Double-arm linear bonding mechanism and die bonding equipment

Abstract

The utility model relates to the technical field of chip die bonding, and particularly discloses a double-arm linear bonding mechanism and die bonding equipment, comprising a portal frame, two ends of the portal frame are die taking stations, and the middle of the portal frame is a die bonding station; and two sets of linear die bonding modules, each set of die bonding module extends from one die taking station to the die bonding station, and the linear die bonding modules are used for transferring the chips at the corresponding die taking stations to the die bonding stations along the length direction of the portal frame. The double-arm linear bonding mechanism and the die bonding device provided by the utility model can effectively solve the problem of low production efficiency caused by long die bonding path of the existing bonding mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of chip solid crystal, in particular to a double-arm linear bonding mechanism and solid crystal equipment. Background Art

[0002] One of the processes of chip bonding is to use a bonding mechanism to transfer the chip to the bracket of the bonding position after it is sucked at the crystal picking position. The existing bonding mechanisms are all rotating swing arm structures. When performing the bonding operation, the chip needs to rotate 180° with the swing arm to move from the crystal picking position to the bonding position. The movement path of the chip is long (the movement path of the chip is a semicircular path with the rotating swing arm as the radius), and the bonding speed is low.

[0003] Therefore, it is necessary to improve the existing bonding mechanism to solve the problem of low production efficiency caused by the long die bonding path.

[0004] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Utility Model Content

[0005] One purpose of the utility model is to provide a double-arm linear bonding mechanism and a die-bonding device, which can effectively solve the problem of low production efficiency caused by a long die-bonding path of the existing bonding mechanism.

[0006] To achieve the above objectives, on the one hand, the utility model provides a double-arm linear bonding mechanism, comprising:

[0007] A gantry, both ends of which are crystal taking stations and the middle is a crystal fixing station;

[0008] Two groups of linear crystal bonding modules, each group of the crystal bonding modules extends from one of the crystal retrieval stations to the crystal bonding station, and the linear crystal bonding modules are used to transfer the chips at the corresponding crystal retrieval station to the crystal bonding station along the length direction of the gantry.

[0009] Optionally, the linear crystal bonding module includes a linear swing arm, a crystal bonding nozzle installed at one end of the linear swing arm, and a linear drive mechanism that is transmission-connected to the other end of the linear swing arm and drives the linear swing arm to reciprocate along the length direction of the gantry.

[0010] Optionally, the linear crystal bonding module further includes a crystal retrieval camera located at the crystal retrieval station and a crystal bonding camera located at the crystal bonding station.

[0011] Optionally, the linear drive mechanism is a double-row stator linear motor.

[0012] Optionally, the linear swing arm comprises:

[0013] A swing arm body, one end of which is connected to the driving end of the linear drive mechanism;

[0014] A force control motor, the force control motor is installed at the other end of the swing arm body;

[0015] A nozzle mounting plate, the nozzle mounting plate is mounted on the driving end of the force control motor and is driven by the force control motor to move up and down;

[0016] Wherein, the die bonding nozzle can be detachably mounted on the nozzle mounting plate.

[0017] Optionally, the nozzle mounting plate is provided with two nozzle clamps for clamping the crystal bonding nozzle and a fastener for fastening and connecting the two nozzle clamps.

[0018] Optionally, the nozzle mounting plate is connected to the swing arm body in an up and down sliding manner via a cross roller guide rail.

[0019] On the other hand, a die bonding device is provided, comprising:

[0020] Any of the above described double-arm linear bonding mechanisms;

[0021] Two sets of chip demolding mechanisms, one set of chip demolding mechanisms is correspondingly arranged at each of the wafer taking stations of the double-arm linear bonding mechanism, and the chip demolding mechanisms are used to lift the chip upward to separate from the film;

[0022] A crystal bonding platform is located at the crystal bonding station of the double-arm linear bonding mechanism.

[0023] The beneficial effects of the utility model are: providing a double-arm linear bonding mechanism and crystal bonding equipment, wherein two groups of symmetrically arranged linear crystal bonding modules are arranged on the gantry, and when crystal bonding operation is required: on the one hand, when the linear crystal bonding module transfers the chip from the crystal retrieval station to the crystal bonding station, it belongs to linear motion, and the chip movement path is shorter, which is beneficial to improving production efficiency; on the other hand, the middle position of the gantry is set as the crystal bonding station, and the linear crystal bonding module only needs to move half the length of the gantry to complete the crystal bonding operation, further reducing the chip movement path, thereby improving production efficiency.

