Ultrasonic impregnator suitable for gluing large-size quartz wafer

Abstract

An ultrasonic impregnator suitable for large-size quartz wafer gluing comprises a machine body, a control system and a hot water circulation system, the hot water circulation system comprises a water tank arranged on the machine body, the top of the water tank is a sunken concave wax liquid pool, a wafer tray is arranged in the concave wax liquid pool, and the wafer tray is arranged on the water tank. And an ultrasonic vibration plate is arranged on the outer side of the water tank upper plate corresponding to the wafer tray. According to the utility model, the structure of the glue dipping machine for the quartz wafers is optimally designed, so that the glue dipping machine for the quartz wafers is more suitable for the glue dipping operation of the large-size quartz wafers, and the purposes of reducing defective wastes at corners and ensuring the excellent quality of the glued wafer group are achieved.

Description

Technical Field

[0001] The utility model relates to a quartz wafer gluing and dipping machine, in particular to an ultrasonic gluing and dipping machine suitable for large-sized quartz wafers. Background Art

[0002] With the development of science and technology, quartz resonators and oscillators are developing towards high fundamental frequency, miniaturization and strict requirements. The quartz crystal manufacturing industry has increasingly stringent requirements on the angle and flatness of wafers. During the processing of large-size quartz wafers (medium plate: 33×25.5mm), the wafer flatness is better and the angle change is smaller. However, after the wafer size increases from 13.4×12.7 to 33×25.5, the difficulty of dipping in glue during wafer gluing also increases. The dipping speed is slow and there are serious bubbles between the wafers after dipping. The generation of bubbles directly causes an increase in the proportion of defective corners in the subsequent cutting and grinding process. The temperature measurement indicators of quartz wafers processed with medium plates are significantly better than those of small-size wafers, but the defective corners caused by bubbles in gluing and dipping are around 10%, an increase of 7 percentage points year-on-year. Figure 2 The distribution of defective products in a single batch of SMD frequency chips processed in medium-sized plates, as well as the problem of defective edges and corners, need to be solved urgently. Utility Model Content

[0003] The utility model provides an ultrasonic glue dipping machine suitable for gluing large-sized quartz wafers, which aims to increase and loosen the gap between wafers of a wafer group through the optimized design of the glue dipping equipment, and quickly immerse wax liquid into the wafer group under the action of ultrasound, so as to ensure that there are no bubbles inside the wafer group after gluing.

[0004] To achieve the above purpose, the utility model adopts the following technical solutions:

[0005] The invention discloses an ultrasonic glue dipping machine for gluing large-sized quartz wafers, comprising a machine body, a control system and a hot water circulation system. The hot water circulation system comprises a water tank arranged on the machine body, the top of the water tank is a wax liquid pool which is sunken in a concave shape, a wafer tray is arranged in the concave wax liquid pool, an ultrasonic vibration plate is arranged on the outer side of an upper plate of the water tank corresponding to the wafer tray, the ultrasonic vibration plate is sealed and isolated from the hot water in the water tank, and ultrasonic vibrators are evenly distributed in the ultrasonic vibration plate; the control system comprises a control unit, the control unit is electrically connected to the ultrasonic vibrator, and the ultrasonic working frequency is 40KHZ.

[0006] The above-mentioned ultrasonic gluing machine is suitable for large-sized quartz wafers. The hot water circulation system also includes a water storage container. The water outlet of the water storage container is connected to the circulating water pump, the water inlet pipe, and the water tank in sequence; the return pipe of the water storage container is connected to the water tank through the overflow port on the water tank.

[0007] The above-mentioned ultrasonic gluing machine is suitable for large-sized quartz wafers. Two-stage limit float switches are also arranged on the water tank, namely float switch A and float switch B. The position of float switch A is lower than that of float switch B. The float switch A controls the lower limit of the water level in the water tank to ensure that the water level is not lower than the wax liquid level in the wax liquid pool and keep the wax liquid temperature constant; the float switch B controls the upper limit of the water level in the water tank. When the upper limit of the water level reaches the position of the float switch B, hot water flows out from the overflow port to keep the water level constant; the float switch A and the float switch B are electrically connected to the control unit; when the water level in the water tank is lower than the wax liquid level in the wax liquid pool, the control unit issues an instruction for the circulation water pump to work; when the water level in the water tank reaches the position of the float switch B, the control unit stops the circulation water pump.

