System and method for electrical energy storage cell temperature measurement

Abstract

A circuit is disclosed that includes an electrical energy storage cell (EESC), a circuit board that includes an electrically isolating substrate, an electrically conductive terminal (ECT) connected between the EESC and the circuit board (the ECT configured to concurrently facilitate (i) an electrical connection between the EESC and the CB and (ii) a thermal transfer from the EEC to the electrically isolating substrate of the CB, and a temperature sensor mounted on a surface of the CB and configured to measure a temperature of the EESC based on a temperature of the electrically isolating substrate of the CB. The temperature sensor is electrically isolated from the ECT. Thermal is allowed to flow from the EESC to the temperature sensor via the ECT and the electrically isolating substrate. Other aspects, such as methods, are also disclosed.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to European Patent Application No. 24166253.5, filed on March 26, 2024, the contents of which are incorporated herein by reference in their entirety. Background Technology

[0003] Description of related technologies

[0004] Battery cell assemblies are typically used to power electronic devices. The temperature of the battery cells can be monitored during their use. Long-pinned or wired temperature sensors are commonly used for temperature measurement. These temperature sensors are typically mounted in a manner strongly coupled to the battery cell temperature. In this respect, each temperature sensor is manually placed near the battery cell. The pins or wires of the temperature sensor can then be soldered to corresponding pads on a circuit board. In practice, the manufacturing process for battery cell devices is relatively labor-intensive, inefficient, time-consuming, and expensive. Summary of the Invention

[0005] This disclosure relates to a circuit comprising: one or more energy storage cells; a circuit board including an electrically insulating substrate; electrically conductive terminals connected between at least one of the energy storage cells and the circuit board (the electrically conductive terminals being configured to concurrently facilitate (i) an electrical connection between at least one of the energy storage cells and the circuit board, and (ii) heat transfer from at least one of the energy storage cells to the electrically insulating substrate); and a temperature sensor mounted to a surface of the circuit board and configured to measure the temperature of at least one of the energy storage cells based on the temperature of the electrically insulating substrate of the circuit board. The temperature sensor is electrically isolated from the electrically conductive terminals. Heat is allowed to flow from at least one of the energy storage cells to the temperature sensor via the electrically conductive terminals and the electrically insulating substrate.

[0006] This disclosure also relates to systems and methods for implementing operating circuits. The method includes: using conductive terminals to concurrently facilitate (i) the measurement of voltage of an energy storage cell, and (ii) thermal transfer from the energy storage cell to a conductive plane provided within a circuit board; allowing heat to flow from the energy storage cell to a substrate of the circuit board via the conductive terminals and the conductive plane; and using a temperature sensor mounted to the surface of the circuit board to measure the temperature of the energy storage cell based on the temperature of the substrate of the circuit board. The temperature sensor is electrically isolated from the conductive terminals and the conductive plane. Attached Figure Description

[0007] This scheme will be described with reference to the following figures, wherein the same reference numerals denote the same items in all figures.

[0008] Figure 1 A perspective view of the power supply is provided.

[0009] Figure 2 Provided Figure 1 An illustrative block diagram of the power supply shown.

[0010] Figure 3 supply Figure 1 The diagram shows a perspective view of the power supply's energy module.

[0011] Figure 4 supply Figure 3 The image shows an assembled view of the energy module.

[0012] Figure 5 Provided in Figures 3 to 4 An illustrative block diagram of the circuitry in the energy module shown.

[0013] Figures 6 to 7 An illustration of the energy module is provided, which can be used to understand the typical placement of the temperature sensor within it.

[0014] Figures 8 to 10 A diagram is provided that can be used to understand the energy module circuit with a surface-mount temperature sensor according to this scheme.

[0015] Figure 11 A diagram of another energy module circuit with a surface-mount temperature sensor according to this scheme is provided.

[0016] Figure 12 A diagram of an energy module circuit is provided, which has electrically isolated and thermally conductive components connected between a surface-mounted temperature sensor and conductive terminals.

[0017] Figures 13A to 13B (Hereinafter referred to as “Figure 13”) provides an illustration of the thermal isolation features.

[0018] Figure 14 A diagram is provided illustrating an energy module circuit with multiple voltage and temperature sensors.

[0019] Figure 15 A flowchart illustrating the method for operating the circuit is provided. Detailed Implementation

[0020] This solution is described with reference to the accompanying drawings. The drawings are not to scale and are provided solely for illustrative purposes. Several aspects of this solution are described below with reference to example applications used for illustration. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding of this solution. However, those skilled in the art will readily recognize that this solution can be practiced without one or more specific details or using other methods. In other instances, well-known structures or operations are not shown in detail to avoid obscuring this solution. This solution is not limited to the order of the actions or events shown, as some actions may occur in a different order and / or concurrently with other actions or events. Furthermore, not all actions or events shown are required to implement the method according to this solution.

[0021] It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, within the scope of the terms “comprising,” “including,” “having,” “having,” “with,” or variations thereof used in the detailed description and / or claims, these terms are intended to be inclusive in a manner similar to the term “comprising.”

[0022] Furthermore, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this scheme pertains. It will be further understood that terms such as those defined in common dictionaries should be interpreted as having the same meaning as their meaning in the context of the relevant field, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0023] As mentioned above, conventional manufacturing processes for battery cell devices are relatively labor-intensive, inefficient, time-consuming, and expensive. Therefore, there is a need for battery cell designs that facilitate improved manufacturing processes. This solution relates to a novel temperature sensor design that allows for improved manufacturing processes for battery devices with cell temperature monitoring features.

