TOF module and electronic equipment

Abstract

The utility model provides a TOF module and electronic equipment, the TOF module comprises a circuit board, a transmitting unit, a receiving unit, a shielding cover and a cover shell, the transmitting unit and the receiving unit are both installed on the same side of the circuit board and are both electrically connected with the circuit board, the shielding cover is installed on the circuit board and covers at least part of the transmitting unit, the shielding cover is provided with an open groove, and the open groove is communicated with the receiving unit. The slot penetrates through the shielding cover along the thickness direction of the shielding cover, and at least part of the transmitting unit is exposed; the housing is installed on the circuit board and covers the shielding case and at least part of the receiving unit, the housing is provided with a first window and a second window, the first window and the second window penetrate through the housing in the thickness direction of the housing and are arranged at intervals, the first window and the slot are oppositely arranged, and at least part of the receiving unit is exposed out of the second window. The TOF module is small in size, and the occupied space in the electronic equipment is saved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a TOF module and an electronic equipment. Background Art

[0002] TOF (Time of flight) technology is to obtain data information of the target object by sending light to the target object, and then calculating the time difference between the light emission and reflection. The TOF module in electronic equipment usually includes multiple devices such as the transmitting unit and the receiving unit. The size of the TOF module is large and occupies a large space in the electronic device. Utility Model Content

[0003] The purpose of the present application is to provide a TOF module and an electronic device. The TOF module is small in size and saves space in the electronic device.

[0004] The embodiment of the present application provides a TOF module, which includes a circuit board, a transmitting unit, a receiving unit, a shielding cover and a cover shell, wherein the transmitting unit and the receiving unit are both installed on the same side of the circuit board and are both electrically connected to the circuit board, the shielding cover is installed on the circuit board and covers at least part of the transmitting unit, the shielding cover is provided with a slot, the slot passes through the shielding cover along the thickness direction of the shielding cover and exposes at least part of the transmitting unit;

[0005] The cover shell is installed on the circuit board and covers the shielding cover and at least part of the receiving unit. The cover shell is provided with a first window and a second window. The first window and the second window both penetrate the cover shell along the thickness direction of the cover shell and are spaced apart from each other. The first window is arranged opposite to the groove, and the second window exposes at least part of the receiving unit.

[0006] In the TOF module provided by the embodiment of the present application, by arranging the transmitting unit and the receiving unit on the same circuit board, the center distance (Baseline) between the transmitting unit and the receiving unit can be reduced, thereby reducing the size of the TOF module, thereby saving the space occupied by the TOF module in the electronic device. At the same time, since the transmitting unit and the receiving unit can both transmit signals through the same circuit board, the number of pins of the connector connected to the circuit board can also be reduced, saving the number of connectors.

[0007] In addition, since the devices that mainly cause radio frequency and / or electromagnetic interference in the TOF module are concentrated in the transmitting unit. The embodiment of the present application is designed to cover the outside of at least part of the transmitting unit, so as to use the shielding cover to shield the transmitting unit, thereby avoiding the influence of radio frequency and / or electromagnetic interference caused by the transmitting unit. At the same time, the shielding cover is provided with slots, so that at least part of the transmitting unit can be exposed relative to the slots, so as to avoid the shielding cover blocking the light emitted by the transmitting unit. In addition, the shielding cover can separate the transmitting unit from the receiving unit, and can play a certain role in isolating crosstalk, so as to block the light emitted by the transmitting unit located on the inner side of the shielding cover from crosstalking to the receiving unit, thereby avoiding the crosstalk light causing the noise of the receiving unit to be too strong, thereby helping to improve the quality of the signal transmitted by the TOF module.

[0008] In addition, the embodiment of the present application sets the cover shell to the outside of the shielding cover. On the one hand, the shielding cover can be installed first, and then the cover shell can be set on the outside of the shielding cover for assembly, so as to avoid the problem that the high temperature environment when installing the shielding cover is easy to damage the cover shell when the cover shell is installed first, thereby improving the assembly effect of the TOF module. On the other hand, the cover shell is simultaneously set on the outside of the shielding cover and part of the receiving unit, which plays a role of packaging and prevents dust and other substances from entering the inside of the cover shell, causing damage to the transmitting unit and the receiving unit. In addition, the first window and the second window are also set on the cover shell, which will not block the light emitted by the transmitting unit and the light received by the receiving unit while playing a packaging effect, thereby ensuring the use function of the TOF module.

[0009] In a possible embodiment, the cover includes a cover body and a partition, the cover body is mounted on the circuit board, and the cover is arranged on the shielding cover and at least part of the receiving unit, the partition is fixedly connected to the inner side of the cover, and the inner side of the cover is divided into a first chamber and a second chamber, the first chamber is connected to the first window, the shielding cover is located in the first chamber, the second chamber is connected to the second window, and at least part of the receiving unit is located in the second chamber. By setting a partition to separate the transmitting unit from the receiving unit, the problem of excessive noise in the receiving unit caused by the light emitted by the transmitting unit crosstalking to the receiving unit is further avoided. At this time, the partition and the shielding cover together play a double isolation crosstalk effect, further improving the quality of the TOF module transmission signal.

