Plastic package surface-mounted insulation module with distributed pins

Abstract

The utility model relates to a plastic package surface-mounted insulation module with distributed pins, aiming at a chip packaging body, each hard conductive piece (6) is used for respectively replacing a bonding lead (4) at each preset target position, the hard conductive pieces (6) are used for realizing the connection of two ends of the original bonding lead (4), and a conductive gasket (7) exposed on the outer surface of the packaging body (1) is combined, so that the packaging body (1) is connected with the plastic package surface-mounted insulation module with the distributed pins. According to the packaging structure, surface pins forming the outer surface of the packaging body and side pins (5) on the side faces of the packaging body form distributed pin design application, the pin arrangement density is improved, the size is more compact, parasitic resistance and parasitic inductance are lower, the working through-flow and heat dissipation capacity of the packaging chip is improved through the design scheme, and the actual working efficiency of the packaging chip is improved.

Description

Technical Field

[0001] The utility model relates to a plastic-sealed surface-mounted insulating module of distributed pins, belonging to the technical field of chip packaging. Background Art

[0002] Chip packaging technology is a process technology that wraps up memory chips to avoid contact between the chips and the outside world and prevent damage to the chips from the outside world. The power packaging industry often integrates various power topologies in the form of modules. The commonly used appearance structures in the industry are TOP Pin and surface mount Pin. Among them, the TOP Pin method is that the chip and the Pin needle are welded on the bottom circuit board, and the chip and the Pin needle are interconnected by wire bonding, and the Pin needle is led out through the top; the surface mount Pin method is that the chip and the Pin needle are welded on the bottom circuit board, and the chip and the Pin needle are interconnected by wire bonding, and the Pin needle is led out through the side.

[0003] However, in the application, in the top pin solution, if the pin needle adopts customized crimping pin, the cost of the pin needle itself is relatively high. If the soldered pin is adopted, the subsequent assembly requires wave soldering, which is also costly. In the surface mount pin solution, the pin needle is made of a copper frame, which has a relatively low cost. However, since the surface mount pin can only be output from two or four sides but not from the middle, the pin density is low. At the same time, some pins need to be pulled away, resulting in large parasitic inductance and resistance, affecting performance. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a plastic-sealed surface-mounted insulating module with distributed pins, replace bonding wires with hard conductive parts, realize the distributed arrangement of pins on the package body, and improve the actual working efficiency of the packaged chip.

[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme: the utility model designs a plastic-sealed surface-mount insulation module with distributed pins, which realizes working connection between each chip in the package body and each bonding lead based on the routing layer, and docks the side pins of the package body. It also includes each hard conductive part and each conductive gasket corresponding to the hard conductive part. The bonding leads of each preset target position are replaced one by one with each hard conductive part, wherein the two ends of each hard conductive part are respectively connected to the positions where the two ends of the original bonding lead of the corresponding preset target position are connected, and the non-end positions on each hard conductive part are respectively electrically connected to the corresponding conductive gaskets, and each conductive gasket is respectively exposed on the outer surface of the package body facing it, and the exposed surfaces of each conductive gasket constitute each surface pin on the outer surface of the package body, which, combined with each side pin on the side of the package body, constitute distributed pins.

[0006] As a preferred technical solution of the present invention: each hard conductive member has a middle section raised higher than both ends thereof, and the raised middle section of each hard conductive member is electrically connected to its corresponding conductive gasket.

[0007] As a preferred technical solution of the present invention: each hard conductive member is a copper Clip.

[0008] As a preferred technical solution of the present invention: each conductive gasket is made of soft metal material.

[0009] As a preferred technical solution of the present invention: the soft metal material is any one of tin, aluminum, silver, and gold, and based on the aluminum conductive gasket, it also includes a hard metal protective layer corresponding to each aluminum conductive gasket, and each aluminum conductive gasket is indirectly connected to the corresponding connection position on the corresponding hard conductive part through its corresponding hard metal protective layer.

[0010] As a preferred technical solution of the present invention: each surface pin exposed on the outer surface of the package body is distributed within a preset radius with the center position as the center of the circle on the outer surface of the package body.

[0011] As a preferred technical solution of the present invention: it also includes a ceramic substrate and a bottom copper layer, wherein each chip in the package is located on one side of the routing layer, the ceramic substrate is located in the package, the ceramic substrate is arranged on the other side of the routing layer, and the other side of the routing layer is connected to the surface of the ceramic substrate facing it, the bottom copper layer is arranged on the surface of the ceramic substrate facing away from the routing layer, and the surface of the bottom copper layer facing away from the ceramic substrate is exposed outside the package.

[0012] As a preferred technical solution of the present invention: the exit positions of the pins on each side of the package body protrude from the surface area on both sides divided by the line connecting the exit positions.

