threshold, the undervoltage detection circuit 302 sends a first reset signal to the first reset terminal R1 of the RS flip-flop 301, causing the first reset terminal R1 to perform a reset action, and the RS flip-flop 301 outputs a low level. If the voltage of the low-voltage power is detected to be greater than or equal to the voltage threshold, the undervoltage detection circuit 302 sends a first reset release signal to the first reset terminal R1 of the RS flip-flop 301, causing the first reset terminal R1 to perform a reset release action. When the oscillator 303 (e.g., with a frequency of 60KHz) outputs a trigger signal, the set terminal Q of the RS flip-flop 301 is valid. At this time, the RS flip-flop 301 outputs a high-level signal, and the control circuit 304 can control the peripheral circuit to provide a drive signal to the high-voltage side drive circuit based on the high-level signal.

[0068] Optionally, the control circuit 304 may include a level shifting circuit 304A and a peripheral driving circuit 304B. The output terminal of the RS flip-flop 301 may be electrically connected to the input terminal of the level shifting circuit 304A. The output terminal of the voltage conversion circuit 2011 may be electrically connected to the power interface of the level shifting circuit 304A. The output terminal of the level shifting circuit 304A may be electrically connected to the input terminal of the peripheral driving circuit 304B. The output terminal of the peripheral driving circuit 304B may be electrically connected to the driving terminal HO, the bootstrap power supply terminal VB, and the switching node terminal VS of the peripheral circuit, respectively.

[0069] The voltage conversion circuit 2011 can provide low-voltage power to the level shifting circuit 304A. The level shifting circuit 304A can shift the high-level signal output by the RS flip-flop 301 under the action of low-voltage power, and then provide control signals to the peripheral circuit through the peripheral driving circuit 304B.

[0070] Optionally, the high-voltage side control circuit may also include a voltage detection circuit 305, a reference voltage and current source 306, and a current detection circuit 307. The reference voltage and current source 306 and the working power supply port VCC of the peripheral circuit are both electrically connected to the input terminal of the voltage detection circuit 305. The output terminal of the voltage detection circuit 305 is electrically connected to the second reset terminal R2 of the RS flip-flop 301. The working power supply port VCC of the peripheral circuit and the current sampling port of the peripheral circuit are both electrically connected to the input terminal of the current detection circuit 307. The output terminal of the current detection circuit 307 is connected to the third reset terminal R3 of the RS flip-flop 301.

[0071] The reference voltage and current source 306 in this embodiment can provide a reference voltage for the voltage detection circuit 305, so that the voltage reference circuit can use the reference voltage as a reference to determine whether the working voltage collected by the working power supply port VCC of the peripheral circuit exceeds the preset voltage. If it exceeds the preset voltage, the voltage detection circuit 305 can output a second reset signal to the second reset terminal R2 of the RS flip-flop 301, so that the second reset terminal R2 performs a reset action, and the output terminal of the RS flip-flop 301 outputs a low-level signal. If it is lower than the preset voltage, the voltage detection circuit 305 can output a second reset release signal to the second reset terminal R2 of the RS flip-flop 301, so that the second reset terminal R2 performs a reset release action. When the oscillator 303 (e.g., with a frequency of 60KHz) outputs a trigger signal, the set terminal Q of the RS flip-flop 301 is valid. At this time, the RS flip-flop 301 outputs a high-level signal, and the control circuit 304 can control the peripheral circuit to provide a drive signal to the high-voltage side drive circuit based on the high-level signal.

[0072] The current detection circuit 307 can compare the voltage signal sampled by the current sampling port of the peripheral circuit with the working voltage collected by the working power supply port VCC of the peripheral circuit to determine whether the voltage difference between the two reaches the preset voltage difference (e.g., 150mV). If it exceeds the preset voltage difference, the current detection circuit 307 can output a third reset signal to the third reset terminal R3 of the RS flip-flop 301, so that the third reset terminal R3 performs a reset action, and the output terminal of the RS flip-flop 301 outputs a low-level signal. If it is lower than the preset voltage, the current detection circuit 307 can output a third reset release signal to the third reset terminal R3 of the RS flip-flop 301, so that the third reset terminal R3 performs a reset release action. When the oscillator 303 (e.g., frequency 60KHz) outputs a trigger signal, the set terminal Q of the RS flip-flop 301 is valid. At this time, the RS flip-flop 301 outputs a high-level signal, and the control circuit 304 can control the peripheral circuit to provide a drive signal to the high-voltage side drive circuit based on the high-level signal.