[0010] In a possible embodiment, the cover shell includes a cover shell and a first side shell, the first side shell is fixedly connected to the peripheral side of the cover shell and is enclosed with the partition to form a first chamber, the first side shell is installed on the circuit board, the cover shell is arranged opposite to the circuit board, the first window and the second window are both provided on the cover shell and both penetrate the cover shell, the partition is fixedly connected to the cover shell and extends from the cover shell to be flush with the surface of the first side shell facing away from the cover shell, so that when the cover shell is installed on the circuit board, the partition can completely isolate the first chamber from the second chamber, thereby preventing light in the first chamber from crosstalking to the second chamber, thereby improving the isolation effect of the partition.

[0011] In a possible embodiment, the TOF module also includes an adhesive layer, the material of the adhesive layer is a light-absorbing material, and the adhesive layer is bonded between the cover shell and the circuit board to improve the sealing effect of the cover shell, prevent light inside the cover shell from passing through to the outside of the cover shell, or prevent light from crosstalking from the first chamber to the second chamber, which is beneficial to improving the quality of the TOF module transmission signal.

[0012] In a possible embodiment, the adhesive layer includes a first adhesive layer, which is bonded between the partition and the circuit board. On the one hand, the cover shell can be fixedly connected to the circuit board through the partition, which is beneficial to improving the installation stability of the cover shell on the circuit board. On the other hand, it prevents the light in the first chamber from passing through the gap between the partition and the circuit board to the second chamber, thereby increasing the effect of isolating light crosstalk, and further preventing the light emitted by the transmitting unit from crosstalking to the receiving unit and causing the receiving unit to have excessive noise, thereby helping to improve the quality of the TOF module transmission signal.

[0013] In a possible embodiment, the adhesive layer also includes a second adhesive layer, which is bonded between the cover body and the circuit board, and can prevent light inside the cover body from passing through to the outside of the cover body, thereby improving the packaging effect of the TOF module and ensuring the quality of the TOF module transmission signal.

[0014] In a possible embodiment, the emitting unit includes a light source component, and the TOF module also includes a raising block, which is arranged on the inner side of the shielding cover and installed between the light source component and the circuit board so as to raise the light source component, thereby facilitating the reduction of the area of ​​the light emitted by the light source component projected onto the shielding cover and the cover shell, thereby facilitating the reduction of the opening size of the slot of the shielding cover and the first window of the cover shell.

[0015] In a possible implementation, the padding block is made of heat dissipation material, which can increase the heat dissipation effect and ensure the reliability of the TOF module.

[0016] An embodiment of the present application also provides an electronic device, a data processing module and a TOF module as described above, wherein a circuit board of the TOF module is electrically connected to the data processing module.

[0017] In a possible embodiment, the first window and the second window are spaced apart, the outer surface of the cover shell includes a mounting surface, the mounting surface is located between the first window and the second window, the electronic device also includes a seal and a protective cover, the protective cover is arranged opposite to the mounting surface, the seal is installed between the mounting surface and the protective cover, and can isolate the light reflected by the protective cover from crosstalking to the receiving unit, thereby reducing the noise of the receiving unit, thereby ensuring the quality of the TOF module transmission signal.

[0018] In a possible implementation, the electronic device further includes a camera module, and the camera module is electrically connected to the data processing module. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0021] Figure 2 for Figure 1 A schematic diagram of the structure of a TOF module in the electronic device shown;

[0022] Figure 3 for Figure 2 Schematic diagram of the exploded structure of the TOF module shown;

[0023] Figure 4 for Figure 3 The schematic diagram of the structure of the shielding cover in the TOF module shown;

[0024] Figure 5 for Figure 3 A schematic diagram of the structure of the housing in the TOF module shown;

[0025] Figure 6 for Figure 5 A schematic diagram of the structure of the housing shown in another viewing angle;

[0026] Figure 7 for Figure 2 A schematic diagram of the cross-sectional structure of the TOF module shown;

[0027] Figure 8 for Figure 1 A schematic cross-sectional view of a partial structure of the electronic device shown. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0029] See also Figure 1 , Figure 1 A schematic diagram of the structure of an electronic device 1 provided in an embodiment of the present application.

[0030] The embodiment of the present application provides an electronic device 1, which can be any electronic device with TOF (Time of flight) function requirements, such as a mobile phone, a personal computer (PC), a tablet computer, a camera, a video camera, a drone, etc. The embodiment of the present application takes the electronic device 1 as an example of a mobile phone for explanation.

[0031] The electronic device 1 includes a housing 100, a TOF (Time of flight) module 300, a data processing module 500 and a camera module 700. The TOF module 300, the data processing module 500 and the camera module 700 are all installed in the housing 100. The data processing module 500 is electrically connected between the TOF module 300 and the camera module 700 to realize signal transmission between the TOF module 300 and the data processing module 500.