[0024] Therefore, the double-arm linear bonding mechanism provided by the utility model can effectively solve the problem of low production efficiency caused by the long die bonding path of the existing bonding mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 A schematic diagram of the structure of a double-arm linear bonding mechanism provided in an embodiment;

[0027] Figure 2 A schematic structural diagram of a linear swing arm provided in an embodiment.

[0028] In the figure:

[0029] 1. Gantry;

[0030] 2. Linear crystal bonding module; 201. Linear swing arm; 2011. Swing arm body; 2012. Force control motor; 2013. Nozzle mounting plate; 2013a. Nozzle clamp block; 2013b. Fastener; 2014. Cross roller guide; 202. Crystal bonding nozzle; 203. Linear drive mechanism; 204. Crystal retrieval camera; 205. Crystal bonding camera. DETAILED DESCRIPTION

[0031] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the embodiment described below is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the description of the present utility model, it is to be understood that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centrally arranged component at the same time.

[0033] In addition, terms such as "long", "short", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are only used to facilitate the description of the present invention. They do not indicate or imply that the device or component referred to must have this specific direction or operate with a specific direction structure, and should not be understood as a limitation of the present invention.

[0034] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0035] The utility model provides a double-arm linear bonding mechanism and a die bonding device, which are suitable for application scenarios of chip die bonding and can effectively solve the problem of low production efficiency caused by a long die bonding path of an existing bonding mechanism.

[0036] In this embodiment, the die bonding equipment includes a double-arm linear bonding mechanism, a die bonding platform, and two sets of chip demolding mechanisms for lifting the chip upward to separate from the film.

[0037] See also Figure 1 The double-arm linear bonding mechanism includes a gantry 1 and two sets of linear crystal bonding modules 2.

[0038] Both ends of the gantry 1 are crystal retrieval stations, and the middle is a crystal bonding station. A group of chip demolding mechanisms is correspondingly arranged at each crystal retrieval station of the double-arm linear bonding mechanism. The crystal bonding platform is located at the crystal bonding station of the double-arm linear bonding mechanism.

[0039] Each group of the crystal bonding modules extends from one of the crystal retrieval stations to the crystal bonding station, and the linear crystal bonding modules 2 are used to transfer the chips at the corresponding crystal retrieval station to the crystal bonding station along the length direction of the gantry 1 .

[0040] The working process of the die bonding equipment provided in this embodiment is as follows:

[0041] S10: The two sets of chip demolding mechanisms respectively lift up the corresponding chips;

[0042] S20: The two sets of linear die bonding modules 2 respectively suck up the corresponding chips and transfer them to the top of the die bonding platform, and then place the chips into the corresponding brackets.

[0043] It should be noted that the gantry 1 is provided with two groups of symmetrically arranged linear crystal bonding modules 2. When crystal bonding operation is required: on the one hand, when the linear crystal bonding module 2 transfers the chip from the crystal retrieval station to the crystal bonding station, it is a linear motion, and the chip movement path is shorter, which is beneficial to improving production efficiency; on the other hand, the middle position of the gantry 1 is set as the crystal bonding station, and the linear crystal bonding module 2 only needs to move half the length of the gantry 1 to complete the crystal bonding operation, further shortening the chip movement path, thereby improving production efficiency.

[0044] Therefore, the double-arm linear bonding mechanism provided in this embodiment can effectively solve the problem of low production efficiency caused by the long die bonding path of the existing bonding mechanism.

[0045] In this embodiment, the linear crystal bonding module 2 includes a linear swing arm 201, a crystal bonding nozzle 202 installed at one end of the linear swing arm 201, and a linear drive mechanism 203 that is transmission-connected to the other end of the linear swing arm 201 and drives the linear swing arm 201 to reciprocate along the length direction of the gantry 1.

[0046] Optionally, the linear die bonding module 2 further includes a die picking camera 204 located at the die picking station and a die bonding camera 205 located at the die bonding station. By performing visual positioning through the camera, the positioning accuracy during the die picking and die bonding operations can be further improved.

[0047] Optionally, the linear drive mechanism 203 is a double-row stator linear motor. The double-row stator linear motor has a larger thrust and a faster transfer speed, which is conducive to further improving production efficiency. In some other embodiments, the linear drive mechanism 203 can also be a motor screw assembly or a cylinder, etc., and the utility model does not limit this.

