Chip test box and chip test device

Abstract

The utility model relates to a chip test box and a chip test device. The chip test box comprises a box body, the first side of the box body is provided with a first through hole, the second side of the box body is provided with a first door body, and the first door body is provided with a second through hole; and the supporting assembly is arranged in the box body and used for supporting the tested chip, the supporting assembly is provided with a third through hole, the third through hole faces the tested chip, and the third through hole is communicated with the first through hole. According to the chip test box provided by the utility model, the chip is fixed through negative pressure, so that the damage to the tested chip in the use and disassembly process is avoided, the sample displacement caused by the fact that the tested chip is fixed by using an adhesive tape is avoided, and the test precision is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip testing box and a chip testing device. Background Art

[0002] When using the existing chip test box, it is usually not possible to fix the sample placed inside the test box. Most of the time, the user needs to fix the chip to be tested on the platform panel by using tape to fix the chip.

[0003] However, during the test, the tape will deform, causing the position of the chip under test to change, affecting the test accuracy, and the tester needs to re-attach it, reducing work efficiency. At the same time, the residual adhesive of the tape will remain on the chip under test, which is difficult to clean after the test is completed. Utility Model Content

[0004] Based on this, it is necessary to provide a chip test box and a chip test device to address the problem that traditional test boxes are difficult to non-destructively fix the chip under test.

[0005] In a first aspect, the present application provides a chip test box, the chip test box comprising:

[0006] A box body, wherein a first through hole is formed on a first side of the box body, a first door is formed on a second side of the box body, and a second through hole is formed on the first door body; and

[0007] The supporting component is arranged inside the box body and is used for supporting the chip under test. The supporting component is provided with a third through hole, the third through hole faces the chip under test, and the third through hole is communicated with the first through hole.

[0008] In the above chip test box, the support assembly is located inside the box body, and a first through hole and a third through hole are respectively opened in the box body and the support assembly, the first end of the third through hole is connected to the first through hole, and the second end of the third through hole faces the chip under test, so that when air is pumped outward through the first through hole, the second end of the third through hole forms a negative pressure to fix the chip under test. Compared with the traditional method of fixing by tape, the chip test box provided by the utility model fixes the chip by negative pressure, avoids damage to the chip under test during use and disassembly, avoids sample displacement of the chip under test due to the use of tape to fix, and ensures test accuracy.

[0009] In one embodiment, an optical platform is further provided inside the chip test box, and the support assembly is arranged on the optical platform. The optical platform is also called an optical flat board, an optical tabletop, etc., which can provide a horizontal and stable tabletop during chip testing. The optical platform is a flat plate with holes at fixed intervals, and the support assembly is arranged on the optical platform, so that the support assembly is detachable relative to the chip test box, which is convenient for installing and removing the chip to be tested.

[0010] In one embodiment, the support assembly includes a support plate, which is provided with a first sub-through hole; and a support rod, wherein the first end of the support rod can be set in the hole of the optical platform, and the second end of the support rod is provided with a clamp, and the clamp is used to clamp the support plate; the support rod is provided with a second sub-through hole, and the first sub-through hole and the second sub-through hole are connected to form the third through hole. In this way, the first sub-through hole, the second sub-through hole and the first through hole are all connected, and when the external exhaust device exhausts the first through hole, the gas is extracted from the first sub-through hole, the second sub-through hole and the first through hole in turn, so that the first sub-through hole is under negative pressure, thereby achieving adsorption of the chip under test.

[0011] In one embodiment, the support assembly further includes a fixing sleeve, wherein the first end of the fixing sleeve is disposed in the hole of the optical platform, and the second end of the fixing sleeve is sleeved on the first end of the support rod; wherein the fixing sleeve is provided with an opening, and the opening is provided with a rotating member, and the rotating member is threadedly connected to the opening. When the rotating member rotates inward along the opening, it squeezes the support rod to fix the support rod. When the height of the support rod needs to be adjusted, the rotating member is first screwed outward so that the support rod can move up and down without being pressed. After moving to the specified position, the rotating member is screwed inward to squeeze the support rod to fix its position. In this way, the height of the support plate can be adjusted, and the height of the chip to be measured can be adjusted.

[0012] In one embodiment, a temperature control component is further included, and the temperature control component includes a heating element, a cooling element and a temperature control element, and the temperature control element is used to control the start and stop of the heating element and the cooling element. The temperature control component is used to control the internal temperature of the chip test box, and the chip to be tested is adsorbed on the support component so that the whole sample to be tested is heated evenly, avoiding the situation that the chip to be tested is attached to the heating platform and tested in an environment exposed to air, resulting in the chip to be tested being only partially affected by the heat and cold, and the test temperature is greatly affected by the external environment, resulting in test errors.