[0024] Figure 1 An illustration of a power source 100 is provided. The power source 100 may be portable or otherwise mobile. The power source 100 may have a certain size and weight to allow a single person to carry it relatively easily and / or to allow it to be carried in a backpack or other bag. The power source 100 may be connected in series or parallel with other power sources to form a power unit.

[0025] Power supply 100 is typically configured to supply power to the load ( Figure 1(Not shown) supplies power. Loads may include any electronic equipment that needs to be powered. Such loads may include, but are not limited to, another power source, communication equipment, media equipment, golf carts, electrical appliances, computing equipment, and / or professional or home energy storage systems.

[0026] like Figure 1 As shown, the power supply 100 includes a housing 102 that houses a plurality of energy modules 104. Each energy module 104 is typically configured to convert a direct current (DC) output from an internal energy storage cell into an alternating current (AC) output for that energy module. The energy storage cell may include, but is not limited to, battery cells and / or supercapacitors. The energy modules 104 are electrically connected to each other via insulated wires 106, 108. In this way, the AC outputs of the energy modules are combined or otherwise added together to produce the AC output power of the power supply 100. More specifically, the energy modules 104 are connected in series in a controllable manner to supply different voltages at the output of the power supply 100. Connectors 112, 114 are located at the distal ends of the insulated wires 106, 108 to provide a means of connecting the output of the power supply 100 to a load.

[0027] In some applications, more than one instance of power supply 100 can be coupled together to obtain a larger capacity power supply and / or a multi-voltage power supply. Such multiple instances of power supply 100 can, for example, be enclosed in a common housing. Figure 1 (Not shown in the image). Multiple instances of power supply 100 may also be used to obtain a multiphase power supply. It should be understood that this arrangement can further benefit from reliable thermal monitoring of the energy storage cells packaged together.

[0028] The operation of energy module 104 can be controlled using internal circuitry 120. Now, regarding... Figure 2 The block diagram discusses illustrative techniques used to control the energy module. The energy module is located in... Figure 2 The figures are labeled 1041, 1042, ..., 104. N Indicates. Energy modules 1041, 1042, ..., 104 N In this document, they can be collectively referred to as Energy Module 104. N is an integer equal to or greater than 1.

[0029] like Figure 2 As shown, circuit 120 may include an optional controller 200, filter 202, and plug device 204. In some scenarios, where power supply 100 is part of a power grid, controller 200 may reside outside power supply 100. The power grid may include multiple power sources connected to each other and controlled by a unit controller. For ease of illustration and explanation of system operation, controller 200 is shown as being inside power supply 100. However, this approach is not limited to the configuration shown. Plug device 204 may include wires (e.g., Figure 1 Wires 106, 108), connectors (e.g., Figure 1 Connectors 112, 114) and / or other components are used to supply power to the load.

[0030] Controller 200 is configured to selectively activate and deactivate energy modules 104 to ensure that power supply 100 delivers AC power to the load at the correct voltage, current, and frequency. Controller 200 is connected to energy modules 1041, 1042, ..., 104. N Each of these modules allows for individual control of the energy module. The controller 200 is configured to selectively switch each energy module between battery mode and bypass mode. When the energy module is in battery mode, the internal energy storage cell is switched into the circuit, connecting it between its terminals 210 and 212. Thus, a voltage output from the energy storage cell is provided at terminals 210 and 212. Conversely, when the energy module is in bypass mode, the internal energy storage cell is bypassed, causing terminals 210 and 212 to be directly shorted. In effect, no voltage from the energy storage cell is provided at terminals 210 or 212 of the energy module.

[0031] Specifically, the energy module can provide the following operating modes: Hi-Z (high impedance) mode, in which the module output is set to a high impedance state (e.g., associated with no switches being turned on in the module); bypass mode, in which the energy module does not contribute any battery voltage but allows current to flow through it (e.g., through the two low-side switches of the H-bridge being turned on); on+ mode, in which the energy storage cell is connected to the module output with a given polarity; and on- mode, in which the energy storage cell is connected to the module output with the opposite polarity compared to the on+ mode.

[0032] By continuously switching the energy module from bypass mode to battery mode, the combined output voltage of energy module 104 can be gradually increased. Similarly, by continuously switching the energy module from battery mode to bypass mode, the combined output voltage of energy module 104 can be gradually decreased. The combined output voltage can be equal to the output voltage V of one energy module. M The quantity changes. Therefore, the combined output voltage V C It can be used at zero volts and N times V. M Variation between volts (i.e., 0 volts < V) C < N V M (Volt). In order to in V M More refined transitions are achieved between steps, and at least one energy module can operate in pulse width modulation (PWM) mode with a time-varying duty cycle. Combined output voltage V CThe signal can be smoothed by filter 202 to generate a voltage signal on line 214. The voltage signal on line 214 can have sinusoidal characteristics, DC signal characteristics, or other waveform characteristics.

[0033] Figure 3 A diagram of energy module 104 is provided. Figure 4 An assembly view of the energy module 104 is provided. Figure 1 Energy module 104 and Figure 2 1041, 1042, ..., 104 N Can be with Figure 3 The energy modules shown are the same or similar.

[0034] The energy module 104 includes a housing 302 that houses energy storage cells 400 to maintain certain positions relative to each other. The energy storage cells 400 can be configured as three cells in two rows, such as... Figures 3 to 4 As shown in the diagram. This solution is not limited in this respect. Energy storage cells can have different characteristics from those shown in the diagram. Figures 3 to 4 The configuration shown is as described. Any number of energy storage cells can be configured in this energy module depending on the given application. Each energy storage cell may include, but is not limited to, a lithium-ion cell. Therefore, energy module 104 may include energy storage cells in the form of batteries, capacitors, or supercapacitors, the like, or combinations thereof. The energy storage cell or lithium-ion cell may have a cylindrical shape as shown or another shape not shown (e.g., a rectangular shape).

