Chip packaging unit and vehicle-mounted camera module
By using COB process and gold wire counter-attack technology in the on-board camera module, the chip is directly fixed to the circuit board and the shape of the gold wire is controlled, which solves the problem of large traditional packaging volume and achieves a chip with miniaturization and high imaging performance Packaging unit.
Patent Information
- Application Number
- CN202323423664.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-14
- Publication Date
- 2024-12-10
- Estimated Expiration
- 2033-12-14
AI Technical Summary
The Sensor photosensitive chip packaging form of traditional vehicle camera modules leads to a large package size, affecting imaging performance, and failing to meet the market's requirements for miniaturization and high imaging quality.
The chip is directly fixed to the circuit board by using the ChipOnBoard (COB) process, and the height of the gold wire is reduced through the gold wire counter-attack process, the size and shape of the gold wire are controlled to meet the miniaturization requirements, and the package is covered on the gold wire for easier use. Subsequent assembly.
The chip packaging unit that has achieved miniaturization makes full use of chip performance, reduces the gold wire height and packaging volume, and meets the market's demand for miniaturization and high imaging performance.
Smart Images
Figure CN222146236U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of camera modules, and in particular to a chip packaging unit and a vehicle-mounted camera module. Background Art
[0002] With the development of the vehicle camera module industry and the market demand for processing technology, the industry has higher and higher requirements for the imaging quality and clarity of vehicle camera modules, and the miniaturization of camera modules. The sensor (photosensitive chip) of the traditional vehicle camera module is installed in the vehicle camera module through the CSP (Chip Scale Package) packaging form, which mainly includes: chip, light input and connector. The overall height of the package is relatively large, and the CSP package will affect the imaging performance of the sensor and cannot meet the current requirements. In addition, the existing chip is packaged on the circuit board through the COB (Chip On Board) process. The traditional COB process makes the gold wire on the chip and circuit board high and large in size, which cannot meet the market's requirements for miniaturization.
[0003] Therefore, a miniaturized, high-imaging-performance chip packaging unit is needed. Utility Model Content
[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a chip packaging unit and a vehicle-mounted camera module.
[0005] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is as follows: a chip packaging unit, comprising:
[0006] A circuit board, the circuit board comprising a solder pad disposed on an upper surface of the circuit board;
[0007] A chip, the chip being glued and fixed to the upper surface of the circuit board;
[0008] A gold wire assembly, the gold wire assembly comprising a first pin, a gold wire and a second pin, the gold wire being connected to the first pin and the second pin respectively, the first pin being electrically connected to the upper surface of the chip, and the second pin being electrically connected to the pad;
[0009] The height H1 of the extension line extending upward from the upper right end point of the chip to the intersection with the gold wire is 40-60um; the height H2 between the top of the gold wire and the upper surface of the circuit board is 440-460um.
[0010] Furthermore, the gold wire includes a first gold wire segment and a second gold wire segment, the first gold wire segment is electrically connected to the first pin, the second gold wire segment is electrically connected to the second pin, and the intersection of the first gold wire segment and the second gold wire segment has an arc.
[0011] Furthermore, the first gold wire segment and the second gold wire segment have an angle C, and the angle C is 80°-95°.
[0012] Furthermore, an angle A is formed between the first gold wire segment and the upper surface of the chip, and a value of the angle A is 15°-35°.
[0013] Furthermore, an angle B is formed between the second gold wire segment and the upper surface of the circuit board, and a value of the angle B is 80°-100°.
[0014] Furthermore, the gold wire assembly connects the upper surface of the chip and the pad through a gold wire back-punching process.
[0015] Furthermore, the chip packaging unit also includes a packaging body, the packaging body covers the gold wire assembly, and the packaging body is partially arranged on the upper surface of the chip and the upper surface of the circuit board.
[0016] Furthermore, a height H3 between the upper surface of the package body and the upper surface of the circuit board is 465-600 um.
[0017] Furthermore, the chip packaging unit also includes a filter, which is parallel to the upper surface of the chip and is arranged on the packaging body.
[0018] The utility model also includes a vehicle-mounted camera module, including a lens, a shell, and the above-mentioned chip packaging unit, wherein the lens is arranged at the upper end of the shell, the chip packaging unit is arranged in the shell, and the lens is opposite to the chip packaging unit.
