Ultrahigh-strength memory card

Abstract

The utility model provides an ultrahigh-strength memory card which comprises a metal shell, a substrate and a metal upper cover. The metal shell is provided with a groove. The substrate is bonded in the groove and comprises a control part and an electric connection part. And the metal upper cover is bonded on the control part, so that the electric connection part is exposed outside. Therefore, as the structures of the metal shell and the metal upper cover have the characteristics of high strength, high hardness, high temperature resistance, good heat dissipation performance and the like, the metal shell and the metal upper cover cannot be cracked and deformed even if a user accidentally falls the memory card onto the ground or bends the memory card forcibly. Therefore, the metal shell and the metal upper cover can provide a good protection effect for the control part, and the control part cannot be broken, so that the control part can be prevented from being damaged to lose functions.

Description

Technical Field

[0001] The utility model relates to a memory card, in particular to an ultra-high strength memory card whose shell will not break and can protect a control part or an electrical connection part of a substrate. Background Art

[0002] Secure Digital Memory Card (SD) is a memory card that is widely used in portable electronic devices, such as digital cameras, digital video cameras, multimedia players or drones. The technology of memory cards is based on the format of MultiMedia Cards. Memory cards have a relatively high data transfer speed and the standards are constantly updated. Most memory cards have a write protection control on the side to prevent some data from being accidentally written, and a few memory cards even support digital copyright management technology.

[0003] However, the shell of the existing memory card is made of two pieces of plastic by ultrasonic lamination, and the plastic shell is easy to crack. When the user accidentally drops the memory card on the ground, bends it with force, or drops the drone on the ground, the plastic shell will crack, causing the control part or electrical connection part of the substrate to be damaged and lose function. Utility Model Content

[0004] The main purpose of the utility model is to provide an ultra-high strength memory card, the outer shell and the upper cover of which will not be broken and can protect the control part of the substrate.

[0005] Another object of the utility model is to provide an ultra-high strength memory card, the outer frame of which will not break and can protect the electrical connection part of the substrate.

[0006] In order to achieve the above-mentioned purpose, the utility model provides an ultra-high strength memory card, comprising a metal shell, a substrate and a metal cover. The metal shell has a groove. The substrate is bonded in the groove of the metal shell and comprises a control part and an electrical connection part. The metal cover is bonded on the control part of the substrate so that the electrical connection part of the substrate is exposed.

[0007] In some embodiments, the ultra-high strength memory card further includes a plastic outer frame, which is fixed around the electrical connection portion of the substrate.

[0008] In some embodiments, the ultra-high strength memory card further includes a metal outer frame, which is fixed around the electrical connection portion of the substrate and is integrally formed with the metal upper cover.

[0009] In some embodiments, the metal frame is made of stainless steel.

[0010] In some embodiments, the metal housing and the metal cover are both made of stainless steel.

[0011] The utility model has the following effects: because the structure of the metal shell and the metal cover has the characteristics of high strength, high hardness, high temperature resistance and good heat dissipation, even if the user accidentally drops the ultra-high strength memory card of the utility model on the ground, or bends it with force, it will not cause the metal shell and the metal cover to break or deform. Therefore, the metal shell and the metal cover can provide a good protection effect for the control part of the substrate, and the control part of the substrate will not break, thereby preventing the control part of the substrate from being damaged and losing its function.

[0012] Furthermore, stainless steel has good corrosion resistance, excellent structural strength, and hardness, and will not break, making it suitable as the material for the metal shell and the metal cover, so that the metal shell and the metal cover provide better protection for the control part of the substrate, solving the shortcoming of the existing memory card being easily damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional diagram showing a first embodiment of an ultra-high strength memory card according to an embodiment of the utility model;

[0014] Figure 2 An exploded view showing a first embodiment of an ultra-high strength memory card according to an embodiment of the utility model;

[0015] Figure 3 A flow chart showing a first embodiment of a manufacturing method of an embodiment of the utility model;

[0016] Figure 4 A schematic diagram showing steps S10 to S30 of a first embodiment of a manufacturing method according to an embodiment of the present utility model;

[0017] Figure 5 A schematic diagram showing step S40 and step S50 of the first embodiment of the manufacturing method of the embodiment of the utility model;