[0035] A top cover 304 and a bottom cover 306 are provided for the housing 302. Covers 304 and 306 can be configured to provide an environmental seal together with the housing 302. The environmental seal can be achieved by compressing gaskets (in...) between the covers 304 and 306 and the sidewalls of the housing. Figures 3 to 4 (Not visible or shown in the image) to facilitate this. Module 104 also includes a power output interface 310.

[0036] Safe and reliable operation of the energy module 104 may require constant monitoring of each energy storage cell 400 to detect when its current, voltage, and / or temperature fall outside a defined operating range. This monitoring can be implemented using circuitry 410, which may also be housed within housing 302. Conductive connectors 404, 406, and 408 are configured to connect the energy storage cell 400 to circuitry 410 for at least voltage measurement. In some non-limiting examples, conductive connector 404 may also be used to direct operationally generated heat away from circuitry 410 (e.g., heat generated by switching elements), preferably away from module 104. Alternatively or additionally, in some non-limiting examples, circuitry 410 may be arranged such that storage components 400 are also used to draw operationally generated heat away from circuitry 410. For example, thermal coupling (e.g., passive and / or active, such as gas or fluid cooling) may be provided between circuitry 410 and one or more storage components 400. Alternatively or additionally, as some non-limiting examples, the power output interface 310 can be used to direct heat generated during operation away from circuit 410. For example, the conductive connector 404 is implemented with a conductive material such as metal. Electrical conductors are generally also good thermal conductors. This can be utilized to also act as a heat sink or heat pipe to transfer heat generated during operation (e.g., heat generated when the switching components conduct current) away from circuit 410. It should be understood that, individually or in any combination, these measures can make module 400 more compact and, in some cases, also allow for hermetically sealed module 400. This can further result in more compact systems using one or more such modules 400. These measures can also result in modules and / or systems that include one or more modules that do not require active cooling (e.g., fans or any other type of additional components or media for cooling). Figure 5 A block diagram of circuit 410 is provided.

[0037] like Figure 5As shown, circuit 410 includes voltage and current sensors 506 connected to energy storage cells 400. These sensors 506 are configured to measure the voltage and / or current of each energy storage cell. Circuit 410 may also include temperature sensors 508 and module temperature sensors 518. Each temperature sensor 508 is configured to measure the temperature of one or more energy storage cells, while the module temperature sensor 518 is configured to measure the internal temperature of the energy module. More specifically, the temperature sensors sense the temperature near the power stage, which consists of FETs 520, 522, 522, and 526. The sensor measurements are transmitted from sensors 506, 508, and 518 to a data processor 502 for processing and measurement result acquisition. The data processor 502 may perform operations to transmit the sensor measurement results as sensor data to circuit 410, and / or perform operations to analyze the sensor measurement results to determine whether certain criteria are met. For example, if the parameter measurement result falls outside a defined range at a given time or within a certain time period, the data processor 502 causes the circuit interrupt 570 to switch from a closed state to an open state, thereby shutting down the power input and output of the energy module 104. The parameter measurement result may include voltage measurement result, current measurement result, or temperature measurement result.

[0038] Circuit 410 also includes a gate driver 504 and a switching circuit, shown herein in a non-limiting manner as a transistor active bridge 550. The switching circuit includes at least one switching element. As some non-limiting examples, the switching circuit can be implemented as a bridge topology including a switching element, such as a full H-bridge or a half H-bridge. The switching circuit can be of any form, for example, facilitating the electrical connection of one or more storage components 400 to electrical connections 560 and / or 562. The switching circuit or transistor active bridge circuit 550 is supplied with a DC voltage waveform by the energy storage cell 400. Thus, the transistor active bridge circuit 550 is connected to the energy storage cell 400 via input lines 510, 512. The transistor active bridge circuit 550 is also connected between a pair of output lines 560, 562. Output lines 560, 562 are connected to... Figure 2 Power interfaces 210 / 212 and / or Figure 3 310.

[0039] The transistor active bridge circuit 550 includes multiple switches, shown in this example as N-channel type field-effect transistors (FETs) 520, 522, 524, and 526. Each FET may include a metal-oxide-semiconductor FET (MOSFET). Alternatively, other types of switches are possible, such as, but not limited to, switches based on bipolar junction transistors (BJTs) or insulated-gate bipolar transistors (IGBTs), or even relays. In this example, each FET 520, 522, 524, and 526 has three (3) terminals, respectively defined as source S, gate G, and drain D. An electrical path is provided from the source to the drain of each FET 520, 522, 524, and 526. This path is generally referred to herein as a source-drain path. The source-drain path of the first FET 520 is connected in series with the source-drain path of the second FET 522. The series-connected transistor pairs 520 and 522 form a first series transistor combination connected across input lines 510 and 512. The source-drain path of the third FET 524 is connected in series with the source-drain path of the fourth FET 526 to form a second series transistor combination connected across input lines 510 and 512.

[0040] The transistor active bridge 550 may have outputs defined by output lines 560 and 562. A first output line in output line 560 may be connected to a first series combination 520, 522 at an interconnect point 564 between a first field-effect transistor 520 and a second field-effect transistor 522. A second output line in output line 562 may be connected to a second series combination 524, 526 at an interconnect point 566 between a third field-effect transistor 524 and a fourth field-effect transistor 526.