[0013] In one embodiment, the chip test box further includes an aperture component, which is disposed at the second through hole and is used for filtering light. By properly setting the size and position of the aperture component, the angle and direction of the light emitted by the light source can be limited, making it more concentrated and stable, thereby improving the test accuracy and reliability.

[0014] In one embodiment, the aperture assembly includes an aperture, a first movable member, and a second movable member, wherein the first movable member is used to control the aperture to move in a first direction, and the second movable member is used to control the aperture to move in a second direction. The variable aperture is used to adjust the position where the light source passes through, thereby adjusting the position where the light source irradiates the chip to be tested, which can be applicable to chips of various sizes and has greater versatility.

[0015] In one embodiment, the first door is rotatably connected to the box body through a first hinge. The first door is rotatably connected to the box body through a first hinge. The first door can be opened and closed by rotating the first hinge. When the first door is opened, the interior of the box body is exposed, and when the first door is closed, the box body is sealed.

[0016] In one embodiment, a second door is provided on the third side of the box, the second door is rotatably connected to the box, the second door includes a first rotation position and a second rotation position, the second door seals the box when the first rotation position is in place, and the interior of the box is in communication with the exterior when the second door is in the second rotation position. The second door seals the box when the first rotation position is in place, and the interior of the box is in communication with the exterior when the second door is in the second rotation position, so as to facilitate placement of the chip to be tested.

[0017] In a second aspect, the present application also provides a chip testing device, which includes: the chip testing box described above; an air extraction mechanism, including an air pump and an air pipe connected to the air pump, the air pipe extending into the chip testing box along the first through hole and the third through hole; and a light source, facing the second through hole, for emitting a light beam.

[0018] The chip test device uses a chip test box for testing, and uses a vacuum mechanism to evacuate air so that the chip is adsorbed on the support assembly. Then, a test beam is emitted by a light source to test the chip to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] FIG1 is a schematic structural diagram of a chip test box in one embodiment;

[0020] FIG2 is a diagram showing the internal structure of a chip test box in one embodiment;

[0021] FIG3 is a schematic diagram of the positional relationship between an optical platform and a chip test box in one embodiment;

[0022] FIG. 4 is a schematic structural diagram of a support assembly in one embodiment.

[0023] Explanation of the reference numerals in the accompanying drawings: 10, housing; 11, first door body; 111, first hinge; 12, optical platform; 13, temperature control member; 14, aperture assembly; 141, aperture; 142, first movable member; 143, second movable member; 15, second door body; 151, second hinge; 20, supporting assembly; 21, supporting plate; 211, first sub-through hole; 22, supporting rod; 221, second sub-through hole; 23, clamp; 24, fixing sleeve; 30, exhaust mechanism; 31, air pump; 32, air pipe; S1, first side; S2, second side; S3, third side; P1, first through hole; P2, third through hole. DETAILED DESCRIPTION

[0024] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0030] Referring to Figures 1 and 2, Figure 1 shows a schematic diagram of the structure of a chip test box in an embodiment of the present invention, and Figure 2 shows an internal structure diagram of a chip test box in an embodiment. A chip test box provided in an embodiment of the present invention comprises a box body 10 and a support assembly 20, wherein the box body 10 is hollow inside, and the support assembly 20 is accommodated inside the box body 10 for supporting and fixing the chip to be tested.

[0031] Referring to FIG. 2 , a first through hole P1 is provided on the first side S1 of the box 10, and the first through hole P1 connects the internal and external spaces of the box 10. Optionally, the first side S1 may be the bottom of the box 10. The support assembly 20 is provided with a third through hole P2, and the first end of the third through hole P2 is connected to the first through hole P1, and the second end of the third through hole P2 faces the chip under test, and is used to fix the chip under test. In this arrangement, when the first through hole P1 is connected to the exhaust device, the exhaust device exhausts air, so that a negative pressure is generated at the second end of the third through hole P2, and the chip under test can be adsorbed and fixed when it is located at the second end of the third through hole.

[0032] Referring to FIG. 1 , a first door body 11 is provided on the second side S2 of the box body 10, and a second through hole is provided in the first door body 11. In an exemplary embodiment, the first door body 11 is rotatably connected to the box body through a first hinge 111. The first door body 11 can be opened and closed by rotating the first hinge 111. When the first door body 11 is opened, the interior of the box body 10 is exposed, and when the first door body 11 is closed, the box body 10 is sealed. When the first door body is closed, the exhaust device can exhaust air to make the interior of the chip test box negative pressure.

