Wafer electroplating jig

Abstract

The utility model discloses a wafer electroplating jig which comprises a jig main body and an automatic clamping mechanism, the jig main body is provided with a containing groove, the automatic clamping mechanism comprises a support, a guide rod is arranged on the support in a penetrating mode, the guide rod is fixedly connected with a clamping block, a spring piece is arranged on the guide rod, and the spring piece is connected with the clamping block. The automatic clamping mechanism further comprises a driving assembly used for synchronously pulling the guide rods, the driving assembly comprises a driving ring and a plurality of connecting rods, the two ends of each connecting rod are rotationally connected to the corresponding guide rod and the driving ring respectively, and the driving ring is rotationally installed on the jig body. Through the arrangement of the driving ring and the connecting rod, the driving ring can be rotated, and the clamping blocks are pulled to be opened after transmission of the connecting rod, so that the wafer can be conveniently disassembled without cooperation or fixation of multiple persons, the convenience of wafer disassembly and assembly is effectively improved, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer electroplating equipment, in particular to a wafer electroplating fixture. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain conductive materials using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other materials. Currently, most wafer electroplating fixtures on the market are fixed with screws or pressing plates, which have complicated operation procedures and low disassembly and assembly efficiency. In addition, the tightness of the bolts and the strength of the pressing plates will also affect the thickness of the wafer electroplating layer, resulting in uneven electroplating quality.

[0003] The utility model patent with patent number 201721778298.4 discloses a wafer electroplating fixture, including: a main body, a groove for accommodating a wafer is arranged on the main body, and an automatic clamping mechanism. The automatic clamping mechanism includes a support, a connecting rod, a clamping block and a spring member, etc. Among them, the support is fixedly connected to the main body, the connecting rod is slidably connected to the support, the clamping block is used to clamp and position the wafer, and a chamfer is arranged on the edge opposite to the main body at the front end. The clamping block is fixedly arranged at one end of the connecting rod, and a hand-held part is arranged at the other end of the connecting rod. The spring member is fitted on the connecting rod and arranged between the support and the clamping block. The wafer electroplating fixture can automatically press the wafer with the clamping block through the restoring force of the spring member.

[0004] However, it is obvious that the device is very inconvenient to remove the wafer. It is necessary to pull the handheld part one by one to open the clamping blocks, and one person cannot open all the clamping blocks at the same time. If the clamping blocks are opened without any external force or fixation, they will automatically retract under the action of the spring. It is very inconvenient and has poor practicality in actual use. Utility Model Content

[0005] In order to overcome the deficiencies of the prior art, the utility model provides a wafer electroplating fixture which is convenient for wafer disassembly.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a wafer electroplating jig, including a jig body and an automatic clamping mechanism, the jig body is provided with a receiving groove, the automatic clamping mechanism includes a support, a guide rod is passed through the support, a clamping block is fixedly connected to the guide rod, and a spring member is provided thereon, the automatic clamping mechanism also includes a driving assembly for synchronously pulling the guide rod, the driving assembly includes a driving ring and a plurality of connecting rods, the two ends of the connecting rod are respectively rotatably connected to the guide rod and the driving ring, and the driving ring is rotatably mounted on the jig body.

[0007] Preferably, an arc-shaped guide groove is provided on the jig body, a guide block is fixedly connected to the drive ring, and the guide block is slidably connected in the arc-shaped guide groove.

[0008] Preferably, a return spring is provided in the arc-shaped guide groove, and the return spring is located on a side of the guide block close to the connecting rod, with two ends of the return spring respectively pressed against the guide block and the groove wall of the annular guide groove.

[0009] Preferably, a strip groove is formed on one end of the guide rod away from the clamping block, a movable pin is slidably connected in the strip groove, and the movable pin is connected to the connecting rod and can move relatively along the strip groove.

[0010] Preferably, the support is an annular table, which is evenly provided with a plurality of guide holes along its circumference, and the guide rods are cooperatively inserted into the guide holes, and the number of the guide holes is not less than the number of the guide rods.

[0011] The technical effect of the utility model is that through the setting of the driving ring and the connecting rod, the driving ring can be rotated, and the clamping block is pulled open after transmission by the connecting rod, so that the wafer can be easily removed without the need for multiple people to cooperate or fix, effectively improving the convenience of wafer disassembly and assembly and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of the utility model.

[0013] Figure 2 for Figure 1 A partial enlarged view of point A in the middle.

[0014] The main technical features in the figure are marked as follows: 1. fixture body; 11. receiving groove; 2. support; 21. guide hole; 22. guide rod; 23. clamping spring; 3. driving ring; 31. connecting rod; 32. strip groove; 33. moving pin; 4. arc guide groove; 41. guide block; 42. reset spring; 5. wafer. DETAILED DESCRIPTION

[0015] The present invention will be further described below through specific implementation modes and accompanying drawings.