[0013] The plastic-sealed surface-mount insulation module with distributed pins described in the utility model adopts the above technical solution and has the following technical effects compared with the prior art:

[0014] The utility model designs a plastic-sealed surface-mount insulation module with distributed pins. For a chip package, each hard conductive part replaces the bonding wires at each preset target position respectively, and the hard conductive part realizes the connection of the two end positions of the original bonding wires, and is combined with a conductive gasket exposed on the outer surface of the package body to form each surface pin on the outer surface of the package body, and each side pin on the side of the package body to form a distributed pin design application, thereby improving the pin arrangement density, making the size more compact, and lowering the parasitic resistance and parasitic inductance. In addition, the design scheme improves the flow and heat dissipation capabilities of the packaged chip, thereby improving the actual working efficiency of the packaged chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a cross-sectional schematic diagram of a plastic-sealed surface-mount insulation module with distributed pins designed in the present invention;

[0016] Figures 2 to 5 It is a three-dimensional schematic diagram of the distribution of each pin of the plastic-sealed surface-mount insulation module with distributed pins designed by the present invention;

[0017] Figure 6 It is a three-dimensional schematic diagram of the existing side pin distribution.

[0018] Among them, 1. Package body, 2. Chip, 3. Routing layer, 4. Bonding wire, 5. Side pins, 6. Hard conductive parts, 7. Conductive gasket, 8. Ceramic substrate, 9. Bottom copper layer. DETAILED DESCRIPTION

[0019] The specific implementation of the utility model is further described in detail below in conjunction with the accompanying drawings.

[0020] The utility model designs a plastic-sealed surface-mount insulation module with distributed pins. In practical applications, such as Figure 1 As shown, for each chip 2 in the package body 1 to achieve working connection with each bonding lead 4 based on the routing layer 3, and to connect with each side pin 5 of the package body, the specific design also includes each hard conductive part 6, and each hard conductive part 6 has a corresponding conductive gasket 7, and each hard conductive part 6 replaces the bonding lead 4 at each preset target position one by one, wherein the two ends of each hard conductive part 6 are respectively connected to the position where the two ends of the original bonding lead 4 at the corresponding preset target position are connected, and the non-end position of each hard conductive part 6 is respectively electrically connected to the corresponding conductive gasket 7, and each conductive gasket 7 is respectively exposed on the outer surface of the package body 1 facing it, and the exposed surface of each conductive gasket 7 constitutes each surface pin on the outer surface of the package body, which, combined with each side pin 5 on the side of the package body, constitutes a distributed pin.

[0021] In actual application, for the hard conductive parts 6, each hard conductive part 6 is specifically designed to have a middle section raised higher than its two ends, and the raised middle section of each hard conductive part 6 is electrically connected to its corresponding conductive gasket 7. The choice of hard conductive parts 6 in this posture is specifically, for example, using copper Clip.

[0022] In this way, in the application, each surface pin and each side pin 5 constitute a distributed pin to meet the needs of different circuit topologies, such as half-bridge, full-bridge, three-level (NPC / ANPC), BOOST, etc., and the specific design uses copper clips to replace the bonding wires 4 to improve the current and heat dissipation capabilities. In actual specific applications, if the chip contacts are designed to have both side pins 6 and surface pins, a variety of specific applications can be realized, such as separate transmission of data and power supply, or two-way simultaneous power supply to meet the demand for high voltage, etc.

[0023] And in practical applications, such as Figure 1 As shown, a planar structure is designed for the raised section of the copper Clip, that is, a conductive gasket 7 is set on the planar structure, and in actual production, an integrated molding structure is formed, and the conductive gasket 7 realizes the construction of the surface pin. Specifically with respect to the conductive gasket 7, in actual application, each conductive gasket 7 is made of a soft metal material, and the soft metal material is specifically selected from any one of tin, aluminum, silver, and gold. If an aluminum conductive gasket 7 is selected, it is further designed to add a hard metal protective layer corresponding to each aluminum conductive gasket 7, and each aluminum conductive gasket 7 is indirectly connected to the corresponding connection position on the corresponding hard conductive part 6 through its corresponding hard metal protective layer; and specifically with respect to the application of the conductive gasket 7, it can be designed that the surface of the conductive gasket 7 facing the outside of the package 1 is slightly raised compared to the surface of the package 1 on which it is set.

[0024] The pins on each surface brought by the design are in the overall chip packaging structure, such as Figures 2 to 5 As shown, specifically for each surface pin exposed on the outer surface of the package body 1, they are distributed on the outer surface of the package body 1 with the center position as the center of the circle and within a preset radius. This design allows a certain distance to be maintained between the surface pins and the side pins 5, which can not only ensure the insulation performance, but also evenly distribute the pins at different positions of the package body.

[0025] Regarding the above design structure, a heat dissipation solution is further introduced in practical applications, such as Figure 1 As shown, the specific design also includes a ceramic substrate 8 and a bottom copper layer 9, wherein each chip 2 in the package body 1 is located on one side of the wiring layer 3, the ceramic substrate 8 is located in the package body 1, the ceramic substrate 8 is arranged on the other side of the wiring layer 3, and the other side of the wiring layer 3 is connected to the surface of the ceramic substrate 8 facing it, the bottom copper layer 9 is arranged on the surface of the ceramic substrate 8 facing away from the wiring layer 3, and the surface of the bottom copper layer 9 facing away from the ceramic substrate 8 is exposed outside the package body 1, that is, in actual work, the heat from the working of the chip 2 is dissipated outward through the wiring layer, and then through the ceramic substrate 8 and the bottom copper layer 9 in turn.

