Cleaning device

Abstract

The utility model provides a cleaning device, which is used for cleaning an electrostatic chuck, and comprises a cleaning chamber; the cleaning tank is located in the cleaning chamber; the grinding device comprises a plurality of grinders, and the grinders are arranged on the side wall and / or the bottom face of the cleaning tank and configured to stretch out and draw back relative to the side wall and / or the bottom face of the cleaning tank; and the bearing table is located above the bottom face of the cleaning tank and used for bearing the electrostatic chuck, and the bearing table is configured to move in the direction perpendicular to the bottom face of the cleaning tank. According to the cleaning device, surface attachments of the electrostatic chuck can be effectively removed, and the electrostatic chuck can rapidly enter and exit from the cleaning tank in the working process, so that rapid and efficient cleaning of the electrostatic chuck is achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a cleaning device. Background Art

[0002] During the dry etching process, the electrostatic chuck is inside the etching chamber, directly below the wafer and in direct contact with the wafer. Some of the process by-products produced during the etching process will adhere to the surface of the electrostatic chuck, thereby reducing the thermal conductivity and process electrical properties of the wafer, and even leading to the cessation of the etching process and a decrease in the wafer yield. It will also affect the adsorption and fixation, temperature control and heat diffusion, RF conduction and data sensing of the electrostatic chuck itself, affecting the service life of the electrostatic chuck and increasing the maintenance cost of the machine. Therefore, how to solve the problem of surface decontamination of the electrostatic chuck and ensure the cleaning effect has become a key issue that determines the service life of the electrostatic chuck and needs to be solved urgently. Utility Model Content

[0003] The technical problem to be solved by the present application is how to improve the cleaning effect of the attached matter on the surface of the electrostatic chuck.

[0004] To solve the above technical problems, the present application provides a cleaning device for cleaning an electrostatic suction cup, comprising: a cleaning chamber; a cleaning tank, wherein the cleaning tank is located in the cleaning chamber; a grinding device, wherein the grinding device comprises a plurality of grinders, wherein the plurality of grinders are respectively arranged on the side walls and / or the bottom surface of the cleaning tank, and are configured to be retracted relative to the side walls and / or the bottom surface of the cleaning tank; and a supporting platform, wherein the supporting platform is located above the bottom surface of the cleaning tank and is used to support the electrostatic suction cup, and the supporting platform is configured to move in a direction perpendicular to the bottom surface of the cleaning tank.

[0005] In some embodiments, the grinder includes a drive motor and a grinding part, the fixed end of the drive motor is connected to the side wall and / or bottom surface of the cleaning tank, the output shaft of the drive motor is connected to the grinding part, and the output shaft is configured to drive the grinding part to extend and retract relative to the side wall and / or bottom surface of the cleaning tank.

[0006] In some embodiments, the grinding device further comprises a plurality of water guns, wherein the plurality of water guns are respectively connected to the side walls and / or the bottom surface of the cleaning tank, and the plurality of grinders and the plurality of water guns are arranged at intervals.

[0007] In some embodiments, the support platform includes a lifting structure and a supporting structure, one end of the lifting structure is connected to the bottom surface of the cleaning tank, and the other end is connected to the supporting structure, and the supporting structure is used to support the electrostatic suction cup.

[0008] In some embodiments, a bubble generator is further included, wherein the bubble generator is located in the cleaning tank and connected to the side wall and / or the bottom surface of the cleaning tank.

[0009] In some embodiments, it also includes: a cleaning liquid supply device, which is connected to the cleaning chamber and is used to introduce a cleaning solution into the cleaning chamber; a cleaning liquid discharge device, which is arranged at the bottom of the cleaning chamber, one end of which is connected to the cleaning chamber, and the other end of which is connected to a waste liquid treatment system for discharging waste liquid.