[0008] The above-mentioned ultrasonic gluing machine for quartz wafers of large size is suitable for a lifting mechanism of the wafer tray on the machine body, the lifting mechanism includes a motor and a slider device, the slider device includes a vertical shaft and a slider that cooperate with each other in transmission, the vertical shaft is connected to the motor shaft, and the slider is fixedly connected to the wafer tray bracket.

[0009] The above ultrasonic gluing machine is suitable for large-sized quartz wafers, and the transmission relationship of the slider device is a spiral transmission or a gear rack transmission.

[0010] The ultrasonic gluing machine is suitable for gluing large-sized quartz wafers, and the motor is a stepping motor.

[0011] The utility model discloses a large-size quartz wafer gluing and dipping machine, which is particularly suitable for the gluing operation of large-size quartz wafers. As it adopts an ultrasonic water bath to increase the heating and temperature control functions, the water bath temperature is ensured to be stably controlled at 100°C, and the wax liquid in the dipping tray can be fully melted. The cavitation vibration effect of the ultrasound is used to drive the chip group in the dipping tray to also generate corresponding vibrations, so that the chip gap of the chip group is increased and loosened. The wax liquid quickly immerses into the chip group under the action of ultrasound, so that the bubbles between the chips can be fully discharged while dipping. The wax liquid fully fills the chip group gap, ensuring that there are no bubbles inside the chip group after gluing, improving the bonding quality and strength of the glued chips, reducing the generation of gluing bubbles, avoiding the subsequent cutting and grinding processes from producing batches of defective corner products, and improving the processing yield of SMD frequency chips in the medium-plate process. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of a large-size quartz wafer gluing and dipping machine;

[0013] Figure 2 This is the distribution diagram of defective SMD frequency chips processed in the middle plate;

[0014] The list of reference numbers in the figure is:

[0015] Machine body 1, water tank 2, wax liquid pool 3, chip tray 4, chip set 4-1, ultrasonic plate 5, ultrasonic vibrator 6, control unit 7, water storage container 8, circulating water pump 9, water inlet pipe 10, return pipe 11, overflow port 12, bracket 13, slider 14, vertical axis 15, motor 16, float switch A 17, float switch B 18, heater 19. DETAILED DESCRIPTION

[0016] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.

[0017] Referring to Figure 1, the utility model provides an ultrasonic gluing machine suitable for large-sized quartz wafers, including a body 1, a control system, and a hot water circulation system. The hot water circulation system includes a water tank 2 arranged on the body 1, and the top of the water tank 2 is a sunken "concave" wax liquid pool 3, in which a wafer tray 4 is arranged, and an ultrasonic vibration plate 5 is arranged on the outer side of the upper plate of the water tank 2 corresponding to the wafer tray 4. The ultrasonic vibration plate 5 is sealed and isolated from the hot water in the water tank 2, and ultrasonic vibrators 6 are evenly distributed in the ultrasonic vibration plate 5; the control system includes a control unit 7, and the control unit 7 is electrically connected to the ultrasonic vibrator 6, and the ultrasonic working frequency is 40KHZ. The hot water circulation system includes a water storage container 8, the outlet water of the water storage container 8 is connected to the circulating water pump 9, under the action of the circulating water pump 9, the hot water enters the water tank 2 through the water inlet pipe 10; when the liquid level of the hot water reaches the float switch A17 at a lower position, a signal is sent to the control unit 7, and the control unit 7 sends a working instruction to the circulating water pump 9, that is, to inject water into the water tank 2 to maintain the liquid level, so that the temperature of the "concave" type wax liquid pool 3 remains stable; when the liquid level of the hot water reaches the float switch A18 at an upper position, a signal is sent to the control unit 7, and the control unit 7 sends a stop instruction to the circulating water pump 9, and the hot water flows out from the overflow port 12 and flows back to the water storage container 8 through the return pipe 11, so as to keep the hot water relatively stable. In normal working state, the liquid level of the hot water is automatically adjusted through the overflow port 12. The temperature of the hot water is also controlled by the control unit 7 to control the on and off of the heater 19, and the hot water heater 19 is arranged below the water storage container.

