Cooking utensil

Abstract

The embodiment of the utility model provides a cooking utensil, the cooking utensil comprises a pot body, a handle and a temperature measuring assembly, the pot body comprises a side wall and a bottom wall, and the side wall is provided with a mounting part. The temperature measuring assembly comprises a temperature sensor, the handle is installed on the installation part, and the temperature sensor is installed on the handle or the installation part. The cooking utensil further comprises a heat conduction layer which is arranged on the side wall, and the first end of the heat conduction layer abuts against the temperature sensor. The temperature sensor of the temperature measuring assembly is mounted on the mounting part or the handle, so that the temperature sensor does not occupy the space of the bottom wall of the pot body, and the temperature sensor is convenient to replace. The heat conduction layer has good heat conductivity, heat of the side wall and the bottom wall of the pot body can be rapidly conducted to the heat conduction layer, then the heat is rapidly conducted to the temperature sensor abutting against the heat conduction layer, the temperature measurement speed is increased, the heat resistance of the heat conduction layer is small, heat loss in the heat transfer process is reduced, and the temperature measurement accuracy is improved.

Description

Technical Field

[0001] The present application relates to the technical field of kitchen appliances, and in particular to a cooking appliance. Background Art

[0002] Cooking utensils are essential tools in people's daily lives. They can be used with heating appliances to quickly heat food. Cooking utensils usually include a handle and a pot body connected together, and a temperature measuring component is provided on the handle to measure the real-time temperature of the pot body during use and display it to the user. However, since the temperature measuring component is provided on the handle, the measurement of the real-time temperature of the bottom of the pot body is delayed, affecting the accuracy of the temperature measurement. Utility Model Content

[0003] In view of this, the present application provides a cooking utensil to solve the problem of low accuracy in measuring the temperature of the bottom wall of the pot body by the temperature measuring component in the prior art.

[0004] An embodiment of the present application provides a cooking utensil, comprising: a pot body, the pot body comprising a side wall and a bottom wall, the side wall being provided with a mounting portion; a handle, the handle being mounted on the mounting portion; a temperature measuring component, the temperature measuring component comprising a temperature sensor, the temperature sensor being mounted on the mounting portion or the handle; wherein the cooking utensil further comprises a heat-conducting layer, the heat-conducting layer being provided on the side wall, the heat-conducting layer having a first end, the first end being in contact with the temperature sensor.

[0005] In this embodiment, the cooking utensil is provided with a temperature measuring component, which can measure the real-time temperature of the pot body of the cooking utensil during use, so that the user can control the temperature and the pot is not easy to be burnt. The pot body is provided with a mounting portion, and the handle is mounted on the pot body through the mounting portion, which is convenient for the installation of the handle, and can improve the reliability and safety of the connection between the two, and extend the service life of the cooking utensil. At the same time, the temperature sensor of the temperature measuring component is installed on the mounting portion or the handle, that is, the temperature sensor is located outside the accommodating cavity, not on the bottom wall of the pot body, so that the temperature sensor does not occupy the space of the bottom wall of the pot body, and it is convenient to replace the temperature sensor. In addition, a heat conducting layer can also be provided on the side wall of the pot body, and the first end of the heat conducting layer is in contact with the temperature sensor. The heat conducting layer has good thermal conductivity, and can quickly conduct the heat of the side wall and the bottom wall of the pot body to the heat conducting layer, and then quickly conduct it to the temperature sensor abutting therewith, thereby improving the speed of temperature measurement, and the thermal resistance of the heat conducting layer is small, which reduces the heat loss during the heat transfer process, improves the accuracy of temperature measurement, and improves the temperature measurement effect of the cooking utensil. Therefore, in this embodiment, by providing a heat-conducting layer on the pot body, the speed and accuracy of the temperature measuring component in measuring the temperature of the pot body can be improved, thereby improving the user experience.

[0006] In a specific embodiment, the first end extends to the mounting portion, and the heat-conducting layer further includes a second end arranged opposite to the first end, and a preset distance is provided between the second end and the bottom wall.

[0007] In this embodiment, during the cooking process, the temperature of the bottom wall of the pot body is the highest. Along the height direction of the cooking utensil, there is a preset distance between the second end of the heat-conducting layer and the bottom wall. The preset distance enables the heat-conducting layer to quickly conduct the temperature of the bottom wall of the pot body to the position of the temperature sensor, thereby improving the speed of the temperature sensor measuring the bottom wall temperature and improving the accuracy of the temperature sensor measuring the bottom wall temperature. At the same time, the heat-conducting layer does not need to cover the bottom wall or the entire side wall, thereby reducing the amount of the heat-conducting layer, simplifying the structure of the pot body, and reducing costs.

