Multilayer strip-shaped sieve mechanism after chip electroplating

Abstract

The utility model relates to the technical field of electronic component screening, and provides a multi-layer strip-shaped screen mechanism for electroplated chips, which comprises a rack, a screening receiving hopper, a screening supporting plate, a screening linear vibrator, a screening support, a first layer of strip-shaped chip bonding screen, a second layer of round hole screen, a screening non-defective product supporting plate, a defective product guiding plate and a fragment supporting plate, the screening support is connected with the machine frame through the screening linear vibrator, a discharging port of the screening receiving hopper is located above the first layer of strip-shaped bonding piece screen cloth, the first layer of strip-shaped bonding piece screen cloth is located above the second layer of round hole screen cloth, the good product screening supporting plate is located below the second layer of round hole screen cloth, and the good product screening supporting plate is provided with a third layer of fragment screen cloth. The chip screening device has the advantages that electroplated chips sequentially fall on the first layer of strip-shaped chip bonding screen, the second layer of round hole screen and the third layer of chip breaking screen, are screened in batches through the vibration effect, are used for screening bonding chips in chip products, and are matched to finish rapid screening of chips with qualified sizes.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component screening, in particular to a multi-layer bar screen mechanism after chip electroplating. Background Art

[0002] Wafer is the mother body for manufacturing chips. It is a group of chips made of silicon wafers to form a large-area semiconductor integrated block. Chip electroplating is to electroplate conductive materials on the chip substrate, such as the chip lead pins, which are used to connect with the external circuit board and the transistor inside the chip; for example, to construct resistors, capacitors and other structures on the chip; electroplating plays an important role in chip manufacturing. A large number of steel balls are used in the electroplating process. Steel balls play a conductive role, so steel balls are one of the indispensable materials in the electroplating process. During electroplating, the steel balls and chips are mixed together and put into the plating barrel to achieve a uniform electroplating effect; after the electroplating is completed, the steel balls are separated from the chips.

[0003] At present, the steel balls and the electroplated chip products are mainly separated by the vibration of the screen. The mixture of chips and steel balls falls on the screen. As the screen vibrates, the chips remain on the screen, and the steel balls pass through the mesh of the screen, thus separating the steel balls from the chips. However, the chips left on the screen will cover the mesh of the screen. As the chips accumulate, some steel balls will remain on the screen, reducing the separation speed of the steel balls and the separation efficiency. If you choose to increase the vibration of the screen, the chips will jump off the screen and speed up the separation of the steel balls, but this will intensify the collision between the chips and the steel balls, which is easy to damage the chips.

[0004] After the chips are separated from the steel balls, they need to be screened. When batches of chips are electroplated in a plating barrel, the degree of plating on the chips is difficult to be exactly the same, and the size of the chips after plating varies. During the electroplating process, some chip products will stick together, so it is necessary to quickly screen out chips of qualified size. However, manual chip size screening is slow.

[0005] The utility model patent document with announcement number CN211330201U discloses a disc-type steel ball wafer separation device; it includes a base and a feeding device arranged on the base, a discharge port is arranged on one side of the feeding device, and a dividing device is arranged below the discharge port; a primary separation disc is arranged on the base; a secondary separation disc is arranged directly below the primary separation disc; a primary vibration device is arranged on one side of the primary separation disc; a secondary vibration device is arranged on one side of the secondary separation disc. In this patent document, the steel ball wafer product mixture falls on the surface of the primary separation disc through the feeding device and the dividing device, and the primary separation disc has a screen. The vibrating screen allows the wafers to remain on the primary separation disc, and the steel balls fall from the screen and fall on the secondary separation disc. This patent document has the disadvantages that the crystals cover the mesh of the screen, reducing the steel ball separation speed and the steel ball separation efficiency; and this patent document does not record the technical solution for screening wafers with size differences.

[0006] Therefore, a screening machine is needed for chip electroplating to improve the efficiency of steel ball separation and quickly screen out chips of qualified size. How to provide a multi-layer bar screen mechanism for chip electroplating to screen out sticky chips in chip products and quickly screen out chips of qualified size is a technical problem that needs to be solved in this field. Utility Model Content

[0007] The technical problem to be solved by the utility model is to provide a multi-layer bar screen mechanism after chip electroplating.