[0041] Gate driver 504 is provided for driving the gate G of each FET 520, 522, 524, 526. In this respect, the gate driver is configured to supply a voltage to the gate G of each FET at specific times to switch the FET to its "on" or "off" state. The gate driver is also configured to stop supplying voltage to the gate G of the FET at specific times to switch the FET to its "on" or "off" state. Gate driver circuitry is well known. Known or to be known gate driver circuitry can be used herein. In some cases, gate driver 504 can be implemented as different circuitry for each or some of the FETs 520, 522, 524, 526.

[0042] When gate driver 504 sends a gate control signal to FETs 520 and 526, FETs 520 and 526 are biased and switched to their "on" state, thereby providing voltage from the energy storage cell 400 at output lines 560 and 562. In practice, current can flow between the drain (D) and source (S) of these FETs to power the load connected between output lines 560 and 562. When the gate control signal is no longer output from the gate driver circuit, FETs 520 and 526 return to their "off" state. Similarly, when gate driver 504 sends a gate control signal to FETs 522 and 524, FETs 522 and 524 are biased and switched to their "on" state, thereby providing voltage from the energy storage cell 400 at output lines 560 and 562, but with the opposite polarity compared to the "on" state of FETs 520 and 526. In practice, current can flow between the drain (D) and source (S) of these FETs 522 and 524 to power the load connected between output lines 560 and 562. It should be understood that when FETs 522 and 524 are "on," the load will experience a current of opposite polarity compared to when FETs 520 and 526 are "on." FETs 522 and 524 transition back to their "off" state when the gate control signal is no longer output from the gate driver. The gate driver can be configured to prevent two FETs in each series pair 520 / 526 and 522 / 524 from closing simultaneously or concurrently.

[0043] The manufacturing process for conventional energy modules is relatively labor-intensive, inefficient, time-consuming, and expensive. This is at least in part due to the use of wired or long-pin temperature sensors for cell temperature measurement. Figures 6 to 7 A diagram is provided to illustrate a conventional temperature sensor architecture for understanding an energy module. This conventional architecture includes a temperature sensor 606 mounted to extend into an empty space 604 between energy storage cells 6021, 6022, 6023, and 6024, and to facilitate proximity to the energy storage cells 6022 and 6024 for positioning. In this manner, the temperature of the energy storage cells 6022 and 6024 is coupled to the temperature sensor 606. For example, the temperature sensor 606 may include a through-hole technology (THT) sensor. The pins 700 of the temperature sensor 606 are soldered to a circuit board 702. The placement of the temperature sensor 606 within the energy storage cells and the soldering of the temperature sensor 606 to the circuit board 702 are performed manually during the manufacturing process of the energy module 600.

[0044] This solution provides a novel temperature sensor architecture for power modules that eliminates the need for long-pin temperature sensors in the modules, thus saving on manual processes. This is achieved by using surface-mount (SMT) sensors for measuring cell temperature. SMT sensors are better suited for automated manufacturing processes of power modules, minimizing cost and time.

[0045] It should be noted that SMT temperature sensors mounted on a circuit board may be more affected by temperature sources on the same circuit board than by the energy storage cells. Furthermore, the greater proximity of the SMT sensor to the energy storage cells can cause a reduction in temperature measurement capability or reliability. Therefore, this solution addresses this issue by maximizing heat conduction from the SMT temperature sensor to the battery cells and minimizing heat conduction from the SMT temperature sensor to other temperature sources on the circuit board. As the discussion progresses, the methods for achieving this will become apparent. However, this is typically achieved through SMT temperature placement, circuit board layout, the use of battery voltage sensing connections, and / or other optional aspects to increase or decrease heat conduction in one or the other direction.

[0046] Figure 8 A perspective view of the illustrative architecture of the internal circuitry 800 of the energy module is provided. The energy module may include, but is not limited to, [other types of circuitry]. Figure 1 Energy module 104 Figure 2 Energy modules 1041, ..., 104 N or Figure 3 The energy module. Figures 4 to 5 Circuit 410 can be connected with Figure 8 The circuit is the same as or similar to that of 800.

[0047] like Figure 8 As shown, for simplicity, the internal circuitry 800 will be described with respect to a single conductive terminal 804 and a single temperature sensor 812. The conductive terminal 804 can be configured to facilitate voltage sensing and measurement. In other words, the primary purpose of the conductive terminal 804 may be to provide an electrical signal at the internal circuitry 800. However, it should be understood that the internal circuitry 800 may include any number of conductive terminals and temperature sensors selected according to a specific application. For example, as... Figure 14 As shown in the top view, the circuit may include four conductive terminals and four temperature sensors. This solution is not limited to... Figure 14 The details are as follows. The following discussion is sufficient to understand the architecture of each pair of components 804, 812 in the internal circuitry containing the energy module.

[0048] It should also be noted that the data processor (e.g., data processor 502) is electrically connected to the conductive terminal 804 and the temperature sensor 812, thereby enabling the reception of voltage and temperature measurement results. The data processor is configured to detect when the voltage and temperature measurement results fall outside a pre-specified range. For the sake of simplicity and brevity in the illustration, Figure 8 The data processor and these electrical connections are not shown in the diagram.

[0049] Conductive terminal 804 includes a distal end 806, which may be soldered or otherwise coupled to the energy storage cell. Conductive terminal 804 may include, but is not limited to, Figure 4 Conductive terminal 404. Temperature sensor 812 may include, but is not limited to, surface-mount thermistors or other surface-mount temperature sensors.

