Thin film deposition forming device

Abstract

The utility model relates to a thin film deposition forming device which comprises a vacuum chamber and a substrate conveying module arranged in the chamber, and a substrate is arranged on the substrate conveying module. The evaporation source is arranged in the vacuum chamber, and the evaporation source is used for forming a coating layer on the substrate; and the laser etching module is arranged in the vacuum chamber, and the laser etching module is used for etching patterns on the coated film layer on the substrate. According to the thin film deposition forming device, film layers can be evaporated one by one, laser etching can be completed on the evaporated film layers in one cavity, time is saved, and efficiency is improved; when multiple film layers need to be evaporated, etching patterns of different film layers can be inconsistent through laser etching; the problem that cavity opening conversion is needed in evaporation and etching laser processes on most existing production lines is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of PVD coating, in particular to a thin film deposition molding device. Background Art

[0002] The application areas of PVD coating include flat panel displays, semiconductors, solar cells, optical and magnetic recording media, optical components, energy-saving glass, LEDs, tool modification, high-end decorative items, etc.

[0003] At present, the mainstream coating methods mainly include: sputtering coating and vacuum evaporation coating. After PVD coating deposits thin films, there are generally other process steps, especially laser etching process.

[0004] The existing process switching generally requires taking out the substrate in the vacuum chamber and then performing the laser etching in the next step, which causes the vacuum chamber to be opened frequently. Since the formed film and substrate are exposed, the required film quality cannot be obtained due to oxidation and other effects, and it is very easy to cause film contamination. In addition, since the film inevitably undergoes temperature changes in each process, strain occurs in the film due to thermal factors related to temperature rise and fall, so there is a problem that a stable film cannot be obtained. Utility Model Content

[0005] To this end, the technical problem to be solved by the utility model is to overcome the existing technology in which evaporation and other processes use the cavity independently, which is opened or closed by the air valve, and a robot is often required to take out the substrate to switch to the next process step. Therefore, when the evaporation process and the laser process alternate, it is often necessary to break the vacuum. Breaking the vacuum to take out the substrate will cause the vacuum cavity to be opened frequently, which may cause contamination and also lead to the problem of an unsmooth production rhythm.

[0006] In order to solve the above technical problems, the utility model provides a thin film deposition forming device, comprising: a vacuum chamber and a substrate conveying module inside the chamber, wherein the substrate is provided on the substrate conveying module; an evaporation source, which is arranged in the vacuum chamber, and the evaporation source is used to form a coating layer on the substrate; a laser etching module, which is arranged in the vacuum chamber, and the laser etching module is used to etch a pattern on the coating layer on the substrate.

[0007] In one embodiment of the present invention, a plurality of parallel baffles are provided in the vacuum chamber, and the baffles divide the vacuum chamber into a plurality of independent cavity structures.

[0008] In one embodiment of the present invention, a linear slide groove is provided on the inner wall of the vacuum chamber, and the substrate transfer module is slidably connected to the linear slide groove.

[0009] In one embodiment of the utility model, the substrate transfer module includes a sliding block, a transmission shaft 1, a drive motor, a tray and a conveyor line, the conveyor line is arranged on the inner wall of the vacuum chamber, the sliding block is arranged in a linear slide groove, and the sliding block and the linear slide groove are slidably connected, the sliding block is connected to the conveyor line, the drive motor is arranged on the sliding block, and the drive motor is connected to the tray through a transmission shaft 1, and a substrate is arranged on the tray.

[0010] In one embodiment of the utility model, an electric gripper is provided on the tray, and the electric gripper is used to clamp the substrate.

[0011] In one embodiment of the utility model, the substrate transfer module further comprises a second transmission shaft, the axis of the second transmission shaft is arranged perpendicularly to the axis of the first transmission shaft, the first transmission shaft and the second transmission shaft are driven by a spur bevel gear, and the second transmission shaft is connected to the tray.

[0012] In one embodiment of the present invention, the laser etching module includes a laser source and a focusing lens, and the laser emitted by the laser source is focused by the focusing lens and irradiated onto the substrate of the substrate conveying module.

[0013] In one embodiment of the present invention, a transmission window is provided on the side wall of the vacuum chamber, and the transmission window is used to transmit the laser light focused by the focusing lens.

[0014] In one embodiment of the utility model, a cleaning nozzle is provided in the vacuum chamber, and the cleaning nozzle is used to clean the substrate. A liquid collecting box is also provided in the vacuum chamber.

[0015] In one embodiment of the present invention, when the cleaning nozzle is cleaning, the substrate conveying module drives the substrate to be arranged opposite to the cleaning nozzle.

