LED packaging device

Abstract

The utility model belongs to the technical field of light-emitting devices, and particularly relates to an LED packaging device which comprises an LED support, a conduction mechanism is arranged on the LED support, a plurality of independent bowl cups which are respectively used for LED wafer die bonding and wire welding are arranged in the LED support, and the conduction mechanism is respectively communicated with the plurality of independent bowl cups. According to the LED packaging device, the conduction mechanism is arranged, and the independent bowl cups are all arranged in the bowl-in-cup, so that in the dispensing process, the independent bowl cups can be filled at the same time only by dispensing glue at the conduction mechanism for one time, the original multiple times of dispensing is reduced to one-time dispensing forming, the dispensing efficiency is improved, and the production cost is reduced. And therefore, the production efficiency is improved, the scrap cost is reduced, and remarkable benefits are brought to the production process of the LED lamp beads.

Description

[Technical field]

[0001] The present application belongs to the technical field of light-emitting devices, and specifically relates to an LED packaging device. [Background technology]

[0002] The LED all-in-one lamp beads currently on the market are usually combined into one lamp bead physically or integratedly, but the number of bowls and cups inside the all-in-one lamp bead is still the same as the number of bowls and cups before the combination. For example, there are still 4 independent bowls and cups inside the 4-in-1 lamp bead that is combined into 1, and the number of bowls and cups after the combination has not decreased. Therefore, in terms of the number of dispensing times, the dispensing efficiency of the two is no different. At the same time, because the all-in-one lamp bead has multiple bowls and cups that need to be dispensed separately, if one of the bowls and cups has an abnormal dispensing, the combined all-in-one lamp bead has an abnormality and needs to be treated as an abnormal product; and if the dispensing of a single lamp bead before the combination has an abnormality, only the single lamp bead is treated as an abnormal product. During the entire operation, the scrapping cost of the combined all-in-one lamp bead will be higher than the scrapping cost of the single lamp bead before the combination. [Contents of the utility model]

[0003] In order to solve the problems of glue dispensing efficiency and scrapping cost of all-in-one lamp beads in the prior art, the present application provides an LED packaging device.

[0004] This application is implemented through the following technical solutions:

[0005] An LED packaging device comprises an LED bracket, a conducting mechanism is arranged on the LED bracket, a plurality of independent bowls are arranged inside the LED bracket for respectively providing LED chip die bonding wires, and the conducting mechanism is connected with the plurality of independent bowls respectively.

[0006] In the LED package device as described above, the conduction mechanism is a sunken cup-in-bowl, and a plurality of independent cups are opened downward from the bottom of the cup-in-bowl.

[0007] In the LED package device as described above, the edge of the independent bowl cup is tangent to the edge of the cup in the bowl.

[0008] In the LED packaging device as described above, the horizontal height of the bottom of the cup in the bowl is higher than the horizontal height of the top of the LED lamp bead.

[0009] In the LED packaging device as described above, the conduction mechanism is a glue injection groove provided on the LED bracket, and a plurality of guide grooves respectively connecting the glue injection groove and a plurality of the independent bowl cups.

[0010] In the LED packaging device as described above, the glue injection groove and the plurality of independent cups are spaced at the same distance.

[0011] In the LED packaging device as described above, the guide groove is arranged along the shortest distance from the glue injection groove to the independent bowl cup.

[0012] In the LED packaging device as described above, the width of the guide groove gradually increases from an end close to the glue injection groove to an end away from the glue injection groove.

[0013] In the LED packaging device as described above, the guide groove is inclined downward from an end close to the glue injection groove to an end away from the glue injection groove.

[0014] In the LED packaging device as described above, the horizontal height of the bottom of the guide groove is higher than the horizontal height of the top of the LED lamp bead.

[0015] Compared with the prior art, this application has the following advantages:

[0016] An LED packaging device of the present application, through the setting of a conduction mechanism, independent bowl cups are all set in the cup in the bowl. Therefore, during the dispensing process, only one dispensing of glue is required at the conduction mechanism to fill multiple independent bowl cups at the same time, reducing the original multiple dispensing of glue to one dispensing molding, thereby improving the dispensing efficiency and reducing the operating procedures that produce defects, thereby improving production efficiency and reducing scrap costs, bringing significant benefits to the LED lamp bead production process.

