Etching device
By separating the film etching chamber into two chambers and monitoring the etching process with electrodes, the problem of difficulty in achieving symmetric and asymmetric etching in existing equipment is solved, and the uniformity and accuracy of the etching process are achieved, suitable for different sizes and shapes nuclear pore membrane preparation.
Patent Information
- Application Number
- CN202420678976.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-02
AI Technical Summary
It is difficult for existing etching equipment to achieve large-area symmetric etching, and the spray etching method can only achieve symmetric etching, cannot effectively deal with asymmetric etching requirements, and it is difficult to monitor the etching process.
An etching device is designed to separate the film etching chamber into two chambers, add the etching solution respectively, and apply voltage and detect current changes through the electrodes to monitor the etching process, so as to achieve symmetric or asymmetric etching.
The applicability of etching is improved, symmetrical and asymmetric etching can be achieved, the uniformity and accuracy of the etching process can be ensured, and core pore membranes with different pore sizes and shapes can be prepared.
Smart Images
Figure CN222135246U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of etching, in particular to an etching device. Background Art
[0002] Nuclear pore membrane, also known as heavy ion microporous membrane or nuclear track etched microporous membrane, nuclear track etched filter membrane, is a kind of precision screening membrane material with through-hole channels and uniform and regular pore size distribution. Materials such as PET, PC, and PI are irradiated with heavy ions to form latent tracks, UV sensitized, and finally chemical solutions are used to etch nuclear pore membranes with different pore types and pore sizes. The etching of nuclear pore membranes uses chemical solvent corrosion to expand the pores. For PET and PC materials, alkaline solutions such as NaOH / KOH are usually used as etching solutions. Since the alkaline solution has a higher reaction rate to the position bombarded by heavy ions, under alkaline solution conditions, regular shaped channels, such as columnar pores, will be left on the film.
[0003] When asymmetric etching is required, etching solution and blocking solution are added to both sides of the film, for example, alkaline etching solution and acid blocking solution are added to both sides of the film, so that asymmetric channels, such as conical channels, can be formed on the film. In addition, the raw materials of the nuclear pore membrane can also be PI, PP and other materials, and there are corresponding types of etching solutions.
[0004] Since the etching of nuclear pore membranes often requires placing them in strong acid, strong alkali or even strong oxidizing etching solutions for reaction, corresponding etching equipment is required. Existing etching equipment generally uses a clamp to clamp the film and places the film in a cup using magnetic stirring and heating. The above method is difficult to use for symmetrical etching of a large area; some etching equipment also uses spray etching, which can only achieve symmetrical etching. Utility Model Content
[0005] In order to overcome at least one defect of the above-mentioned prior art, the utility model uses a thin film to separate the etching chamber into two chambers. In this way, etching solutions can be added to the two chambers respectively to achieve symmetrical or asymmetrical etching of the thin film, and the applicability is strong; and the utility model can apply voltage through electrodes during the etching process and detect the change of current during the etching process to clarify the progress of thin film etching.
[0006] The technical solution adopted by the utility model to solve the problem is:
[0007] An etching device, comprising:
[0008] A base body, an etching cavity is arranged on the base body, a film installation area is arranged on the base body, the film installation area is used to install the film, and the film divides the etching cavity into two chambers;
[0009] Electrode: at least one electrode is arranged in each chamber.
[0010] In a preferred embodiment, the seat body includes two etching seats, the etching seats have etching grooves, the etching grooves of the two etching seats are spliced together to form an etching cavity, and the splicing surface between the two etching seats forms a thin film installation area.
[0011] In a preferred embodiment, the seat body includes a first heating plate and a second heating plate, the first heating plate is arranged on the side of the etching seat, and the second heating plate is arranged on the bottom of the etching seat;
[0012] The etching seat and the first heating plate are locked by bolts, and the etching seat and the second heating plate are locked by bolts.
