Novel semiconductor chip
By designing protective shielding covers and limiting mechanisms on semiconductor chips, the electromagnetic interference problem is solved, the chip stability and heat dissipation capabilities are improved, and the maintenance process is simplified.
Patent Information
- Application Number
- CN202420898452.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-28
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2034-04-28
AI Technical Summary
Existing semiconductor chips are susceptible to electromagnetic interference in high-frequency and high-power electromagnetic field environments, affecting the performance and reliability of the chip.
A new semiconductor chip was designed, using a protective shield cover to cover the chip base, and an electromagnetic protective coating and heat dissipation strip hole were installed on its surface, combining the limiting mechanism to achieve stable installation and convenient maintenance of the protective cover.
It effectively reduces the impact of electromagnetic interference on the chip, improves the stability and reliability of the chip, enhances the heat dissipation ability, and simplifies the chip maintenance and replacement process.
Smart Images
Figure CN222146224U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and specifically to a new type of semiconductor chip. Background Art
[0002] A semiconductor chip, also known as an integrated circuit chip, is a collection of tiny electronic components made from semiconductor materials. It is commonly used to implement various functions and circuits in electronic devices. It is one of the most important and basic parts of modern electronic technology and is present in almost all electronic devices.
[0003] Most existing semiconductor chips are directly soldered on circuit boards and are in a completely exposed state. They are easily interfered by the surrounding electromagnetic fields, which can affect the normal operation of the chip. Especially in high-frequency, high-power electromagnetic field environments, the chip may experience interference, errors and other problems, affecting the performance and reliability of the chip. Utility Model Content
[0004] In view of this, the purpose of the present invention is to solve the shortcomings of the background technology and to provide a new type of semiconductor chip to solve the problems in the prior art.
[0005] In order to achieve the above purpose, the utility model provides a new type of semiconductor chip, including a chip seat, a tin soldering point is arranged on the chip seat, a protective shielding cover is movably connected to the top of the chip seat, a plurality of groups of heat dissipation strip holes are opened on the outer surface of the protective shielding cover, a limiting hook plate is fixedly connected to the outer surface of the protective shielding cover, a limiting mechanism for stabilizing the protective shielding cover is arranged on the chip seat, and the surface of the protective shielding cover has an electromagnetic protection coating.
[0006] Preferably, the limiting mechanism includes a bracket fixedly mounted on the chip seat, the inner surface of the bracket is fixedly connected with a rotating shaft, and there are two groups of rotating shafts. The limiting mechanism can be used to stably limit the limiting hook plate, so that the protective shielding cover can be stably mounted on the chip seat.
[0007] Preferably, the inner side of the rotating shaft is rotatably connected to a shaft cylinder, and a sliding rod is movably penetrated through the inner surface of the shaft cylinder. Two groups of rotating shafts are provided and are respectively located at the two ends of the shaft cylinder, so as to prevent the rotating shaft from passing through the shaft cylinder and affecting the movement of the sliding rod.
[0008] Preferably, a limiting hook frame is arranged at one end of the slide bar close to the limiting hook plate, and an end plate is fixedly connected to one end of the slide bar away from the limiting hook frame.
[0009] Preferably, a spring is movablely sleeved on the outer surface of the slide rod, and a slip ring is slidably connected to the outer surface of the slide rod.
[0010] Compared with the prior art, the utility model has the following beneficial effects:
[0011] 1. The new semiconductor chip has a protective shielding cover with a protective coating on the surface, which can effectively reduce the impact of the electromagnetic environment on the chip. By covering the chip seat, the protective shielding cover provides an additional shielding layer to block the interference of the surrounding electromagnetic field on the chip, thereby improving the stability and reliability of the chip. At the same time, the multiple heat dissipation holes opened on the surface of the protective shielding cover can effectively enhance the heat dissipation capacity of the chip.
[0012] 2. When the new semiconductor chip needs to be inspected and maintained, it is only necessary to push the end plate and rotate it so that the limit hook frame and the limit hook plate are out of the hook state, and the protective shielding cover can be easily removed, making it more convenient to maintain the chip and replace the protective shielding cover, and it can easily adapt to different maintenance needs. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the overall structure of this application;
[0014] Figure 2 This is a schematic diagram of the surface structure of the bracket of this application.
[0015] Among them: 1. chip seat; 2. tin soldering point; 3. protective shielding cover; 4. heat dissipation strip hole; 5. limit hook plate; 6. bracket; 7. rotating shaft; 8. shaft cylinder; 9. sliding rod; 10. limit hook frame; 11. end plate; 12. spring; 13. slip ring. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0017] See also Figure 1-2 A new type of semiconductor chip includes a chip seat 1, a tin soldering point 2 is arranged on the chip seat 1, a protective shielding cover 3 is movably connected to the top of the chip seat 1, a plurality of groups of heat dissipation strip holes 4 are opened on the outer surface of the protective shielding cover 3, a limiting hook plate 5 is fixedly connected to the outer surface of the protective shielding cover 3, and a limiting mechanism for stabilizing the protective shielding cover 3 is arranged on the chip seat 1.