[0018] Figure 6 is a schematic diagram of step S60 of the first embodiment of the manufacturing method of the embodiment of the utility model;

[0019] Figure 7 is a three-dimensional diagram of a second embodiment of the ultra-high strength memory card of the utility model;

[0020] Figure 8 is an exploded view of a second embodiment of the ultra-high strength memory card of the utility model;

[0021] Fig. 9 is a flow chart of a second embodiment of the manufacturing method of the utility model embodiment;

[0022] Fig.10 is a schematic diagram of steps S10 to S30 of a second embodiment of the manufacturing method of an embodiment of the utility model;

[0023] Fig.11 It is a schematic diagram of step S40 and step S50 of the second embodiment of the manufacturing method of the embodiment of the utility model.

[0024] Description of the accompanying symbols:

[0025] 1,1A: ultra-high strength memory card; 10: metal shell; 11: groove; 12: adhesive layer; 20: substrate; 21: control unit; 22: electrical connection unit; 23: adhesive layer; 30: metal cover; 40: plastic frame; 41: metal frame; 50: oven; S10-S60: steps. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and advantages to be solved by the utility model clearer, the following will be described in detail with reference to the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the utility model. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the utility model. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0027] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0028] Figure 1 It is a three-dimensional diagram of the first embodiment of the ultra-high strength memory card 1 of the utility model. Figure 2 FIG. 1 is an exploded view of the first embodiment of the ultra-high strength memory card 1 of the utility model. Figure 1 and Figure 2As shown, the utility model provides an ultra-high strength memory card 1 (Secure Digital Memory Card, SD), comprising a metal shell 10, a substrate 20, a metal cover 30 and a plastic frame 40. The metal shell 10 has a groove 11. The substrate 20 is bonded in the groove 11 of the metal shell 10, and comprises a control part 21 and an electrical connection part 22. The metal cover 30 is bonded to the control part 21 of the substrate 20, so that the electrical connection part 22 of the substrate 20 is exposed. The plastic frame 40 is fixed around the electrical connection part 22 of the substrate 20.

[0029] Specifically, the internal structure of the control unit 21 of the substrate 20 includes a card controller, a memory controller and a memory chip, and its functions are prior art. The electrical connection unit 22 of the substrate 20 can be electrically connected to the electrical connection unit of a portable electronic device (e.g., a digital camera, a digital video camera, a multimedia player or a drone) and is used to transmit data, and its functions are also prior art.

[0030] Preferably, the metal housing 10 and the metal upper cover 30 are made of stainless steel.

[0031] Figure 3 It is a flow chart of the first embodiment of the manufacturing method of the utility model. Figure 4 It is a schematic diagram of steps S10 to S30 of the first embodiment of the method of the present invention. Figure 5 It is a schematic diagram of step S40 and step S50 of the first embodiment of the method of the present utility model. Figure 6 Schematic diagram of step S60 of the first embodiment of the method of the utility model. The utility model provides a method for manufacturing an ultra-high strength memory card, comprising the following steps:

[0032] Step S10, as Figure 3 and Figure 4 As shown, an adhesive layer 12 is coated on the surface of the groove 11 of the metal housing 10 .

[0033] Step S20, as Figure 3 and Figure 4 As shown, the substrate 20 is placed in the groove 11 of the metal housing 10 .

[0034] Step S30, as Figure 3 and Figure 4 As shown, an adhesive layer 23 is coated on the surface of the control unit 21 of the substrate 20 .

[0035] Step S40, as Figure 3 and Figure 5As shown, the metal cover 30 covers the control part 21 of the substrate 20, so that the electrical connection part 22 of the substrate 20 is exposed.

[0036] Step S50, as Figure 3 and Figure 5 As shown, the combination of the metal shell 10 , the substrate 20 and the metal cover 30 is placed in an oven 50 for baking, so that the substrate 20 is bonded in the groove 11 of the metal shell 10 , and the metal cover 30 is bonded on the control unit 21 .

[0037] Step S60, as Figure 3 and Figure 6 As shown, the combination of the metal housing 10, the substrate 20 and the metal cover 30 is placed in a mold (not shown), and is subjected to insert injection molding so that the plastic frame 40 is fixed around the electrical connection portion 22 of the substrate 20 to meet the front end insulation requirements.