[0013] In a preferred embodiment, the seat body includes two etching seats and a support plate, the etching seats have etching grooves, the etching grooves of the two etching seats are spliced together to form an etching cavity, the two support plates are arranged between the two etching seats, and the splicing surface between the two support plates forms a thin film installation area.
[0014] In a preferred embodiment, the etching device includes a first clamping structure, which is arranged between the etching seat and the support plate, and includes a first clamping concave portion and a first clamping convex portion that cooperate with each other;
[0015] The support plate is provided with a first clamping concave portion, and the etching seat is provided with a first clamping convex portion, or the etching seat is provided with a first clamping concave portion, and the support plate is provided with a first clamping convex portion.
[0016] In a preferred embodiment, the seat body includes a first heating plate and a second heating plate, the first heating plate is arranged on the side of the etching seat, and the second heating plate is arranged on the bottom of the etching seat;
[0017] The support plate, the etching seat and the first heating plate are locked by bolts, and the etching seat and the second heating plate are locked by bolts.
[0018] In a preferred embodiment, a water inlet is provided at the upper portion of the etching seat, a water outlet is provided at the lower portion of the etching seat, each chamber corresponds to at least one water inlet and at least one water outlet, and the water inlet and the water outlet are both connected to the corresponding chamber;
[0019] An electrode socket is arranged on the upper part of the etching seat, each chamber corresponds to at least one electrode socket, the electrode socket is communicated with the corresponding chamber, and the electrode socket is used for inserting the electrode.
[0020] In a preferred embodiment, the etching device includes a second clamping structure, which is arranged between two etching seats. The second clamping structure includes a second clamping recess and a second clamping protrusion that cooperate with each other, one of the etching seats is provided with the second clamping recess, and the other etching seat is provided with the second clamping protrusion.
[0021] In a preferred embodiment, the etching device includes a sealing structure, which is arranged between two etching seats. The sealing structure includes a sealing ring and a mounting groove that cooperate with each other. The etching seat is provided with a mounting groove, and the sealing ring is embedded in the mounting groove.
[0022] In a preferred embodiment, the etching device comprises an annular insert, and at least one annular insert is detachably disposed in the etching chamber.
[0023] In summary, the utility model has the following technical effects: the utility model uses a thin film to separate the etching chamber into two chambers, so that etching solutions can be added to the two chambers respectively to achieve symmetrical or asymmetrical etching of the thin film, and the applicability is strong; and the utility model can apply voltage through electrodes during the etching process and detect the change of current during the etching process to clarify the progress of thin film etching. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 This is a schematic diagram of the overall structure of Example 1 of the utility model;
[0025] Figure 2 For the utility model embodiment 1 Figure 1 Schematic diagram of the decomposition structure;
[0026] Figure 3 This is a schematic diagram of the structure of one of the etching seats in Example 1 of the utility model;
[0027] Figure 4 This is a schematic structural diagram of another etching seat in Embodiment 1 of the utility model;
[0028] Figure 5 This is a schematic structural diagram of a film and a support plate in Example 1 of the utility model;
[0029] Figure 6 For the utility model embodiment 1 Figure 1 A top view schematic diagram of
[0030] Figure 7 For the utility model embodiment 1 Figure 6 Schematic cross-sectional view along the AA direction;
[0031] Figure 8 This is the utility model embodiment 3 Figure 6 Schematic cross-sectional view along the AA direction.
[0032] The meanings of the reference numerals are as follows:
[0033] 10. seat body, 11. etching cavity, 111. etching groove, 12. film installation area, 13. etching seat, 14. first heating plate, 15. second heating plate, 20. film, 30. electrode, 40. support plate, 50. first clamping structure, 51. first clamping recess, 52. first clamping protrusion, 60. bolt, 70. water inlet, 80. water outlet, 90. electrode socket, 100. second clamping structure, 101. second clamping recess, 102. second clamping protrusion, 110. sealing structure, 111. sealing ring, 112. mounting groove, 120. annular insert. DETAILED DESCRIPTION
[0034] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0035] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.