[0032] Exemplarily, the TOF module 300 may be an iTOF (indirect Time-of-Flight) module or a dTOF (Direct Time of Flight) module. Exemplarily, the data processing module 500 includes but is not limited to an application processor (AP), a graphics processor (GPU), an image signal processor (ISP), a controller or a digital signal processor (DSP) and other devices.

[0033] When the electronic device 1 is working, the TOF module 300 can emit light to the target object and receive the reflected light of the target object to obtain information of the target object, such as depth information, and transmit the acquired data information of the target object to the data processing module 500. The data processing module 500 receives, analyzes or processes the acquired data information of the target object and transmits it to the camera module 700. The camera module 700 is used for focusing, blurring or depth modeling based on the received data information, thereby realizing the imaging function of the electronic device 1 on the target object.

[0034] See also Figure 2 and Figure 3 , Figure 2 for Figure 1 The schematic diagram of the structure of the TOF module 300 in the electronic device 1 is shown. Figure 3 for Figure 2 A schematic diagram of the exploded structure of the TOF module 300 is shown.

[0035] The TOF module 300 includes a circuit board 10, a shielding cover 30, an adhesive layer 40, a cover 50, a transmitting unit 70 and a receiving unit 90. The transmitting unit 70 and the receiving unit 90 are mounted on the same side of the circuit board 10 and are both electrically connected to the circuit board 10. The shielding cover 30 is mounted on the circuit board 10 and covers the outer side of at least part of the transmitting unit 70. The cover 50 is mounted on the circuit board 10 and covers the outer side of the shielding cover 30 and at least part of the receiving unit 90. The adhesive layer 40 is bonded between the cover 50 and the circuit board 10. Among them, the transmitting unit 70 is used to emit light to the target object. The receiving unit 90 is used to receive the reflected light of the target object. Exemplarily, the light emitted by the transmitting unit 70 can be infrared light. For example, the light emitted by the transmitting unit 70 can be 940nm infrared light or 850nm infrared light.

[0036] Specifically, the circuit board 10 may be a flexible printed circuit (FPC), or the circuit board 10 may be a rigid-flexible board, and the bent portion of the circuit board 10 is a flexible portion. The circuit board 10 includes a first surface 11 and a second surface 13, and the first surface 11 and the second surface 13 are disposed opposite to each other along the thickness direction of the circuit board 10.

[0037] The adhesive layer 40 is used to bond the circuit board 10 to the cover 50 so that the cover 50 is installed on the circuit board 10. Exemplarily, the material of the adhesive layer 40 can be a light absorbing material, which has an absorption effect on the wavelength band of the light generated by the emitting unit 70. Exemplarily, the light absorbing material can be selected from a material that has strong absorption of the wavelength band of the light generated by the emitting unit 70, such as a material whose transmittance to the light generated by the emitting unit 70 is equal to 0. In this embodiment, the adhesive layer 40 includes a first adhesive layer 41 and a second adhesive layer 42. Among them, the second adhesive layer 42 includes a first adhesive portion 421 and a second adhesive portion 423. In this embodiment, the first adhesive layer 41 is connected between the first adhesive portion 421 and the second adhesive portion 423.

[0038] See also Figure 4 , Figure 4 for Figure 3 The schematic diagram of the structure of the shielding cover 30 in the TOF module 300 is shown. The shielding cover 30 is used to shield the radio frequency or electromagnetic interference generated by the device installed inside the shielding cover 30. Exemplarily, the material of the shielding cover 30 can be metal. For example, the metal can be nickel silver.

[0039] The shielding cover 30 is provided with a receiving cavity 31 and a slot 33. The opening of the slot 33 is provided on the outer surface of the shielding cover 30 and is connected to the receiving cavity 31, so that the slot 33 is connected to the inner side and the outer side of the shielding cover 30. The shielding cover 30 includes a cover plate 35 and a side plate 37. The side plate 37 is fixedly connected to the peripheral side of the cover plate 35 and encloses the cover plate 35 to form the receiving cavity 31. In this embodiment, the opening of the slot 33 is provided on the outer surface of the cover plate 35.

[0040] See also Figure 5 and Figure 6 , Figure 5 for Figure 3 The schematic diagram of the structure of the cover 50 in the TOF module 300 is shown in FIG. Figure 6 for Figure 5 The structure of the cover 50 is shown in another perspective.

[0041] The cover 50 includes a cover body 51 and a partition 53, and the partition 53 is fixedly connected to the inner side of the cover body 51. Exemplarily, the material of the cover 50 can be a resin material, which can be molded by injection molding.

[0042] Specifically, the cover body 51 is provided with a receiving cavity 52, a first window 501, a second window 503, a first mounting groove 505, and a second mounting groove 507. The opening of the first window 501 and the opening of the second window 503 are both provided on the outer surface of the cover body 51, and are both connected to the receiving cavity 52, so that the first window 501 and the second window 503 are both connected to the inner side and the outer side of the cover body 51. In this embodiment, the opening of the first window 501 and the opening of the second window 503 are arranged at intervals from each other. Among them, the first window 501 is used to transmit light, and the second window 503 is used to transmit reflected light.