[0048] Further, see Figure 2 The linear swing arm 201 includes a swing arm body 2011, a force control motor 2012, and a nozzle mounting plate 2013. One end of the swing arm body 2011 is connected to the driving end of the linear drive mechanism 203; the force control motor 2012 is mounted on the other end of the swing arm body 2011; the nozzle mounting plate 2013 is mounted on the driving end of the force control motor 2012, and is driven by the force control motor 2012 to move up and down; wherein the die bonding nozzle 202 is detachably mounted on the nozzle mounting plate 2013. The force control motor 2012 can control the downward pressure of the die bonding nozzle 202 when pressing the chip downward into the bracket, so as to avoid excessive downward pressure that may damage the chip or the bracket.

[0049] Optionally, the nozzle mounting plate 2013 is provided with two nozzle clamping blocks 2013a for clamping the die-bonding nozzle 202 and a fastener 2013b for fastening and connecting the two nozzle clamping blocks 2013a. The die-bonding nozzle 202 can be replaced by loosening the fastener 2013b.

[0050] In this embodiment, the nozzle mounting plate 2013 is connected to the swing arm body 2011 for up and down sliding via a cross roller guide rail 2014 to improve the smoothness and stability of the nozzle mounting plate 2013 when it moves up and down, and to prevent the nozzle from shaking left and right, resulting in poor crystal bonding.

[0051] In summary, the double-arm linear bonding mechanism and die bonding equipment provided in this embodiment have the following advantages:

[0052] ① When the linear die bonding module 2 transfers the chip from the die picking station to the die bonding station, it is a linear motion, and the chip movement path is short, which is conducive to improving production efficiency;

[0053] ② Set the middle position of the gantry 1 as the die bonding station. The linear die bonding module 2 only needs to move half the length of the gantry 1 to complete the die bonding operation, further reducing the chip's moving path and thereby improving production efficiency.

[0054] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0055] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A double-arm linear bonding mechanism, It is characterized in that include: A gantry (1), wherein both ends of the gantry (1) are crystal taking stations and the middle is a crystal fixing station; Two groups of linear crystal bonding modules (2), each group of the crystal bonding modules extending from one of the crystal retrieval stations to the crystal bonding station, the linear crystal bonding modules (2) being used to transfer the chip at the corresponding crystal retrieval station to the crystal bonding station along the length direction of the gantry (1).

2. The double-arm linear bonding mechanism according to claim 1, It is characterized in that The linear crystal bonding module (2) comprises a linear swing arm (201), a crystal bonding nozzle (202) mounted on one end of the linear swing arm (201), and a linear drive mechanism (203) which is transmission-connected to the other end of the linear swing arm (201) and drives the linear swing arm (201) to reciprocate along the length direction of the gantry (1).

3. The double-arm linear bonding mechanism according to claim 2, It is characterized in that The linear crystal bonding module (2) further comprises a crystal retrieval camera (204) located at the crystal retrieval station and a crystal bonding camera (205) located at the crystal bonding station.

4. The double-arm linear bonding mechanism according to claim 3, It is characterized in that The linear drive mechanism (203) is a double-row stator linear motor.

5. The double-arm linear bonding mechanism according to claim 3, It is characterized in that The linear swing arm (201) comprises: A swing arm body (2011), one end of the swing arm body (2011) being connected to a driving end of the linear drive mechanism (203); A force control motor (2012), wherein the force control motor (2012) is installed at the other end of the swing arm body (2011); A suction nozzle mounting plate (2013), the suction nozzle mounting plate (2013) being mounted on a driving end of the force control motor (2012) and being driven by the force control motor (2012) to move up and down; Wherein, the die bonding nozzle (202) can be detachably mounted on the nozzle mounting plate (2013).

6. The double-arm linear bonding mechanism according to claim 5, It is characterized in that The nozzle mounting plate (2013) is provided with two nozzle clamping blocks (2013a) for clamping the crystal fixing nozzle (202) and a fastener (2013b) for fastening and connecting the two nozzle clamping blocks (2013a).

7. The double-arm linear bonding mechanism according to claim 5, It is characterized in that The suction nozzle mounting plate (2013) is connected to the swing arm body (2011) in an up-and-down sliding manner via a cross roller guide rail (2014).

8. A die bonding device, It is characterized in that include: The double-arm linear bonding mechanism according to any one of claims 1 to 7; Two sets of chip demolding mechanisms, one set of chip demolding mechanisms is correspondingly arranged at each of the wafer taking stations of the double-arm linear bonding mechanism, and the chip demolding mechanisms are used to lift the chip upward to separate from the film; A crystal bonding platform is located at the crystal bonding station of the double-arm linear bonding mechanism.

Images