[0010] In some embodiments, the cleaning liquid supply device includes: a first storage device, used to store a first solution, the first storage device is connected to the cleaning chamber through a first pipeline; a second storage device, used to store a second solution, the second storage device is connected to the cleaning chamber through a second pipeline; a first valve, the first valve is arranged on the first pipeline; a second valve, the second valve is arranged on the second pipeline; a first controller, the first controller is electrically connected to the first valve, and is used to control the first valve to open or close according to the liquid level of the first solution in the cleaning chamber; a second controller, the second controller is electrically connected to the second valve, and is used to control the second valve to open or close according to the liquid level of the second solution in the cleaning chamber.

[0011] In some embodiments, the cleaning liquid supply device also includes: a first liquid level alarm, which is arranged in a first installation cavity connected to the side wall of the cleaning chamber and electrically connected to the first controller, for detecting the liquid level of the first solution and transmitting the detection result to the first controller; a second liquid level alarm, which is arranged in a second installation cavity connected to the side wall of the cleaning chamber and electrically connected to the second controller, for detecting the liquid level of the second solution and transmitting the detection result to the second controller.

[0012] In some embodiments, the cleaning liquid discharge device includes: a third pipeline, the inlet end of the third pipeline is located at the bottom of the cleaning chamber and communicated with the cleaning chamber, the outlet end of the third pipeline is communicated with the waste liquid treatment system, and is used to discharge the first solution; a fourth pipeline, the inlet end of the fourth pipeline is located at the bottom of the cleaning chamber and communicated with the cleaning chamber, the outlet end of the fourth pipeline is communicated with the waste liquid treatment system, and is used to discharge the second solution; a third valve, the third valve is arranged at the inlet end of the third pipeline, and is electrically connected to the first controller; a fourth valve, the fourth valve is arranged at the inlet end of the fourth pipeline, and is electrically connected to the second controller.

[0013] In some embodiments, the waste liquid treatment system includes a first treatment system and a second treatment system, the outlet end of the third pipeline is connected to the first treatment system, and the outlet end of the fourth pipeline is connected to the second treatment system.

[0014] The beneficial effects of the cleaning device provided in this application include but are not limited to the following:

[0015] 1. During cleaning, multiple grinders are used to grind the electrostatic chuck. Mechanical grinding can effectively remove the attachments on the surface of the electrostatic chuck, and the corresponding grinding time can be set according to the surface working condition of the electrostatic chuck. It is efficient, convenient, safe and reliable. Compared with manual grinding, the use of multiple grinders to mechanically grind the electrostatic chuck can reduce the risk of damage to the surface of the electrostatic chuck and improve the grinding quality. Furthermore, multiple grinders work in conjunction with multiple ultrapure water guns, which can blow away the grinding materials generated during the grinding process to prevent them from depositing on the surface of the electrostatic chuck, thereby better controlling the grinding amount and improving the grinding quality.

[0016] 2. By setting up multiple load-bearing platforms in the cleaning tank, or setting up multiple support arms on the supporting structure of the load-bearing platform, multiple electrostatic suction cups can be cleaned simultaneously, thereby improving work efficiency. At the same time, the lifting load-bearing platform facilitates the electrostatic suction cup to quickly enter and exit the cleaning tank, which is easy to use.

[0017] 3. The structural method of arranging a cleaning tank in the cleaning chamber can ensure a constant solution concentration during the electrostatic chuck pickling process and improve the pickling quality.

[0018] 4. The combination of mechanical grinding and pickling can completely remove the attachments on the surface of the electrostatic chuck, while protecting the electrostatic chuck from damage, greatly improving the cleaning quality of the electrostatic chuck, and meeting the requirements of the process flow for the cleaning effect of the electrostatic chuck, enabling the electrostatic chuck to obtain better surface quality, thereby extending its service life and improving product quality in semiconductor production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The following figures describe in detail the exemplary embodiments disclosed in this application. The same reference numerals represent similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of this application. Other embodiments may also accomplish the inventive intent in this application. It should be understood that the drawings are not drawn to scale.