[0043] The opening of the first mounting groove 505 and the opening of the second mounting groove 507 are both arranged on the outer surface of the cover body 51. The first mounting groove 505 is arranged around the first window 501. The second mounting groove 507 is arranged around the second window 503. In this embodiment, the first mounting groove 505 is a rectangular groove, and the second mounting groove 507 is a circular groove. The outer surface of the cover body 51 includes a mounting surface 511, and the mounting surface 511 is located between the first window 501 and the second window 503. In this embodiment, the mounting surface 511 is a plane. The width of the mounting surface 511 is W.

[0044] It is understandable that the outer shape of the cover body 51 can be a regular structure or a special-shaped structure. In this embodiment, the cover body 51 includes a cover shell 513 and a side shell 515. The side shell 515 is fixedly connected to the peripheral side of the cover shell 513, and is enclosed with the cover shell 513 to form a receiving cavity 52. ​​Among them, the opening of the first window 501 and the opening of the second window 503 are both arranged on the outer surface of the cover shell 513, and the first window 501 and the second window 503 are both penetrated through the cover shell 513 along the thickness direction of the cover shell 513 to achieve communication with the receiving cavity 52, so as to achieve that the first window 501 and the second window 503 are both connected to the inner side and the outer side of the cover body 51. The opening of the first mounting groove 505 and the opening of the second mounting groove 507 are both arranged on the outer surface of the cover shell 513, and are both recessed from the outer surface of the cover shell 513 in the direction of the receiving cavity 52. ​​In this embodiment, the side shell 515 includes a first side shell 515a and a second side shell 515b fixedly connected to the first side shell 515a. The first side shell 515 a and the second side shell 515 b are fixedly connected to the same side of the cover shell 513 .

[0045] like Figure 6As shown, the partition 53 is fixedly connected to the surface of the cover shell 513 facing the receiving chamber 52, so that the partition 53 is fixedly connected to the inner side of the cover body 51. The partition 53 divides the receiving chamber 52 into a first chamber 55 and a second chamber 57. The first chamber 55 is connected to the first window 501, and the second chamber 57 is connected to the second window 503. Specifically, in this embodiment, the partition 53 is fixedly connected between the first side shell 515a and the second side shell 515b. The partition 53, the cover shell 513 and the first side shell 515a are enclosed to form the first chamber 55, and the partition 53, the cover shell 513 and the second side shell 515b are enclosed to form the second chamber 57. The first side shell 515a is the part of the side shell 515 located in the first chamber 55, and the second side shell 515b is the part of the side shell 515 located in the second chamber 57.

[0046] In this embodiment, the partition 53 extends from the cover shell 513 to be flush with the surface of the first side shell 515a away from the cover shell 513, so that when the cover shell 50 is installed on the circuit board 10, the partition 53 can completely isolate the first chamber 55 from the second chamber 57, thereby preventing the light in the first chamber 55 from crosstalking to the second chamber 57, and improving the isolation effect of the partition 53. In this embodiment, the surface of the first side shell 515a away from the cover shell 513 is flush with the surface of the second side shell 515b away from the cover shell 513. When the cover shell 50 is installed on the circuit board 10, the partition 53 can also seal the second chamber 57 together with the second side shell 515b to prevent the light in the second chamber 57 from passing through the cover shell 50, thereby improving the sealing effect of the TOF module 300 and ensuring the quality of the signal transmitted by the TOF module 300.

[0047] See also Figure 7 , Figure 7 for Figure 2 A schematic diagram of the cross-sectional structure of the TOF module 300 is shown.

[0048] In this embodiment, the transmitting unit 70 includes a driving member ( Figure 7), a light source component 73 and a light diffuser 75, the light source component 73 is electrically connected to the driver. Among them, the light source component 73 includes a light emitting surface, and the light emitting surface is used to emit light. Exemplarily, the driver can be a driver chip (Driver IC). The light source component 73 can be a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, VCSEL), a light emitting diode (Light Emitting Diode, LED) or other infrared light source. The light diffuser 75 can be a diffuser (Diffuser), a diffractive optical element (Diffractive Optical Element, DOE) or a metasurface device. Among them, the driver can emit a driving current or a driving voltage to drive the light emitting surface of the light source component 73 to emit light. The light passes through the light diffuser 75, and the light diffuser 75 modulates the waveform of the emitted light, such as a laser waveform, into a designed light field, such as a surface light field or a point light field, to project it onto the surface of the target object.

[0049] It is understandable that the transmitting unit 70 includes interference devices and non-interference devices. Among them, the interference device refers to a device that can cause radio frequency and / or electromagnetic interference. The non-interference device refers to a device that does not cause radio frequency and / or electromagnetic interference. In this embodiment, the interference device in the transmitting unit 70 includes a driving component and a light source component 73, and the non-interference device includes a light diffusion component 75. It is understandable that the transmitting unit 70 can actually also include devices such as capacitors, inductors, resistors, etc., and such devices are also interference devices.