[0018] The machine body 1 is provided with a lifting mechanism of the wafer tray 4, the lifting mechanism includes a motor 16 and a slider device, the slider device includes a vertical shaft 15 and a slider 14 that are mutually transmission-coordinated, the vertical shaft 15 is connected to the output shaft of the motor 16, and the slider 14 is fixedly connected to the bracket 13 of the wafer tray. When the wafer group 4-1 workpiece to be glued is placed on the wafer tray 4, the lifting mechanism of the wafer tray 4 is used to lift it out of the wax liquid, and after it is placed securely, the wafer tray 4 and the wafer group 4-1 are sunk into the wax liquid together, so that the wafer group 4-1 is completely immersed in the wax liquid. The control unit 7 is used to make the ultrasonic vibrator 6 in the ultrasonic plate 5 enter the working state, and the ultrasonic working frequency is 40KHZ. The gap between the wafers of the wafer group 4-1 is increased and loosened, and the wax liquid quickly immerses into the wafer group 4-1 under the action of ultrasound, so as to achieve the purpose of ensuring that there are no bubbles inside the wafer group 4-1 after gluing.

[0019] The transmission relationship of the slider device is spiral transmission or gear rack transmission, and can also be other transmission methods. The motor 16 adopts a stepping motor, which can accurately adjust the position of the chip tray 4 so that the chip group 4-1 is always in an ideal immersion position.

Claims

1. An ultrasonic glue dipping machine suitable for gluing large-sized quartz wafers, characterized by: The invention comprises a machine body, a control system and a hot water circulation system. The hot water circulation system comprises a water tank arranged on the machine body. The top of the water tank is a sunken "concave" wax liquid pool. A wafer tray is arranged in the "concave" wax liquid pool. An ultrasonic vibration plate is arranged on the outer side of the upper plate of the water tank corresponding to the wafer tray. The ultrasonic vibration plate is sealed and isolated from the hot water in the water tank. Ultrasonic vibrators are evenly distributed in the ultrasonic vibration plate. The control system comprises a control unit. The control unit is electrically connected to the ultrasonic vibrator. The ultrasonic working frequency is 40KHZ.

2. The ultrasonic gluing machine for large-sized quartz wafers according to claim 1 is characterized in that: The hot water circulation system also includes a water storage container, the water outlet of the water storage container is sequentially connected to a circulating water pump, a water inlet pipe, and a water tank; the return water pipe of the water storage container is connected to the water tank through an overflow port on the water tank.

3. The ultrasonic gluing machine for large-sized quartz wafers according to claim 1 or 2, characterized in that: The water tank is also provided with two-stage limit float switches, namely float switch A and float switch B. The position of float switch A is lower than that of float switch B. The float switch A controls the lower limit of the water level in the water tank to ensure that the water level is not lower than the wax liquid level in the wax liquid pool and keep the wax liquid temperature constant; the float switch B controls the upper limit of the water level in the water tank. When the upper limit of the water level reaches the position of the float switch B, hot water flows out from the overflow port to keep the water level constant; the float switch A and the float switch B are electrically connected to the control unit; when the water level in the water tank is lower than the wax liquid level in the wax liquid pool, the control unit issues an instruction for the circulation water pump to work; when the water level in the water tank reaches the position of the float switch B, the control unit stops the circulation water pump from working.

4. The ultrasonic glue dipping machine for gluing large-sized quartz wafers according to claim 1 is characterized in that: A lifting mechanism for a wafer tray is arranged on the machine body, and the lifting mechanism comprises a motor and a slider device, and the slider device comprises a vertical shaft and a slider which are mutually transmission-matched, the vertical shaft is connected to the motor shaft, and the slider is fixedly connected to the wafer tray bracket.

5. The ultrasonic glue dipping machine for gluing large-sized quartz wafers according to claim 4 is characterized in that: The transmission relationship of the slider device is a spiral transmission or a gear rack transmission.

6. The ultrasonic gluing machine for large-sized quartz wafers according to claim 4 is characterized in that: The motor is a stepping motor.

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