[0020] in:

[0021] Figure 1 This is a schematic diagram of the structure of a cleaning device according to an embodiment of the present application;

[0022] Figure 2 A schematic diagram of the cleaning tank and its internal components of the cleaning device according to an embodiment of the present application;

[0023] Figure 3This is a schematic diagram of the structure of a cleaning device with a cleaning liquid supply device and a cleaning liquid discharge device according to an embodiment of the present application. DETAILED DESCRIPTION

[0024] The following description provides specific application scenarios and requirements of the present application, with the purpose of enabling those skilled in the art to make and use the content in the present application. It will be apparent to those skilled in the art that various local modifications to the disclosed embodiments are apparent, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0025] With the continuous development of semiconductor technology, more and more special gases are used in wafer process, especially in the development of mature process and advanced process, which will lead to more toxic, harmful, flammable, explosive and corrosive process waste gas in the etching process, forming attachments on the surface of the electrostatic chuck. During the wafer processing, the attachments will reduce the thermal conductivity of the electrostatic chuck and affect the process indicators of the wafer. This puts forward higher technical requirements on how to improve the cleaning technology of the electrostatic chuck to become a mature process or even an advanced process development.

[0026] The present application provides a cleaning device for cleaning an electrostatic suction cup, comprising: a cleaning chamber; a cleaning tank, wherein the cleaning tank is located in the cleaning chamber; a grinding device, wherein the grinding device comprises a plurality of grinders, wherein the plurality of grinders are respectively arranged on the side walls and / or the bottom surface of the cleaning tank and are configured to be retracted relative to the side walls and / or the bottom surface of the cleaning tank; and a supporting platform, wherein the supporting platform is located above the bottom surface of the cleaning tank and is used to support the electrostatic suction cup, and the supporting platform is configured to move in a direction perpendicular to the bottom surface of the cleaning tank.

[0027] The cleaning device of the present application can effectively remove surface attachments of the electrostatic chuck and can enable the chuck to quickly enter and exit the cleaning tank during operation, thereby achieving rapid and efficient cleaning of the electrostatic chuck.

[0028] The automatic cleaning device provided in the present application will be described in detail below in conjunction with the embodiments and drawings.

[0029] refer to Figure 1The embodiment of the present application provides a cleaning device, including a cleaning chamber 1, a cleaning tank 2, a supporting platform 3 and a grinding device 4; the cleaning tank 2 is located in the cleaning chamber 1; the grinding device 4 includes a plurality of grinders 41, and the plurality of grinders 41 are respectively connected to the side walls and / or the bottom surface of the cleaning tank 2, and can be retracted relative to their mounting surfaces; the supporting platform 3 is located above the bottom surface of the cleaning tank 2, and the electrostatic suction cup 5 is placed on the supporting platform 3, and the supporting platform 3 can move in a direction perpendicular to the bottom surface of the cleaning tank 2 to drive the electrostatic suction cup 5 to enter and exit the cleaning tank 2.

[0030] The cleaning chamber 1 is the main structure of the cleaning device, which mainly provides a certain space layout for the overall structure and stores the cleaning liquid, and its internal structure includes but is not limited to cylindrical and square. An injection port and a discharge port are provided on the cavity wall of the cleaning chamber 1, which are used to inject the cleaning liquid and discharge the waste liquid respectively. The types of cleaning liquids include but are not limited to acidic liquids and pure liquids, such as hydrofluoric acid, hydrochloric acid, sulfuric acid or mixed acidic liquids, and pure liquids such as pure water, ultrapure water, etc. When the cleaning liquid uses a corrosive liquid such as acid, the cleaning chamber 1 is made of anti-corrosion material, such as fiberglass, stainless steel, etc., or the inner wall material of the cleaning chamber 1 is made of anti-corrosion material.

[0031] In some embodiments, the cleaning chamber 1 is provided with a plurality of injection ports, each of which is used to inject different types of cleaning liquids.

