Electroplating pretreatment equipment for circuit board

Abstract

The utility model relates to the technical field of circuit board production, in particular to electroplating pretreatment equipment for a circuit board. According to the technical scheme, the circuit board mounting structure comprises a mounting base, a mounting groove is formed in the upper surface of the mounting base, a plurality of circuit board mounting positions are arranged in the mounting groove, and each circuit board mounting position is provided with a positioning mechanism; the positioning mechanism comprises positioning columns arranged at the four corners of the circuit board-shaped mounting position and a driving assembly for driving the positioning columns to rotate, the positioning columns are used for being inserted into holes of the circuit board, a plurality of sheet-shaped protrusions are arranged on the peripheral sides of the positioning columns, and the sheet-shaped protrusions are used for making contact with the hole walls of the circuit board. According to the utility model, the circuit board is fixed through the positioning mechanism, the positioning column and the sheet-shaped bulge are inserted into the hole of the circuit board, the silver colloid is added into the hole, the positioning column is driven to rotate through the driving assembly, and the silver colloid is stricken in the hole, so that the uniform smearing of the silver colloid is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production equipment, in particular to a circuit board electroplating pre-treatment device. Background Art

[0002] After drilling holes in a circuit board, the hole walls are not conductive and cannot be directly electroplated. Therefore, before electroplating, the circuit board will be treated with through-hole silver paste so that the silver paste adheres to the hole walls for electroplating inside the hole.

[0003] At present, silver glue through-holes are generally made by dipping a scraper in silver glue and then moving it back and forth in the area with holes on the board surface to scrape the silver glue into the holes. After one side is completed, the other side is moved on. After that, the silver glue on the surface of the circuit board needs to be scraped off and the excess silver glue in the hole needs to be blown out, leaving only an appropriate amount of silver glue attached to the hole wall. The entire silver glue through-hole process is not only inefficient, but also has poor stability. The process of reciprocating movement of the scraper to scrape the silver glue into the through-holes is cumbersome, and it is difficult to ensure that the silver glue is poured into every through-hole, which is prone to leakage, which will increase the workload of subsequent processing and reduce the efficiency and effect of the overall silver glue through-hole work. Utility Model Content

[0004] In view of the problems existing in the background technology, the utility model proposes a circuit board electroplating pre-treatment device which is convenient for injecting silver glue into the through hole of the circuit board and can evenly apply the silver glue.

[0005] The technical solution of the utility model: a circuit board electroplating pre-treatment device, comprising a mounting base, a mounting groove is provided on the upper surface of the mounting base, a plurality of circuit board mounting positions are provided in the mounting groove, and each of the circuit board mounting positions is provided with a positioning mechanism;

[0006] The positioning mechanism includes positioning columns arranged at the four corners of the circuit board-shaped mounting position and a driving component for driving the positioning columns to rotate. The positioning columns are used to be inserted into the holes of the circuit board. A plurality of sheet-like protrusions are arranged on the outer peripheral side of the positioning columns, and the sheet-like protrusions are used to contact the hole wall of the circuit board.

[0007] In an optional embodiment, the sheet-like protrusions form a plurality of accommodating cavities after contacting the hole wall of the circuit board, and the accommodating cavities are used to contain silver paste.

[0008] In an optional embodiment, the driving assembly includes a rotating shaft fixed to the lower end of the positioning column, the rotating shaft is rotatably connected to the mounting base, a synchronous wheel is provided on the rotating shaft, the synchronous wheel in the same circuit board mounting position is connected via a synchronous belt transmission, and also includes a driving motor, wherein one end of the rotating shaft is connected to the output end of the driving motor.

[0009] In an optional embodiment, the rotating shaft is installed in the mounting base through a bearing, and the diameter of the positioning column is larger than the diameter of the bearing.

[0010] In an optional embodiment, it also includes a lifting device and a glue injection device, the lifting device is fixed to the rear side of the mounting base, the glue injection device is installed on the lifting seat of the lifting device, and the glue injection device is used to inject silver glue into the accommodating cavity.

[0011] Compared with the prior art, the utility model has the following beneficial technical effects:

[0012] The utility model fixes the circuit board through the positioning mechanism, inserts the positioning column and the sheet-like protrusion into the hole of the circuit board, adds silver glue into the hole, drives the positioning column to rotate through the driving component, and scrapes the silver glue in the hole, thereby realizing uniform application of the silver glue. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic structural diagram of the mounting base in an embodiment of the utility model is given;

[0014] Figure 2 A structural schematic diagram of the drive assembly in the utility model is given;

[0015] Figure 3 This is a schematic diagram of the installation of the positioning column and the circuit board in the utility model;

[0016] Figure 4 This is a schematic diagram of the structure of an embodiment of the utility model;

[0017] Figure numerals: 1 mounting base; 3 mounting groove; 4 sheet-like protrusion; 5 positioning column; 6 driving motor; 7 synchronous belt; 8 rotating shaft; 9 synchronous wheel; 10 circuit board; 11 accommodating cavity; 12 lifting device; 13 glue injection device. DETAILED DESCRIPTION

[0018] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "vertical", "cross", "inside", "outside", "front", "back" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] Example

[0021] like Figure 1 As shown, a circuit board electroplating pretreatment device proposed by the utility model comprises a mounting base 1, a mounting groove 3 is provided on the upper surface of the mounting base 1, a plurality of circuit board mounting positions are provided in the mounting groove 3, and each of the circuit board mounting positions is provided with a positioning mechanism;

[0022] The positioning mechanism includes positioning columns 5 arranged at the four corners of the circuit board-shaped mounting position and a driving component for driving the positioning columns 5 to rotate. The positioning columns 5 are used to be inserted into the holes of the circuit board. A plurality of sheet-like protrusions 4 are arranged on the outer peripheral side of the positioning columns 5. The sheet-like protrusions 4 are used to contact the hole wall of the circuit board.