[0050] In addition to components 804 and 812, circuit 800 also includes other electronic components 814 mounted on a multilayer circuit board 802. These electronic components may include, but are not limited to, resistors, capacitors, inductors, amplifiers, filters, and selective circuit interrupters (e.g., Figure 5 Selective circuit interruption 570), voltage regulator (e.g., Figure 5 Voltage regulator 542), isolator (e.g., Figure 5 isolator 540), processor (e.g., Figure 5 Data processor 502), gate driver (e.g., Figure 5 Gate driver 504), transistor active bridge circuit (e.g., Figure 5 Transistor active bridge circuit 550).

[0051] The multilayer circuit board 802 includes substrate layers 822, 826, and 830 and conductive layers 820, 824, 828, and 832. The exact number of layers possessed by the circuit board 802 is not necessary or limiting for this teaching. Substrate layers 822, 826, and 830 are formed of the same or different dielectric materials. Each of the conductive layers 820, 824, 828, and 832 may include one or more conductors 840, 842, 844, 846, and 848 formed thereon. Conductors 840, 842, 844, 846, and 848 may include, but are not limited to, traces. It should be noted that this solution is not limited to... Figures 8 to 10 The conductive layer architecture is shown in the diagram. For example, the conductive layer 820 may be less than or greater than the distance D2 from the conductive connection 810. Additionally or alternatively, the conductive layer 820 may cover all or part of the surface of the substrate layer 822, and / or include conductive traces that connect the conductive connection 810 to another component residing elsewhere on the substrate layer 822.

[0052] A through-hole pad 834 is formed through the circuit board 802. A connecting member 808 of a conductive terminal 804 extends through the through-hole pad 834. The connecting member 808 can be coupled to the circuit board 802 using solder, and an electrical connection is provided between the conductive terminal 804 and the conductor 844. This connection is referred to as a conductive connection 810. The conductive connection 810 may include, but is not limited to, a solder joint.

[0053] When the module is like Figure 9 In the assembly shown, temperature sensor 812 is mounted on side 870 of circuitry 800 facing energy storage cells 9021 and 9022. Temperature sensor 812 is positioned close to conductive terminal 804 and conductor 844, allowing it to detect the temperature of energy storage cells 9021 and 9022 via conductive terminal 804. Since the distal end 806 of conductive terminal 804 is directly conductively connected to energy storage cells 9021 and 9022, conductive terminal 804 also provides relatively good thermal conductivity suitable for cell temperature measurement, while simultaneously providing the primary purpose of relatively good electrical conductivity suitable for cell voltage measurement. Therefore, an electrical component primarily intended to establish an electrical connection is further utilized to obtain more accurate temperature measurements in a non-contact manner with the monitored device. It should be understood that, in this case, the "monitored device" will be one or more of the energy storage cells.

[0054] It should be noted that the temperature sensor 812 is not directly electrically connected to the conductive terminal 804. Electrical isolation between the temperature sensor 812 and the conductive terminal 804 is facilitated by the design of the multilayer circuit board 802, the relative positions of the two components 804 and 812, and the relative positions of components 812 and 844. First, the thickness t of the substrate layer 830 is chosen to be relatively thin. For example, in some scenarios, the thickness t is chosen to be less than 0.2 mm to ensure that the conductive layers 828 and 832 are positioned relatively close to each other. Second, a conductive trace or plane 844 is disposed on the conductive layer 828, (i) to be electrically connected to the conductive terminal 804 via the conductive connection 810, and (ii) to reside directly in the vicinity of (e.g., above) the temperature sensor 812. The size, shape, and / or material of the conductive plane 844 can be selected to maximize thermal conduction to the temperature sensor 812. For example, the conductive plane 844 may substantially overlap with or extend the area occupied by the temperature sensor 812 on layer 832. The conductive plane 844 is formed of a conductive material configured to provide thermal conductivity with the conductive terminal 804. The conductive material may include, but is not limited to, copper, tin, gold, or other materials or alloys. A data processor can be electrically connected to the conductive terminal via the conductive plane. Therefore, in addition to its primary task of performing routing or establishing electrical connections between the conductive terminal 804 and other electrical components, the conductive plane 844 can also serve as a thermal conductor for the temperature sensor 812. This saves space and cost. It also simplifies manufacturing processes, such as the assembly of the energy module 104. By preventing deformation of the sensor leads during production, the temperature sensor with leads can be protected. This improves the yield of the assembled module.

[0055] The substrate 830 is formed of a material configured to provide thermal conduction and electrical isolation between the conductive connection 810 and the temperature sensor 812, and between the conductive plane 844 and the temperature sensor 812. The temperature sensor 812 is disposed on the circuit board 802 at a location providing a gap 850 between itself and the connection member 808 of the conductive terminal 804. The size of the gap 850 is chosen to ensure electrical isolation between the temperature sensor and the conductive connection 810. Therefore, despite electrical isolation from the conductive terminal 804, this structure allows for good thermal contact with the temperature sensor 812.

[0056] exist Figure 8In this circuit, region 860 includes conductive connection 810 and temperature sensor 812. Region 860 is thermally isolated from other electrical components of circuit 800. These other electrical components include conductors 840, 842, 846, 848 and electronic component 814. A gap 852 is provided between region 860 and components 814, 846, 848. The size and shape of gap 852 are selected such that region 860 is located at least a given distance D1 from the nearest edge 862 of each conductor 846, 848. A gap 856 is also provided between region 860 and conductors 840, 842. The size and shape of gap 856 are selected such that region 860 is located at at least a given distance D2 from the nearest edge 864 of each conductor 840, 842. Distances D1 and D2 are selected to ensure a minimum amount of thermal conduction between region 860 and components 814, 840, 842, 846, 848 of circuit 800. Figure 10 The diagram provided illustrates the thermal isolation and conductive areas of circuit 800.

