Chip packaging dispensing mechanism
By introducing fixing bolts, limit blocks and hot air fans into the chip packaging dispensing mechanism, the problems of chip offset and glue solidification time are solved, and higher accuracy and production efficiency are achieved.
Patent Information
- Application Number
- CN202323653660.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-30
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2033-12-30
AI Technical Summary
The existing chip packaging dispensing mechanism lacks a fixed mechanism, which may deviate during the dispensing process, resulting in the wrong dispensing position, and the glue solidifies too long, which may lead to damage such as dust, affecting the protection effect of components. .
A dispensing mechanism including base, fixing bolts, strip grooves and limit blocks is designed to achieve precise movement of the dispensing head through the No. 1 linear motor, the ring guide, the No. 2 linear motor and the top guide, and to achieve the precise movement of the dispensing head through electric telescopic retraction. The cylinder, clamp and fixing bolts fix the chip, and use the hot air fan and ventilation holes to accelerate the solidification of the glue.
Improves the stability and accuracy of dispensing, prevents chip offset, shortens the glue solidification time, and improves the production efficiency and quality of chip packaging.
Smart Images
Figure CN222152642U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip production equipment, and specifically to a chip packaging dispensing mechanism. Background Art
[0002] Glue dispensing can firmly fix the chip on the circuit board. When the chip is working, it will generate a certain amount of heat. Effective heat dissipation can prevent the chip from overheating and causing performance problems or damage. Glue dispensing can help form a good contact between the chip and the PCB and improve the heat dissipation efficiency. Another important function is to protect the electronic board and some important electronic components from moisture, humidity, shock, etc., thereby better protecting these sensitive components.
[0003] Application No. 202321078692.2 discloses a chip packaging dispensing mechanism, including a base, side panels, guide rails, pillars, cross bars, electric push rods, through grooves, rotating shafts, fixed rings, clicks, feed bins, feed pipes and discharge pipes, etc. When using this device for chip packaging dispensing operations, the device is placed in a suitable position, and then the chip is fixed on the top of the base, and the position of the dispensing needle is adjusted by the longitudinal linear motor and the transverse linear motor. At the same time, the dispensing angle is adjusted by the rotation of the stepper motor, and the glue is placed in the feed bin through the feed pipe. The electric control valve is opened to guide the glue in the feed bin through the discharge pipe to the dispensing needle, and the dispensing operation is completed by the dispensing needle. When the chip is packaged, the chip electronic components are dispensed at different angles, and the dispensing process is controlled by automated equipment, thereby improving the efficiency of chip packaging dispensing and the quality of chip dispensing packaging.
[0004] However, in use, there are the following defects:
[0005] Since the device lacks a fixed mechanism, the chip may shift during the dispensing process, resulting in an error in the dispensing position. In addition, since the glue cannot solidify immediately after dispensing, dust may stick to it, causing damage to components and affecting the practicality of the device. Utility Model Content
[0006] The purpose of the present application is to provide a chip packaging dispensing mechanism, which solves the problem raised in the background technology that the chip may shift during the dispensing process due to the lack of a fixed mechanism in the device, resulting in an error in the dispensing position, and because the glue cannot solidify immediately after dispensing, it may cause dust to stick to it, causing damage to components and affecting the practicability of the device.
[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a chip packaging dispensing mechanism, comprising a base, a fixing bolt, a strip groove and a limit block, the outer side wall of the base is fixedly installed with an annular guide rail, the top of the annular guide rail is slidably connected to a No. 1 linear motor, the top of the No. 1 linear motor is fixedly installed with a telescopic motor, the top of the telescopic motor is fixedly connected to an electric telescopic cylinder, the top of the electric telescopic cylinder side wall is fixedly connected with a top plate, the top of the top plate is fixedly installed with a top guide rail, the top of the top guide rail is laterally slidably connected to a No. 2 linear motor, and the No. 2 linear motor is fixedly installed with a top plate. A sliding clamp is fixedly connected to the lower side wall of the machine, a conveying pipe is fixedly installed at the bottom of the sliding clamp, a rubber head is fixedly connected to the bottom of the conveying pipe, support rods are fixedly connected to both sides of the top of the base, a placement plate is fixedly connected to the top of the support rod, a strip groove is provided on the top of the placement plate, a clamp is fixedly connected to the side wall of the limit block, a fixing bolt is movably connected to the top of the limit block, the limit block is horizontally slidably connected to the placement plate through the strip groove, a number of ventilation holes are evenly provided on the top of the placement plate, and a hot air blower is fixedly installed on the top of the base below the placement plate.