[0038] Thus, because the structure of the metal shell 10 and the metal cover 30 has the characteristics of high strength, high hardness, high temperature resistance and good heat dissipation, even if the user accidentally drops the ultra-high strength memory card 1 of the utility model to the ground, or bends it with force, it will not cause the metal shell 10 and the metal cover 30 to break or deform. Therefore, the metal shell 10 and the metal cover 30 can provide a good protection effect for the control part 21 of the substrate 20, and the control part 21 of the substrate 20 will not break, thereby preventing the control part 21 of the substrate 20 from being damaged and losing its function.

[0039] Furthermore, stainless steel has good corrosion resistance, excellent structural strength, and high hardness and will not break, making it suitable as the material for the metal shell 10 and the metal cover 30, so that the metal shell 10 and the metal cover 30 provide better protection for the control unit 21 of the substrate 20, solving the shortcoming of the memory card being easily damaged in the prior art.

[0040] In addition, the metal housing 10 and the metal upper cover 30 can provide good dustproof and waterproof effects.

[0041] Figure 7 It is a perspective view of a second embodiment of the ultra-high strength memory card 1A of the present invention. Figure 8 FIG. 1 is an exploded view of the second embodiment of the ultra-high strength memory card 1A of the present invention. Figure 7 and Figure 8 As shown, in terms of structure, the difference between the second embodiment and the first embodiment is that the ultra-high strength memory card 1A of the present invention further includes a metal outer frame 41 and no plastic outer frame 40, and the metal outer frame 41 is fixed around the electrical connection portion 22 of the substrate 20 and is integrally formed with the metal upper cover 30.

[0042] Preferably, the metal outer frame 41 is made of stainless steel.

[0043] Fig. 9 It is a flow chart of the second embodiment of the manufacturing method of the utility model. Fig.10 It is a schematic diagram of steps S10 to S30 of the second embodiment of the manufacturing method of the present invention. Fig.11 Schematic diagram of step S40 and step S50 of the second embodiment of the manufacturing method of the utility model. In terms of method, the difference between the second embodiment and the first embodiment is: first, Fig. 9 , Fig.10 and Fig.11 As shown, in step S40, the metal outer frame 41 is fixed around the electrical connection portion 22 of the substrate 20, and the metal outer frame 41 is integrally formed with the metal upper cover 30; second, in step S50, the combination of the metal shell 10, the substrate 20, the metal upper cover 30 and the metal outer frame 41 is placed in the oven 50 for baking; third, there is no step S60.

[0044] Thus, because the structure of the metal outer frame 41 has the characteristics of high strength, high hardness, high temperature resistance and good heat dissipation, even if the user accidentally drops the ultra-high strength memory card 1A of the utility model to the ground, or bends it with force, it will not cause the metal outer frame 41 to break or deform. Therefore, the metal outer frame 41 can provide a good protection effect for the electrical connection part 22 of the substrate 20, and the electrical connection part 22 of the substrate 20 will not break, thereby preventing the electrical connection part 22 of the substrate 20 from being damaged and losing its function.

[0045] Furthermore, stainless steel has good corrosion resistance, excellent structural strength, and high hardness, and will not break, making it suitable as the material of the metal frame 41, so that the metal frame 41 provides better protection for the electrical connection portion 22 of the substrate 20, thereby solving the shortcoming of the memory card in the prior art that it is easily damaged.

[0046] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the protection scope of the present invention.

Claims

1. An ultra-high strength memory card, characterized in that: include: A metal housing having a groove; a substrate, bonded in the groove of the metal housing, and comprising a control portion and an electrical connection portion; and, A metal cover is bonded to the control part of the substrate so that the electrical connection part of the substrate is exposed.

2. The ultra-high strength memory card according to claim 1, characterized in that: Also includes: A plastic outer frame is fixed around the electrical connection portion of the substrate.

3. The ultra-high strength memory card according to claim 1, characterized in that: Also includes: A metal outer frame is fixed around the electrical connection portion of the substrate and is integrally formed with the metal upper cover.

4. The ultra-high strength memory card according to claim 3, characterized in that: The material of the metal outer frame is stainless steel.

5. The ultra-high strength memory card according to claim 1 or 4, characterized in that: The metal shell and the metal cover are both made of stainless steel.

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