[0008] The utility model is implemented as follows: a multi-layer bar screen mechanism after chip electroplating, comprising:

[0009] Frame, screening hopper, screening support plate, screening linear vibrator, screening support, first layer strip sticky screen, second layer round hole screen, screening good product pallet, bad product guide plate and debris pallet;

[0010] The screening support is connected to the frame through the screening linear vibrator, the first layer of strip sticky film screen, the second layer of round hole screen, the screening good product pallet, the defective product guide plate, and the debris pallet are all fixedly connected to the screening support, the screening hopper is connected to the frame through the screening support plate, the discharge port of the screening hopper is located above the first layer of strip sticky film screen, the first layer of strip sticky film screen is located above the second layer of round hole screen, the screening good product pallet is located below the second layer of round hole screen, the screening good product pallet has a third layer of debris screen, a blanking channel is provided between the discharge port of the first layer of strip sticky film screen and the screening support, the discharge port of the second layer of round hole screen is communicated with the blanking channel, the feed port of the defective product guide plate is located below the blanking channel and above the screening good product pallet, and the debris pallet is located below the third layer of debris screen.

[0011] Furthermore, it also includes: a defective product receiving box and a debris receiving box;

[0012] The defective product receiving box is fixedly connected to the frame and is also located below the discharge port of the defective product guiding plate. The debris receiving box is fixedly connected to the frame and is also located below the discharge port of the debris supporting plate.

[0013] Furthermore, the discharge port of the screening good product pallet extends out of the screening support.

[0014] Compared with the background technology, the utility model has the following advantages: the electroplated chips fall into the first layer of strip sticky chip screen, the second layer of round hole screen and the third layer of debris screen in sequence through the screening hopper, and the chips are screened in batches through vibration, and the long sticky chips and debris are screened out, and the chips of good size fall on the screening good product tray; the utility model is applied to the screening machine after chip electroplating, which is used to screen the sticky chips in the chip products, and cooperates to quickly screen out the chips of qualified size, thereby improving the screening efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.

[0016] Figure 1 It is a schematic structural stereogram of a screening machine after chip electroplating in an embodiment of the utility model.

[0017] Figure 2 It is a front plan view of the screening machine after chip electroplating in the embodiment of the utility model.

[0018] Figure 3 yes Figure 2 Top view of the .

[0019] Figure 4 yes Figure 2 Right view of .

[0020] Figure 5 It is a structural schematic diagram of a feeding device in an embodiment of the utility model.

[0021] Figure 6 It is a schematic diagram of the positions of the first triangular plate and the first linear vibrator in the embodiment of the utility model.

[0022] Figure 7 It is a schematic diagram of the separation of the steel ball and the chip on the first triangular plate in the embodiment of the utility model.

[0023] Figure 8 It is a schematic diagram of the positions of the second triangular plate and the second linear vibrator in the embodiment of the utility model.

[0024] Fig. 9 It is a structural schematic diagram of the chip bar screen mechanism in the embodiment of the utility model.

[0025] Fig.10 It is a schematic diagram of the positions of the first layer of strip-shaped sticky film screen, the second layer of round hole screen, the third layer of debris screen and the debris support plate on the screening support in the embodiment of the utility model.

[0026] Fig.11 It is a structural schematic diagram of the chip fine screening mechanism in the embodiment of the utility model.

[0027] Figure numerals: frame 1; feeding device 2; feeding funnel 21; feeding support plate 22; feeding linear vibrator 23; material guide plate 24; steel ball chip distribution device 3; first triangular plate 31; first material receiving area 311; first steel ball discharge outlet 312; first chip discharge outlet 313; steel ball auxiliary discharge outlet 314; first linear vibrator 32; first steel ball receiving box 33; second triangular plate 34; second material receiving area 341; second steel ball discharge outlet 342; second chip discharge outlet 343; second linear vibrator 35; second steel ball receiving box 36; steel ball receiving box 37; lifting handle 371; through hole 372; push-pull handle 373; transport cart 38; chip screening device 4; chip bar screen machine Structure 41; screening hopper 411; screening support plate 412; screening linear vibrator 413; screening support 414; material drop channel 4141; first layer strip sticky film screen 415; second layer round hole screen 416; screening good product support plate 417; third layer debris screen 4171; defective product guide plate 418; defective product receiving box 419; debris support plate 4110; debris receiving box 4111; chip fine screening mechanism 42; fine screening hopper 421; fine screening support 422; fine screening mesh plate 423; material drop plate 424; circular vibrator 425; qualified product receiving box 426; carrying handle 4261; material blocking plug plate 427; receiving box bracket 428; enclosure 4281; steel ball 5; chip 6. DETAILED DESCRIPTION

[0028] The embodiment of the utility model provides a multi-layer bar screen mechanism after chip electroplating, which overcomes the shortcoming of slow speed of manual chip size screening in the background technology; it realizes the technical effect of screening sticky chips in chip products, and quickly screening out chips of qualified size, thereby improving screening efficiency.

