Water vapor treatment equipment and system

Abstract

The utility model discloses water vapor treatment equipment and a water vapor treatment system. The water vapor treatment equipment comprises a treatment chamber, a vacuum generation device, a cooling flow channel and a cooling source, wherein the processing chamber is provided with a cavity for accommodating a carrier plate; the vacuum generating device is communicated with the cavity; the cooling flow channel is formed in the side wall of the processing chamber and comprises a flow channel inlet and a flow channel outlet; the cooling source communicates with the flow channel inlet and is used for providing a cooling medium for the cooling flow channel. According to the water vapor treatment equipment and system, the interior of the treatment chamber is in a low-temperature and low-pressure state through the cooling source and the vacuum generation device, water vapor can be removed within a short time, energy consumed for removing the water vapor is low, and adverse effects on the surface of a carrier plate cannot be generated.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar energy, and in particular relates to water vapor processing equipment and a system. Background Art

[0002] Because the transmission resistance of amorphous silicon thin film is large, the carrier tunneling transmission can be improved by thinning the thickness of the amorphous silicon layer in the vertical direction. However, it is impossible to form good carrier transmission through the amorphous silicon layer in the lateral direction. Therefore, a transparent conductive substrate is introduced on the surface of amorphous silicon for lateral carrier transmission. The transparent conductive substrate solves the problem of lateral carrier transmission very well. At the same time, its excellent light transmittance can ensure the absorption of light by solar cells. However, the oxygen and hydrogen content in transparent conductive oxide (TCO) has a significant impact on its properties. In the process of preparing TCO thin film by physical vapor deposition (PVD) equipment, it is necessary to first place the silicon wafer on the surface of the carrier, and then place the carrier with the silicon wafer in the PVD equipment for vapor deposition coating. During the coating process, the entry of water vapor can easily cause changes in the properties of the film and deteriorate the conductivity. During mass production, the interior of the PVD equipment's cavity is always in a high vacuum state. The increase in water vapor content inside is mainly due to external introduction. The external introduction is mainly due to the high water vapor content of the carrier board, which causes water vapor to be brought into the chamber of the PVD equipment, ultimately affecting the process coating effect.

[0003] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0004] The utility model aims to provide a water vapor treatment device and system, which can remove water vapor in a carrier plate and reduce energy consumption.

[0005] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0006] A water vapor treatment device, the water vapor treatment device comprising:

[0007] A processing chamber, wherein the processing chamber has a cavity for accommodating a carrier;

[0008] a vacuum generating device, connected to the cavity;

[0009] A cooling channel is formed in a side wall of the processing chamber, wherein the cooling channel includes a channel inlet and a channel outlet;

[0010] A cooling source is connected to the flow channel inlet and is used to provide cooling medium to the cooling flow channel.

[0011] In one or more embodiments of the present invention, at least one side wall of the processing chamber includes an outer side wall and an inner side wall, and the cooling channel is formed between the outer side wall and the inner side wall.

[0012] In one or more embodiments of the present invention, the water vapor treatment device further includes a cooling pipe, and the cooling flow channel is formed in the cooling pipe.

[0013] In one or more embodiments of the present invention, the cooling pipe is fully or partially installed on the side wall of the processing chamber; and / or the cooling pipe is fully or partially embedded in the side wall of the processing chamber.

[0014] In one or more embodiments of the present invention, the cooling source is a liquid nitrogen tank.

[0015] In one or more embodiments of the present invention, the flow channel inlet is located above the flow channel outlet.

[0016] In one or more embodiments of the present invention, a plurality of positioning members for mounting the carrier plate are fixedly installed inside the side wall of the processing chamber.

[0017] In one or more embodiments of the present invention, a plurality of the positioning members are fixedly installed inside the side wall of the processing chamber along a horizontal direction or a vertical direction.

[0018] In one or more embodiments of the present invention, the processing temperature in the chamber is less than or equal to -20°C; and / or,

[0019] The processing pressure in the cavity is less than or equal to 30Pa.

[0020] Another specific embodiment of the present invention provides a technical solution as follows:

[0021] A water vapor treatment system comprises a transmission structure and the water vapor treatment device as described above, wherein the transmission structure is used to transport a carrier plate to a treatment chamber of the water vapor treatment device.