[0016] The above technical solution of the utility model has the following advantages compared with the prior art:

[0017] The thin film deposition forming device described in the utility model can evaporate film layers one by one, and laser etching can be completed for the evaporated film layers in one chamber, thus saving time and improving efficiency; when multiple film layers need to be evaporated, laser etching can be performed on different film layers with inconsistent patterns; the problem that the evaporation and etching laser processes on most production lines currently require cavity conversion is solved; for cleaning residual impurities on the substrate after the evaporation or laser process, a cleaning nozzle can be set on the inner wall of the chamber, and the direction of the substrate can be adjusted to the nozzle, which can achieve a good cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein

[0019] Figure 1 It is an overall layout diagram of the thin film deposition and forming device of the utility model;

[0020] Figure 2 It is a front view of the first embodiment of the substrate transfer module of the utility model;

[0021] Figure 3 It is a top view of the first embodiment of the substrate transfer module of the utility model;

[0022] Figure 4 It is a top view of the second embodiment of the substrate transfer module of the present utility model.

[0023] Explanation of the reference numerals in the specification: vacuum chamber 1, baffle door 1 2, baffle door 2 3, evaporation chamber 1 4, evaporation chamber 2 5, cleaning chamber 6, substrate transfer module 7, evaporation source 8, laser etching module 9, cleaning nozzle 10, linear slide 11, sliding block 12, transmission shaft 1 13, tray 14, transmission shaft 2 15, laser source 16, focusing lens 17, transmission window 18, liquid collecting box 19, substrate 100. DETAILED DESCRIPTION

[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0025] Embodiment 1

[0026] A transparent conductive film is formed on a transparent conductive substrate (usually a TCO glass substrate) by magnetron sputtering, vacuum evaporation, chemical vapor deposition or inkjet electronic printing, and then a transparent conductive array is formed on the transparent conductive film layer by laser etching. For this type of process, a evaporation device is designed that integrates evaporation and laser etching, and the two processes can be switched without breaking the vacuum and taking out the substrate.

[0027] Reference Figure 1As shown, the thin film deposition molding device of the utility model comprises: a vacuum chamber 1, wherein a loading inlet and a loading outlet are respectively arranged at the front and rear ends thereof, wherein the loading inlet and the loading outlet are both provided with automatic doors for keeping the vacuum chamber 1 sealed, wherein a blocking door 1 2 and a blocking door 2 3 are arranged in the vacuum chamber 1, wherein the blocking door 1 2 and the blocking door 2 3 divide the vacuum chamber 1 into three chambers, namely, a vapor deposition chamber 1 4, a vapor deposition chamber 2 5 and a cleaning chamber 6; a substrate conveying module 7, which is arranged in the vacuum chamber 1, and the substrate conveying module 7 passes through the vapor deposition chamber 1 4, the vapor deposition chamber 2 5 and the cleaning chamber 6 in sequence along the conveying direction. A washing chamber 6, on which a substrate is arranged; an evaporation source 8, which is arranged in an evaporation chamber 4, and the evaporation source 8 is used to form a coating layer on the substrate; a laser etching module 9, which is arranged in an evaporation chamber 4, and the laser etching module 9 is used to etch a pattern on the coating layer on the substrate; a cleaning nozzle 10, which is arranged in the cleaning chamber 6, and the cleaning nozzle 10 is used to clean the substrate, when the cleaning nozzle 10 is cleaning, the substrate conveying module 7 drives the substrate to be arranged opposite to the cleaning nozzle 10, and a liquid collecting box 19 is arranged in the cleaning chamber 6.

[0028] The structure of the second evaporation chamber 5 is the same as that of the first evaporation chamber 4 .

[0029] In the above structure, a linear slide groove 11 is provided on the inner wall of the vacuum chamber 1 , and two ends of the linear slide groove 11 are respectively located in the evaporation chamber 1 4 and the cleaning chamber 6 , and the substrate transfer module 7 is slidably connected to the linear slide groove 11 .

[0030] Reference Figure 2 , 3 As shown, the substrate transfer module 7 includes a sliding block 12, a transmission shaft 13, a driving motor, a tray 14 and a conveying line, the conveying line is arranged on the inner wall of the vacuum chamber 1, the sliding block 12 is arranged in a linear slide 11, and the sliding block 12 and the linear slide 11 are slidably connected, the sliding block 12 is connected to the conveying line, the driving motor is arranged on the sliding block 12, and the driving motor is connected to the tray 14 through the transmission shaft 13, and the tray 14 is provided with a substrate. The tray 14 is provided with an electric gripper, and the electric gripper is used to clamp the substrate.