[0029] The overall idea of ​​the technical solution of the embodiment of the utility model is as follows:

[0030] The multi-layer strip screen mechanism has a first layer of strip sticky chip screen, a second layer of round hole screen and a third layer of debris screen; the first layer of strip sticky chip screen is used to screen and separate the long sticky chips in the chip products, the second layer of round hole screen is used to screen the sticky chips again and screen the long strip chips, and the third layer of debris screen is used to screen the debris in the chip products. Under the action of the linear vibrator, chips with poor size enter the defective product receiving box, the debris enters the debris receiving box, and the chips with good size are placed on the screening good product pallet.

[0031] The multi-layer bar screen mechanism of the utility model is applied to the screening machine after chip electroplating, and the screening machine after chip electroplating includes a feeding device, a steel ball chip dividing device and a chip screening device, and the chip screening device includes a chip bar screen mechanism and a chip fine screening mechanism. Here, the chip bar screen mechanism is the utility model.

[0032] The mixture of electroplated chips and steel balls is placed in the feeding funnel of the feeding device, and then falls on the guide plate. The vibration frequency of the guide plate is controlled by the feeding linear vibrator, thereby controlling the material outflow of the guide plate. The mixture of electroplated chips and steel balls gradually falls on the first triangular plate of the steel ball chip dividing device under the vibration of the linear vibrator.

[0033] The first triangular plate is tilted, and the steel balls automatically roll to the first steel ball discharge port due to their circular structure. The chips are square block structures and gradually move to the first chip discharge port during the vibration process to separate the steel balls and chips. When the first triangular plate stops vibrating, the steel balls roll to the first steel ball discharge port under the action of gravity due to their large mass. The chips are small in mass, and there is surface contact between the chips and the first triangular plate. With the support of static friction, the chips stop at the first triangular plate. The first triangular plate is for the first rough screening of steel balls, and the second triangular plate is for the second fine screening of steel balls.

[0034] The chips coming out of the steel ball chip dividing device fall into the chip bar screen mechanism and chip fine screening mechanism of the chip screening device in turn. The chips with good size are moved from the screening good product pallet to the fine screening receiving hopper of the chip fine screening mechanism. The fine screening mesh plate of the chip fine screening mechanism screens and separates the products with unqualified end sizes at both ends of the chip products under the action of the circular vibrator. After fine screening, the chip products with qualified size are collected in the qualified product receiving box.

[0035] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0036] See also Figures 1 to 11 , a preferred embodiment of the utility model.

[0037] A multi-layer bar screen mechanism after chip electroplating, comprising:

[0038] Frame, screening hopper 411, screening support plate 412, screening linear vibrator 413, screening support 414, first layer strip-shaped sticky film screen 415, second layer round hole screen 416, screening good product support plate 417, bad product guide plate 418 and debris support plate 4110;

[0039] The screening support 414 is connected to the frame via the screening linear vibrator 413; the first layer of strip-shaped sticky film screen 415, the second layer of round hole screen 416, the screening good product support plate 417, the bad product guide plate 418, and the debris support plate 4110 are all fixedly connected to the screening support 414; the screening hopper 411 is connected to the frame via the screening support plate 412; the discharge port of the screening hopper 411 is located above the first layer of strip-shaped sticky film screen 415; the first layer of strip-shaped sticky film screen 415 is located above the second layer of round hole screen 416; the screening The good product selection pallet 417 is located below the second layer of round hole screen 416, the good product screening pallet 417 has a third layer of debris screen 4171, a drop channel 4141 is provided between the discharge port of the first layer of strip adhesive screen 415 and the screening support 414, the discharge port of the second layer of round hole screen 416 is communicated with the drop channel 4141, the feed port of the defective product guide plate 418 is located below the drop channel 4141 and above the good product screening pallet 417, and the debris pallet 4110 is located below the third layer of debris screen 4171.