[0008] In this technical solution, glue can be dispensed at any position on the placement plate through the No. 1 linear motor, the annular guide rail, the No. 2 linear motor and the top guide rail. The top plate rotates under the drive of the No. 1 linear motor, and the glue dispensing head slides horizontally under the drive of the No. 2 linear motor to move to the position where glue dispensing is required. The glue dispensing head is moved close to the glue dispensing position by the descent of the electric telescopic cylinder for glue dispensing. Chips of different sizes can be fixed through the strip grooves, splints, limit blocks and fixing bolts. The chip is placed on the placement plate, and the sliding limit block allows the splint to clamp the edge of the chip and is fixed by the fixing bolts, thereby increasing stability during glue dispensing and preventing the chip from shifting and causing the glue dispensing position to be wrong, thereby improving the precision performance of the device. At the same time, the glue can be quickly solidified through the ventilation holes and the hot air blower. The hot air blower blows out hot air with a low wind speed, and blows the chips on the placement plate through the ventilation holes. Driven by the airflow, the glue will quickly solidify, thereby reducing waiting time and improving chip production efficiency.
[0009] As an optional solution of the technical solution of the present application, a glue inlet is fixedly connected to the side wall of the delivery pipe.
[0010] As an optional solution of the technical solution of the present application, the rear end of the transmission shaft of the telescopic motor is fixedly connected to the electric telescopic cylinder.
[0011] Compared with the prior art, the present invention has the following beneficial effects:
[0012] 1. The present application can fix chips of different sizes and sizes through strip grooves, splints, limit blocks and fixing bolts. The limit blocks enable the splints to clamp the edges of the chips and are fixed by fixing bolts, thereby increasing stability during dispensing, preventing the chip from shifting and causing incorrect dispensing positions, and improving the precision performance of the device.
[0013] 2. The present application uses ventilation holes and a hot air blower to quickly solidify the glue. The hot air blower blows out hot air with a low wind speed to blow air to the chips placed on the board through the ventilation holes. Driven by the airflow, the glue will quickly solidify, thereby reducing waiting time and improving chip production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is the overall structure diagram of the chip packaging dispensing mechanism;
[0015] Figure 2 It is a three-dimensional structural diagram of the dispensing head of the chip packaging dispensing mechanism;
[0016] Figure 3 This is a top view of the chip packaging dispensing mechanism.
[0017] Among them, 1. Base; 2. Annular guide rail; 3. No. 1 linear motor; 4. Telescopic motor; 5. Electric telescopic cylinder; 6. Top plate; 7. Top guide rail; 8. No. 2 linear motor; 9. Sliding clamp; 10. Delivery pipe; 11. Glue dispensing head; 12. Glue inlet; 13. Support rod; 14. Placement plate; 141. Ventilation hole; 15. Hot air blower; 16. Clamp; 17. Limit block; 18. Fixing bolt; 19. Strip groove. DETAILED DESCRIPTION
[0018] In order to make the technical means, creative features, objectives and effects of the utility model easier to understand, they are further explained below in conjunction with specific implementation methods.
[0019] like Figure 1 As shown, a chip packaging dispensing mechanism includes a base 1, a fixing bolt 18, a strip groove 19 and a limit block 17, an annular guide rail 2 is fixedly installed on the outer wall of the base 1, a No. 1 linear motor 3 is slidably connected to the top of the annular guide rail 2, a telescopic motor 4 is fixedly installed on the top of the No. 1 linear motor 3, an electric telescopic cylinder 5 is fixedly connected to the top of the telescopic motor 4, the tail end of the transmission shaft of the telescopic motor 4 is fixedly connected to the electric telescopic cylinder 5, a top plate 6 is fixedly connected to the top of the side wall of the electric telescopic cylinder 5, a top guide rail 7 is fixedly installed on the top of the top plate 6, a No. 2 linear motor 8 is slidably connected to the top of the top guide rail 7, a sliding clamp 9 is fixedly connected to the lower side wall of the No. 2 linear motor 8, and the sliding clamp 9 slides laterally on the side wall of the top plate 6 driven by the No. 2 linear motor 8.