[0026] And for the overall package design, such as Figures 2 to 5As shown, the protrusion positions of the pins 5 on each side of the package body 1 are specifically designed to protrude from the surface areas on both sides divided by the lines connecting the protrusion positions. In the actual product production process, for the application of the plastic encapsulation material based on the outer shape mold, a slope angle is formed on the side, which is convenient for the peeling of the specific upper outer shape model and the lower outer shape model after the plastic encapsulation material is formed, thereby improving the plastic encapsulation effect here.

[0027] The distributed pins composed of the surface pins and the side pins 5 of the present invention are designed in actual application. Figures 2 to 5 As shown, the structures are 2 / 2 / 2 (side 1)-3 (middle)-2 / 2 / 2 (side 2), 2 / 3 / 2 (side 1)-3 (middle)-2 / 3 / 2 (side 2), 3 / 3 / 3 (side 1)-3 (middle)-3 / 3 / 3 (side 2), 2 / 1 / 2 (side 1)-3 (middle)-2 / 1 / 2 (side 2); Figure 6 The figure shows a three-dimensional diagram of the existing side pin distribution, with a structure of 2 / 2 / 2 (side 1) - 0 (middle) - 2 / 2 / 2 (side 2).

[0028] The above technical scheme designs a plastic-sealed surface-mount insulation module with distributed pins. For the chip package, each hard conductive part 6 replaces the bonding lead 4 at each preset target position, and the hard conductive part 6 realizes the connection between the two ends of the original bonding lead 4, and is combined with the conductive gasket 7 exposed on the outer surface of the package body 1 to form each surface pin on the outer surface of the package body, and each side pin 5 on the side of the package body to form a distributed pin design application, which improves the pin arrangement density, has a more compact size, and has lower parasitic resistance and parasitic inductance. In addition, the design scheme improves the current flow and heat dissipation capacity of the packaged chip, and improves the actual working efficiency of the packaged chip.

[0029] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in this field without departing from the purpose of the present invention.

Claims

1. A plastic-sealed surface mount insulation module with distributed pins, characterized in that: The invention relates to each chip (2) in the package (1) being connected to each bonding lead (4) based on the routing layer (3) and connecting each side pin (5) of the package, and also includes each hard conductive part (6) and each conductive gasket (7) corresponding to each hard conductive part (6), and each hard conductive part (6) is used to replace each bonding lead (4) at each preset target position, wherein the two ends of each hard conductive part (6) are respectively connected to the position where the two ends of the original bonding lead (4) at the corresponding preset target position are connected, and the non-end position of each hard conductive part (6) is respectively electrically connected to the corresponding conductive gasket (7), and each conductive gasket (7) is respectively exposed on the outer surface facing the package (1), and the exposed surface of each conductive gasket (7) constitutes each surface pin on the outer surface of the package, and is combined with each side pin (5) on the side of the package to constitute a distributed pin.

2. A plastic-sealed surface mount insulation module with distributed pins according to claim 1, characterized in that: Each hard conductive member (6) has a middle section that is raised higher than both ends thereof, and the raised middle section of each hard conductive member (6) is electrically connected to its corresponding conductive gasket (7).

3. A plastic-sealed surface mount insulation module with distributed pins according to claim 2, characterized in that: Each hard conductive part (6) is a copper Clip.

4. The distributed pin plastic-sealed surface mount insulation module according to claim 1, characterized in that: Each conductive gasket (7) is made of a soft metal material.

5. A plastic-sealed surface mount insulation module with distributed pins according to claim 4, characterized in that: The soft metal material is any one of tin, aluminum, silver and gold, and is based on the aluminum conductive gasket (7), and also includes hard metal protective layers corresponding to each aluminum conductive gasket (7), and each aluminum conductive gasket (7) is indirectly connected to a corresponding connection position on a corresponding hard conductive component (6) via its corresponding hard metal protective layer.

6. The plastic-sealed surface mount insulation module with distributed pins according to claim 1, characterized in that: Each of the surface pins exposed on the outer surface of the package body (1) is distributed within a preset radius with the center position as the center of the circle on the outer surface of the package body (1) where the pin is located.

7. The plastic-sealed surface mount insulation module with distributed pins according to claim 1, characterized in that: It also includes a ceramic substrate (8) and a bottom copper layer (9), wherein each chip (2) in the package (1) is located on one side of the wiring layer (3), the ceramic substrate (8) is located in the package (1), the ceramic substrate (8) is arranged on the other side of the wiring layer (3), and the other side of the wiring layer (3) is connected to the surface of the ceramic substrate (8) facing the wiring layer (3), and the bottom copper layer (9) is arranged on the surface of the ceramic substrate (8) facing away from the wiring layer (3), and the surface of the bottom copper layer (9) facing away from the ceramic substrate (8) is exposed outside the package (1).

8. The distributed pin plastic-sealed surface mount insulation module according to claim 1, characterized in that: The protrusion positions of the pins (5) on each side of the package body (1) protrude from the surface area on both sides divided by a line connecting the protrusion positions.

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