[0032] refer to Figure 2 The inner cavity of the cleaning tank 2 may be a square cavity, a cylindrical cavity, etc., and the size may be designed according to the number of cleanings of the electrostatic chuck 5 at one time. A support frame 21 is provided below the cleaning tank 2. The structure of the support frame 21 is not limited. In some embodiments, the support frame 21 includes a plurality of columns, and the two ends of the columns are respectively fixedly connected to the bottom surface of the cleaning chamber 1 and the bottom wall of the cleaning tank 2, and the connection methods include threaded connection, plug-in connection, and clamping connection. The support frame 21 and the cleaning tank 2 may also be designed as an integrated whole.

[0033] The grinder 41 includes a driving motor 411 and a grinding part 412. The fixed end of the driving motor 411 is connected to the side wall and / or bottom surface of the cleaning tank 2. The output shaft of the driving motor 411 is connected to the grinding part 412. The output shaft of the driving motor 411 can be extended and retracted along the axial direction to drive the grinding part 412 to extend and retract relative to the mounting surface.

[0034] According to the grinding requirements, the working surface of the grinding part 412 can be designed as a plane, a spherical surface, a curved surface, etc. The shape of the grinding part 412 includes but is not limited to a pad, a plate, a sphere, a block, a wedge, etc. According to the structural form of the grinding part 412 and different grinding requirements, the driving motor 411 can drive the grinding part 412 to perform different forms of movement to grind and remove the surface of the electrostatic chuck. Among them, the movement form of the grinding part 412 can be rotation, linear reciprocating motion, curvilinear motion or compound motion, etc.

[0035] In some embodiments, a connector is provided between the drive motor 411 and the grinding part 412, and both ends of the connector are respectively connected to the grinding part 412 and the output shaft of the drive motor 411. This arrangement can expand the range of movement of the grinding part 412 to accommodate electrostatic suction cups of different sizes.

[0036] In some embodiments, the grinding device 4 also includes a plurality of water guns 42, which are respectively connected to the side walls and / or bottom surfaces of the cleaning tank 2, and a plurality of grinders 41 and a plurality of water guns 42 are arranged at intervals to grind and clean the surface of the electrostatic chuck 5. The function of the water gun 42 is to flush the grinding material between the grinding part 412 and the electrostatic chuck 5 during the grinding process to avoid the deposition of the grinding material and improve the grinding quality. The water gun 42 can use ultrapure water to pressure-wash the surface of the electrostatic chuck 5 to meet the requirements of the semiconductor production process. In some embodiments, the grinding device 4 uses a rotating grinding pad and an ultrapure water gun to work together. The recommended rotation speed of the rotating grinding pad is 60-150 rpm, the recommended caliber size of the ultrapure water gun head is 0.2-0.5mm, and the water pressure is 0.3-0.6MPa.

[0037] In some embodiments, a bubble generator 6 is further provided in the cleaning tank 2, and the number of the bubble generators 6 is not limited, and the bubble generators 6 are connected to the side wall and / or the bottom surface of the cleaning tank 2. During the cleaning process, the bubble generating device built into the bubble generator 6 can provide bubbles to the cleaning liquid, and the energy generated by the bubbles bursting when in contact with the surface of the electrostatic chuck 5 is used to flush and clean the surface. This method has good cleaning effect and low energy consumption.

[0038] The support platform 3 includes a lifting structure 31 and a supporting structure 32. One end of the lifting structure 31 is connected to the bottom of the cleaning tank 2, and the other end is connected to the supporting structure 32. The lifting structure 31 can be pneumatic, hydraulic, electric, etc., for example, a hydraulic telescopic rod is used. The supporting structure 32 is used to support the electrostatic suction cup 5. The electrostatic suction cup 5 can be fixed on the supporting structure 32 or directly placed on the supporting structure 32. The structural form of the supporting structure 32 is not limited, and it can be a circular disk, a square disk, a supporting frame, etc. The supporting structure 32 can also be designed as a claw shape for clamping the electrostatic suction cup 5.