[0040] The electroplated chips pass through the screening hopper 411 and fall on the first layer of strip sticky chip screen 415, the second layer of round hole screen 416 and the third layer of debris screen 4171 in turn. Through the vibration effect, the chips are screened in batches, and the long sticky chips and fragments are screened out, and the chips of good size fall on the screening good product tray 417. The utility model is applied to the screening machine after chip electroplating, which is used to screen the sticky chips in the chip products, cooperate to complete the rapid screening of chips of qualified size, and improve the screening efficiency.

[0041] It also includes: a defective product receiving box 419 and a debris receiving box 4111;

[0042] The defective product receiving box 419 is fixedly connected to the frame and is also located below the discharge port of the defective product guide plate 418 . The debris receiving box 4111 is fixedly connected to the frame and is also located below the discharge port of the debris support plate 4110 .

[0043] The discharge port of the screening good product support plate 417 extends out of the screening support 414 .

[0044] The first layer of strip-shaped sticky chip screen 415 is used to screen and separate the long sticky chips in the chip products. The long sticky chips remain in the first layer of strip-shaped sticky chip screen 415, and then gradually move in the direction of the material drop channel 4141 during the vibration process and then fall into the defective product receiving box 419. The chips passing through the mesh of the first layer of strip-shaped sticky chip screen 415 fall on the second layer of round hole screen 416. The second layer of round hole screen 416 is used to screen the sticky chips again and screen the long strip-shaped chips. The chips with secondary sticky chips and chips with poor size remain in the second layer of round hole screen 416, and then gradually move in the direction of the material drop channel 4141 during the vibration process and then fall into the defective product receiving box 419. The chips passing through the mesh of the second layer of round hole screen 416 fall on the screening good product pallet 417.

[0045] Due to the friction between the steel balls and the chips during use, smaller fragments, particles, impurities, etc. will be generated. These fragments, particles, and impurities will fall onto the chip bar screen mechanism 41 along with the chips. Chips that meet the size requirements will remain on the screening good product tray 417. Smaller fragments will pass through the mesh of the fragment screen and fall onto the fragment tray 4110. Under the action of the screening linear vibrator 413, the fragments will gradually move to the discharge port of the fragment tray 4110 and then fall into the fragment receiving box 4111.

[0046] The mesh of the first layer of strip-shaped adhesive sheet screen 415 is larger than the mesh of the second layer of round hole screen 416, and the mesh of the second layer of round hole screen 416 is larger than the mesh of the third layer of debris screen 4171. The size and technical requirements of the screen shall be subject to actual production needs.

[0047] The first layer of strip-shaped sticky film screen 415 is a strip-shaped screen structure, and the second layer of round hole screen 416, the third layer of debris screen 4171 and the fine screen plate 423 are all round hole screen structures.

[0048] The following is a detailed description of the application of the utility model to a screening machine after chip electroplating.

[0049] A screening machine for chips after electroplating, comprising:

[0050] The frame 1, the feeding device 2, the steel ball chip dividing device 3 and the chip screening device 4; the chip screening device includes a chip bar screen mechanism 41 and a chip fine screening mechanism 42, the chip bar screen mechanism 41 is the utility model, and the description of the chip bar screen mechanism 41 is as mentioned above.

[0051] The feeding device 2 includes a feeding hopper 21, a feeding support plate 22, a feeding linear vibrator 23 and a material guide plate 24. The feeding hopper 21 is connected to the frame 1 through the feeding support plate 22, and the material guide plate 24 is connected to the frame 1 through the feeding linear vibrator 23. The discharge port of the feeding hopper 21 is located above the feed port of the material guide plate 24.

[0052] The steel ball chip distributing device 3 comprises a first triangular plate 31, a first linear vibrator 32 and a first steel ball receiving box 33. The first triangular plate 31 is connected to the frame 1 through the first linear vibrator 32. The three corner ends of the first triangular plate 31 are respectively a first material receiving area 311, a first steel ball discharge outlet 312 and a first chip discharge outlet 313. The first triangular plate 31 is tilted. The discharge outlet of the guide plate 24 is located above the first material receiving area 311. The first steel ball receiving box 33 is fixedly connected to the frame 1 and is also located below the first steel ball discharge outlet 312.