[0008] In a specific embodiment, the projected length of the heat conductive layer along the height direction of the cooking utensil is L1, the depth of the pot body is L2, and the ratio of L1 / L2 satisfies 0.8≤L1 / L2≤1.

[0009] In this embodiment, the ratio of L1 / L2 should not be too small. When it is too small, the preset distance between the second end of the heat-conducting layer and the bottom wall is far. During the heating process of the cooking utensil, the heat conducted from the bottom wall to the heat-conducting layer is easily lost, and the heat transfer is delayed, which affects the speed and accuracy of the temperature sensor measuring the bottom wall temperature. Therefore, in this embodiment, when the ratio of L1 / L2 satisfies 0.8≤L1 / L2≤1, the heat-conducting layer can quickly transfer the heat of the bottom wall of the pot body, reduce heat loss, and improve the speed and accuracy of temperature measurement.

[0010] In a specific embodiment, the heat-conducting layer further includes a second end disposed opposite to the first end, and the second end extends to the bottom wall.

[0011] In this embodiment, the second end of the heat-conducting layer can extend to the bottom wall, so that both the bottom wall and the side wall include the heat-conducting layer, so that the bottom wall with a higher temperature during cooking has the heat-conducting layer, so that the heat of the bottom wall can be quickly transferred to the heat-conducting layer of the side wall, and then transferred to the temperature sensor, further improving the speed and accuracy of temperature measurement. The heat-conducting layer is filled everywhere on the pot body, which can improve the uniformity of heating of the pot body and improve the use effect of the pot body.

[0012] In a specific embodiment, the pot body further includes an inner layer and an outer layer, and the heat conductive layer is located between the inner layer and the outer layer.

[0013] In this embodiment, the bottom wall and the side wall of the pot body may include an inner layer and an outer layer, the heat-conducting layer arranged on the side wall is located between the inner layer and the outer layer, and the heat-conducting layer arranged on the bottom wall is located between the inner layer and the outer layer. During the use of the cooking utensil, the inner layer is used to contact with kitchen utensils such as a spatula, and the outer layer is used to contact with heating appliances such as a gas stove, so that the heat-conducting layer is located between the inner layer and the outer layer, so that the inner layer and the outer layer can protect the heat-conducting layer, avoid direct contact between the heat-conducting layer and the kitchen utensils or heating appliances to cause damage, and extend the service life of the heat-conducting layer.

[0014] In a specific embodiment, the thickness of the heat-conducting layer is smaller than the thickness of the inner layer, and the thickness of the heat-conducting layer is smaller than the thickness of the outer layer.

[0015] In this embodiment, the thickness of the heat-conducting layer is made smaller, which can reduce the overall thickness of the side walls and bottom wall of the pot body, reduce the overall weight of the pot body, make it easier for users to take and use, and reduce production costs.

[0016] In a specific embodiment, the heat-conducting layer has a first heat-conducting segment and a second heat-conducting segment that are relatively bent, the end of the first heat-conducting segment facing away from the second heat-conducting segment is the first end, and the inner layer has a body and a bent segment that are relatively bent; the second heat-conducting segment is located between the body and the outer layer, the first heat-conducting segment is located between the bent segment and the mounting portion, and the bent segment covers the first heat-conducting segment.

[0017] In this embodiment, along the height direction of the cooking utensil, the heat-conducting layer has a first heat-conducting section and a second heat-conducting section that are relatively bent, so that the bottom surface of the first heat-conducting section is connected to the top surface of the mounting portion, and the first end is located at the end of the first heat-conducting section away from the second heat-conducting section, so that the first end is convenient for abutting against the temperature sensor on the mounting portion, thereby improving the speed of heat conduction. At the same time, the inner layer has a relatively bent body and a bent section, so that the body and the bent section cover the first heat-conducting section and the second heat-conducting section, so that the inner layer can protect the heat-conducting layer and extend the service life of the heat-conducting layer.

[0018] In a specific embodiment, the heat conducting layer is made of graphene.

