PCB opening structure applied to Hall sensor

Abstract

The utility model discloses a PCB opening structure applied to a Hall sensor. The PCB opening structure is arranged on a PCB panel. Comprising a plurality of open holes corresponding to Pins of the Hall sensor, the Pins are inserted into the open holes, and gaps of 0.1 mm are formed between the Pins and the open holes; the periphery of the hole is provided with a bonding pad, the periphery of the bonding pad is provided with solder resist ink, and the distance of the narrowest part of the bonding pad is 0.1 mm; the two sides of the bonding pad are provided with teardrop-shaped structures for soldering tin to flow. By improving the size of the hole and the design of the bonding pad, the risk of tin connection during selective wave soldering can be effectively reduced, the cost required for production of the product is reduced, the risks of product performance reduction and later reliability abnormity caused by maintenance are avoided, and the purposes of reducing the production of finished products and reducing the product scrap are achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of PCB processing, and relates to a PCB opening structure applied to a Hall sensor. Background Art

[0002] The operating principle of the car parking controller module is based on the Hall sensor inside the product to sense the vehicle's moving distance. This function can prevent the vehicle from sliding backwards and causing traffic accidents due to the driver's negligence when the vehicle stops on a slope during driving. It has become a standard accessory for most vehicles.

[0003] The current PCB board is designed with an elliptical hole, which is formed by two 1.667mm translations and is 1.5mm long. When the Hall sensor is installed on the above PCB board, the edge spacing of the hole ring between the pin pins is 0.2mm, and the material needs to be exposed to 1mm from the PCB after normal welding, resulting in a shadow effect between the pin pin and the PCB during welding, and the phenomenon of bridging is prone to occur when using selective wave soldering to weld it.

[0004] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. Utility Model Content

[0005] The utility model aims to provide a PCB opening structure applied to a Hall sensor, and improves the tin connection problem that occurs during the installation of the existing Hall sensor by improving the structure.

[0006] The purpose of the utility model is achieved through the following technical solutions:

[0007] A PCB opening structure applied to a Hall sensor is arranged on a PCB panel; it comprises a plurality of openings corresponding to the pins of the Hall sensor, the pins are inserted into the openings and there is a gap of 0.1 mm between the pins and the openings; a solder pad is arranged around the opening, solder resist ink is arranged around the solder pad, and the spacing of the pads at the narrowest point is 0.1 mm; teardrop-shaped structures for solder flow are arranged on both sides of the solder pad.

[0008] In one embodiment, the aperture of the opening is 0.75 mm; the narrowest distance between two adjacent openings is 0.52 mm; and the area where the solder resist ink is located is 0.05 mm larger than a single side of the pad.

[0009] Furthermore, the solder resist ink has an elliptical structure.

[0010] The above technical solution has the following beneficial effects: by improving the hole size and pad design, the risk of bridging during selective wave soldering can be effectively reduced, the cost required for the production of the product is reduced, and the risk of product performance degradation and subsequent reliability abnormalities due to maintenance is avoided, thereby reducing the production of finished products and reducing product scrapping. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0012] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0013] Figure 1 This is a schematic diagram of the first state structure provided by the utility model.

[0014] Figure 2 The utility model is provided with a cross-sectional structure schematic diagram.

[0015] In the figure: 1-PCB panel; 2-opening; 3-pad; 3.1-teardrop-shaped structure; 4-solder resist ink. DETAILED DESCRIPTION

[0016] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0017] The utility model mainly focuses on PCB opening design, reduces the aperture of the Hall sensor installation, optimizes the shape of the pad, and increases the distance between the edges of the holes of the parts to reduce the problem of tinning in selective wave soldering.

[0018] Example

[0019] See also Figure 1-Figure 2As shown, a PCB opening structure for a Hall sensor is provided on a PCB panel 1. At present, the diameter of the Hall sensor pin is 0.39*0.38mm in length and width, and is designed as a rectangle, with a diagonal length of 0.55mm. Based on this size, the following positions are redesigned:

[0020] like Figure 1 As shown, the distance between two adjacent holes is D4, the distance between two adjacent hole rings is D2, the aperture of a single hole structure is D3, and the narrowest distance between the hole 2 of the single hole structure and the outer edge of the pad 3 is D1, wherein the hole 2 is located at the center of the pad 3, the solder resist ink 4 is an elliptical structure, and the area where the solder resist ink 4 is located is 0.05mm larger than the single side of the pad 3 to prevent ink from contaminating the pad 3 during PCB processing. Teardrop-shaped structures 3 are set on the upper and lower sides of the pad 3. The specific improved parameters are as follows:

[0021] 1. The aperture of the opening 2 on the PCB is designed from 0.85mm to 0.75mm. By reducing the aperture, the distance between the two openings 2 can be increased. At the same time, the reduced aperture can also meet the requirement that after the material (Hall sensor pin) is inserted into the aperture, there is a 0.1mm gap between one side of the material and the hole wall for welding.

[0022] 2. The width D1 of the pad 3 on the PCB is changed from 0.11 to 0.10mm. By reducing the width of the pad 3, the distance D2 between the two hole rings can be increased, which increases the flow of tin during soldering and reduces the occurrence of bridging. Through the above design, the hole ring spacing D2 is 0.32mm and the hole spacing D4 is 0.52mm.

[0023] 3. Stretching the two sides of the elliptical pad again to add a teardrop-shaped structure 3 can increase the fluidity of tin during welding, reduce the risk of bridging, and reduce the occurrence of empty soldering caused by unstable tin waves, and further improve the strength of the material after welding.

[0024] The utility model can effectively reduce the risk of bridging during selective wave soldering by improving the opening size and pad design, thereby reducing the cost required for the production of the product and avoiding the risk of reduced product performance due to maintenance and abnormal reliability in the later stage.

[0025] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A PCB opening structure applied to a Hall sensor, arranged on a PCB panel; characterized in that: It includes a plurality of openings corresponding to the pins of the Hall sensor, wherein the pins are inserted into the openings and there is a gap of 0.1 mm between the pins and the openings; a solder pad is arranged around the opening, and solder resist ink is arranged around the solder pad, and the spacing between the pads at the narrowest point is 0.1 mm; teardrop-shaped structures for solder flow are arranged on both sides of the solder pad.

2. The PCB opening structure according to claim 1, characterized in that: The aperture of the opening is 0.75 mm; the narrowest spacing between two adjacent openings is 0.52 mm; the area where the solder resist ink is located is 0.05 mm larger than a single side of the pad.

3. The PCB opening structure according to claim 1, characterized in that: The solder resist ink has an elliptical structure.

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