[0039] In some embodiments, the cleaning device is provided with a plurality of carrier platforms 3 , or a plurality of support arms are provided on the supporting structure 32 of the carrier platform 3 , so as to achieve simultaneous cleaning of a plurality of electrostatic suction cups 5 .

[0040] refer to Figure 3In some embodiments, the cleaning device also includes a cleaning liquid supply device 7 and a cleaning liquid discharge device 8. The cleaning liquid supply device 7 is connected to the cleaning chamber 1 and is used to introduce the cleaning solution into the cleaning chamber 1. The cleaning liquid discharge device 8 is arranged at the bottom of the cleaning chamber 1. The cleaning liquid discharge device 8 is respectively connected to the cleaning chamber 1 and the waste liquid treatment system 9 for discharging the waste liquid.

[0041] The cleaning liquid supply device 7 includes a first storage device 701 , a second storage device 702 , a first valve 703 , a second valve 704 , a first controller 705 , a second controller 706 , a first pipeline 707 , and a second pipeline 708 .

[0042] The first storage device 701 is used to store the first solution, and the first storage device 701 is connected to the cleaning chamber 1 through the first pipeline 707. The first valve 703 is arranged on the first pipeline 707, close to the side wall of the cleaning chamber 1, and is electrically connected to the first controller 705. The first controller 705 controls the first valve 703 to open or close according to the liquid level of the first solution in the cleaning chamber 1.

[0043] The second storage device 702 is used to store the second solution, and is connected to the cleaning chamber 1 via a second pipeline 708. The second valve 704 is disposed on the second pipeline 708, close to the side wall of the cleaning chamber 1, and is electrically connected to the second controller 706. The second controller 706 controls the second valve 704 to open or close according to the second liquid level in the cleaning chamber 1.

[0044] In some embodiments, the first solution is an acid solution, such as hydrofluoric acid solution, hydrochloric acid solution, sulfuric acid solution or a mixture thereof, and the second solution is a pure liquid, such as ultrapure water, isopropyl alcohol or a mixture thereof. The first storage device 701 and the second storage device 702 can be a liquid storage tank, a liquid storage bottle, a liquid storage pool, etc.

[0045] In some embodiments, a power pump (not shown) is provided between the first storage device 701 and the first valve 703, and the power pump is electrically connected to the first controller 705. The power pump can extract the cleaning liquid in the first storage device 701 and transport it in the direction of the cleaning chamber 1. The type of the power pump is not limited, and it can be a centrifugal pump, a gear pump, a vane pump, etc.

[0046] In some embodiments, the bubble generator 6 is electrically connected to the first controller 705 or the second controller 706 , and the first controller 705 or the second controller 706 issues an opening or closing instruction to the bubble generator 6 according to process requirements.

[0047] When the cleaning liquid is injected into the cleaning chamber 1, it is necessary to monitor the injection amount of the cleaning liquid or the liquid level in the cleaning chamber 1. In some embodiments, manual monitoring is adopted. A transparent observation window is opened on the wall of the cleaning chamber 1, and scales are marked on the window to obtain the liquid level in the cleaning chamber 1. In some embodiments, a first liquid level alarm 709 and a second liquid level alarm 710 are provided, and a first installation cavity 11 and a second installation cavity 12 are provided on the side wall of the cleaning chamber 1. The first installation cavity 11 and the second installation cavity 12 protrude from the outer wall of the cleaning chamber 1 respectively and are connected with the interior of the cleaning chamber 1. The first liquid level alarm 709 and the second liquid level alarm 710 are respectively installed in the first installation cavity 11 and the second installation cavity 12. The probe end of the liquid level alarm is located in the cleaning chamber 1, and the connecting end is electrically connected to the first controller 705 and the second controller 706 respectively. When the first liquid level alarm 709 or the second liquid level alarm 710 detects acid or pure liquid, the data will be transmitted to the corresponding controller. Once the liquid level data reaches the preset value, the controller controls the corresponding valve to close automatically.