[0019] Beneficial effects of the present invention: From the above description of the present invention, it can be seen that compared with the prior art, the chip packaging unit of the present invention includes a circuit board, a chip, and a gold wire assembly. The gold wire assembly is electrically connected to the pad of the circuit board and the chip through a first pin, a gold wire, and a second pin. The present invention directly fixes the sensor on the circuit board using the COB process, and uses a gold wire reverse punching process to reduce the height of the gold wire, and can fully utilize the performance of the chip; the present invention controls the size parameters of the gold wire to ensure the size of the chip packaging unit and meet the requirements of miniaturization; the present invention limits the shape of the gold wire, which is convenient for covering the package body on the gold wire and also convenient for the subsequent assembly of other components. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 This is a structural schematic diagram of a vehicle-mounted camera module in an embodiment of the utility model;
[0021] Figure 2 This is a schematic structural diagram of a chip packaging unit in an embodiment of the utility model;
[0022] Explanation of the numbers in the figure: 1. circuit board; 2. chip; 3. gold wire assembly; 4. package; 5. filter; 6. lens; 7. housing; 11. pad; 31. first pin; 32. gold wire; 33. second pin; 321. first gold wire segment; 322. second gold wire segment. DETAILED DESCRIPTION
[0023] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top / bottom" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0025] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0026] Reference Figure 2 As shown, a preferred embodiment of the utility model, a chip packaging unit, includes:
[0027] A circuit board 1, wherein the circuit board 1 comprises a solder pad 11 arranged on an upper surface of the circuit board 1;
[0028] A chip 2, wherein the chip 2 is glued and fixed to the upper surface of the circuit board 1;
[0029] A gold wire assembly 3, the gold wire assembly 3 comprising a first pin 31, a gold wire 32 and a second pin 33, the gold wire 32 being connected to the first pin 31 and the second pin 33 respectively, the first pin 31 being electrically connected to the upper surface of the chip 2, and the second pin 33 being electrically connected to the pad 11;
[0030] The extension line extends upward from the upper right end point of the chip 2 to intersect with the gold wire 32, and the height value H1 of the extension line is 40-60um; the height value H2 between the top of the gold wire 32 and the upper surface of the circuit board 1 is 440-460um.
[0031] The chip packaging unit of the utility model comprises a circuit board 1, a chip 2, and a gold wire assembly 3. The gold wire assembly 3 is electrically connected to the pad 11 of the circuit board 1 and the chip 2 through a first pin 31, a gold wire 32, and a second pin 33. The utility model directly fixes the sensor on the circuit board 1 by using the COB process, and adopts the process of reverse punching the gold wire 32 to reduce the height of the gold wire 32, and can fully utilize the performance of the chip 2; the utility model controls the size parameters of the gold wire 32 to ensure the size of the chip packaging unit and meet the miniaturization requirements; the utility model limits the shape of the gold wire 32, so as to facilitate the covering of the package body 4 on the gold wire 32 and facilitate the subsequent assembly of other components.
[0032] As a preferred embodiment of the utility model, it may also have the following additional technical features:
[0033] In this embodiment, the gold wire 32 includes a first gold wire segment 321 and a second gold wire segment 322. The first gold wire segment 321 is electrically connected to the first pin 31, and the second gold wire segment 322 is electrically connected to the second pin 33. The intersection of the first gold wire segment 321 and the second gold wire segment 322 has an arc. The first gold wire segment 321 and the second gold wire segment 322 are connected to the first pin 31 and the second pin 33 respectively. The first gold wire segment 321 and the second gold wire segment 322 are both straight line segments, but the intersection corner has an arc to smoothly transition the corner.
[0034] In this embodiment, the first gold wire segment 321 and the second gold wire segment 322 have an angle C, and the value of the angle C is 80°-95°. Controlling the value of the angle C is beneficial to improving the packaging efficiency of the gold wire 32 and improving the stability and firmness of the gold wire 32.
[0035] In this embodiment, the first gold wire segment 321 and the upper surface of the chip 2 have an angle A, and the value of the angle A is 15°-35°. By controlling the value of the angle A, it is possible to reduce the height between the first gold wire segment 321 and the chip 2, and it is also beneficial to ensure the extension amount of the first gold wire segment 321 in the direction of the upper surface of the chip 2, so as to facilitate the later setting of a sufficient amount of packaging body 4, and facilitate the installation of the filter 5 on the packaging body 4 later.
[0036] In this embodiment, the second gold wire segment 322 and the upper surface of the circuit board 1 have an angle B, and the value of the angle B is 80°-100°. The angle B is preferably 90°. The value control of the angle B is conducive to improving the packaging efficiency of the gold wire 32 and improving the stability and firmness of the gold wire 32.