[0053] The steel ball chip distributing device 3 also includes a second triangular plate 34, a second linear vibrator 35 and a second steel ball receiving box 36. The second triangular plate 34 is connected to the frame 1 through the second linear vibrator 35. The three corner ends of the second triangular plate 34 are respectively a second material receiving area 341, a second steel ball discharge outlet 342 and a second chip discharge outlet 343. The second triangular plate 34 is tilted. The second material receiving area 341 is located below the first chip discharge outlet 313. The second steel ball receiving box 36 is fixedly connected to the frame 1 and is also located below the second steel ball discharge outlet 342.

[0054] The feed port of the screening hopper 411 is located below the second chip discharge port 343 .

[0055] The chip fine screening mechanism 42 includes a fine screening hopper 421, a fine screening support 422, a fine screening mesh plate 423, a discharge plate 424, a circular vibrator 425 and a qualified product receiving box 426. The fine screening support 422 is connected to the frame 1 through the circular vibrator 425. The fine screening hopper 421 and the discharge plate 424 are fixedly connected to the fine screening support 422. The fine screening mesh plate 423 is fixedly arranged inside the fine screening hopper 421. The feed port of the fine screening hopper 421 is located below the discharge port of the screening good product pallet 417. The feed port of the discharge plate 424 is located below the fine screening mesh plate 423. The discharge port of the discharge plate 424 is located above the qualified product receiving box 426. The qualified product receiving box 426 is fixedly connected to the frame 1.

[0056] The mixture of the electroplated chips 6 and the steel balls 5 falls from the feeding device 2 onto the triangular plate of the steel ball chip dividing device 3. Since the triangular plate is tilted, the steel balls 5 automatically roll to the steel ball discharge port due to their own circular structure. The chips 6 are square block structures and gradually move to the chip discharge port during the vibration of the linear vibrator, thereby improving the steel ball separation efficiency. The separated chips pass through the chip bar screen mechanism 41 and the chip fine screening mechanism 42 of the chip screening device 4 to quickly screen out chips of qualified size.

[0057] In the present embodiment, the guide plate 24 is adjustable horizontally or tilted. When the linear vibrator 23 for loading is not working, the mixture of the electroplated chips 6 and the steel balls 5 stays on the guide plate 24. When the linear vibrator 23 for loading is working, the mixture of the electroplated chips 6 and the steel balls 5 gradually moves to the discharge port of the guide plate 24 and then falls into the receiving area of ​​the first triangular plate 31. The outflow of material from the guide plate 24 is controlled by the vibration frequency.

[0058] The steel balls 5 falling into the mixture of the first triangular plate 31 are basically discharged outward from the first steel ball discharge port 312 , and a very small number of steel balls 5 fall into the second material receiving area 341 of the second triangular plate 34 with the chips 6 , and are then completely discharged from the second steel ball discharge port 342 .

[0059] The chips fall from the second chip discharge port into the screening hopper 411, pass through the first layer of strip sticky screen 415 and the second layer of round hole screen 416, and fall onto the screening good product tray 417. The chips with good size gradually move to the discharge port of the screening good product tray 417 during the vibration process, and finally fall into the fine screening hopper 421.

[0060] The fine screening plate 423 of the chip fine screening mechanism 42, under the action of the circular vibrator 425, screens out the chip products with unqualified end sizes at both ends, and the qualified products pass through the mesh holes of the fine screening plate 423 and then pass through the unloading plate 424 and fall into the qualified product receiving box 426.

[0061] The first material receiving area 311 is higher than the first steel ball discharge outlet 312 , and the first chip discharge outlet 313 is higher than the first material receiving area 311 . The beneficial effect of this technical solution is that it effectively prevents the steel ball 5 from rolling to the first chip discharge outlet 313 .

[0062] The second material receiving area 341 is higher than the second steel ball discharge port 342, and the second chip discharge port 343 is higher than the second material receiving area 341. The beneficial effect of this technical solution is that in the first triangular plate 31, sometimes the steel ball 5 is surrounded by multiple chips. In the process of the chip gradually moving, the chip carries the steel ball 5 to the first chip discharge port 313, and then falls to the second material receiving area 341 of the second triangular plate 34. At this time, the steel ball 5 and the chip are scattered, effectively separating the steel ball and the chip, and preventing the steel ball 5 from moving to the chip bar screen mechanism 41. The inclination of the first triangular plate 31 and the second triangular plate 34 can be adjusted.