[0050] In this embodiment, the receiving unit 90 includes an optical component 91, a filter 93 and a sensor (Sensor) 95. Among them, the optical component 91 is used to converge the reflected light. Exemplarily, the optical component 91 can be at least one of a lens (Lens) and a metasurface device. The filter 93 is used to filter out the non-effective wavelength information in the optical signal received by the receiving unit 90 to improve the signal-to-noise ratio of the TOF module 300. Exemplarily, the filter 93 can be a narrow-band filter, such as an infrared (IR) filter. The sensor 95 is used to receive light to obtain data information of the target object.

[0051] Continue reading Figure 7 In this embodiment, the TOF module 300 further includes a connector 60, a spacer block 80 and an electrical connector ( Figure 7). The connector 60 is used to be electrically connected to the data processing module 500. Specifically, the connector 60 is mounted on the circuit board 10 and is electrically connected to the circuit board 10. Exemplarily, the connector 60 may be a board-to-board (BTB) connector, which is electrically connected to the data processing module 500 and electrically connected to a connector that is mutually compatible with the connector 60 to achieve signal transmission between the circuit board 10 and the data processing module 500, thereby achieving signal transmission between the TOF module 300 and the data processing module 500.

[0052] The padding block 80 is used to pad the light source 73 of the emitting unit 70. For example, the padding block 80 can be made of a heat dissipation material to simultaneously improve the heat dissipation effect of the emitting unit 70, thereby improving the heat dissipation effect of the TOF module 300. For example, the heat dissipation material can be metal or ceramic. For example, the metal padding block 80 can be a brass block. In this embodiment, the padding block 80 is provided with a through hole ( Figure 7 The through hole penetrates the padding block 80 along the thickness direction of the padding block 80. The electrical connector is arranged in the through hole and is electrically connected to the circuit board 10. For example, the electrical connector can be formed by depositing a metal material in the through hole of the padding block 80.

[0053] Continue reading Figure 7 In the assembled TOF module 300, the side plate 37 of the shielding cover 30 is mounted on the first surface 11 of the circuit board 10, and the cover plate 35 is arranged opposite to the circuit board 10 to achieve the shielding cover 30 being mounted on the first surface 11 of the circuit board 10. Exemplarily, the side plate 37 of the shielding cover 30 can be connected to the pad on the circuit board 10 by a solder SMT (Surface Mounted Technology) process to achieve the shielding cover 30 being mounted on the circuit board 10.

[0054] The side shell 515 of the cover body 51 of the cover shell 50 is installed on the first surface 11 of the circuit board 10, and the cover shell 513 is arranged opposite to the circuit board 10 to realize that the cover body 51 is installed on the circuit board 10, thereby realizing that the cover shell 50 is installed on the circuit board 10. The shielding cover 30 is accommodated in the first chamber 55 of the cover body 51, so that the cover body 51 is covered on the outside of the shielding cover 30, thereby realizing that the cover shell 50 is covered on the outside of the shielding cover 30. At this time, the first window 501 of the cover body 51 in the cover shell 50 is arranged opposite to the slot 33 of the shielding cover 30, so that the light passing through the slot 33 can be emitted from the first window 501, so as to avoid the cover body 51 blocking the light. The partition 53 isolates the first chamber 55 and the second chamber 57, so as to avoid the light in the first chamber 55 from crosstalking to the second chamber 57.

[0055] The adhesive layer 40 is bonded between the cover body 51 and the circuit board 10, and / or between the separator 53 and the circuit board 10, so that the adhesive layer 40 is bonded between the cover shell 50 and the circuit board 10. In this embodiment, the adhesive layer 40 is bonded between the first surface 11 of the circuit board 10 and the surface of the middle shell 515 of the cover body 51 away from the cover shell 513, and between the first surface 11 of the circuit board 10 and the surface of the separator 53 away from the cover shell 513, so that the adhesive layer 40 is bonded between the cover body 51 and the circuit board 10, and between the separator 53 and the circuit board 10, so that the adhesive layer 40 is bonded between the cover shell 50 and the circuit board 10.

[0056] Combined with reference Figure 3 , Figure 6 and Figure 7 Specifically, the first adhesive layer 41 in the adhesive layer 40 is bonded between the partition 53 and the circuit board 10. The second adhesive layer 42 is bonded between the cover body 51 and the circuit board 10. In this embodiment, the first adhesive portion 421 in the second adhesive layer 42 is bonded between the first side shell 515a of the side shell 515 and the circuit board 10, so that the first adhesive portion 421 seals the first chamber 55. The second adhesive portion 423 is bonded between the second side shell 515b of the side shell 515 and the circuit board 10, so that the second adhesive portion 423 seals the second chamber 57. Among them, by providing the first adhesive layer 41 and the first adhesive portion 421, the adhesive layer 40 is arranged around the peripheral side of the shielding cover 30 and seals the first chamber 55. At this time, the material of the adhesive layer 40 is selected from a light absorbing material that has an absorbing effect on the light emitted by the emitting unit 70, which can prevent the light in the first chamber 55 from being entangled in the second chamber 57, and prevent the light in the first chamber 55 from penetrating to the outside of the cover body 51, further improving the sealing effect of the first chamber 55, thereby facilitating the improvement of the packaging effect of the TOF module 300 and ensuring the quality of the signal transmitted by the TOF module 300. In addition, by providing the second adhesive portion 423 to seal the second chamber 57, it is possible to prevent the light in the second chamber 57 from penetrating to the outside of the cover body 51, thereby facilitating the improvement of the packaging effect of the TOF module 300 and ensuring the quality of the signal transmitted by the TOF module 300.