[0023] The circuit board 10 is fixed by the positioning mechanism, and the positioning column 5 and the sheet-like protrusion 4 are inserted into the hole of the circuit board 10, and silver glue is added into the hole. The positioning column 5 is driven to rotate by the driving component to scrape the silver glue flat in the hole, thereby achieving uniform application of the silver glue.

[0024] It should be noted that the sheet-like protrusions 4 form a plurality of accommodating cavities 11 after contacting the hole wall of the circuit board, and the accommodating cavities 11 are used to contain silver glue. The silver glue is injected into the accommodating cavities 11, and then the positioning column 5 is rotated to evenly apply the silver glue to the hole wall of the circuit board 10 through the sheet-like protrusions 4, thereby realizing the silver glue application process before electroplating.

[0025] Combination Figure 2 and Figure 3 As shown, in this embodiment, the driving assembly includes a rotating shaft 8 fixed to the lower end of the positioning column 5, the rotating shaft 8 is rotatably connected to the mounting base 1, a synchronous wheel 9 is provided on the rotating shaft 8, the synchronous wheel 9 in the same circuit board mounting position is connected through a synchronous belt 7, and also includes a driving motor 6, one end of the rotating shaft 8 is connected to the output end of the driving motor 6.

[0026] The rotating shaft 8 is installed in the installation base 1 through a bearing, and the diameter of the positioning column 5 is larger than the diameter of the bearing.

[0027] After the silver glue is injected into the accommodating cavity 11, the rotating shaft 8 is driven to rotate by the driving motor 6, and under the action of the synchronous belt 7 and the synchronous wheel 9, the rotating shaft 8 at the same circuit board mounting position rotates synchronously, so that the positioning column 5 and the sheet-like protrusion 4 apply the silver glue to the hole wall of the circuit board.

[0028] like Figure 4 As shown, optionally, the circuit board electroplating pre-treatment device further includes a lifting device 12 and a glue injection device 13, wherein the lifting device 12 is fixed to the rear side of the mounting base 1, and the glue injection device 13 is installed on the lifting seat of the lifting device 12, and the glue injection device 13 is used to inject silver glue into the accommodating cavity 11. The silver glue is injected into the hole of the circuit board 10 by the glue injection device 13 under the drive of the lifting device 12, and in some cases, the glue can also be injected into the hole of the circuit board by manual glue injection.

[0029] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention are understood according to specific circumstances.

[0030] The above specific embodiments are only one or several preferred embodiments of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A circuit board electroplating pre-treatment device, characterized in that: It comprises a mounting base (1), the upper surface of the mounting base (1) is provided with a mounting groove (3), a plurality of circuit board mounting positions are provided in the mounting groove (3), and each circuit board mounting position is provided with a positioning mechanism; The positioning mechanism comprises positioning columns (5) arranged at the four corners of the circuit board-shaped mounting position and a driving assembly for driving the positioning columns (5) to rotate. The positioning columns (5) are used to be inserted into the holes of the circuit board. The outer peripheral side of the positioning columns (5) is provided with a plurality of sheet-like protrusions (4), and the sheet-like protrusions (4) are used to contact the hole wall of the circuit board.

2. A circuit board electroplating pretreatment device according to claim 1, characterized in that: After the sheet-like protrusions (4) come into contact with the hole wall of the circuit board, a plurality of accommodating cavities (11) are formed, and the accommodating cavities (11) are used to contain silver glue.

3. A circuit board electroplating pretreatment device according to claim 2, characterized in that: The driving assembly comprises a rotating shaft (8) fixed to the lower end of the positioning column (5), the rotating shaft (8) being rotatably connected to the mounting base (1), a synchronous wheel (9) being arranged on the rotating shaft (8), the synchronous wheel (9) in the same mounting position of the circuit board being connected by a synchronous belt (7), and further comprising a driving motor (6), wherein one end of the rotating shaft (8) is connected to the output end of the driving motor (6).

4. A circuit board electroplating pretreatment device according to claim 3, characterized in that: The rotating shaft (8) is installed in the installation base (1) via a bearing, and the diameter of the positioning column (5) is larger than the diameter of the bearing.

5. The circuit board electroplating pre-treatment equipment according to claim 4, characterized in that: It also comprises a lifting device (12) and a glue injection device (13), wherein the lifting device (12) is fixed to the rear side of the mounting base (1), and the glue injection device (13) is mounted on the lifting seat of the lifting device (12), and the glue injection device (13) is used to inject silver glue into the accommodating cavity (11).

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