[0063] A steel ball auxiliary discharge port 314 is provided on the lower side of the first triangular plate 31, and the steel ball auxiliary discharge port 314 is located between the first chip discharge port 313 and the first steel ball discharge port 312. The beneficial effect of this technical solution is that when there are too many steel balls to fall from the first steel ball discharge port 312 to the first steel ball receiving box 33 in time, the accumulated steel balls are discharged from the steel ball auxiliary discharge port 314 and then fall into the auxiliary steel ball receiving box.

[0064] The steel ball chip distributing device 3 also includes a steel ball receiving box 37, a transport cart 38 and a material guide pipe. The box cover of the steel ball receiving box 37 has a lifting handle 371 and a through hole 372. The outer wall of the box body of the steel ball receiving box 37 has a push-pull handle 373. The steel ball receiving box 37 is placed on the transport cart 38. The bottoms of the first steel ball receiving box 33 and the second steel ball receiving box 36 are connected to the upper end of the material guide pipe, and the lower end of the material guide pipe extends into the through hole 372. The beneficial effect of this technical solution is that the steel balls in the first steel ball receiving box 33 and the second steel ball receiving box 36 fall into the steel ball receiving box 37 through the material guide tube. After the screening work is completed, the material guide tube is taken out from the through hole 372, and the staff uses the push-pull handle 373 to move the steel ball receiving box 37 and the transport cart 38. After reaching the steel ball recovery area, the lifting handle 371 is used to open the box cover, and finally the steel balls are taken away, and the steel ball receiving box 37 and the transport cart 38 are moved to the position of the utility model.

[0065] The chip fine screening mechanism 42 also includes a material blocking plug plate 427 and a material receiving box bracket 428. The fine screening support 422 is provided with a guide groove, and the material blocking plug plate 427 is slidably connected to the guide groove. The material blocking plug plate 427 is also located below the fine screening mesh plate 423. The material receiving box bracket 428 is fixedly connected to the frame 1. The top of the material receiving box bracket 428 has a surrounding plate 4281, and the qualified product receiving box 426 is placed in the surrounding plate 4281. The outer wall of the qualified product receiving box 426 has a carrying handle 4261. The beneficial effect of this technical solution is that the chip fine screening mechanism 42 is provided with a material blocking plug plate 427. When the qualified product receiving box 426 is full of chips, the material blocking plug plate 427 is inserted to prevent the chips from falling into the qualified product receiving box 426, but the fine screening receiving hopper 421 can continue to receive chips. At this time, the qualified product receiving box 426 can be moved away and replaced with an empty qualified product receiving box 426, and then the material blocking plug plate 427 is pulled out, and the finely screened chips fall into the qualified product receiving box 426. There is no need to suspend the chip screening device 4 when replacing the qualified product receiving box 426, thereby improving efficiency.

[0066] The post-electroplating chip screening machine of this embodiment also includes a control system of the prior art, which is used to control the working states of the loading device 2, the steel ball chip dividing device 3 and the chip screening device 4, so as to orderly separate the steel balls and quickly screen out chips of qualified size.

[0067] The chip screening machine after electroplating of this embodiment is also suitable for separating chip multilayer ceramic capacitors (MLCC) from steel balls, and quickly screening out chip multilayer ceramic capacitors of qualified sizes.

[0068] The working method of the chip screening machine after electroplating in this embodiment is as follows:

[0069] (1) The electroplated chips and steel ball mixture are placed in the feeding hopper 21 of the feeding device 2, and then fall on the guide plate 24. The feeding linear vibrator 23 controls the vibration frequency of the guide plate 24, thereby controlling the material outflow of the guide plate 24. Under the action of vibration, the electroplated chips and steel ball mixture gradually fall on the first triangular plate 31 of the steel ball chip distribution device 3. When the feeding linear vibrator 23 stops working, the electroplated chips and steel ball mixture stops falling on the first triangular plate 31.