[0033] The existence of the second through hole enables the light beam to shine from the second through hole to the chip under test. Optionally, for a WSS (Wavelength Selective Switch) chip, a test signal needs to be sent to the WSS chip through a light source, so that the light source can emit a light beam to the WSS chip through the second through hole to test the chip under test.

[0034] In the above-mentioned chip test box, the support assembly 20 is located inside the box body 10, and a first through hole P1 and a third through hole P2 are respectively provided in the box body 10 and the support assembly 20, the first end of the third through hole P2 is connected to the first through hole P1, and the second end of the third through hole P2 faces the chip under test, so that when air is pumped outward through the first through hole P1, a negative pressure is formed at the second end of the third through hole P2 to fix the chip under test. Compared with the conventional method of fixing with tape, the chip test box provided by the utility model fixes the chip with negative pressure, thereby avoiding damage to the chip under test during use and disassembly, avoiding sample displacement of the chip under test due to fixing with tape, and ensuring test accuracy. The chip test box provided by the utility model can also reduce the scrap rate, improve reliability, and enhance work efficiency.

[0035] In an exemplary embodiment, an optical platform 12 is further provided inside the chip test box, as shown in FIG3 , which shows a schematic diagram of the positional relationship between the optical platform 12 and the chip test box in an embodiment, and the optical platform 12 is arranged on the first side S1 inside the chip test box. The optical platform 12 is also called an optical flat board, an optical tabletop, etc., and can provide a horizontal and stable tabletop during chip testing.

[0036] The optical platform is a flat plate with holes at fixed intervals, usually made of plastic or metal, for inserting and connecting electronic components and wires. The optical platform 12 has a series of neatly arranged small holes, so that electronic components and plug wires can be easily inserted into the breadboard. In this embodiment, the support assembly 20 is configured on the optical platform 12, so that the support assembly 20 is detachable relative to the chip test box, which is convenient for installing and removing the chip to be tested. Optionally, the support assembly 20 can be inserted into the small holes of the optical platform 12 to achieve fixation, so that the position of the support assembly 20 on the optical platform 12 can be adjusted.

[0037] In a feasible implementation, the support assembly 20 includes a support plate 21 and a support rod 22. Optionally, the support plate 21 may be made of resin or plastic material, such as PC (Polycarbonate) material, epoxy resin, etc. The support rod 22 may be made of metal material.

[0038] Referring to FIG. 4 , FIG. 4 shows a schematic diagram of the structure of a support assembly 20 in an embodiment. The support plate 21 is provided with a first sub-through hole 211, and the position where the first sub-through hole 211 is located is used to place the chip under test. Optionally, the number of the first sub-through holes 211 can be multiple, and the multiple first sub-through holes 211 are arranged in an array to form a chip placement area for placing the chip under test.

[0039] The first end of the support rod 22 can be arranged in the hole of the optical platform 12, so as to adjust the position of the support rod 22 and thus adjust the position of the support plate 21. In a feasible implementation, the first end of the support rod 22 can be a straight rod inserted into the hole of the optical platform 12. In another feasible implementation, the first end of the support rod 22 can also be provided with an external thread, the hole of the optical platform 12 is provided with an internal thread, and the first end of the support rod 22 is threadedly connected with the hole of the optical platform 12. The second end of the support rod 22 is provided with a clamp 23, and the clamp 23 is used to clamp the support plate 21. Optionally, the clamp 23 can be a dry plate clamp.

[0040] A second sub-through hole 221 is provided inside the support rod 22, and the first sub-through hole 211 and the second sub-through hole 221 are connected to form a third through hole P2. In this way, the first sub-through hole 211, the second sub-through hole 221 and the first through hole P1 are all connected, and when the external exhaust device exhausts air from the first through hole P1, the gas is extracted from the first sub-through hole 211, the second sub-through hole 221 and the first through hole P1 in sequence, so that the first sub-through hole 211 is under negative pressure, thereby achieving adsorption of the chip under test.