[0057] like Figure 10 As seen, temperature sensor 812 is mounted on surface 1004 of circuit board 802 facing energy storage cells 9021 and 9022. Temperature sensor 812 can be configured to output a signal that includes a value corresponding to the measured temperature of energy storage cells 9021 and 9022.

[0058] The thermal conductivity from temperature sensor 812 to energy storage cells 9021, 9022 is greater than the thermal conductivity from temperature sensor 812 to other temperature sources (e.g., 814, 840, 842, 844, 846, and / or 848) mounted on circuit board 802. These other temperature sources may optionally include processing circuitry disposed on the circuit board. The processing circuitry may include, but is not limited to, electronic components such as resistors, capacitors, inductors, amplifiers, filters, selective circuit interrupters, voltage regulators, isolators, processors, gate drivers, and / or transistor active bridge circuitry.

[0059] Heat is allowed to flow from the energy storage cells 9021, 9022 to (e.g., toward) the first surface 1006 of the distal end 806 of the conductive terminal 804, and electrically isolated (e.g., through air) from the opposing second surface 1008 of the distal end 806 of the conductive terminal 804 to the temperature sensor 812. The first surface 1006 of the distal end 806 is adjacent to and in contact with the energy storage cells 9021, 9022. The second surface 1008 of the distal end 806 faces and is spaced apart from the temperature sensor 812. The temperature sensor may reside between the distal end 806 of the conductive terminal 804 and a conductive plane 844 disposed on an electrically isolated substrate 830. The distal end 806 of the conductive terminal 804 may include a first elongated member extending substantially perpendicular to a second elongated member (e.g., 844) through the circuit board 802.

[0060] This plan is not limited to Figures 8 to 10 The architecture is shown. The temperature sensor instead resides on the opposite side 1100 of the circuit board, opposite the energy storage cell, as shown. Figure 11 As shown in the diagram. This alternative placement of the temperature sensor allows access to the temperature sensor after the conductive terminals are soldered to the circuit board. After the conductive terminals are soldered to the circuit board, the temperature sensor and the conductive connection can be thermally connected and still electrically isolated by any suitable material 1102. The material 1102 may include, but is not limited to, potting materials, thermal adhesives, and / or thermal pastes.

[0061] Alternative or additional land may be used, such as Figure 12 One or more electrically isolated and thermally conductive components 1202 are shown to improve thermal conduction from the conductive connection 810 to the temperature sensor. The electrically isolated and thermally conductive component 1202 may include, but is not limited to, thermal jumpers, thermal paste, thermal adhesive, and / or thermal potting materials. Component 1202 may be connected between the conductive connection 810 and / or the temperature sensor. Any known or to be known electrically isolated and thermally conductive component may be used herein.

[0062] Alternatively or additionally, the circuit board may be milled or otherwise processed such that thermal isolation features are formed therein, providing thermal isolation between region 860 and conductors 840, 842, 846, 848. Thermal isolation features 1300, 1302, 1350, 1352 may be as follows: Figure 13A As shown, it extends all the way through the circuit board, or as... Figure 13B The diagram shows only a partial extension through the circuit board.

[0063] Figure 15A flowchart of an illustrative method 1500 for operating a circuit is provided. Method 1500 begins at 1502 and continues to 1504, wherein electronic components of the circuit (e.g., Figure 8 Component 814) and circuit board (e.g., Figure 8 The area of ​​the circuit board 802 (e.g., Figure 8 The circuit board provides electrical and thermal isolation between regions 860, and includes conductive terminals (e.g., ...). Figure 8 Conductive terminal 804), temperature sensor (e.g., Figure 8 Temperature sensor 812) and optional conductive plane (e.g., Figure 8 The conductive plane 844). Thermal isolation can be achieved by one or more gaps located on and within the circuit board (e.g., the conductive plane 844). Figure 8 The gaps are 852 and 856. Figure 13A Thermal isolation features 1300, 1302 and / or thermal isolation features 1350, 1352 of Figure 13 are provided between other electronic components and areas. The gap may be filled with a gas (e.g., air) or a portion of at least one material forming the circuit board or any other material providing thermal isolation. In 1506, conductors (e.g., ...) on the circuit board are also included. Figure 8 The conductors (840, 842, 846, 848) provide electrical and thermal isolation between themselves and areas of the circuit board, including cell voltage sensors, temperature sensors, and optional conductive planes.

[0064] In 1508, conductive terminals are used to facilitate (i) an electrical connection between the circuit board and at least one of the energy storage cells and / or (ii) an electrical connection to the energy storage cell (e.g., Figure 9 The voltage of the energy storage cells 9021 and / or 9022 is measured. Thus, the conductive terminals are electrically connected to the data processor (e.g., Figure 5 The data processor 502 enables voltage measurements to be analyzed to detect when the energy storage cell is not operating as expected (e.g., the battery voltage falls outside the acceptable range). This electrical connection between the conductive terminals and the data processor can be achieved using a conductor or conductive plane disposed on the substrate layer of the circuit board.

[0065] The 1510 also uses conductive terminals to facilitate heat transfer from the energy storage cell to a conductive plane disposed within the circuit board. The 1510 may also optionally involve using conductive connections provided between the conductive terminals and the circuit board to further facilitate heat transfer from the energy storage cell to the conductive plane.

[0066] In 1512, heat is allowed to flow from the energy storage cell to the substrate of the circuit board via conductive terminals, conductive connections, and / or conductive planes (e.g., Figure 8The substrate layer 830). Optionally, heat can also be allowed to flow in 1514 through electrically isolated and thermally conductive components connecting the conductive terminals and the temperature sensor (e.g., Figure 12 Component 1202).