[0019] In this embodiment, the graphene material has good thermal conductivity, which can improve the thermal conductivity of the heat-conducting layer, so that the heat on the bottom wall and the side wall is quickly transferred to the heat-conducting layer, and then quickly transferred to the temperature sensor through the heat-conducting layer, thereby improving the accuracy of temperature measurement. In addition, the thermal resistance of the graphene material is small, which can reduce the heat loss of the heat-conducting layer during the heat conduction process and improve the accuracy of temperature measurement. In this embodiment, the graphene material also has good thermal stability, which can improve the safety of the heat-conducting layer in high temperature environments, and also help to improve the working stability of the temperature sensor abutting the heat-conducting layer.

[0020] In a specific embodiment, along the circumference of the cooking appliance, at least a portion of the side wall is provided with the heat conductive layer.

[0021] In this embodiment, the heat-conducting layer is a sheet structure, and along the height direction of the cooking utensil, the first end is connected to the temperature sensor, and the second end is close to the bottom wall of the pot body, so that the heat of the bottom wall can be quickly transferred to the temperature sensor through the heat-conducting layer, thereby improving the temperature measurement effect. In this embodiment, under the premise of meeting the use requirements, the heat-conducting layer is a sheet structure with a smaller area, which can reduce the difficulty of production and assembly and reduce costs.

[0022] In a specific embodiment, along the height direction of the cooking utensil, the top of the mounting portion has a first mounting groove, the top of the handle is provided with a second mounting groove, and the temperature measuring component is installed in the first mounting groove and the second mounting groove.

[0023] In this embodiment, along the height direction of the cooking utensil, the top of the mounting portion is provided with a first mounting groove, and the temperature sensor can be installed in the first mounting groove, thereby improving the connection reliability between the temperature sensor and the mounting portion. The first mounting groove includes a first side wall and a second side wall, and along the height direction of the cooking utensil, the height of the first side wall is less than the height of the second side wall, so that the bottom surface of the first heat-conducting section of the heat-conducting layer and the bending section of the inner layer can abut against the top surface of the first side wall, so that the first end of the first heat-conducting section abuts against the temperature sensor, so that heat can be directly conducted from the heat-conducting layer to the temperature sensor. At the same time, along the height direction of the cooking utensil, a second mounting groove is provided on the top of the handle, so that other components in the temperature measuring assembly are installed in the second mounting groove, thereby improving the connection reliability between other components in the temperature measuring assembly and the handle. In this embodiment, the temperature sensor and other components in the temperature measuring assembly are installed on the top of the handle, so that the temperature measuring assembly can be prevented from directly contacting with an open flame during the heating process of the cooking utensil, thereby improving the use safety of the temperature measuring assembly and extending the service life of the temperature measuring assembly.

[0024] It should be understood that the foregoing general description and the following detailed description are exemplary only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0026] Figure 1 This is a schematic diagram of the structure of a cooking appliance provided in the present application in a specific embodiment;

[0027] Figure 2 for Figure 1 A partial enlarged view of part I;

[0028] Figure 3 for Figure 1 A partial enlarged view of part II;

[0029] Figure 4 This is a schematic structural diagram of a heat-conducting layer and an outer layer in a cooking utensil provided in the present application in a specific embodiment;

[0030] Figure 5 This is a schematic structural diagram of the heat-conducting layer and the outer layer in the cooking utensil provided in the present application in another specific embodiment;

[0031] Figure 6 This is a schematic structural diagram of a pot body and a handle in a cooking utensil provided in the present application in a specific embodiment;

[0032] Figure 7 for Figure 6 A partial enlarged view of part III;

[0033] Figure 8 for Figure 6 A partial enlarged view of part IV.

[0034] Description of reference numerals:

[0035] 1- Cooking utensils;

[0036] 11- pot body;

[0037] 111- side wall;

[0038] 112-bottom wall;

[0039] 113-installation part;

[0040] 113a-first mounting slot;

[0041] 113b- first side wall;

[0042] 113c- second side wall;

[0043] 114-accommodating chamber;

[0044] 115-Inner layer;

[0045] 115a-bending section;

[0046] 115b-Ontology;

[0047] 116 - outer layer;

[0048] 12-handle;

[0049] 121- second installation slot;

[0050] 13- Temperature measurement component;

[0051] 131- temperature sensor;

[0052] 14- heat conducting layer;

[0053] 141-first end;

[0054] 142-second end;

[0055] 143-first heat conduction section;

[0056] 144 - second heat conduction section.