[0057] The padding block 80 is mounted on the first surface 11 of the circuit board 10 and is located in the accommodating cavity 31 of the shielding cover 30, so that the padding block 80 is arranged on the inner side of the shielding cover 30. In the transmitting unit 70, the interference device is accommodated in the accommodating cavity 31 of the shielding cover 30, so that the shielding cover 30 is arranged on the outside of the interference device, so that the shielding cover 30 shields the interference caused by the interference device to the radio frequency and / or electromagnetic. Specifically, the driving member and the light source member 73 are both accommodated in the accommodating cavity 31 of the shielding cover 30, so that the shielding cover 30 is arranged on the outside of the driving member and the light source member 73, so that the shielding cover 30 is arranged on the outside of at least part of the transmitting unit 70. Among them, the driving member is mounted on the first surface 11 of the circuit board 10 and is electrically connected to the circuit board 10. The light source member 73 is mounted on the side of the padding block 80 away from the circuit board 10, so that the padding block 80 is installed between the light source member 73 and the circuit board 10, so that the padding block 80 is installed between the transmitting unit 70 and the circuit board 10. The light source component 73 is electrically connected to the electrical connector provided in the through hole of the padding block 80, so that the light source component 73 is electrically connected to the circuit board 10 through the electrical connector, thereby realizing the electrical connection between the light source component 73 and the driving component, and then realizing that the driving component drives the light source component 73 to emit light. At this time, the light-emitting surface of the light source component 73 is away from the padding block 80, and is arranged opposite to the slot 33 of the shielding cover 30. The light-emitting surface of the light source component 73 is exposed relative to the slot 33 of the shielding cover 30 and the first window 501 of the cover body 51, so that the light emitted from the light-emitting surface of the light source component 73 can pass through the slot 33 and the first window 501.

[0058] The light diffuser 75 in the emitting unit 70 is located on the side of the light source 73 away from the circuit board 10 and is installed in the first installation slot 505 of the cover 51. The light diffuser 75 is supported on the bottom wall of the first installation slot 505 and covers the opening of the first window 501.

[0059] In the receiving unit 90, the sensor 95 is mounted on the first surface 11 of the circuit board 10 and is electrically connected to the circuit board 10. The filter 93 is mounted on the side of the sensor 95 away from the circuit board 10. The sensor 95 and the filter 93 are both accommodated in the second chamber 57 of the cover body 51, so that the cover 50 is covered on the outside of at least part of the receiving unit 90. The optical component 91 is installed in the second mounting groove 507 of the cover 50. The optical component 91 is carried on the bottom wall of the second mounting groove 507 and covers the opening of the second window 503.

[0060] Combined with reference Figure 1 , Figure 7 and Figure 8 , Figure 8 for Figure 1 A schematic cross-sectional structure diagram of a partial structure of the electronic device 1 is shown.

[0061] The electronic device 1 further includes a protective cover 800 and a sealing member 900. In the assembled electronic device 1, the protective cover 800 is installed on the housing 100, and the sealing member 900 is installed between the protective cover 800 and the housing 100. Exemplarily, the protective cover 800 may be a cover glass (CG). The sealing member 900 may be a sponge.

[0062] Specifically, in this embodiment, the circuit board 10 of the TOF module 300 is installed in the housing 100. Exemplarily, the circuit board 10 can be installed in the housing 100 by means of a structural member installed in the electronic device 1. The protective cover 800 is installed in the housing 100 and is arranged opposite to the mounting surface 511 between the first window 501 and the second window 503 in the housing 50 of the TOF module 300. The seal 900 is installed between the mounting surface 511 of the housing 50 and the protective cover 800 to realize the installation of the seal 900 between the housing 50 and the housing 100, thereby realizing the installation of the seal 900 between the TOF module 300 and the housing 100.

[0063] In the electronic device 1, when the TOF module 300 is working, the driving member in the transmitting unit 70 drives the light source member 73 to emit light, and the light passes through the slot 33 of the shielding cover 30 and the first window 501 of the housing 50 in turn, and is modulated into a designed light field by the light diffuser 75, and then is projected onto the surface of the target object through the protective cover 800. The reflected light of the target object is projected into the optical member 91 of the receiving unit 90 through the protective cover 800, and then enters the second chamber 57 of the housing 50 through the second window 503, and then passes through the filter 93 to reach the sensor 95. The sensor 95 receives the reflected light and obtains the data information of the target object. The data information of the target object is transmitted to the data processing module 500 through the connector 60, and the data processing module 500 realizes focusing, blurring or depth modeling based on the acquired data information of the target object, thereby realizing the imaging function of the electronic device 1 on the target object.