[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0037] Example 1
[0038] See also Figure 1-Figure 7 The utility model discloses an etching device, including: a base body 10, an etching cavity 11 is arranged on the base body 10, a film installation area 12 is arranged on the base body 10, the film installation area 12 is used to install a film 20, and the film 20 divides the etching cavity 11 into two chambers; an electrode 30, and at least one electrode 30 is arranged in each chamber.
[0039] The utility model utilizes the film 20 to separate the etching chamber 11 into two chambers. Thus, etching solutions can be added to the two chambers respectively to realize symmetrical or asymmetrical etching of the film 20, and the applicability is strong. Moreover, the utility model can apply voltage during the etching process through the electrode 30 and detect the change of current during the etching process, so as to clarify the etching progress of the film 20.
[0040] Preferably, the film 20 has a thickness of 2 μm-100 μm.
[0041] When performing symmetrical etching: the same etching solution is added to the two chambers to achieve symmetrical etching of the film 20. Specifically, the etching solution is an etching solution; for example, the same alkaline etching solution is added to the two chambers respectively to achieve symmetrical etching of the film 20; or the same strong oxidizing etching solution is added to the two chambers respectively to achieve symmetrical etching of the film 20; it can be seen that the specific type of etching solution depends on the actual application scenario and is not limited to this.
[0042] When performing asymmetric etching: different etching solutions are added into the two chambers to realize asymmetric etching of the thin film 20. Specifically, the two different etching solutions are an etching solution and a blocking solution. For example, an alkaline etching solution and an acidic blocking solution are respectively added into the two chambers to realize asymmetric etching of the thin film 20. Or a strong oxidizing etching solution and a strong reducing blocking solution are respectively added into the two chambers to realize asymmetric etching of the thin film 20. It can be seen that the specific type of etching solution depends on the actual application scenario and is not limited thereto.
[0043] In an embodiment of the utility model, the seat body 10 includes two etching seats 13 and a support plate 40. The etching seat 13 has an etching groove 111. The etching grooves 111 of the two etching seats 13 are spliced together to form an etching cavity 11. The two support plates 40 are arranged between the two etching seats 13. The splicing surface between the two support plates 40 forms a thin film installation area 12.
[0044] Specifically, the two etching seats 13 are symmetrically arranged and can be spliced with each other. When the two etching seats 13 are spliced with each other, the etching grooves 111 of the two etching seats 13 are aligned with each other to form an etching cavity 11; since the film installation area 12 is arranged between the two support plates 40, the two support plates 40 are arranged between the two etching grooves 111, and the film 20 is installed in the film installation area 12, for example, the film 20 can be directly clamped between the two support plates 40, and the two etching grooves 111 correspond to two chambers.
[0045] The support plate 40 not only clamps and fixes the film 20, but also supports the film 20, thereby preventing the film 20 from shaking significantly in the solution. In order to prevent the support plate 40 from hindering the contact between the film 20 and the solution, the edge of the support plate 40 abuts against the edge of the film 20, and there is a gap between the rest of the support plate 40 and the rest of the film 20 for the solution to pass through, so that the solution contacts the film 20, thereby achieving uniform etching of the entire film 20.
[0046] Preferably, the support plate 40 is mesh-shaped, and the solution can enter the gap between the support plate 40 and the film 20 through the pores of the support plate 40 to achieve uniform etching of the entire film 20 .
[0047] Preferably, the etching seat 13 is a polytetrafluoroethylene block, so that the etching seat 13 can carry various types of solutions, such as strong acid etching solution, strong alkali etching solution or strong oxidizing etching solution; the support plate 40 is a polytetrafluoroethylene plate, so that the support plate 40 can contact various types of solutions, such as strong acid etching solution, strong alkali etching solution or strong oxidizing etching solution; the sizes of the etching seat 13 and the support plate 40 are determined according to actual conditions.