[0018] Through the above technical solution, when the semiconductor chip is in use, the chip holder 1 is soldered to the circuit board through the soldering point 2, and the protective shielding cover 3 is clamped on the chip holder 1 and stabilized with the help of the limiting mechanism, which can effectively reduce electromagnetic interference and ensure the performance and reliability of the chip in a complex electromagnetic environment.
[0019] Specifically, the limiting mechanism includes a bracket 6 fixedly mounted on the chip holder 1 , the inner surface of the bracket 6 is fixedly connected with a rotating shaft 7 , and there are two groups of rotating shafts 7 .
[0020] Through the above technical solution, when the shaft tube 8 rotates along the rotating shaft 7, the positions of the sliding rod 9 and the limiting hook frame 10 can be deflected.
[0021] Specifically, the inner side of the rotating shaft 7 is rotatably connected with a shaft cylinder 8 , and a sliding rod 9 is movably provided on the inner surface of the shaft cylinder 8 .
[0022] Through the above technical solution, when the slide rod 9 slides through the shaft tube 8, the spring 12 will be compressed or stretched to a corresponding degree.
[0023] Specifically, a limiting hook frame 10 is provided at one end of the slide rod 9 close to the limiting hook plate 5 , and an end plate 11 is fixedly connected to one end of the slide rod 9 away from the limiting hook frame 10 .
[0024] Through the above technical solution, the end plate 11 has the effect of limiting the spring 12 to prevent it from separating from the slide rod 9 during the extension and retraction process.
[0025] Specifically, a spring 12 is movably sleeved on the outer surface of the slide rod 9 , and a slip ring 13 is slidably connected to the outer surface of the slide rod 9 .
[0026] Through the above technical solution, the slip ring 13 provides limited support for one end of the spring 12 , and when the end plate 11 gradually approaches the slip ring 13 , the spring 12 is compressed.
[0027] Working principle: When the semiconductor chip is in use, the chip holder 1 is first soldered to the circuit board through the soldering point 2, and then the protective shielding cover 3 is clamped on the chip holder 1. After that, the end plate 11 is moved to make the shaft cylinder 8 rotate along the rotating shaft 7, so that the limit hook frame 10 gradually approaches the limit hook plate 5. At the same time, the end plate 11 is pushed to make the slide bar 9 slide along the slip ring 13, and at the same time pass through the shaft cylinder 8 to drive the limit hook frame 10 to push forward. In this process, the spring 12 is gradually compressed. When the limit hook frame 10 is adjusted to be partially inside the limit hook plate 5, the end plate 11 is released. At this time, the spring 12 Under the reset action, the end plate 11 will be pushed outward, and the slide rod 9 will pass through the shaft tube 8 and move obliquely upward until the limit hook frame 10 stably hooks the limit hook plate 5, so that the protective shielding cover 3 can be stably installed on the chip seat 1. The protective shielding cover 3 with a protective coating on the surface can effectively reduce the impact of the chip in the electromagnetic environment. At the same time, the multiple heat dissipation strip holes 4 opened on the surface of the protective shielding cover 3 can also allow the chip to dissipate heat in time. When the chip needs to be inspected and maintained, it is only necessary to push the end plate 11 and rotate it to disengage the limit hook frame 10 and the limit hook plate 5 from the hook state.
[0028] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.
Claims
1. A novel semiconductor chip, comprising a chip holder (1), characterized in that: The chip seat (1) is provided with a soldering point (2), the top of the chip seat (1) is movably connected with a protective shielding cover (3), the outer surface of the protective shielding cover (3) is provided with a plurality of groups of heat dissipation strip holes (4), the outer surface of the protective shielding cover (3) is fixedly connected with a limiting hook plate (5), and the chip seat (1) is provided with a limiting mechanism for stabilizing the protective shielding cover (3).
2. A novel semiconductor chip according to claim 1, characterized in that: The limiting mechanism comprises a bracket (6) fixedly mounted on the chip seat (1), the inner surface of the bracket (6) is fixedly connected with a rotating shaft (7), and the rotating shaft (7) is provided in two groups.
3. A novel semiconductor chip according to claim 2, characterized in that: The inner side of the rotating shaft (7) is rotatably connected to a shaft cylinder (8), and a sliding rod (9) is movably provided on the inner surface of the shaft cylinder (8).
4. A novel semiconductor chip according to claim 3, characterized in that: A limit hook frame (10) is arranged at one end of the slide bar (9) close to the limit hook plate (5), and an end plate (11) is fixedly connected to one end of the slide bar (9) away from the limit hook frame (10).
5. A novel semiconductor chip according to claim 4, characterized in that: The outer surface of the slide rod (9) is movably sleeved with a spring (12), and the outer surface of the slide rod (9) is slidably connected with a slip ring (13).