[0041] Optionally, the support assembly 20 may further include a fixing sleeve 24, which is disposed between the optical platform 12 and the support rod 22, and is used to adjust the height of the support rod 22, thereby adjusting the height of the support plate 21. Optionally, the fixing sleeve 24 may be cylindrical. Specifically, the first end of the fixing sleeve 24 is disposed in the hole of the optical platform 12, and the second end of the fixing sleeve 24 is sleeved on the first end of the support rod 22. In a feasible implementation, the first end of the fixing sleeve 24 may be a straight rod, which is inserted into the hole of the optical platform 12. In another feasible implementation, the first end of the fixing sleeve 24 may also be provided with an external thread, the hole of the optical platform 12 is provided with an internal thread, and the first end of the fixing sleeve 24 is threadedly connected to the hole of the optical platform 12. Among them, the fixing sleeve 24 is provided with an opening, the opening is provided with a rotating member, and the rotating member is threadedly connected to the opening. When the rotating member rotates inward along the opening, it squeezes the support rod 22 to achieve the fixation of the support rod 22. When the height of the support rod 22 needs to be adjusted, the rotating member is first rotated outward so that the support rod can move up and down without being pressed. After moving to the specified position, the rotating member is rotated inward to squeeze the support rod 22 to fix its position. In this way, the height of the support plate can be adjusted, and the height of the chip under test can be adjusted.

[0042] In an exemplary embodiment, referring to FIG1 , the chip test box further includes a temperature control component, which is used to control the internal temperature of the chip test box. The temperature control component includes a heating element (not shown in the figure), a cooling element (not shown in the figure) and a temperature control element 13, and the temperature control element 13 is used to control the start and stop of the heating element and the cooling element. Optionally, the heating element may be a hot air blower, an electric heater, etc., and the cooling element may be a cooling fan, etc. When the internal temperature of the chip test box is too low, the heating element is started by the temperature control element 13 to achieve heating, and when the internal temperature of the chip test box is too high, the cooling element is started by the temperature control element 13 to achieve cooling. Optionally, the temperature control element 13 may also be an automatic temperature control device, which adaptively adjusts the internal temperature of the chip test box after setting the temperature.

[0043] High and low temperature working test is one of the common test tests for electronic components. When using existing high and low temperature test chambers, most of them require staff to use tape to fix the chip under test on the exposed heating panel of the constant temperature heating platform to achieve heating of the chip. However, in this way, during the test process, the tape will deform after being heated, causing the position of the chip under test to change, seriously affecting the test accuracy. The tester needs to re-attach it, reducing work efficiency. At the same time, the residual glue of the tape after being heated will remain on the chip under test. After the test is completed, it is difficult to clean the residual glue. In addition, the chip is heated on only one side, and it is impossible to accurately simulate the working state of the chip in a high temperature environment, thus failing to meet the use requirements.

[0044] The chip test box provided in this embodiment can adsorb the chip under test to the support assembly 20, so that the whole sample under test is heated evenly. This avoids attaching the chip under test to the heating platform and testing it in an environment exposed to air, which results in the chip under test being only partially affected by the cold and heat, and the test temperature being greatly affected by the external environment, resulting in test errors.

[0045] In an exemplary embodiment, the chip test box further includes an aperture assembly 14, which is disposed at the second through hole of the second side S2 of the chip test box, and is used for filtering light. The aperture assembly 14 is used to control the light path between the light source and the chip under test to reduce interference and improve accuracy. By reasonably setting the size and position of the aperture assembly 14, the angle and direction of the light emitted by the light source can be limited to make it more concentrated and stable, thereby improving the test accuracy and reliability.

[0046] The WSS chip is an optical device used in optical communication systems for the selection and routing of optical wavelengths. In optical communication systems, WSS chips often need to undergo phase correction tests, including diffraction efficiency, reflectivity, and jitter, to ensure their normal operation and performance stability. In order to test the phase difference of the optical signal output by the WSS chip at different wavelengths, a specific wavelength needs to be input to the WSS, and the aperture assembly 14 can achieve the selection of the wavelength.

[0047] In a feasible implementation, the aperture assembly 14 includes an aperture 141, a first movable member 142 and a second movable member 143, the aperture 141 is used to achieve light filtering, and the first movable member 142 and the second movable member 143 are used to move the position of the aperture 141 so that the light beam emitted by the light source can irradiate the chip to be tested after passing through the aperture 141. Optionally, the first movable member 142 and the second movable member 143 can be threadedly connected to the aperture 141, and the position of the aperture 141 can be adjusted by rotation. Among them, the first movable member 142 is used to control the aperture 141 to move along the first direction X, and the second movable member is used to control the aperture to move along the second direction Y. The first direction is a direction perpendicular to the optical breadboard, and the second direction is a direction parallel to the optical breadboard. Optionally, the first direction is a horizontal direction, and the second direction is a vertical direction.

[0048] In this embodiment, a variable aperture is used to adjust the position through which the light source passes, thereby adjusting the position where the light source irradiates the chip to be tested, which is applicable to chips of various sizes and has greater versatility.