[0048] In an embodiment of the utility model, the etching device includes a first clamping structure 50, which is arranged between the etching seat 13 and the support plate 40, and the first clamping structure 50 includes a first clamping recess 51 and a first clamping protrusion 52 that cooperate with each other; the support plate 40 is provided with the first clamping recess 51, and the etching seat 13 is provided with the first clamping protrusion 52, or the etching seat 13 is provided with the first clamping recess 51, and the support plate 40 is provided with the first clamping protrusion 52; the first clamping structure 50 is conducive to installing the support plate 40 on the etching seat 13.
[0049] In an embodiment of the utility model, the seat body 10 includes a first heating plate 14 and a second heating plate 15, the first heating plate 14 is arranged on the side of the etching seat 13, and the second heating plate 15 is arranged on the bottom of the etching seat 13; the support plate 40, the etching seat 13 and the first heating plate 14 are locked by bolts 60, and the etching seat 13 and the second heating plate 15 are locked by bolts 60; in this way, the support plate 40, the etching seat 13 and the first heating plate 14 are locked by bolts 60, and the etching seat 13 and the second heating plate 15 are locked by bolts 60, so as to achieve the purpose of uniform heat transfer.
[0050] In the embodiment of the utility model, a water inlet 70 is provided on the upper portion of the etching seat 13, and a water outlet 80 is provided on the lower portion of the etching seat 13. Each chamber corresponds to at least one water inlet 70 and at least one water outlet 80, and the water inlet 70 and the water outlet 80 are both connected to the corresponding chamber; an electrode socket 90 is provided on the upper portion of the etching seat 13, and each chamber corresponds to at least one electrode socket 90. The electrode socket 90 is connected to the corresponding chamber, and the electrode socket 90 is used to insert the electrode 30.
[0051] Specifically, the water inlet 70 can be used as a filling port for injecting the etching solution, and can also be used as a placement port for the stirring device; the water outlet 80 is used to quickly empty the etching solution, so as to more accurately control the etching process and better control the size of the pore size of the nuclear pore membrane etching; when the area of the film 20 to be etched is large, the concentration of the etching solution will change to a certain extent as the etching time increases. In order to make the etching more uniform, the stirring device extends from the water inlet 70 into the corresponding chamber, and the etching solution is continuously and slowly stirred during the etching process to keep the etching solution in the chamber uniform.
[0052] The stirring device can be an electric stirring device, a built-in rotor stirring device, or the etching device can be placed in an ultrasonic device for ultrasonic oscillation. In order to maintain the uniformity of etching, the stirring device is turned on and a suitable rotation speed or frequency is set according to the size of the etching area, which can not only achieve the purpose of stirring the solution evenly, but also avoid the film 20 from shaking significantly and affecting the uniformity of etching; when the etching is completed, the water outlet 80 is immediately opened to release the etching solution, and then the water outlet 80 is closed, and the blocking liquid is immediately introduced from the water inlet 70 to stop the etching process.
[0053] Of course, a circulation pipe can also be connected between the water outlet 80 and the water inlet 70. After the injection of the etching solution is completed, the circulation pipe can be used to circulate the etching solution in the chamber, thereby realizing the circulation of the etching solution in the chamber during the etching process, making the etching solution in the chamber more uniform.
[0054] In an embodiment of the utility model, the etching device includes a second clamping structure 100, which is arranged between two etching seats 13. The second clamping structure 100 includes a second clamping recess 101 and a second clamping protrusion 102 that cooperate with each other, wherein one of the etching seats 13 is provided with the second clamping recess 101, and the other etching seat 13 is provided with the second clamping protrusion 102; in this way, the second clamping structure 100 facilitates the alignment and installation of the two etching seats 13, and prevents the two etching seats 13 from sliding apart after installation.