[0073] As can be seen, in this embodiment, a voltage detection loop can be formed by voltage detection circuit 305, reference voltage and current source 306 and working power supply port VCC of peripheral circuit, and a current detection loop can be formed by current detection current, working power supply port VCC of peripheral circuit and current sampling port CS of peripheral circuit. Combined with the reset operation of RS trigger 301, it can be ensured that the buck switching power supply circuit where the high voltage side control circuit is located provides stable output voltage and controlled current for the drive module.

[0074] It should be noted that the fourth reset terminal R4 of RS flip-flop 301 can also be electrically connected to the over-temperature protection circuit 308. When the temperature of the high-voltage side control circuit 304 exceeds the preset temperature, a fourth reset signal can be output to the fourth reset terminal R4 of RS flip-flop 301, causing the fourth reset terminal R4 to perform a reset action, and the output terminal of RS flip-flop 301 outputs a low-level signal. If the temperature is lower than the preset temperature, the over-temperature protection circuit 308 can output a fourth reset release signal to the fourth reset terminal R4 of RS flip-flop 301, causing the fourth reset terminal R4 to perform a reset release action. When the oscillator 303 (e.g., with a frequency of 60KHz) outputs a trigger signal, the set terminal Q of RS flip-flop 301 is effective. At this time, RS flip-flop 301 outputs a high-level signal, and the control circuit 304 can control the peripheral circuit to provide a drive signal to the high-voltage side drive circuit based on the high-level signal.

[0075] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0076] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0077] Additionally, as used herein, the "or" used in a list of items beginning with "at least one" indicates a separate list, such that a list of, for example, "at least one of A, B, or C" means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). Furthermore, the word "exemplary" does not imply that the described example is preferred or better than other examples.

[0078] It should also be noted that in the system and method of this application, the components or steps can be decomposed and / or recombined. These decompositions and / or recombinations should be considered as equivalent solutions of this application.

[0079] Various changes, substitutions, and modifications can be made to the technology herein without departing from the teachings defined by the appended claims. Furthermore, the scope of the claims is not limited to the specific aspects of the processes, machines, manufactures, events, means, methods, and actions described above. Currently existing or later-developed processes, machines, manufactures, events, means, methods, or actions that perform substantially the same function or achieve substantially the same result as the corresponding aspects herein can be utilized. Therefore, the appended claims include such processes, machines, manufactures, events, means, methods, or actions within their scope.

[0080] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0081] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. An integrated circuit, characterized in that, For driving a motor, the integrated circuit includes: a wafer module and a power module electrically connected to the port of the motor. The wafer module includes a wafer and a power circuit, a digital circuit, a drive module, and a monitoring circuit integrated on the wafer. The power circuit and the power module are both electrically connected to a power input terminal. The power circuit is electrically connected to the power interface of the digital circuit, the power interface of the drive module, and the power interface of the monitoring circuit, respectively. The monitoring circuit is electrically connected to the digital circuit and is used to monitor the port electrical parameters of the motor and send the port electrical parameters to the digital circuit. The digital circuit is electrically connected to the drive module and is used to obtain a digital drive signal based on the port electrical parameters and send the digital drive signal to the drive module. The drive module is used to control the power module to output pulse signals using electrical energy based on the digital drive signal, so that the motor works under the action of the pulse signal.

2. The integrated circuit according to claim 1, characterized in that, The power module, the power supply circuit, the digital circuit, and the drive module are integrated on the same wafer.

3. The integrated circuit according to claim 2, characterized in that, The integrated circuit also includes a heat dissipation module, which is at least disposed on the power module.

4. The integrated circuit according to any one of claims 1 to 3, characterized in that, The power supply circuit includes a first voltage regulator circuit and a second voltage regulator circuit. The input terminal of the first voltage regulator circuit is used to be electrically connected to the power supply input terminal. The first voltage regulator circuit and the second voltage regulator circuit have a step-down function. The output terminal of the first voltage regulator circuit is electrically connected to the input terminal of the second voltage regulator circuit, the power interface of the drive module, and the power interface of the monitoring circuit, respectively. The output terminal of the second voltage regulator circuit is electrically connected to the power interface of the digital circuit.

5. The integrated circuit according to claim 4, characterized in that, The power module includes a half-bridge circuit, which includes an upper power switch and a lower power switch. The drive module is electrically connected to the control terminals of the upper power switch and the lower power switch, respectively. The input terminal of the upper power switch is electrically connected to the power supply terminal, the input terminal of the lower power switch is electrically connected to the ground terminal, and the output terminals of both the upper and lower power switches are electrically connected to the input terminal of the motor.

6. The integrated circuit according to claim 5, characterized in that, Both the first voltage regulator circuit and the second voltage regulator circuit include a low dropout linear regulator, the upper power switch is a P-type power switch, and the lower power switch is an N-type power switch.

7. The integrated circuit according to claim 5, characterized in that, The first voltage regulator circuit includes a buck switching power supply circuit, and the second voltage regulator circuit includes a low dropout linear regulator. Both the upper power switch and the lower power switch are N-type power switches.