[0031] In addition, the laser etching module 9 includes a laser source 16 and a focusing lens 17. The laser emitted by the laser source 16 is focused by the focusing lens 17 and irradiated onto the substrate of the substrate conveying module 7. A transmission window 18 is provided on the side wall of the evaporation chamber 4. The transmission window 18 is used to transmit the laser focused by the focusing lens 17.

[0032] The thin film deposition forming device of the utility model does not need to break the vacuum when switching between the PVD thin film deposition and laser etching processes, thus saving the time of opening the vacuum box and reducing the risk of vacuum box contamination, and the next step can be achieved without stopping the substrate transmission.

[0033] Embodiment 2

[0034] Based on the structure of the first embodiment, refer to Figure 4 As shown, the substrate transfer module 7 further includes a second transmission shaft 15, the axis of the second transmission shaft 15 is arranged perpendicularly to the axis of the first transmission shaft 13, the transmission shaft 13 and the second transmission shaft 15 are driven by a spur bevel gear, and the second transmission shaft 15 is connected to the tray 14. Embodiment 2 is another design solution composed of two transmission shafts, namely, the first transmission shaft 13 and the second transmission shaft 15, the first transmission shaft 13 is connected to the sliding block 12, and the second transmission shaft 15 is connected to the tray 14, and the transmission structure between the first transmission shaft 13 and the second transmission shaft 15 is used to realize that the transmission shaft 62 can rotate around 360 degrees.

[0035] At the beginning of transmission, the cavity is evacuated, and the sliding block 12 slides along the linear slide groove 11 on the inner wall of the evaporation cavity. The substrate moves from the loading entrance to the loading exit by the tray 14. After entering the rear evaporation cavity, the tray 14 carries the substrate 100 to the position directly above the evaporation source 8. The film thickness monitoring system monitors the real-time film thickness until the film thickness reaches the requirement. When it needs to be switched to the laser etching process, the transmission shaft 15 is rotated to the laser alignment position, or the external gear is rotated to the laser alignment position of the substrate surface to be etched.

[0036] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A thin film deposition molding device, characterized in that: include: A vacuum chamber and a substrate transfer module inside the chamber, wherein the substrate is provided on the substrate transfer module; An evaporation source is disposed in the vacuum chamber and is used to form a coating layer on the substrate; The laser etching module is arranged in the vacuum chamber and is used for etching patterns on the coated layer on the substrate.

2. The thin film deposition molding device according to claim 1, characterized in that: A plurality of parallel baffles are arranged in the vacuum chamber, and the baffles divide the chamber into a plurality of independent cavity structures.

3. The thin film deposition molding device according to claim 1, characterized in that: A linear slide groove is provided on the inner wall of the vacuum chamber, and the substrate conveying module is slidably connected to the linear slide groove.

4. The thin film deposition molding device according to claim 3, characterized in that: The substrate transfer module includes a sliding block, a transmission shaft 1, a driving motor, a tray and a conveying line, wherein the conveying line is arranged on the inner wall of the vacuum chamber, the sliding block is arranged in a linear slide groove, and the sliding block and the linear slide groove are slidably connected, the sliding block is connected to the conveying line, the driving motor is arranged on the sliding block, and the driving motor is connected to the tray through the transmission shaft 1, and a substrate is arranged on the tray.

5. The thin film deposition molding device according to claim 4, characterized in that: The tray is provided with an electric gripper, and the electric gripper is used for clamping the substrate.

6. The thin film deposition molding device according to claim 5, characterized in that: The substrate transfer module further comprises a second transmission shaft, the axis of which is perpendicular to the axis of the first transmission shaft, the first transmission shaft and the second transmission shaft are driven by spur bevel gears, and the second transmission shaft is connected to the tray.

7. The thin film deposition molding device according to claim 1, characterized in that: The laser etching module comprises a laser source and a condensing lens. The laser emitted by the laser source is irradiated onto the substrate of the substrate conveying module through the condensing lens.

8. The thin film deposition molding device according to claim 7, characterized in that: A transmission window is provided on the side wall of the vacuum chamber, and the transmission window is used to transmit the laser light focused by the focusing lens.

9. The thin film deposition molding device according to claim 1, characterized in that: A cleaning nozzle is arranged in the vacuum chamber, and the cleaning nozzle is used for cleaning the substrate. A liquid collecting box is also arranged in the vacuum chamber.

10. The thin film deposition molding device according to claim 9, characterized in that: When the cleaning nozzle is cleaning, the substrate conveying module drives the substrate to be arranged opposite to the cleaning nozzle.

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