Brief Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 is a three-dimensional stereogram of the first embodiment of the present application;

[0019] Figure 2 yes Figure 1 A top view of an LED chip installed in the middle;

[0020] Figure 3 yes Figure 2 Cross-sectional view at AA in the middle;

[0021] Figure 4 is a top view of the second embodiment of the present application;

[0022] Figure 5 It is a three-dimensional stereogram of a traditional LED bracket. [Specific implementation method]

[0023] In order to make the technical problems, technical solutions and beneficial effects solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0024] See also Figures 1 to 5 An LED packaging device includes an LED bracket 1, a conducting mechanism 2 is provided on the LED bracket 1, and a plurality of independent bowl cups 3 are provided in the LED bracket 1 for respectively providing LED chips 4 with bonding wires, and the conducting mechanism 2 is connected to the plurality of independent bowl cups 3 respectively.

[0025] In a first embodiment of an LED packaging device of the present application, independent bowl cups are all arranged in the cup in the bowl through the setting of the conduction mechanism. Therefore, during the dispensing process, only one dispensing of glue is required at the conduction mechanism to fill multiple independent bowl cups at the same time, reducing the original multiple dispensing of glue to one dispensing molding, thereby improving the dispensing efficiency and reducing the operating procedures that produce defects, thereby improving production efficiency and reducing scrap costs, bringing significant benefits to the LED lamp bead production process.

[0026] Furthermore, as a preferred implementation manner of the present solution but not a limitation, the conduction mechanism 2 is a sunken bowl-in-cup 100 , and the plurality of independent bowl-in-cups 3 are opened downward from the bottom of the bowl-in-cup 100 .

[0027] In this embodiment, the sealing between the LED lamp bead and the cup in the bowl is ensured, effectively preventing the overflow and contamination of the dispensing material. This sealing not only improves production efficiency and reduces material waste, but also reduces the generation rate of abnormal products, thereby saving costs.

[0028] Furthermore, as a preferred implementation manner of the present solution but not a limitation, the edge of the independent bowl cup 3 is tangent to the edge of the cup in the bowl 100 .

[0029] In this embodiment, the gap when installing the four-in-one lamp beads is increased, thereby improving the accuracy and stability of glue dispensing. Secondly, the tangent design makes the connection between the LED lamp beads and the bowl cup more uniform and firm, avoiding production quality problems caused by poor connection.

[0030] Furthermore, as a preferred implementation manner of the present solution but not a limitation, the horizontal height of the bottom of the cup-in-bowl 100 is higher than the horizontal height of the top of the LED lamp bead 4 .

[0031] Furthermore, as a preferred implementation of the present solution but not a limitation, the conduction mechanism 2 is a glue injection groove 21 provided on the LED bracket 1, and a plurality of guide grooves 22 respectively connecting the glue injection groove 21 and a plurality of the independent bowl cups 3.

[0032] In the second embodiment, the setting of the glue injection groove enables the glue dispensing material to be accurately delivered to each independent bowl cup, ensuring that the glue dispensing process of the LED lamp beads is more uniform and accurate. Secondly, by connecting with the guide groove of the independent bowl cup, the flow direction of the glue dispensing material can be effectively controlled, avoiding the poor glue dispensing phenomenon caused by poor flow or confusion, and ensuring the quality and stability of glue dispensing. In addition, this design can also reduce the waste of glue dispensing materials, improve production efficiency and resource utilization, enhance product reliability and durability, and thus improve the overall product quality level.

[0033] Furthermore, as a preferred implementation of the present solution but not a limitation, the interval between the glue injection groove 21 and the plurality of independent bowl cups 3 is the same.

[0034] In this embodiment, it is ensured that the dispensing material can be evenly distributed into each independent bowl cup, ensuring the consistency and accuracy of the dispensing process, thereby improving the quality and stability of the LED lamp beads.