[0037] In this embodiment, the gold wire assembly 3 connects the upper surface of the chip 2 and the pad 11 by a gold wire reverse punching process. The gold wire assembly 3 uses a gold wire reverse punching process to connect the chip 2 and the circuit board 1. Specifically, the end of the gold wire 32 is first fixed on the pad 11 of the circuit board 1 to form a pin, and then the gold wire 32 is stretched, and the other end is also fixed on the chip 2 to form a pin. The advantage of this arrangement is that the overall height of the gold wire assembly 3 can be reduced to meet the miniaturization requirements.
[0038] In this embodiment, the chip packaging unit further includes a packaging body 4, which covers the gold wire assembly 3, and the packaging body 4 is partially disposed on the upper surface of the chip 2 and the upper surface of the circuit board 1. The gold wire assembly 3 is covered by the packaging body 4 to encapsulate and fix the gold wire assembly 3.
[0039] In this embodiment, the height H3 between the upper surface of the package body 4 and the upper surface of the circuit board 1 is 465-600 um. The value of H3 is controlled to meet the miniaturization requirement.
[0040] In this embodiment, the chip packaging unit further includes a filter 5, which is parallel to the upper surface of the chip 2 and is disposed on the packaging body 4. The filter 5 has a filtering effect, and the filter 5 is directly disposed on the packaging body 4, which reduces the height of the filter 5 relative to the chip 2, thereby achieving miniaturization requirements.
[0041] Reference Figure 1 As shown, the utility model also includes a vehicle-mounted camera module, including a lens 6, a housing 7, and the above-mentioned chip packaging unit, wherein the lens 6 is arranged at the upper end of the housing 7, the chip packaging unit is arranged in the housing 7, and the lens 6 faces the chip packaging unit. The vehicle-mounted camera module includes the lens 6, the housing 7, and the above-mentioned chip packaging unit, meeting the miniaturization requirements.
[0042] The above is only a preferred specific implementation method of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed by the utility model according to the technical solution and improved ideas of the utility model, which should be included in the protection scope of the utility model.
Claims
1. A chip packaging unit, characterized in that: include: A circuit board (1), the circuit board (1) comprising a solder pad (11) arranged on the upper surface of the circuit board (1); A chip (2), the chip (2) being glued and fixed to the upper surface of the circuit board (1); A gold wire assembly (3), the gold wire assembly (3) comprising a first pin (31), a gold wire (32) and a second pin (33), the gold wire (32) being connected to the first pin (31) and the second pin (33) respectively, the first pin (31) being electrically connected to the upper surface of the chip (2), and the second pin (33) being electrically connected to the pad (11); The extension line extends upward from the upper right end point of the chip (2) to intersect with the gold wire (32), and the height value H1 of the extension line is 40-60um; the height value H2 between the top of the gold wire (32) and the upper surface of the circuit board (1) is 440-460um.
2. The chip packaging unit according to claim 1, characterized in that: The gold wire (32) comprises a first gold wire segment (321) and a second gold wire segment (322); the first gold wire segment (321) is electrically connected to the first pin (31); the second gold wire segment (322) is electrically connected to the second pin (33); and the intersection of the first gold wire segment (321) and the second gold wire segment (322) has an arc.
3. The chip packaging unit according to claim 2, characterized in that: The first gold wire segment (321) and the second gold wire segment (322) have an included angle C, and the value of the included angle C is 80°-95°.
4. The chip packaging unit according to claim 2, characterized in that: An angle A is formed between the first gold wire segment (321) and the upper surface of the chip (2), and the value of the angle A is 15°-35°.
5. The chip packaging unit according to claim 2, characterized in that: The second gold wire segment (322) and the upper surface of the circuit board (1) have an included angle B, and the value of the included angle B is 80°-100°.
6. The chip packaging unit according to claim 1, characterized in that: The gold wire assembly (3) is connected to the upper surface of the chip (2) and the pad (11) through a gold wire back-punching process.
7. The chip packaging unit according to claim 1, characterized in that: The chip packaging unit further comprises a packaging body (4), the packaging body (4) covers the gold wire assembly (3), and the packaging body (4) is partially arranged on the upper surface of the chip (2) and the upper surface of the circuit board (1).
8. The chip packaging unit according to claim 7, characterized in that: The height value H3 between the upper surface of the packaging body (4) and the upper surface of the circuit board (1) is 465-600 um.
9. The chip packaging unit according to claim 7, characterized in that: The chip packaging unit further comprises a filter (5), wherein the filter (5) is parallel to the upper surface of the chip (2) and is arranged on the packaging body (4).
10. A vehicle-mounted camera module, comprising a lens (6) and a housing (7), characterized in that: It also comprises the chip packaging unit according to any one of claims 1 to 9, the lens (6) is arranged at the upper end of the shell (7), the chip packaging unit is arranged in the shell (7), and the lens (6) is facing the chip packaging unit.