[0057] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0058] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0059] It should be clear that the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0060] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application. The singular forms "a", "said" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0061] It should be understood that the term "and / or" used in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0062] The present application embodiment provides a cooking utensil 1, such as Figure 1 As shown, the cooking utensil 1 comprises a pot body 11, a handle 12 and a temperature measuring assembly 13, wherein the pot body 11 comprises a side wall 111, a bottom wall 112 and a mounting portion 113 connected to the side wall 111, the side wall 111 and the bottom wall 112 of the pot body 11 enclose a receiving cavity 114 of the pot body 11, and the mounting portion 113 is located outside the receiving cavity 114. Figure 2The temperature measuring component 13 includes a temperature sensor 131. The handle 12 is mounted on the mounting portion 113. The temperature sensor 131 can be mounted on the handle 12, or on the mounting portion 113, or partially on the handle 12 and partially on the mounting portion 113. The cooking utensil can also include a heat-conducting layer 14, which is disposed on the side wall 111 and has a first end 141, which abuts against the temperature sensor 131.

[0063] In this embodiment, the cooking utensil 1 is provided with a temperature measuring component 13, which can measure the real-time temperature of the pot body 11 of the cooking utensil 1 during use, so that the user can control the temperature and the pot is not easily burnt. The pot body 11 is provided with a mounting portion 113, and the handle 12 is mounted on the pot body 11 through the mounting portion 113, which is convenient for the installation of the handle 12, and can improve the reliability and safety of the connection between the two, and extend the service life of the cooking utensil 1. At the same time, the temperature sensor 131 of the temperature measuring component 13 is installed on the mounting portion 113 or the handle 12, that is, the temperature sensor 131 is located outside the accommodating cavity 114, not on the bottom wall 112 of the pot body 11, so that the temperature sensor 131 does not occupy the space of the bottom wall 112 of the pot body 11, and it is convenient to replace the temperature sensor 131. In addition, a heat-conducting layer 14 may be provided on the side wall 111 of the pot body 11, and the first end 141 of the heat-conducting layer 14 abuts against the temperature sensor 131. The heat-conducting layer 14 has good thermal conductivity, and can quickly conduct the heat of the side wall 111 and the bottom wall 112 of the pot body 11 to the heat-conducting layer 14, and then quickly conduct it to the temperature sensor 131 abutting therewith, thereby improving the speed of temperature measurement, and the heat resistance of the heat-conducting layer 14 is small, which reduces the heat loss during the heat transfer process, improves the accuracy of temperature measurement, and improves the temperature measurement effect of the cooking utensil 1. Therefore, in this embodiment, by providing the heat-conducting layer 14 on the pot body 11, the speed and accuracy of the temperature measurement component 13 on the pot body 11 can be improved, and the user's use effect can be improved. In a specific embodiment, when the temperature sensor 131 is installed inside the handle 12, the first end 141 of the thermal conductive layer 14 can extend to the handle 12 and abut against the temperature sensor 131; when the temperature sensor 131 is installed at the end of the handle 12 close to the mounting portion 113, the first end 141 of the thermal conductive layer 14 can extend to the mounting portion 113 and abut against the temperature sensor 131; when the temperature sensor 131 is installed on the mounting portion 113, the first end 141 of the thermal conductive layer 14 can extend to the mounting portion 113 and abut against the temperature sensor 131.

[0064] In a specific embodiment, the temperature measuring component 13 may also include a display for displaying the real-time temperature of the pot body 11. When using the cooking utensil 1, it is convenient for the user to directly read the real-time temperature of the pot body 11, thereby improving the user's experience.

[0065] In a specific embodiment, Figures 1 to 3 As shown, the heat-conducting layer 14 is arranged on the side wall 111 and the mounting portion 113 of the pot body 11 , and the bottom wall is not provided with a heat-conducting layer. The heat-conducting layer 14 also includes a second end 142 arranged opposite to the first end 141 , and there is a preset distance between the second end 142 and the bottom wall 112 .

[0066] In this embodiment, during the cooking process, the temperature of the bottom wall 112 of the pot body 11 is the highest. Along the height direction X of the cooking utensil 1, there is a preset distance between the second end 142 of the heat-conducting layer 14 and the bottom wall 112. The preset distance enables the heat-conducting layer 14 to quickly conduct the temperature of the bottom wall 112 of the pot body 11 to the position of the temperature sensor 131, thereby improving the speed of the temperature sensor 131 measuring the temperature of the bottom wall 112 and improving the accuracy of the temperature sensor 131 measuring the temperature of the bottom wall 112. At the same time, the heat-conducting layer 14 does not need to cover the bottom wall 112 or the entire side wall 111, thereby reducing the amount of the heat-conducting layer 14, simplifying the structure of the pot body, and reducing costs.