[0022] Compared with the prior art, the utility model has the following beneficial effects:

[0023] The utility model provides a water vapor treatment device and system, which makes the interior of the treatment chamber in a low temperature and low pressure state through a cooling source and a vacuum generating device, can remove water vapor in a short time, consumes less energy for removing water vapor, and will not have adverse effects on the surface of the carrier plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the water vapor treatment equipment in one embodiment of the utility model;

[0026] Figure 2 This is a schematic diagram of the explosion structure of the side wall of the processing chamber in one embodiment of the utility model;

[0027] Figure 3 It is a schematic structural diagram of a front view of a water vapor treatment device in another embodiment of the utility model;

[0028] Figure 4 This is a schematic structural diagram of a front view of a water vapor treatment device in another embodiment of the utility model;

[0029] Figure 5 This is a schematic structural diagram of a water vapor treatment device in a front view in one embodiment of the utility model;

[0030] Figure 6 This is a schematic structural diagram of a water vapor treatment device in a front view in one embodiment of the utility model;

[0031] Figure 7 It is a structural schematic diagram of a water vapor treatment system in one embodiment of the utility model. DETAILED DESCRIPTION

[0032] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0035] In the mass production process of silicon wafer coating using PVD equipment, TCO film is easily deposited on the surface of the carrier. As the production cycle increases, the TCO film deposited on the surface of the carrier gradually accumulates. When it accumulates to a certain thickness, the TCO film accumulated on the carrier is likely to affect the edge coating of the new silicon wafer. At the same time, the area blocked by the silicon wafer is prone to agglomeration and falling, thereby affecting the uniformity of the TCO coating. Therefore, the carrier needs to be polished and cleaned periodically. After polishing and cleaning, the surface of the carrier is prone to absorb water vapor. When the carrier is used again, the water vapor content is too high, which is easy to affect the ratio of H and O components in the film layer during the coating process, thereby affecting the battery efficiency.

[0036] To address this problem, the existing treatment method is to concentrate the carrier board in an oven for baking. This process requires the oven temperature to be raised to above 160°C and the baking time needs to be greater than 30 minutes. Long-term baking can effectively remove moisture from the carrier board, but when the temperature inside the oven is high and the moisture inside the oven is high at the beginning, the surface of the carrier board is easily oxidized. The surface properties of the carrier board after oxidation change, resulting in the weakening of the bonding force between the TCO film and the carrier board during the coating process, causing the accumulated thickness of the TCO film on the surface of the oxidized carrier board to fail to reach the thickness reached by the carrier board without an oxide layer and begin to fall off prematurely. The cleaning cycle of the unbaked carrier board can reach 1000RUN before the accumulated TCO film begins to fall off; after the carrier board is baked, the accumulated TCO film begins to fall off after the cleaning cycle reaches 800RUN.

[0037] Therefore, removing water vapor by baking not only reduces the cleaning cycle of the substrate and makes the maintenance cycle more frequent, but also increases a lot of energy consumption, slows down the processing speed, and takes a long time.

[0038] Therefore, the applicant creatively proposed a water vapor treatment device to solve the above problems.

[0039] The technical solution of the present utility model will be described below in conjunction with the accompanying drawings.

[0040] Reference Figure 1 As shown, a water vapor treatment device in an embodiment of the present invention comprises: a treatment chamber 1 , a vacuum generating device 2 , a cooling channel 3 , and a cooling source 4 .

[0041] Among them, the processing chamber 1 has a cavity 101 for accommodating a carrier; the vacuum generating device 2 is connected to the cavity 101; the cooling channel 3 is formed in the side wall 11 of the processing chamber 1, and the cooling channel 3 includes a channel inlet 31 and a channel outlet 32; the cooling source 4 is connected to the channel inlet 31, and is used to provide cooling medium to the cooling channel 3.

[0042] According to this design, when the carrier is placed in the processing chamber 1, the cavity 101 can be evacuated by the vacuum generating device 2, and the cooling medium transported in the cooling channel 3 by the cooling source 4 can exchange heat with the cavity 101, so that the cavity 101 of the processing chamber 1 is in a low temperature and low pressure state. In a low temperature environment, water vapor can freeze quickly, and in a low temperature and low pressure environment, solid ice can quickly reach the sublimation point, so the water vapor can be quickly and effectively processed within a period of 10 minutes to 30 minutes. During this process, the surface properties of the carrier do not change. Compared with the existing water vapor treatment method, the water vapor treatment equipment of the present application consumes less energy to process water vapor, can remove water vapor in a shorter time, and will not have an adverse effect on the surface properties of the carrier.