8. The integrated circuit according to claim 7, characterized in that, The step-down switching power supply circuit includes a voltage conversion circuit and a high-voltage side control circuit and a low-voltage side control circuit, which are respectively electrically connected to the voltage conversion circuit. The voltage conversion circuit is electrically connected to the power input terminal. The drive module includes a high-voltage side drive circuit and a low-voltage side drive circuit. The high-voltage side control circuit is electrically connected to the power interface of the high-voltage side drive circuit, and the low-voltage side control circuit is electrically connected to the power interface of the low-voltage side drive circuit. The wafer includes a P-type substrate, an N-type doped layer is formed in the P-type substrate, and a P-type well is also formed in the N-type doped layer. The voltage conversion circuit and the high-voltage side control circuit are both disposed in the P-type well, and the low-voltage side control circuit is formed on the P-type substrate.

9. The integrated circuit according to claim 8, characterized in that, The high-voltage side control circuit includes: an RS trigger, an oscillator, a control circuit, an undervoltage detection circuit, and peripheral circuits. The input terminal of the voltage conversion circuit is electrically connected to the power supply input terminal, and the output terminal of the voltage conversion circuit is electrically connected to the input terminal of the undervoltage detection circuit and the charging terminal of the control circuit, respectively. The oscillator is electrically connected to the set terminal of the RS flip-flop, the output terminal of the undervoltage detection circuit is electrically connected to the first reset terminal of the RS flip-flop, the input terminal of the control circuit is electrically connected to the output terminal of the RS flip-flop, the output terminal of the control circuit is electrically connected to the control terminal of the peripheral circuit, and the peripheral circuit is electrically connected to the power interface of the high-voltage side drive circuit.

10. The integrated circuit according to claim 9, characterized in that, The high-voltage side control circuit also includes a reference voltage and current source, a current detection circuit, and a voltage detection circuit. The working power supply ports of the reference voltage and current source and the peripheral circuit are all electrically connected to the input terminal of the voltage detection circuit. The output terminal of the voltage detection circuit is electrically connected to the second reset terminal of the RS flip-flop. The operating power supply port and the current sampling port of the peripheral circuit are both electrically connected to the input terminal of the current detection circuit. The output terminal of the current detection circuit is connected to the third reset terminal of the RS flip-flop.

11. The integrated circuit according to claim 7, characterized in that, The driving module includes a charge pump and two driving circuits. The output terminal of the first voltage regulator circuit is electrically connected to the input terminal of the charge pump, and the output terminal of the charge pump is electrically connected to the power supply terminals of the two driving circuits. The digital circuit is electrically connected to the input terminals of the two driving circuits, one of the output terminals of the two driving circuits is electrically connected to the control terminal of the upper power switch, and the other of the two driving circuits is electrically connected to the control terminal of the lower power switch.

12. The integrated circuit according to claim 11, characterized in that, The driving circuit includes a push-pull circuit, a first decoder, a second decoder, a first programmable current source, and a second programmable current source. The output terminal of the digital circuit is electrically connected to the input terminal of the first decoder, the input terminal of the second decoder, and the input terminal of the push-pull circuit, respectively. The output terminal of the push-pull circuit is electrically connected to the control terminal of the upper power switch or the control terminal of the lower power switch. The power interface of the first decoder, the power interface of the second decoder, the first programmable current source, and the second programmable current source are all electrically connected to the output terminal of the charge pump. The output terminal of the first decoder is electrically connected to the control terminal of the first programmable current source. The first programmable current source is electrically connected to the first power terminal of the push-pull circuit. The output terminal of the second decoder is electrically connected to the control terminal of the second programmable current source. The output terminal of the second programmable current source is electrically connected to the second power terminal of the push-pull circuit. The digital circuit is also used to send a first current adjustment indication to the first decoder based on the port electrical parameters. The first decoder is used to adjust the output current of the first programmable current source based on the first current adjustment indication, so that the push-pull circuit can output a conduction control signal using the output current of the first programmable current source. The digital circuit is also used to send a second current adjustment indication to the second decoder based on the port electrical parameters. The second decoder is used to adjust the output current of the second programmable current source based on the second current adjustment indication, so that the push-pull circuit outputs a turn-off control signal using the output current of the second programmable current source.

13. The integrated circuit according to claim 5, characterized in that, The power module also includes a sampling resistor, and the input terminal of the lower power switch is electrically connected to the ground terminal through the sampling resistor.

14. A motor system, characterized in that, The device includes a motor and an integrated circuit as described in any one of claims 1 to 13, wherein the output terminal of the power module included in the integrated circuit is electrically connected to the port of the motor.

Images