[0067] In 1516, a temperature sensor (e.g., Figure 8 The temperature sensor 812 measures the temperature of the energy storage cell based on the temperature of the substrate of the circuit board. The temperature sensor is mounted to the surface of the circuit board for electrical isolation from conductive terminals and conductive planes. The conductive plane is disposed on a first side of the substrate layer, and the temperature sensor is disposed on the opposite second side of the substrate layer, at a position overlapping the conductive plane.

[0068] Subsequently, method 1500 continues to box 1518, where method 1500 terminates or performs other operations. Other operations may include, but are not limited to, returning to box 1502.

[0069] Although this solution has been shown and described with respect to one or more embodiments, equivalent changes and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. Furthermore, while a particular feature of this solution may have been disclosed with respect to only one of several embodiments, such features may be combined with one or more other features of other embodiments, as may be desired and advantageous for any given or particular application. Therefore, the breadth and scope of this solution should not be limited by any of the foregoing scenarios. Rather, the scope of this solution should be defined by the appended claims and their equivalents.

[0070] Without excluding further possible embodiments, certain example embodiments are summarized in the following terms:

[0071] Clause 1: A circuit comprising: one or more energy storage cells; a circuit board including an electrically isolated substrate; electrically conductive terminals connected between at least one of the energy storage cells and the circuit board, the electrically conductive terminals being configured to concurrently facilitate (i) an electrical connection between the at least one of the energy storage cells and the circuit board, and (ii) heat transfer from the at least one of the energy storage cells to the electrically isolated substrate; and a temperature sensor mounted to a surface of the circuit board and configured to measure the temperature of the at least one of the energy storage cells based on the temperature of the electrically isolated substrate of the circuit board. The temperature sensor is electrically isolated from the electrically conductive terminals. Heat is allowed to flow from the at least one of the energy storage cells to the temperature sensor via the electrically conductive terminals and the electrically isolated substrate.

[0072] Clause 1A. The circuit according to Clause 1, wherein the temperature sensor is mounted on the surface of a circuit board facing the energy storage cell, and / or the temperature sensor is configured to output a signal including a value corresponding to the measured temperature of the energy storage cell.

[0073] Clause 1B. The circuit according to any one of the preceding clauses, wherein the thermal conductivity between the temperature sensor and the energy storage cell (e.g., from the energy storage cell) is greater than the thermal conductivity between the temperature sensor and other temperature sources (e.g., heat sources) disposed on the circuit board (e.g., from the other temperature sources). The other temperature sources or heat sources may optionally include processing circuitry disposed on the circuit board. The processing circuitry may include, but is not limited to, electronic components such as resistors, capacitors, inductors, amplifiers, filters, selective circuit interrupters, voltage regulators, isolators, processors, gate drivers, and / or transistor active bridge circuitry.

[0074] Clause 1C. A circuit according to any one of the preceding clauses, wherein: heat is allowed to flow from the energy storage cell to (e.g., toward) a first surface at the distal end of the electrically conductive terminal, and flows electrically isolated (e.g., through air) from an opposing second surface at the distal end of the electrically conductive terminal to the temperature sensor; the first surface at the distal end is adjacent to and in contact with the energy storage cell; and / or the second surface at the distal end faces the temperature sensor and is spaced apart from the temperature sensor.

[0075] Clause 1D. The circuit according to any one of the preceding clauses, wherein the temperature sensor resides between the distal end of the electrically conductive terminal and the conductive plane disposed on the electrically isolated substrate.

[0076] Clause 1E. A circuit according to any one of the preceding clauses, wherein the distal end of the electrically conductive terminal includes a first elongated member extending substantially perpendicular to a second elongated member passing through the circuit board.

[0077] Clause 2: The circuit according to any one of the preceding clauses further includes a conductive connection provided between the electrically conductive terminal and the circuit board, the conductive connection being configured to further facilitate heat transfer from at least one of the energy storage cells to a conductive plane disposed on the electrically isolated substrate.

[0078] Clause 3: The circuit according to any one of the preceding clauses, wherein the conductive connection provides a path that allows heat to flow further to the temperature sensor.

[0079] Clause 4: The circuit according to any one of the preceding clauses further includes an electrically isolated and thermally conductive component connected between the conductive connection and the temperature sensor.

[0080] Clause 5: The circuit according to any one of the preceding clauses, wherein the conductive plane is disposed on a first side of the substrate, and the temperature sensor is disposed on an opposite second side of the substrate at a position overlapping the conductive plane.

[0081] Clause 6: The circuit according to any one of the preceding clauses further includes at least one other electronic component, said at least one other electronic component being thermally isolated from the area of ​​the circuit board including the conductive terminal, the temperature sensor and the conductive plane disposed on the substrate.

[0082] Clause 7: The circuit according to any one of the preceding clauses further includes one or more gaps located on and within the circuit board between the region and the at least one other electronic component.

[0083] Clause 8: A circuit according to any one of the preceding clauses, wherein the one or more gaps are filled with gas or other thermally insulating material, the other thermally insulating material comprising a portion of at least one material forming the circuit board.

[0084] Clause 9: A circuit according to any one of the preceding clauses, wherein the plurality of conductors of the circuit board are thermally isolated from the region of the circuit board including the conductive terminals, the temperature sensor and the conductive plane disposed on the substrate.

[0085] Clause 10: The circuit according to any one of the preceding clauses further includes a data processor electrically connected to the conductive terminal and the temperature sensor, and configured to detect when the voltage and temperature measurement results fall outside a pre-specified range.