[0067] In a specific embodiment, Figures 1 to 3 As shown, the projected length of the heat-conducting layer 14 along the height direction X of the cooking utensil 1 is L1, the depth of the pot body 11 is L2, and the ratio of L1 / L2 satisfies 0.8≤L1 / L2≤1. For example, L1 / L2 can be 0.8, 0.9, 1, etc. The ratio of L1 / L2 should not be too small. When it is too small, the preset distance between the second end 142 of the heat-conducting layer 14 and the bottom wall 112 is far. During the heating process of the cooking utensil 1, the heat conducted from the bottom wall 112 to the heat-conducting layer 14 is easily lost, and the heat transfer is delayed, which affects the speed and accuracy of the temperature sensor 131 measuring the bottom wall temperature. Therefore, in this embodiment, when the ratio of L1 / L2 satisfies 0.8≤L1 / L2≤1, the heat-conducting layer 14 can quickly transfer the heat of the bottom wall 112 of the pot body 11, reduce heat loss, and improve the speed and accuracy of temperature measurement.

[0068] In a specific embodiment, Figure 3 As shown, along the thickness direction of the side wall 111 , the side wall 111 further includes an inner layer 115 and an outer layer 116 , and the heat conductive layer 14 of the side wall is located between the inner layer 115 and the outer layer 116 .

[0069] In this embodiment, along the thickness direction of the side wall 111, the side wall 111 includes an inner layer 115 and an outer layer 116. When the cooking utensil 1 is in use, the inner layer 115 is used to contact kitchen utensils such as a spatula, and the outer layer 116 is used to contact heating appliances such as a gas stove. The heat-conducting layer 14 is located between the inner layer 115 and the outer layer 116, so that the inner layer 115 and the outer layer 116 can protect the heat-conducting layer 14, avoid direct contact between the heat-conducting layer 14 and kitchen utensils or heating appliances to cause damage, and extend the service life of the heat-conducting layer 14.

[0070] In this embodiment, the inner layer 115 may be made of aluminum alloy, and the outer layer 116 may be made of stainless steel.

[0071] In a specific embodiment, Figure 1 and Figure 2 As shown, the heat-conducting layer 14 has a first heat-conducting section 143 and a second heat-conducting section 144 that are bent relatively, the end of the first heat-conducting section 143 that is away from the second heat-conducting section 144 is the first end 141, and the inner layer 115 has a body 115b and a bent section 115a that are bent relatively. The second heat-conducting section 144 is located between the body 115b and the outer layer 116, the first heat-conducting section 143 is located between the bent section 115a and the mounting portion 113, and the bent section 115a covers the first heat-conducting section 143.

[0072] In this embodiment, along the height direction X of the cooking utensil 1, the heat-conducting layer 14 has a first heat-conducting section 143 and a second heat-conducting section 144 that are relatively bent, so that the bottom surface of the first heat-conducting section 143 is connected to the top surface of the mounting portion 113, and the first end 141 is located at the end of the first heat-conducting section 143 away from the second heat-conducting section 144, so that the first end 141 is convenient for abutting against the temperature sensor 131 on the mounting portion 113, thereby increasing the speed of heat conduction. At the same time, the inner layer 115 has a relatively bent body 115b and a bent section 115a, so that the body 115b and the bent section 115a cover the first heat-conducting section 143 and the second heat-conducting section 144, so that the inner layer 115 can protect the heat-conducting layer 14 and extend the service life of the heat-conducting layer 14.

[0073] In another specific embodiment, Figures 6 to 8 As shown, the heat conducting layer 14 may further include a second end 142 disposed opposite to the first end 141 , and the second end 142 extends to the bottom wall 112 .

[0074] In this embodiment, Figure 6 and Figure 7 As shown, the second end of the heat-conducting layer 14 can extend to the bottom wall 112, so that the bottom wall 112 and the side wall 111 both include the heat-conducting layer 14, so that the bottom wall 112 with a higher temperature during cooking has the heat-conducting layer 14, so that the heat of the bottom wall 112 can be quickly transferred to the heat-conducting layer 14 of the side wall 111, and then transferred to the temperature sensor, further improving the speed and accuracy of temperature measurement. The heat-conducting layer 14 is filled everywhere on the pot body 11, which can improve the uniformity of heating of the pot body 11 and improve the use effect of the pot body 11.