[0048] In some embodiments, a flow meter is provided on the first pipeline 707 or the second pipeline 708 , and the flow meter is electrically connected to the first controller 705 or the second controller 706 for monitoring the flow of the cleaning liquid entering the cleaning chamber 1 .

[0049] The cleaning liquid discharge device 8 includes a third pipeline 81 and a fourth pipeline 82. The inlet and outlet of the third pipeline 81 and the fourth pipeline 82 are connected to the cleaning chamber 1 and the waste liquid treatment system 9, respectively, and are used to discharge the first solution and the second solution, respectively. To facilitate the discharge of the waste liquid, the inlet ends of the third pipeline 81 and the fourth pipeline 82 can be respectively arranged at the bottom of the side wall of the cleaning chamber 1. A third valve 83 is provided at the inlet end of the third pipeline 81, and a fourth valve 84 is provided at the inlet end of the fourth pipeline 82. The third valve 83 and the fourth valve 84 are respectively electrically connected to the first controller 705 and the second controller 706. According to the requirements of the discharge process, the first controller 705 and the second controller 706 control the opening or closing of the third valve 83 and the fourth valve 84, respectively.

[0050] In some embodiments, the third pipeline 81 and the fourth pipeline 82 are provided with a suction pump (not shown in the figure), and the suction pump can quickly extract the waste liquid in the cleaning chamber 1. Taking the third pipeline 81 as an example, the suction pump can be set between the third valve 83 and the cleaning chamber 1 or between the third valve 83 and the waste liquid treatment system 9. The type of the suction pump is not limited, and it can be a gear pump, a centrifugal pump, a vane pump, etc., and its displacement can be determined according to the capacity of the cleaning chamber 1.

[0051] In order to further meet environmental protection requirements, the waste liquid treatment system 9 is divided into a first treatment system 91 and a second treatment system 92, which are used to treat harmful waste liquid and general waste liquid respectively, harmful waste liquid such as waste acid liquid, waste alkali liquid, etc., and general waste liquid such as waste water. The outlet of the third pipeline 81 is connected to the first treatment system 91, and the outlet of the fourth pipeline 82 is connected to the second treatment system 92.

[0052] The working process of the cleaning device using the present application is described in detail below.

[0053] First, the electrostatic suction cup 5 to be cleaned is placed or fixed on the supporting platform 3, and the driving motor 411 is started to extend the grinding part 412 to the working position close to the electrostatic suction cup 5, and the electrostatic suction cup 5 is mechanically ground. At the same time, the grinding material is removed by using the water gun 42. The appropriate grinding time is set according to the surface state of the electrostatic suction cup 5. After the grinding is completed, the driving motor 411 and the water gun 42 are turned off. At this time, the grinding part 412 retracts to the side wall or bottom surface of the cleaning tank 2 to facilitate the subsequent process.

[0054] After the grinding and cleaning of the electrostatic chuck 5 is completed, the first controller 705 controls the first valve 703 to open and inject acid into the cleaning chamber 1 until the acid reaches the warning position, and the electrostatic chuck 5 is pickled. After the pickling is completed, the first controller 705 controls the third valve 83 to open to discharge the waste acid. The second controller 706 controls the second valve 704 to open and inject pure liquid into the cleaning chamber 1 until the pure liquid reaches the warning position, and the electrostatic chuck 5 is cleaned with pure liquid. At the same time, the cleaning chamber 1 and the cleaning tank 2 are cleaned to remove the residual acid. After the pure liquid cleaning is completed, the second controller 706 controls the fourth valve 84 to open to discharge the waste liquid.

[0055] The pickling and pure liquid cleaning steps can be performed multiple times as needed. After the entire cleaning process is completed, the electrostatic chuck 5 that has passed the cleaning is lifted to the upper surface of the cleaning tank 2 by the supporting platform 3 and taken out.