[0070] (2) The first triangular plate 31 is tilted, combined with Figure 7 The hollow arrow in the figure shows that the steel ball automatically rolls to the first steel ball discharge port 312 due to its own circular structure, and then Figure 7As shown in the solid arrow in the figure, the chip is a square block structure and gradually moves to the first chip discharge port 313 during the vibration of the linear vibrator to separate the steel balls and the chips; there is no situation where the chips cover the mesh holes of the screen, thereby preventing the steel balls from passing through the mesh holes and reducing the separation speed of the steel balls; when the first triangular plate 31 stops vibrating, the steel balls roll to the first steel ball discharge port 312 under the action of gravity due to their large mass, and the chips are in surface contact with the first triangular plate 31 due to their small mass, and the chip stops on the first triangular plate 31 under the support of static friction.

[0071] The steel balls falling into the mixture of the first triangular plate 31 are basically discharged from the first steel ball discharge port 312, and a small number of steel balls are carried by the chips to the first chip discharge port 313, and then fall into the receiving area of ​​the second triangular plate 34. Then, due to their own circular structure, the steel balls automatically roll to the second steel ball discharge port 342 and are completely discharged. After falling into the steel ball receiving box, the steel balls flow to the steel ball receiving box 37.

[0072] The chips on the second triangular plate 34 gradually move to the second chip discharge port 343 , and then fall into the screening hopper 411 of the chip screening device 4 .

[0073] (3) In the chip strip screen mechanism 41, under the action of the screening linear vibrator 413, the long sticky chips remain on the first layer of the strip sticky chip screen 415, gradually move and then fall into the defective product receiving box 419; the secondary sticky chips and chips with poor sizes remain on the second layer of the round hole screen 416, gradually move and then fall into the defective product receiving box 419; the chips with good sizes remain on the third layer of the debris screen 4171, gradually move to the discharge port of the screening good product tray 417, and then fall into the fine screening hopper 421; the debris in the chip product falls from the third layer of the debris screen 4171 to the debris tray 4110, and then gradually move and fall into the debris receiving box 4111.

[0074] (4) The fine screening mesh plate 423 of the chip fine screening mechanism 42 screens the chips again under the action of the circular vibrator 425, and screens out the chips with unqualified end sizes at both ends of the chip products, ensuring that the chips with qualified sizes enter the qualified product receiving box 426. When the qualified product receiving box 426 is full of chips, the material blocking plug plate 427 is inserted to prevent the chips from falling into the qualified product receiving box 426, but the fine screening hopper 421 can continue to receive chips. At this time, the qualified product receiving box 426 can be moved away and replaced with an empty qualified product receiving box 426, and then the material blocking plug plate 427 is pulled out, and the finely screened chips fall into the qualified product receiving box 426. There is no need to stop the chip screening device 4 when replacing the qualified product receiving box 426, thereby improving efficiency.

[0075] Although the specific implementation methods of the present invention are described above, those skilled in the art should understand that the specific embodiments described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A multi-layer bar screen mechanism after chip electroplating, characterized in that: include: Frame, screening hopper, screening support plate, screening linear vibrator, screening support, first layer strip sticky screen, second layer round hole screen, screening good product pallet, bad product guide plate and debris pallet; The screening support is connected to the frame through the screening linear vibrator, the first layer of strip sticky film screen, the second layer of round hole screen, the screening good product pallet, the defective product guide plate, and the debris pallet are all fixedly connected to the screening support, the screening hopper is connected to the frame through the screening support plate, the discharge port of the screening hopper is located above the first layer of strip sticky film screen, the first layer of strip sticky film screen is located above the second layer of round hole screen, the screening good product pallet is located below the second layer of round hole screen, the screening good product pallet has a third layer of debris screen, a blanking channel is provided between the discharge port of the first layer of strip sticky film screen and the screening support, the discharge port of the second layer of round hole screen is communicated with the blanking channel, the feed port of the defective product guide plate is located below the blanking channel and above the screening good product pallet, and the debris pallet is located below the third layer of debris screen.

2. The multi-layer bar screen mechanism after chip electroplating according to claim 1, characterized in that: Also includes: Defective product collection box and debris collection box; The defective product receiving box is fixedly connected to the frame and is also located below the discharge port of the defective product guiding plate. The debris receiving box is fixedly connected to the frame and is also located below the discharge port of the debris supporting plate.

3. The multi-layer bar screen mechanism after chip electroplating according to claim 1, characterized in that: The discharge port of the good product screening support plate extends out of the screening support.

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