[0086] Clause 11: A method for operating a circuit, comprising: using conductive terminals to concurrently facilitate (i) measurement of voltage of an energy storage cell, and (ii) thermal transfer from the energy storage cell to a conductive plane provided within a circuit board; allowing heat to flow from the energy storage cell to a substrate of the circuit board via the conductive terminals and the conductive plane; and using a temperature sensor mounted to a surface of the circuit board to measure the temperature of the energy storage cell based on the temperature of the substrate of the circuit board, wherein the temperature sensor is electrically isolated from the conductive terminals and the conductive plane.

[0087] Clause 12: The method according to Clause 11 further includes using a conductive connection provided between the conductive terminal and the circuit board to further facilitate heat transfer from the energy storage cell to the conductive plane.

[0088] Clause 13: The method according to any one of the preceding method clauses further includes allowing heat to flow further through the conductive connection.

[0089] Clause 14: The method according to any one of the preceding method clauses further includes allowing heat to flow further through an electrically isolated and thermally conductive component connected between the conductive connection and the temperature sensor.

[0090] Clause 15: The method according to any one of the preceding method clauses, wherein the conductive plane is disposed on a first side of the substrate, and the temperature sensor is disposed on an opposite second side of the substrate at a position overlapping the conductive plane.

[0091] Clause 16: The method according to any one of the preceding method clauses further includes providing thermal isolation between other electronic components or conductors and areas of the circuit board, including conductive terminals, temperature sensors and conductive planes.

[0092] Clause 17: The method according to any of the preceding method clauses, wherein the thermal isolation is provided by one or more gaps located on and within the circuit board, between the other electronic components or conductors and the region.

[0093] Clause 18: The method according to any one of the preceding method clauses, wherein the one or more gaps are filled with gas or comprise a portion of at least one material forming the circuit board.

[0094] Clause 19: The method according to any one of the preceding method clauses further includes providing an electrical connection between the conductive terminal, the temperature sensor, and the data processor of the circuit.

[0095] Clause 20: An arrangement (e.g., a circuit or system) includes components for performing the steps according to any one of the above method clauses.

[0096] The breadth and scope of this disclosure should not be limited by any of the foregoing example embodiments, but should be defined solely by the appended claims and their equivalents.

Claims

1. A circuit comprising: One or more energy storage cells; Circuit board, the circuit board including an electrically isolated substrate; An electrically conductive terminal is connected between at least one of the energy storage cells and the circuit board, the electrically conductive terminal being configured to concurrently facilitate (i) an electrical connection between the at least one of the energy storage cells and the circuit board, and (ii) thermal transfer from the at least one of the energy storage cells to the electrically isolated substrate; and A temperature sensor, mounted to the surface of the circuit board and configured to measure the temperature of at least one of the energy storage cells based on the temperature of the electrically isolated substrate of the circuit board, wherein the temperature sensor is electrically isolated from the electrically conductive terminals; Heat is allowed to flow from at least one of the energy storage cells to the temperature sensor via the electrically conductive terminal and the electrically isolated substrate.

2. The circuit of claim 1, further comprising a conductive connection provided between the electrically conductive terminals and the circuit board, the conductive connection being configured to further facilitate heat transfer from at least one of the energy storage cells to a conductive plane disposed on the electrically isolated substrate.

3. The circuit according to claim 2, wherein, The conductive connection provides a path that allows heat to flow further to the temperature sensor.

4. The circuit according to claim 2 or claim 3 further includes an electrically isolated and thermally conductive component connected between the conductive connection and the temperature sensor.

5. The circuit according to any one of the preceding claims, wherein, The conductive plane is disposed on a first side of the substrate, and the temperature sensor is disposed on the opposite second side of the substrate at a position overlapping the conductive plane.

6. The circuit according to any one of the preceding claims further includes at least one other electronic component, said at least one other electronic component being thermally isolated from the area of ​​the circuit board including the conductive terminal, the temperature sensor and the conductive plane disposed on the substrate.

7. The circuit according to any one of the preceding claims, wherein, The region is spaced apart from the at least one other electronic component.

8. The circuit according to claim 7, wherein, The space between the region and the at least one other electronic component is filled with gas or includes a portion of at least one material forming the circuit board.

9. The circuit according to any one of the preceding claims, wherein, The multiple conductors of the circuit board are thermally isolated from the area of ​​the circuit board including the conductive terminals, the temperature sensor, and the conductive plane disposed on the substrate.

10. The circuit according to any one of the preceding claims further includes a data processor electrically connected to the conductive terminal and the temperature sensor, and configured to detect when the voltage and temperature measurement results fall outside a pre-specified range.

11. A method for operating a circuit, comprising: Conductive terminals are used to concurrently facilitate (i) the measurement of the voltage of the energy storage cell and (ii) the heat transfer from the energy storage cell to the conductive plane provided within the circuit board; This allows heat to flow from the energy storage cell to the substrate of the circuit board via the conductive terminals and the conductive plane; as well as The temperature of the energy storage cell is measured using a temperature sensor mounted on the surface of the circuit board, based on the temperature of the substrate of the circuit board, wherein the temperature sensor is electrically isolated from the conductive terminals and the conductive plane.

12. The method of claim 11, further comprising using a conductive connection provided between the conductive terminal and the circuit board to further facilitate heat transfer from the energy storage cell to the conductive plane.

13. The method according to claim 11 or 12, wherein, The conductive plane is disposed on a first side of the substrate, and the temperature sensor is disposed on the opposite second side of the substrate at a position overlapping the conductive plane.

14. The method according to any one of the preceding claims further includes providing an electrical connection between the conductive terminal, the temperature sensor, and the data processor of the circuit.

15. An arrangement comprising components for performing the steps of any one of the preceding method claims.

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