[0043] In order to form a cooling channel 3 for the cooling medium to flow, so as to exchange heat with the internal medium of the cavity 101, optionally, refer to Figure 1 , Figure 2 As shown, at least one side wall 11 of the processing chamber 1 in this embodiment includes an outer wall 111 and an inner wall 112, and the cooling channel 3 is formed between the outer wall 111 and the inner wall 112. Exemplarily, a first groove 113 arranged in a circuitous manner is provided on the surface of the outer wall 111 facing the inner wall 112, and a second groove 114 arranged in a circuitous manner is provided on the surface of the inner wall 112 facing the outer wall 111, and the cooling channel 3 can be formed when the outer wall 111 and the inner wall 112 are attached to each other.

[0044] Of course, the present application is not limited to this. A first groove 113 arranged in a circuitous manner is provided on the surface of the outer wall 111 facing the inner wall 112; or a second groove 114 arranged in a circuitous manner may be provided on the surface of the inner wall 112 facing the outer wall 111. The above methods can form a cooling channel 3 through the outer wall 111 and the inner wall 112.

[0045] Exemplarily, the outer wall 111 and the inner wall 112 of a side wall 11 of the processing chamber 1 in this embodiment are formed with a cooling channel 3. In order to cool the medium inside the cavity 101 more quickly and evenly, two, or three... or all side walls 11 of the processing chamber 1 include an outer wall 111 and an inner wall 112, and the cooling channel 3 is formed between the outer wall 111 and the inner wall 112.

[0046] Of course, the present application is not limited thereto. In order to form a cooling channel 3 for the cooling medium to flow, so as to exchange heat with the internal medium of the cavity 101, refer to Figure 3 As shown, in another embodiment, the water vapor treatment device further includes a cooling pipe 5 , and the cooling channel 3 is formed in the cooling pipe 5 .

[0047] In order to fix the cooling pipe 5, refer to Figure 3 As shown, in another embodiment, the cooling pipe 5 is completely installed on the side wall 11 of the processing chamber 1; or, the cooling pipe 5 is partially installed on the side wall 11 of the processing chamber 1. Of course, the present application is not limited to this, and reference is made to Figure 4 As shown, in yet another embodiment, the cooling pipe 5 is entirely embedded in the side wall 11 of the processing chamber 1 ; or, the cooling pipe 5 is partially embedded in the side wall 11 of the processing chamber 1 .

[0048] Reference Figure 1 As shown, the cooling source 4 in this embodiment is a liquid nitrogen tank, and the cooling medium is liquid nitrogen. Since the tank body of the liquid nitrogen tank itself has a certain pressure, the cooling medium can enter the cooling channel 3 through the channel inlet 31 and flow out of the cooling channel 3 through the channel outlet 32.

[0049] Reference Figure 1 As shown, the flow channel inlet 31 in this embodiment is located above the flow channel outlet 32. Since the cooling medium in this application mainly adopts liquid nitrogen, the liquid nitrogen entering the cooling flow channel 3 through the flow channel inlet 31 contacts the air in the cooling flow channel 3 and absorbs the heat in the air and gradually gasifies, and finally becomes nitrogen, which flows out of the cooling flow channel 3 through the flow channel outlet 32. Due to the characteristics of gas floating upward and liquid flowing downward, when the flow channel inlet 31 is located above the flow channel outlet 32, it is convenient to carry out more and more comprehensive heat exchange with the internal medium of the cavity 101 through liquid nitrogen, and it can also facilitate the discharge of nitrogen. When the flow channel outlet 32 ​​is externally connected to the nitrogen use end, the nitrogen can also be reasonably utilized.

[0050] Reference Figure 5 , Figure 6 As shown, a plurality of positioning members 6 for mounting a carrier board are fixedly mounted inside the side wall 11 of the processing chamber 1 in this embodiment.