[0056] In the above cleaning process, the electrostatic chuck is first ground using a grinding device to remove most of the attachments, and then pickling is performed to allow the acid to react chemically with the attachments remaining on the surface of the electrostatic chuck to remove them, thereby allowing the electrostatic chuck to obtain better surface quality. This method of combining mechanical grinding with chemical removal can more effectively remove attachments on the surface of the electrostatic chuck, avoiding the phenomenon of incomplete or excessive removal of attachments, solving the current technical problems of difficult cleaning and poor cleaning effects of electrostatic chucks, while reducing the risk of damage to the electrostatic chuck during the cleaning process, extending its service life, and improving the quality of semiconductor products.

[0057] In addition, the conventional pickling method of the electrostatic chuck is to inject the acid directly into the cleaning container (without the cleaning chamber 1). The problem with this method is that the concentration of the acid during the cleaning process is uncontrollable. As the acid reacts with the surface attachments of the electrostatic chuck, the acid concentration in the cleaning container will gradually decrease, which causes the reaction speed of the acid and the attachments to become slower and slower, and even the reaction stops, resulting in poor pickling effect. The cleaning device of the present application adopts a structural form in which a cleaning tank 2 is arranged in the cleaning chamber 1. During the pickling process, the acidic components in the cleaning chamber 1 can be continuously diffused into the cleaning tank 2, thereby ensuring the acid concentration in the cleaning tank 2 and improving the efficiency and quality of pickling.

[0058] The beneficial effects of the cleaning device provided in this application include but are not limited to the following:

[0059] During cleaning, multiple grinders are used to grind the electrostatic chuck. Compared with manual grinding, mechanical grinding of the electrostatic chuck by multiple grinders can reduce the risk of damage to the surface of the electrostatic chuck. Furthermore, multiple grinders work in coordination with multiple ultrapure water guns to prevent the grinding material from depositing on the surface of the electrostatic chuck, thereby improving the grinding quality.

[0060] By arranging multiple carriers in the cleaning tank, multiple electrostatic suction cups can be cleaned simultaneously, thereby improving work efficiency.

[0061] The structural mode of arranging a cleaning tank in the cleaning chamber can ensure a constant solution concentration during the pickling process of the electrostatic chuck, thereby improving the pickling quality.

[0062] The combination of mechanical grinding and pickling can completely remove the attachments on the surface of the electrostatic chuck, while protecting the electrostatic chuck from damage, so that the electrostatic chuck has better surface quality and extends its service life.

[0063] It can be seen that the cleaning device of the present application adopts a simple structure to effectively improve the cleaning efficiency and quality of the electrostatic chuck, solves the current technical problem of poor cleaning effect of the electrostatic chuck, is efficient, safe and convenient, and has good application prospects.

[0064] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

[0065] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this application. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this application.

[0066] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "fix" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a rotating connection or a sliding connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood in combination with specific circumstances.

[0067] In addition, when terms such as "first", "second", and "third" are used in the specification of this application to describe various features, these terms are only used to distinguish these features and cannot be understood as indicating or implying the relationship between the features, the relative importance, or implicitly indicating the number of features indicated.

[0068] In addition, the present specification describes exemplary embodiments by reference to idealized exemplary cross-sectional views and / or plan views and / or stereograms. Therefore, differences from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are foreseeable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but should include deviations in shapes caused by, for example, manufacturing. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device nor to limit the scope of the exemplary embodiments.

[0069] At the same time, the present application uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in the present application does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0070] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0071] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. A cleaning device for cleaning an electrostatic chuck, characterized in that: include: Cleaning chambers; a cleaning tank, the cleaning tank being located in the cleaning chamber; A grinding device, the grinding device comprising a plurality of grinders, the plurality of grinders being respectively arranged on the side walls and / or the bottom surface of the cleaning tank and being configured to be telescopic relative to the side walls and / or the bottom surface of the cleaning tank; as well as A carrying platform is located above the bottom surface of the cleaning tank and is used to support the electrostatic suction cup. The carrying platform is configured to move in a direction perpendicular to the bottom surface of the cleaning tank.