[0064] Among them, when the light emitted by the transmitting unit 70 is incident on the protective cover 800, the protective cover 800 will reflect a part of the light. The light reflected by the protective cover 800 easily passes through the gap between the protective cover 800 and the housing 50 and enters the receiving unit 90, thereby causing the noise of the receiving unit 90 to be too strong, thereby affecting the quality of the signal transmitted by the TOF module 300. In the electronic device 1 provided in the embodiment of the present application, by setting the first window 501 and the second window 503 of the housing 50 at intervals, and installing the seal 900 between the mounting surface 511 located between the first window 501 and the second window 503 in the housing 50 and the protective cover 800, the light reflected by the protective cover 800 can be isolated from crosstalking to the receiving unit 90, reducing the noise of the receiving unit 90, thereby ensuring the quality of the signal transmitted by the TOF module 300. In addition, by setting the protective cover 800, foreign matter such as dust can also be prevented from entering the electronic device 1, so as to protect the TOF module 300 and other components in the electronic device 1 from being damaged by foreign matter.

[0065] In the TOF module 300 provided in the embodiment of the present application, by setting the transmitting unit 70 and the receiving unit 90 on the same circuit board 10, the center distance (Baseline) between the transmitting unit 70 and the receiving unit 90 can be reduced, so that the size of the TOF module 300 can be reduced, thereby saving the space occupied by the TOF module 300 in the electronic device 1. At the same time, since the transmitting unit 70 and the receiving unit 90 can both transmit signals through the same circuit board 10, the number of pins of the connector 60 connected to the circuit board 10 can also be reduced, saving the number of connectors.

[0066] In addition, since the devices that mainly cause radio frequency and / or electromagnetic interference in the TOF module 300 are concentrated in the transmitting unit 70. The embodiment of the present application is designed to cover the outer side of at least part of the transmitting unit 70 by designing the shielding cover 30 to shield the transmitting unit 70 by the shielding cover 30, thereby avoiding the influence of radio frequency and / or electromagnetic interference caused by the interfering devices in the transmitting unit 70. At the same time, the shielding cover 30 is provided with a slot 33, and at least part of the transmitting unit 70 is exposed relative to the slot 33, so as to avoid the shielding cover 30 blocking the light emitted by the transmitting unit 70. In addition, the shielding cover 30 can separate the transmitting unit 70 from the receiving unit 90, and can play a certain role in isolating crosstalk, so as to block the light emitted by the transmitting unit 70 located on the inner side of the shielding cover 30 from crosstalking to the receiving unit 90, thereby avoiding the crosstalk light causing the noise of the receiving unit 90 to be too strong, thereby helping to improve the quality of the signal transmitted by the TOF module 300.

[0067] In addition, since the cover 50 is usually made of resin material, it is easy to be damaged under high temperature conditions. In the embodiment of the present application, the cover 50 is set to cover the outside of the shielding cover 30. On the one hand, the shielding cover 30 can be installed first, and then the cover 50 can be set to the outside of the shielding cover 30 for assembly, so as to avoid the problem that the high temperature environment when the shielding cover 30 is installed by the SMT process when the cover 50 is installed first is easy to damage the cover 50, thereby improving the assembly effect of the TOF module 300. On the other hand, the cover 50 is simultaneously set to the outside of the shielding cover 30 and part of the receiving unit 90, which plays a role of packaging, and prevents dust and other substances from entering the inside of the cover body 51, causing damage to the transmitting unit 70 and the receiving unit 90. In addition, the first window 501 and the second window 503 are also set on the cover 50, which will not block the light emitted by the transmitting unit 70 and the light received by the receiving unit 90 while playing a packaging effect, thereby ensuring the use function of the TOF module 300.

[0068] In addition, in the TOF module 300 of the embodiment of the present application, a partition 53 is provided to separate the inner side of the cover body 51 in the housing 50 into a first chamber 55 and a second chamber 57 that are isolated from each other, and the shielding cover 30 is provided in the first chamber 55, and at least part of the receiving unit 90 is provided in the second chamber 57, so that the transmitting unit 70 is separated from the receiving unit 90 by the partition 53, and the problem of excessive noise in the receiving unit 90 caused by the light emitted by the transmitting unit 70 crosstalking to the receiving unit 90 is further avoided. At this time, the partition 53 and the shielding cover 30 together play a double isolation crosstalk effect, further improving the quality of the signal transmitted by the TOF module 300.