[0035] Further, as a preferred implementation manner of the present solution but not a limitation, the guide groove 22 is arranged along the shortest distance from the glue injection groove 21 to the independent bowl cup 3 .

[0036] In this embodiment, the delivery path of the dispensing material from the glue injection slot to the independent bowl cup is minimized to the greatest extent, effectively shortening the time and distance in the dispensing process, thereby improving production efficiency and response speed.

[0037] Further, as a preferred implementation manner of the present solution but not a limitation, the width of the guide groove 22 gradually increases from an end close to the glue injection groove 21 to an end away from the glue injection groove 21 .

[0038] In this embodiment, the flow resistance of the dispensing material during the diversion process is reduced, the viscosity loss and flow loss of the dispensing material are reduced, the efficiency of the dispensing process and the degree of material saving are improved, and in addition, the design of gradually increasing width can also reduce the generation of bubbles and impurities, thereby ensuring the stability and quality of the dispensing process.

[0039] Furthermore, as a preferred implementation mode of the present invention but not a limitation, the guide groove 22 is inclined downward from one end close to the glue injection groove 21 to one end away from the glue injection groove 21, thereby accelerating the flow speed of the glue dispensing material, shortening the time of the glue dispensing process, and improving production efficiency.

[0040] Further, as a preferred implementation manner of the present solution but not a limitation, the horizontal height of the bottom of the guide groove 22 is higher than the horizontal height of the top of the LED lamp bead 4 .

[0041] The working principle of this embodiment is as follows:

[0042] An LED packaging device of the present application, through the setting of a conduction mechanism, independent bowl cups are all set in the cup in the bowl. Therefore, during the dispensing process, only one dispensing of glue is required at the conduction mechanism to fill multiple independent bowl cups at the same time, reducing the original multiple dispensing of glue to one dispensing molding, thereby improving the dispensing efficiency and reducing the operating procedures that produce defects, thereby improving production efficiency and reducing scrap costs, bringing significant benefits to the LED lamp bead production process.

[0043] The above are implementation methods provided in combination with specific contents, and it is not intended that the specific implementation of this application is limited to these descriptions. Any method structure similar to the present application, or a number of technical deductions or replacements based on the concept of the present application, should be considered as the protection scope of this application.

Claims

1. An LED packaging device, characterized in that: The LED bracket (1) comprises an LED bracket (1) provided with a conducting mechanism (2), the LED bracket (1) being provided with a plurality of independent bowl cups (3) for respectively providing LED chips (4) with bonding wires, and the conducting mechanism (2) being respectively connected to the plurality of independent bowl cups (3).

2. The LED package device according to claim 1, characterized in that: The conduction mechanism (2) is a sinking bowl-in-cup (100), and a plurality of independent bowl-in-cups (3) are opened downward from the bottom of the bowl-in-cup (100).

3. The LED package device according to claim 2, characterized in that: The edge of the independent bowl cup (3) is tangent to the edge of the cup in the bowl (100).

4. The LED package device according to claim 2, characterized in that: The level of the bottom of the cup-in-bowl (100) is higher than the level of the top of the LED chip (4).

5. The LED package device according to claim 1, characterized in that: The conduction mechanism (2) is a glue injection groove (21) provided on the LED bracket (1), and a plurality of guide grooves (22) respectively connecting the glue injection groove (21) and the plurality of independent bowl cups (3).

6. The LED package device according to claim 5, characterized in that: The glue injection groove (21) is spaced at the same distance from the plurality of independent bowls and cups (3).

7. The LED package device according to claim 5, characterized in that: The guide groove (22) is arranged along the shortest distance from the glue injection groove (21) to the independent bowl cup (3).

8. The LED package device according to claim 5, characterized in that: The width of the guide groove (22) gradually increases from an end close to the glue injection groove (21) to an end away from the glue injection groove (21).

9. The LED package device according to claim 5, characterized in that: The guide groove (22) is inclined downward from an end close to the glue injection groove (21) to an end away from the glue injection groove (21).

10. The LED package device according to claim 5, characterized in that: The horizontal height of the bottom of the guide groove (22) is higher than the horizontal height of the top of the LED chip (4).

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