[0016] like Figure 1~2A wafer electroplating jig includes a jig body 1 and an automatic clamping mechanism. The jig body 1 is provided with a receiving groove 11. The automatic clamping mechanism includes a support 2. The support 2 is an annular table arranged concentrically with the receiving groove 11. It is provided with a plurality of guide holes 21 evenly arranged along its circumference. A guide rod 22 is passed through the support 2. The guide rod 22 is cooperatively passed through the guide holes 21. The number of the guide holes 21 is not less than the number of the guide rods 22. The guide holes 21 of appropriate number and position can be selected as needed to insert the guide rods 22 to ensure the fixing effect on the wafer. A clamping block is fixedly connected to one end of the guide rod 22, and a clamping spring 23 is sleeved on it. The two ends of the clamping spring 23 are respectively pressed against the support 2 and the clamping block.

[0017] Specifically, the automatic clamping mechanism also includes a driving assembly for synchronously pulling the guide rod 22. The driving assembly includes a driving ring 3 and a plurality of connecting rods 31, one end of each connecting rod 31 is hinged to the driving ring 3, and a moving pin 33 is fixed to the other end. A strip groove 32 is provided on the end of the guide rod 22 away from the clamping block, and a moving pin 33 is slidably connected in the strip groove 32. One end of the moving pin 33 passes through the strip groove 32 and is threaded with a nut. The moving pin 33 is connected to the connecting rod 31 and can move relatively along the strip groove 32 to avoid additional resistance to the movement of the guide rod 22 due to the position of the connecting rod 31 when the wafer is placed in the receiving slot 11, thereby ensuring the convenience of installing the wafer on the fixture.

[0018] Furthermore, the drive ring 3 can be rotatably mounted on the jig body 1, and a plurality of arc guide grooves 4 are evenly opened on the jig body 1 along the circumferential direction. A guide block 41 is fixedly connected to the drive ring 3, and the guide block 41 is slidably connected in the arc guide groove 4, and the cross-sectional figure of the arc guide groove 4 in the vertical direction is an inverted T shape; a reset spring 42 is provided in the arc guide groove 4, and the reset spring 42 is located on the side of the guide block 41 close to the connecting rod 31, and its two ends are respectively pressed against the guide block 41 and the groove wall of the annular guide groove, so as to drive the guide block 41 to move to reset the drive ring, thereby facilitating the subsequent re-entry of the wafer.

[0019] The specific implementation process of the utility model is as follows: when the wafer is placed, the clamping block is squeezed, the guide rod 22 resists the retraction of the clamping spring 23, and the strip groove 32 moves relative to the movable pin 33. After the wafer is completely inserted, the guide rod 22 opens toward the accommodating groove 11 under the action of the clamping spring 23 and applies a clamping force; when the wafer needs to be removed, the driving ring is rotated, and the guide rod 22 is linked through the connecting rod 31, so as to synchronously open the clamping block on the guide rod 22 and take out the wafer.

[0020] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. The present invention can be used on similar products. Any changes or modifications made by any technician in the field of the present invention are covered by the patent scope of the present invention.

Claims

1. A wafer electroplating jig, comprising a jig body (1) and an automatic clamping mechanism, wherein the jig body (1) is provided with a receiving groove (11), the automatic clamping mechanism comprises a support (2), a guide rod (22) is passed through the support (2), a clamping block is fixedly connected to the guide rod (22), and a spring member is provided on the guide rod, wherein: The automatic clamping mechanism also includes a driving assembly for synchronously pulling the guide rod (22), the driving assembly including a driving ring (3) and a plurality of connecting rods (31), the two ends of the connecting rod (31) are rotatably connected to the guide rod (22) and the driving ring (3), and the driving ring (3) is rotatably mounted on the fixture body (1).

2. The wafer electroplating fixture according to claim 1, characterized in that: An arc-shaped guide groove (4) is provided on the jig body (1), a guide block (41) is fixedly connected to the drive ring (3), and the guide block (41) is slidably connected in the arc-shaped guide groove (4).

3. The wafer electroplating fixture according to claim 2, characterized in that: A return spring (42) is arranged in the arc-shaped guide groove (4). The return spring (42) is located on a side of the guide block (41) close to the connecting rod (31), and its two ends are respectively pressed against the guide block (41) and the groove wall of the annular guide groove.

4. The wafer electroplating fixture according to claim 1, characterized in that: A strip groove (32) is formed on one end of the guide rod (22) away from the clamping block. A movable pin (33) is slidably connected in the strip groove (32). The movable pin (33) is connected to the connecting rod (31) and can move relatively along the strip groove (32).

5. The wafer electroplating fixture according to claim 1, characterized in that: The support (2) is an annular platform, and is evenly provided with a plurality of guide holes (21) along its circumference. The guide rods (22) are cooperatively arranged in the guide holes (21), and the number of the guide holes (21) is not less than the number of the guide rods (22).

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