[0075] At the same time, in this embodiment, Figure 8 As shown, the first heat-conducting segment 143 of the heat-conducting layer is disposed on the mounting portion 113 , so that the first heat-conducting segment 143 of the heat-conducting layer is in contact with the temperature sensor, thereby reducing the heat loss of the heat-conducting layer.

[0076] The bottom wall 112 and the side wall 111 of the pot body 11 may both include an inner layer 115 and an outer layer 116 , the heat conductive layer 14 arranged on the side wall 111 is located between the inner layer 115 and the outer layer 116 , and the heat conductive layer 14 arranged on the bottom wall 112 is located between the inner layer 115 and the outer layer 116 .

[0077] In a specific embodiment, Figure 7 As shown, the thickness of the thermally conductive layer 14 may be smaller than the thickness of the inner layer 115 and the outer layer 116 .

[0078] In this embodiment, the thickness of the heat conductive layer 14 is made smaller, which can reduce the overall thickness of the side wall 111 and the bottom wall 112 of the pot body, reduce the overall weight of the pot body, make it easier for users to take and use, and reduce production costs.

[0079] In a specific embodiment, Figure 4 As shown, along the circumference of the cooking utensil 1, at least part of the side wall 111 is provided with a heat-conducting layer, that is, the heat-conducting layer is a sheet-like structure embedded in the side wall. The heat-conducting layer can completely cover the side wall along the circumference, or can also cover part of the side wall along the circumference.

[0080] In this embodiment, the heat-conducting layer is a sheet structure. Along the height direction X of the cooking utensil, the first end 141 is connected to the temperature sensor, and the second end 142 is close to the bottom wall of the pot body, so that the heat of the bottom wall can be quickly transferred to the temperature sensor through the heat-conducting layer, thereby improving the temperature measurement effect. In this embodiment, under the premise of meeting the use requirements, the heat-conducting layer is a sheet structure with a smaller area, which can reduce the difficulty of production and assembly and reduce costs.

[0081] In another specific embodiment, Figure 5 As shown, the cooking utensil may include a plurality of heat-conducting layers, and the plurality of heat-conducting layers are distributed at intervals along the circumference of the side wall, and the first ends 141 of the plurality of heat-conducting layers are connected and extend to contact the temperature sensor, and the plurality of second ends 142 are close to the bottom wall, thereby further improving the conduction of heat from the second end 142 to the bottom wall, thereby improving the conduction of heat from the heat-conducting layer to the bottom wall, and improving the accuracy of temperature measurement.

[0082] Among them, multiple heat-conducting layers can be evenly distributed, which can reduce the weight and volume differences at different positions of the side wall 111, improve the overall uniformity of the side wall 111, and facilitate the user to maintain the balance of the cooking utensil when holding the cooking utensil.

[0083] In the above embodiments, the heat-conducting layer 14 can be made of graphene. The graphene material has good thermal conductivity, which can improve the heat conduction speed of the heat-conducting layer 14, so that the heat on the bottom wall 112 and the side wall 111 is quickly transferred to the heat-conducting layer 14, and then quickly transferred to the temperature sensor 131 through the heat-conducting layer 14, thereby improving the accuracy of temperature measurement. In addition, the thermal resistance of the graphene material is relatively small, which can reduce the heat loss of the heat-conducting layer 14 during the heat conduction process and improve the accuracy of temperature measurement. In this embodiment, the graphene material also has good thermal stability, which can improve the safety of the use of the heat-conducting layer 14 in a high temperature environment, and also help to improve the working stability of the temperature sensor 131 abutting against the heat-conducting layer 14.

[0084] In this embodiment, the heat conducting layer 14 may be graphene heat conducting paper.

[0085] In a specific embodiment, Figure 8 As shown, along the height direction X of the cooking appliance, the top of the mounting portion 113 has a first mounting groove 113 a , the top of the handle 12 is provided with a second mounting groove 121 , and the temperature measuring component is installed in the first mounting groove 113 a and the second mounting groove 121 .