[0051] Optional, see Figure 5 , Figure 6As shown, in this embodiment, a plurality of positioning members 6 are fixedly installed inside the side wall 11 of the processing chamber 1 in the horizontal direction; or, a plurality of positioning members 6 are fixedly installed inside the side wall 11 of the processing chamber 1 in the vertical direction. Exemplarily, at least two positioning members 6 are provided, which are fixedly installed on two opposite side walls 11 in the horizontal direction. When a carrier needs to be placed in the processing chamber 1, the carrier can be placed above the two positioning members 6. Exemplarily, four positioning members 6 are provided and all are fixedly installed on two opposite side walls 11 in the horizontal direction, in groups of two, and one group of positioning members 6 is spaced above another group of positioning members 6. According to this design, two carriers can be spaced apart in the horizontal direction. By analogy, a plurality of carriers can be spaced apart in the processing chamber 1 in the horizontal direction; further, by analogy, a plurality of carriers can be spaced apart in the vertical direction in the processing chamber 1. Of course, the present application is not limited thereto, and three positioning members 6 may be provided, respectively on three adjacent side walls 11, or multiple positioning members 6 may be provided on two adjacent side walls 11, as long as the carrier can be placed in the cavity 101 in a horizontal or vertical direction.

[0052] During the water vapor treatment, the treatment temperature in the chamber 101 in this embodiment is less than or equal to -20° C. The treatment pressure in the chamber 101 is less than or equal to 30 Pa.

[0053] Reference Figure 7 As shown, the utility model also discloses a water vapor treatment system, which includes a transmission structure 200 and the water vapor treatment device 100 as described above. The transmission structure 200 is used to transport the carrier to the water vapor treatment device 100, and then the water vapor is removed from the carrier by the water vapor treatment device 100.

[0054] It can be seen from the above technical solutions that the utility model has the following beneficial effects:

[0055] The utility model provides a water vapor treatment device and system, which makes the interior of the treatment chamber in a low temperature and low pressure state through a cooling source and a vacuum generating device, can remove water vapor in a short time, consumes less energy for removing water vapor, and will not have adverse effects on the surface of the carrier plate.

[0056] In the description of the embodiments of the present invention, it should be understood that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0057] In the description of the embodiments of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0058] In the description of the embodiments of the present invention, it is also necessary to explain that the "first", "second", etc. used in this article do not specifically refer to the order or sequence, nor are they used to limit the present case. They are only used to distinguish components or operations described with the same technical terms.

[0059] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0060] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A water vapor treatment device, characterized in that: The water vapor treatment equipment comprises: A processing chamber, wherein the processing chamber has a cavity for accommodating a carrier; a vacuum generating device, connected to the cavity; A cooling channel is formed in a side wall of the processing chamber, wherein the cooling channel includes a channel inlet and a channel outlet; A cooling source is connected to the flow channel inlet and is used to provide cooling medium to the cooling flow channel.

2. The water vapor treatment equipment according to claim 1, characterized in that: At least one side wall of the processing chamber includes an outer side wall and an inner side wall, and the cooling channel is formed between the outer side wall and the inner side wall.

3. The water vapor treatment equipment according to claim 1, characterized in that: The water vapor processing equipment further includes a cooling pipe, and the cooling flow channel is formed in the cooling pipe.

4. The water vapor treatment equipment according to claim 3, characterized in that: The cooling pipe is fully or partially installed on the side wall of the processing chamber; and / or the cooling pipe is fully or partially embedded in the side wall of the processing chamber.

5. The water vapor treatment equipment according to claim 1, characterized in that: The cooling source is a liquid nitrogen tank.

6. The water vapor treatment equipment according to claim 1, characterized in that: The flow channel inlet is located above the flow channel outlet.

7. The water vapor treatment equipment according to claim 1, characterized in that: A plurality of positioning members for mounting the carrier plate are fixedly mounted inside the side wall of the processing chamber.

8. The water vapor treatment equipment according to claim 7, characterized in that: The plurality of positioning members are fixedly installed inside the side wall of the processing chamber along a horizontal direction or a vertical direction.

9. The water vapor treatment equipment according to claim 1, characterized in that: The processing temperature in the chamber is less than or equal to -20°C; and / or, The processing pressure in the cavity is less than or equal to 30Pa.

10. A water vapor treatment system, characterized in that: The water vapor treatment system comprises a transmission structure and the water vapor treatment device according to any one of claims 1 to 9, wherein the transmission structure is used to transport the carrier plate to a treatment chamber of the water vapor treatment device.

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