[0055] In an embodiment of the utility model, the etching device includes a sealing structure 110, which is arranged between two etching seats 13. The sealing structure 110 includes a sealing ring 111 and a mounting groove 112 that cooperate with each other. The etching seat 13 is provided with a mounting groove 112, and the sealing ring 111 is embedded in the mounting groove 112.
[0056] Specifically, the sealing ring 111 is a fluororubber ring, and the sealing ring 111 enables the two etching seats 13 to be tightly connected to improve the sealing performance.
[0057] Based on the above structure, the utility model can not only etch a film 20 with a diameter less than 100 mm, but also prepare a film 20 with a diameter greater than 100 mm. When the etching area becomes larger, it will face problems such as uneven etching, decreased etching solution concentration, insufficient etching rate, inability to achieve asymmetric etching, and inability to accurately control the progress of etching and monitor and terminate the etching state. In order to solve these problems, the utility model uses a stirring device to solve the problem of etching uniformity, uses an electrode 30 to achieve voltage control to solve the problem of etching rate and monitor the etching state in real time, and sets a water inlet 70 and a water outlet 80 to achieve continuous replacement of the etching solution to keep the concentration of the etching solution unchanged; two chambers are set on both sides of the film 20 to achieve precise asymmetric etching, which can not only prepare columnar pore nuclear pore membranes, but also prepare nuclear pore membranes with shapes such as conical pores.
[0058] The specific etching process of the utility model is as follows:
[0059] When symmetrical etching is performed, that is, to obtain columnar or symmetrical conical holes, after the film 20 is installed in the film installation area 12, the same alkaline etching solution is respectively introduced into the two etching grooves 111. The alkaline etching solution reacts with the film 20. The reaction rate of the latent track area (track etching rate) is much greater than the reaction rate of the position not bombarded by heavy ions (body etching rate). A current testing device, such as a picoammeter, is used to apply voltage to the electrode 30 to detect the current on both sides of the film 20. At the beginning of etching, the film 20 acts as an intermediate insulator, so there is almost no current; and during the etching process, when the current begins to increase, it means that the latent track on the film 20 has formed a through-type channel; when the current detected by the electrode 30 is constantly increasing, it indicates that the pore size of the nuclear pore membrane is getting larger and larger, which can reflect the progress of etching to a certain extent; during the general symmetrical etching operation, no external voltage is applied. In particular, a source meter is used to apply an infinite positive and negative cycle voltage to both sides of the film 20, such as a -1V to 1V cycle, which not only keeps the conditions on both sides of the film 20 consistent, but also because the applied voltage has a gathering effect on the ions in the solution, it can ultimately accelerate the etching rate.
[0060] When performing asymmetric etching, an etching solution and a blocking solution with opposite properties to the etching solution are respectively introduced into the two etching grooves 111, for example, an alkaline etching solution and an acidic blocking solution are respectively introduced into the two etching grooves 111 to achieve asymmetric etching. The other etching steps are consistent with the symmetric etching, and finally a conical channel can be etched out.
[0061] Example 2
[0062] See also Figure 1-Figure 8 Different from Example 1, in the embodiment of the utility model, the seat body 10 includes two etching seats 13, the etching seats 13 have etching grooves 111, the etching grooves 111 of the two etching seats 13 are spliced together to form an etching cavity 11, and the splicing surface between the two etching seats 13 forms a film installation area 12; the seat body 10 includes a first heating plate 14 and a second heating plate 15, the side of the etching seat 13 is provided with the first heating plate 14, and the bottom of the etching seat 13 is provided with the second heating plate 15; the etching seat 13 and the first heating plate 14 are locked by bolts 60, and the etching seat 13 and the second heating plate 15 are locked by bolts 60.
[0063] For a film 20 with a smaller diameter or a film 20 with a larger thickness, there is no need to support the film 20 using a support plate 40, and the film 20 will not shake significantly in the solution. In this way, the film 20 can be directly installed between the two etching seats 13, and the two etching seats 13 directly clamp the film 20.