2. The cleaning device according to claim 1, characterized in that: The grinder includes a drive motor and a grinding part, wherein the fixed end of the drive motor is connected to the side wall and / or bottom surface of the cleaning tank, the output shaft of the drive motor is connected to the grinding part, and the output shaft is configured to drive the grinding part to extend and retract relative to the side wall and / or bottom surface of the cleaning tank.

3. The cleaning device according to claim 2, characterized in that: The grinding device further comprises a plurality of water guns, wherein the plurality of water guns are respectively connected to the side walls and / or the bottom surface of the cleaning tank, and the plurality of grinders and the plurality of water guns are arranged at intervals.

4. The cleaning device according to claim 1, characterized in that: The supporting platform includes a lifting structure and a supporting structure. One end of the lifting structure is connected to the bottom surface of the cleaning tank, and the other end is connected to the supporting structure. The supporting structure is used to support the electrostatic suction cup.

5. The cleaning device according to claim 1, characterized in that: It also includes a bubble generator, which is located in the cleaning tank and connected to the side wall and / or the bottom surface of the cleaning tank.

6. The cleaning device according to claim 1, characterized in that: Also includes: a cleaning liquid supply device, the cleaning liquid supply device being connected to the cleaning chamber and being used for passing a cleaning solution into the cleaning chamber; A cleaning liquid discharge device is arranged at the bottom of the cleaning chamber, one end of the cleaning liquid discharge device is connected to the cleaning chamber, and the other end is connected to the waste liquid treatment system for discharging waste liquid.

7. The cleaning device according to claim 6, characterized in that: The cleaning liquid supply device comprises: A first storage device, used to store a first solution, wherein the first storage device is connected to the cleaning chamber via a first pipeline; A second storage device, used to store a second solution, wherein the second storage device is connected to the cleaning chamber via a second pipeline; a first valve, the first valve being arranged on the first pipeline; a second valve, the second valve being disposed on the second pipeline; a first controller, the first controller being electrically connected to the first valve and configured to control the first valve to be opened or closed according to a liquid level of the first solution in the cleaning chamber; A second controller is electrically connected to the second valve and is used for controlling the second valve to be opened or closed according to the liquid level of the second solution in the cleaning chamber.

8. The cleaning device according to claim 7, characterized in that: The cleaning liquid supply device also includes: A first liquid level alarm, which is disposed in a first installation cavity communicated with a side wall of the cleaning chamber and is electrically connected to the first controller, and is used to detect a liquid level of the first solution and transmit a detection result to the first controller; The second liquid level alarm is arranged in a second installation cavity communicated with the side wall of the cleaning chamber and is electrically connected to the second controller, and is used for detecting the liquid level of the second solution and transmitting the detection result to the second controller.

9. The cleaning device according to claim 8, characterized in that: The cleaning liquid discharge device comprises: a third pipeline, wherein an inlet end of the third pipeline is located at the bottom of the cleaning chamber and communicates with the cleaning chamber, and an outlet end of the third pipeline is communicated with the waste liquid treatment system for discharging the first solution; a fourth pipeline, wherein the inlet end of the fourth pipeline is located at the bottom of the cleaning chamber and communicates with the cleaning chamber, and the outlet end of the fourth pipeline is communicated with the waste liquid treatment system for discharging the second solution; a third valve, the third valve being arranged at the inlet end of the third pipeline and being electrically connected to the first controller; A fourth valve is arranged at the inlet end of the fourth pipeline and is electrically connected to the second controller.

10. The cleaning device according to claim 9, characterized in that: The waste liquid treatment system includes a first treatment system and a second treatment system. The outlet end of the third pipeline is connected to the first treatment system, and the outlet end of the fourth pipeline is connected to the second treatment system.

Images