[0069] In the TOF module 300 provided in the embodiment of the present application, by setting the first adhesive layer 41 between the partition 53 and the circuit board 10, on the one hand, the cover 50 can be fixedly connected to the circuit board 10 through the partition 53, which is beneficial to improve the installation stability of the cover 50 on the circuit board 10. On the other hand, the first adhesive layer 41 is made of a light absorbing material that has a light absorbing effect on the wavelength band of the light emitted by the transmitting unit 70, which can prevent the light in the first chamber 55 from passing through the gap between the partition 53 and the circuit board 10 to the second chamber 57, thereby increasing the effect of isolating light crosstalk, and further avoiding the problem of light emitted by the transmitting unit 70 crosstalking to the receiving unit 90 and causing the receiving unit 90 to have excessive noise, thereby helping to improve the quality of the signal transmitted by the TOF module 300.

[0070] In addition, by setting a second adhesive layer 42 bonded between the cover body 51 and the circuit board 10, it is possible to prevent light inside the cover body 51 from passing through to the outside of the cover body 51, thereby improving the packaging effect of the TOF module 300 and ensuring the quality of the signal transmitted by the TOF module 300.

[0071] The embodiment of the present application sets a spacer block 80 between the light source part 73 of the transmitting unit 70 and the circuit board 10, which is conducive to reducing the area of ​​the light emitted by the light source part 73 projected onto the shielding cover 30 and the housing 50, thereby helping to reduce the opening size of the slot 33 of the shielding cover 30 and the first window 501 of the housing 50. In addition, when the transmission power of the transmitting unit 70 increases, the light source part 73 will have a heat dissipation risk, and the heat dissipation capacity of the circuit board 10 is poor, which can easily cause the device in the TOF module 300 to fail due to overheating, and then cause the reliability of the TOF module 300 to decrease. The embodiment of the present application sets the material of the spacer block 80 as a heat dissipation material, which can increase the heat dissipation effect and ensure the reliability of the TOF module 300.

[0072] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiments and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A TOF module, characterized in that: The TOF module includes a circuit board, a transmitting unit, a receiving unit, a shielding cover and a housing, wherein the transmitting unit and the receiving unit are both mounted on the same side of the circuit board and are both electrically connected to the circuit board, the shielding cover is mounted on the circuit board and covers at least a portion of the transmitting unit, the shielding cover is provided with a slot, the slot passes through the shielding cover along a thickness direction of the shielding cover and exposes at least a portion of the transmitting unit; The cover shell is installed on the circuit board and covers the shielding cover and at least a part of the receiving unit. The cover shell is provided with a first window and a second window. The first window and the second window both penetrate the cover shell along the thickness direction of the cover shell and are spaced apart from each other. The first window is arranged opposite to the groove, and the second window exposes at least a part of the receiving unit.

2. The TOF module according to claim 1, characterized in that: The cover shell includes a cover body and a partition, the cover body is mounted on the circuit board and covers the shielding cover and at least part of the receiving unit, the partition is fixedly connected to the inner side of the cover shell and divides the inner side of the cover shell into a first chamber and a second chamber, the first chamber is connected to the first window, the shielding cover is located in the first chamber, the second chamber is connected to the second window, and at least part of the receiving unit is located in the second chamber.

3. The TOF module according to claim 2, characterized in that: The cover shell includes a cover shell and a first side shell, the first side shell is fixedly connected to the peripheral side of the cover shell and is enclosed with the partition to form the first chamber, the first side shell is installed on the circuit board, the cover shell is arranged opposite to the circuit board, the first window and the second window are both provided in the cover shell and both penetrate the cover shell, the partition is fixedly connected to the cover shell and extends from the cover shell to be flush with the surface of the first side shell facing away from the cover shell.

4. The TOF module according to claim 2, characterized in that: The TOF module further includes an adhesive layer, the material of the adhesive layer is a light absorbing material, and the adhesive layer is bonded between the cover shell and the circuit board.

5. The TOF module according to claim 4, characterized in that: The adhesive layer includes a first adhesive layer, and the first adhesive layer is adhered between the separator and the circuit board.

6. The TOF module according to claim 5, characterized in that: The adhesive layer further includes a second adhesive layer, and the second adhesive layer is bonded between the cover body and the circuit board.

7. The TOF module according to any one of claims 1 to 6, characterized in that: The emitting unit includes a light source component, and the TOF module also includes a padding block, which is arranged on the inner side of the shielding cover and installed between the light source component and the circuit board.

8. The TOF module according to claim 7, characterized in that: The padding block is made of heat dissipation material.

9. An electronic device, characterized in that: It comprises a data processing module and the TOF module according to any one of claims 1 to 8, wherein the circuit board of the TOF module is electrically connected to the data processing module.

10. The electronic device according to claim 9, characterized in that: The first window and the second window are spaced apart from each other, the outer surface of the cover shell includes a mounting surface, the mounting surface is located between the first window and the second window, the electronic device also includes a seal and a protective cover, the protective cover is arranged opposite to the mounting surface, and the seal is installed between the mounting surface and the protective cover.

11. The electronic device according to claim 9, characterized in that: The electronic device also includes a camera module, and the camera module is electrically connected to the data processing module.

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