[0086] In this embodiment, along the height direction X of the cooking utensil, the top of the mounting portion 113 has a first mounting groove 113a, and the temperature sensor can be mounted in the first mounting groove 113a, thereby improving the connection reliability between the temperature sensor and the mounting portion 113. The first mounting groove 113a includes a first side wall 113b and a second side wall 113c, and along the height direction X of the cooking utensil, the height of the first side wall 113b is less than the height of the second side wall 113c, so that the bottom surface of the first heat-conducting section 143 of the heat-conducting layer can abut against the top surface of the first side wall 113b, providing a placement space for the first heat-conducting section 143, facilitating the abutment of the first end of the first heat-conducting section 143 with the temperature sensor, so that heat can be directly transferred from the heat-conducting layer to the temperature sensor.

[0087] At the same time, along the height direction X of the cooking utensil, a second mounting groove 121 is provided at the top of the handle 12, so that other components in the temperature measuring assembly are mounted in the second mounting groove 121, which can improve the connection reliability between other components in the temperature measuring assembly and the handle 12. In this embodiment, the temperature sensor and other components in the temperature measuring assembly are mounted on the top of the handle 12, so that the temperature measuring assembly can be prevented from directly contacting with an open flame during the heating process of the cooking utensil, thereby improving the safety of the temperature measuring assembly and extending the service life of the temperature measuring assembly.

[0088] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A cooking utensil, It is characterized in that The cooking device (1) comprises: A pot body (11), the pot body (11) comprising a side wall (111) and a bottom wall (112), the side wall (111) being provided with a mounting portion (113); A handle (12), wherein the handle (12) is mounted on the mounting portion (113); A temperature measuring component (13), the temperature measuring component (13) comprising a temperature sensor (131), the temperature sensor (131) being mounted on the mounting portion (113) or the handle (12); The cooking utensil further comprises a heat-conducting layer (14), wherein the heat-conducting layer (14) is arranged on the side wall (111), and the heat-conducting layer (14) has a first end (141), and the first end (141) abuts against the temperature sensor (131).

2. The cooking device according to claim 1, It is characterized in that The first end (141) extends to the mounting portion (113), and the heat-conducting layer (14) further comprises a second end (142) arranged opposite to the first end (141), and a preset distance is provided between the second end (142) and the bottom wall (112).

3. The cooking device according to claim 2, It is characterized in that The projected length of the heat-conducting layer (14) along the height direction of the cooking utensil (1) is L1, the depth of the pot body (11) is L2, and the ratio of L1 / L2 satisfies 0.8≤L1 / L2≤1.

4. The cooking device according to claim 1, It is characterized in that The heat-conducting layer (14) further comprises a second end (142) arranged opposite to the first end (141), and the second end (142) extends to the bottom wall (112).

5. The cooking device according to claim 1, It is characterized in that Along the thickness direction of the pot body (11), the pot body (11) further comprises an inner layer (115) and an outer layer (116), and the heat conductive layer (14) is located between the inner layer (115) and the outer layer (116).

6. The cooking device according to claim 5, It is characterized in that The thickness of the heat-conducting layer (14) is smaller than the thickness of the inner layer (115), and the thickness of the heat-conducting layer (14) is smaller than the thickness of the outer layer (116).

7. The cooking device according to claim 5, It is characterized in that The heat-conducting layer (14) comprises a first heat-conducting section (143) and a second heat-conducting section (144) which are bent relative to each other, the end of the first heat-conducting section (143) which is away from the second heat-conducting section (144) is the first end (141), and the inner layer (115) comprises a body (115b) and a bent section (115a) which are bent relative to each other; The second heat-conducting section (144) is located between the body (115b) and the outer layer (116), the first heat-conducting section (143) is located between the bending section (115a) and the mounting portion (113), and the bending section (115a) covers the first heat-conducting section (143).

8. The cooking device according to any one of claims 1 to 7, It is characterized in that The heat conducting layer (14) is made of graphene.

9. The cooking device according to any one of claims 1 to 7, It is characterized in that Along the circumference of the cooking appliance (1), at least a portion of the side wall (111) is provided with the heat conductive layer (14).

10. The cooking device according to any one of claims 1 to 7, It is characterized in that Along the height direction of the cooking utensil (1), the top of the mounting portion (113) is provided with a first mounting groove (113a), the top of the handle (12) is provided with a second mounting groove (121), and the temperature measuring component (13) is installed in the first mounting groove (113a) and the second mounting groove (121).

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