[0049] Continuing to refer to FIG. 1 , in an exemplary embodiment, the third side S3 of the box body 10 is provided with a second door body 15, and the second door body 15 is rotatably connected to the box body 10 via a hinge 151. During the rotation process of the second door body 15, the second door body 15 includes a first rotation position and a second rotation position. When the second door body 15 is in the first rotation position, the box body 10 is sealed. When the second door body is in the second rotation position, the interior of the box body 10 is connected with the external space, so as to facilitate the placement of the chip to be tested.

[0050] Referring to FIG. 2 , the present application also provides a chip testing device, which includes the above-mentioned chip testing box, an exhaust mechanism 30 and a light source (not shown in the figure). The exhaust mechanism 30 includes an air pump 31 and an air pipe 32 connected to the air pump 31, and the air pipe 32 extends into the chip testing box along the first through hole P1 and the third through hole P2. Optionally, the air pipe 32 can be a hose. The exhaust mechanism 30 is connected to the first through hole P1, and can perform exhaust when started, so that a negative pressure is formed at the second end of the third through hole P2, thereby fixing the chip to be tested. The light source faces the second through hole, and is used to emit a light beam, so that the light beam passes through the second through hole or the aperture 142 to illuminate the chip to be tested, thereby achieving performance testing of the chip to be tested.

[0051] When in use, the switch of the exhaust mechanism 30 is started, the second door 15 is opened, and the chip under test is placed at the second end of the third through hole so that it is adsorbed and fixed. When it is necessary to adjust the light beam according to the size and placement of the chip under test so that the external light beam is irradiated on the chip display area, the position of the aperture 141 can be adjusted by the first movable member 142 and the second movable member 143 so that the external light beam is irradiated on the chip display area through the aperture 141. After that, the temperature control member 13 is turned on, the temperature of the test box is set, and the heating or lowering of the temperature is started to simulate the high and low temperature working environment of the chip under test.

[0052] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A chip test box, characterized in that: The chip test box comprises: A box body, wherein a first through hole is formed on a first side of the box body, a first door is formed on a second side of the box body, and a second through hole is formed on the first door body; and The supporting component is arranged inside the box body and is used for supporting the chip under test. The supporting component is provided with a third through hole, the third through hole faces the chip under test, and the third through hole is communicated with the first through hole.

2. The chip test box according to claim 1, characterized in that: An optical platform is also provided inside the chip test box, and the supporting assembly is arranged on the optical platform.

3. The chip test box according to claim 2, characterized in that: The support assembly includes A support plate having a first sub-through hole; and A support rod, wherein the first end of the support rod can be arranged in the hole of the optical platform, and the second end of the support rod is provided with a clamp, and the clamp is used to clamp the support plate; a second sub-through hole is opened inside the support rod, and the first sub-through hole and the second sub-through hole are connected to form the third through hole.

4. The chip test box according to claim 3, characterized in that: The support assembly also includes a fixing sleeve, a first end of which is disposed in a hole of the optical platform, and a second end of which is sleeved on the first end of the support rod; wherein the fixing sleeve is provided with an opening, the opening is provided with a rotating member, and the rotating member is threadedly connected to the opening.

5. The chip test box according to claim 1, characterized in that: It also includes a temperature control component, which includes a heating element, a cooling element and a temperature control element. The temperature control element is used to control the start and stop of the heating element and the cooling element.

6. The chip test box according to claim 1, characterized in that: The chip test box further includes an aperture component, which is disposed at the second through hole and is used for filtering light.

7. The chip test box according to claim 6, characterized in that: The aperture assembly includes an aperture, a first movable member, and a second movable member. The first movable member is used to control the aperture to move along a first direction, and the second movable member is used to control the aperture to move along a second direction.

8. The chip test box according to claim 1, characterized in that: The first door body is rotatably connected to the box body through a first hinge.

9. The chip test box according to claim 1, characterized in that: A second door body is provided on the third side of the box body, and the second door body is rotatably connected to the box body. The second door body includes a first rotation position and a second rotation position. The second door body seals the box body when it is in the first rotation position, and when the second door body is in the second rotation position, the interior of the box body is connected with the external space.

10. A chip testing device, characterized in that: The chip testing device comprises: The chip test box according to any one of claims 1 to 9; an air extraction mechanism, comprising an air pump and an air pipe connected to the air pump, wherein the air pipe extends into the chip test box along the first through hole and the third through hole; and The light source faces the second through hole and is used for emitting a light beam.

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