[0064] Example 3
[0065] See also Figure 1-Figure 8 Different from Example 1, in this embodiment of the utility model, the etching device includes an annular insert 120, and at least one annular insert 120 is detachably disposed in the etching chamber 11.
[0066] Specifically, the two etching grooves 111 are both symmetrically and detachably provided with annular inserts 120 , so that the inner diameter of the etching groove 111 can be changed and can be suitable for films 20 of different sizes.
[0067] It is understandable that there may be multiple annular inserts 120 , and the multiple annular inserts 120 may have different sizes and a concentric structure so as to be able to achieve nested installation. The annular inserts 120 are provided with avoidance holes for avoiding the electrodes 30 .
[0068] The technical means disclosed in the solution of the utility model are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications are also regarded as the protection scope of the utility model.
Claims
1. An etching device, characterized in that: include: A base body, wherein an etching cavity is disposed on the base body, and a film installation area is disposed on the base body, wherein the film installation area is used to install a film, and the film divides the etching cavity into two chambers; Electrode, at least one electrode is arranged in each chamber.
2. The etching device according to claim 1, characterized in that: The seat body includes two etching seats, each of which has an etching groove. The etching grooves of the two etching seats are spliced together to form the etching cavity, and the splicing surface between the two etching seats forms the film installation area.
3. The etching device according to claim 2, characterized in that: The seat body comprises a first heating plate and a second heating plate, the first heating plate is arranged on the side of the etching seat, and the second heating plate is arranged on the bottom of the etching seat; The etching seat and the first heating plate are locked by bolts, and the etching seat and the second heating plate are locked by bolts.
4. The etching device according to claim 1, characterized in that: The seat body includes two etching seats and a support plate. The etching seats have etching grooves. The etching grooves of the two etching seats are spliced together to form the etching cavity. The two support plates are arranged between the two etching seats. The splicing surface between the two support plates forms the film installation area.
5. The etching device according to claim 4, characterized in that: It includes a first clamping structure, which is arranged between the etching seat and the support plate, and includes a first clamping concave portion and a first clamping convex portion that cooperate with each other; The support plate is provided with the first clamping concave portion, and the etching seat is provided with the first clamping convex portion, or the etching seat is provided with the first clamping concave portion, and the support plate is provided with the first clamping convex portion.
6. The etching device according to claim 4, characterized in that: The seat body comprises a first heating plate and a second heating plate, the first heating plate is arranged on the side of the etching seat, and the second heating plate is arranged on the bottom of the etching seat; The support plate, the etching seat and the first heating plate are locked by bolts, and the etching seat and the second heating plate are locked by bolts.
7. The etching device according to claim 2 or 4, characterized in that: The upper part of the etching seat is provided with a water inlet, and the lower part of the etching seat is provided with a water outlet, each of the chambers corresponds to at least one of the water inlets and at least one of the water outlets, and the water inlets and the water outlets are both connected to the corresponding chambers; An electrode socket is arranged on the upper part of the etching seat, each of the chambers corresponds to at least one electrode socket, the electrode socket is communicated with the corresponding chamber, and the electrode socket is used for inserting the electrode.
8. The etching device according to claim 2 or 4, characterized in that: It includes a second clamping structure, which is arranged between the two etching seats. The second clamping structure includes a second clamping recess and a second clamping protrusion that cooperate with each other. One of the etching seats is provided with the second clamping recess, and the other etching seat is provided with the second clamping protrusion.
9. The etching device according to claim 2 or 4, characterized in that: It comprises a sealing structure, which is arranged between the two etching seats. The sealing structure comprises a sealing ring and a mounting groove which cooperate with each other. The etching seat is provided with the mounting groove, and the sealing ring is embedded in the mounting groove.
10. The etching device according to claim 1, characterized in that: It comprises an annular insert, at least one of which is detachably arranged in the etching chamber.