[0020] like Figure 1As shown, a hot air blower 15 is fixedly installed on the top of the base 1 below the placement plate 14, and the hot air blower 15 blows hot air with a relatively low wind speed upwards.
[0021] like Figure 1 As shown, the side wall of the limit block 17 is fixedly connected with a clamping plate 16, and the top of the limit block 17 is movably connected with a fixing bolt 18, through which the limit block 17 can be fixed.
[0022] like Figure 2 As shown, a delivery pipe 10 is fixedly installed at the bottom of the sliding clamp 9, a glue dispensing head 11 is fixedly connected to the bottom of the delivery pipe 10, and a glue inlet 12 is fixedly connected to the side wall of the delivery pipe 10, through which glue is provided.
[0023] like Figure 3 As shown, support rods 13 are fixedly connected to both sides of the top of the base 1, and a placement plate 14 is fixedly connected to the top of the support rods 13. A plurality of ventilation holes 141 are evenly opened on the top of the placement plate 14, and a strip groove 19 is opened on the top of the placement plate 14. The limit block 17 is horizontally slidably connected to the placement plate 14 through the strip groove 19, and the ventilation holes 141 allow hot air to pass through the placement plate 14.
[0024] In actual use, through the No. 1 linear motor 3, the annular guide rail 2, the No. 2 linear motor 8 and the top guide rail 7, glue can be dispensed at any position on the placement plate 14. The top plate 6 is rotated by the No. 1 linear motor 3, and the glue dispensing head 11 slides horizontally under the drive of the No. 2 linear motor 8, and can be moved to the position where glue is required. The glue dispensing head 11 is moved close to the glue dispensing position by the descent of the electric telescopic cylinder 5, and the chips of different sizes can be fixed by the strip groove 19, the clamping plate 16, the limit block 17 and the fixing bolt 18. The chip is placed on the placement plate 14, and the sliding limit block 17 allows the clamping plate 16 to clamp the edge of the chip and is fixed by the fixing bolt 18, thereby increasing stability during glue dispensing and preventing the chip from shifting and causing the glue dispensing position to be incorrect, thereby improving the precision performance of the device. At the same time, the glue can be quickly solidified through the ventilation holes 141 and the hot air blower 15. The hot air blower 15 blows out hot air with a relatively low wind speed, and blows the chip on the placement plate 14 through the ventilation holes 141. Driven by the airflow, the glue will quickly solidify, reducing the waiting time and improving the production efficiency of the chip.
Claims
1. A chip packaging dispensing mechanism, comprising a base (1), a fixing bolt (18), a strip groove (19) and a limit block (17), characterized in that: The outer wall of the base (1) is fixedly mounted with an annular guide rail (2), the top of the annular guide rail (2) is slidably connected to a No. 1 linear motor (3), the top of the No. 1 linear motor (3) is fixedly mounted with a telescopic motor (4), the top of the telescopic motor (4) is fixedly connected to an electric telescopic cylinder (5), the top of the side wall of the electric telescopic cylinder (5) is fixedly connected with a top plate (6), the top of the top plate (6) is fixedly mounted with a top guide rail (7), the top of the top guide rail (7) is laterally slidably connected to a No. 2 linear motor (8), the lower side wall of the No. 2 linear motor (8) is fixedly connected with a sliding clamp (9), the bottom of the sliding clamp (9) is fixedly mounted with a conveying pipe (10), the conveying The bottom of the tube (10) is fixedly connected to a dispensing head (11), the top sides of the base (1) are fixedly connected to support rods (13), the top of the support rods (13) is fixedly connected to a placement plate (14), the top of the placement plate (14) is provided with a strip groove (19), the side wall of the limit block (17) is fixedly connected to a clamping plate (16), the top of the limit block (17) is movably connected to a fixing bolt (18), the limit block (17) is horizontally slidably connected to the placement plate (14) through the strip groove (19), the top of the placement plate (14) is evenly provided with a plurality of ventilation holes (141), and a hot air blower (15) is fixedly installed on the top of the base (1) below the placement plate (14).
2. A chip packaging dispensing mechanism according to claim 1, characterized in that: The side wall of the delivery pipe (10) is fixedly connected with a glue inlet (12).
3. The chip packaging dispensing mechanism according to claim 1, characterized in that: The rear end of the transmission shaft of the telescopic motor (4) is fixedly connected to the electric telescopic cylinder (5).