Anti-static packaging film and display module

Abstract

The utility model belongs to the technical field of packaging materials, and particularly discloses an anti-static packaging film and a display module. The anti-static packaging film comprises an anti-static layer and a supporting layer, a first adhesive layer is arranged on the side, close to the anti-static layer, of the supporting layer, the surface resistance value of the anti-static layer is set to be 107-1011 ohms, the volume resistivity of the anti-static layer is 2.7 * 1015-2.7 * 1016 ohm.cm, and when the relative humidity of the anti-static layer is controlled to be (30 + / -5)%, the first adhesive layer is arranged on the side, close to the anti-static layer, of the supporting layer, the surface resistance value of the anti-static layer is set to be 107-1011 ohms, and the volume resistivity of the anti-static layer is 2.7 * 1015-2.7 * 1016 ohm.cm. The surface resistance value is less than 1011 omega; and when the relative humidity of the anti-static layer is controlled to be (50 + / -5)%, the surface resistance value is less than 109 omega. Meanwhile, the anti-static packaging film is used for preparing a display module for mine lighting. The anti-static layer which can have corresponding surface resistance values according to different humidity conditions is arranged on the outermost side, so that an excellent anti-static effect can be kept under different environmental conditions in a mine.

Description

Technical Field

[0001] The present application relates to the technical field of packaging materials, and in particular to an anti-static packaging film and a display module. Background Art

[0002] Mining occupies an important position in my country's economy. As one of the world's largest consumers and producers of mineral resources, China has rich mineral resource types and reserves. With the continuous development of my country's mining industry, the rational use of lighting equipment (such as LED lamps) is crucial in underground working environments such as mines.

[0003] There is insufficient light deep in the mines. In order to ensure the safety of miners and improve work efficiency, sufficient lighting needs to be provided. Lighting equipment can not only provide bright and uniform light to illuminate the work area, but also serve as a safety sign to indicate the location of dangerous areas, safe exits, etc. Due to the presence of flammable gases such as methane in mines, the display modules in the lighting equipment usually have explosion-proof designs to ensure safety. The safety protection measures for static electricity in mines are mainly to prevent combustion and explosion caused by static electricity. Antistatic film materials are usually used to encapsulate and protect the internal light-emitting devices. However, the LED light boards currently commonly used in mines have large chip sizes and large spacing, which makes it difficult to ensure a comprehensive antistatic effect when performing antistatic packaging protection; and the lamp beads are prone to damage during use.

[0004] In view of the above technology, the inventors believe that it is necessary to develop and produce an antistatic packaging film with excellent antistatic effect, good surface uniformity and good reliability, as well as a display module for mine lighting. Utility Model Content

[0005] In order to improve the antistatic performance and surface uniformity of a packaging film, the present application provides an antistatic packaging film and a display module.

[0006] In the first aspect, the present application provides an anti-static packaging film, which adopts the following technical solution:

[0007] An antistatic packaging film comprises an antistatic layer and a supporting layer, wherein a first adhesive layer is arranged on a side of the supporting layer close to the antistatic layer, and the surface resistance value of the antistatic layer is set to 10 7 ~10 11 Ω, the volume resistivity of the antistatic layer is 2.7×10 15 ~2.7×10 16 Ω·cm, when the relative humidity of the antistatic layer is controlled at (30±5)%, the surface resistance value is less than 10 11 Ω; when the relative humidity of the antistatic layer is controlled at (50±5)%, the surface resistance value is <109 Ω.

[0008] Preferably, the thickness of the first adhesive layer is set to 1-10 μm, the bonding force between the first adhesive layer and the support layer is greater than 100 N / cm, and the bonding force between the first adhesive layer and the antistatic layer is greater than 80 N / cm.

[0009] Preferably, the first adhesive layer is a polyurethane adhesive layer.

[0010] Preferably, the thickness of the antistatic layer is set to 20-50 μm, and the thickness of the support layer is set to 50-150 μm.

[0011] Preferably, the light transmittance of the antistatic layer is set to 50-90%, and the light transmittance of the support layer is set to 80-95%.

[0012] Preferably, the method further comprises a second adhesive layer, wherein the second adhesive layer is attached to a side of the support layer facing away from the first adhesive layer.

[0013] Preferably, the thickness of the second adhesive layer is set to 50-100 μm, the light transmittance of the second adhesive layer is set to 80-95%, and the bonding force between the second adhesive layer and the support layer is > 80 N / cm 2 .

[0014] Preferably, the thickness of the antistatic packaging film is set to 100-300 μm, the haze is set to 30-100%, the hardness is set to 2-4H, and the 60° glossiness is set to 10-50.

[0015] In a second aspect, the present application provides a display module for mine lighting, which adopts the following technical solution:

[0016] It comprises a light-emitting module and a packaging film, wherein the packaging film is attached to the light-emitting module and the packaging film adopts the above-mentioned antistatic packaging film.

[0017] Preferably, the light-emitting module comprises a substrate, a protective layer and a light-emitting device, wherein the light-emitting device is arranged on the substrate, the protective layer is attached to the substrate, the light-emitting device is buried inside the protective layer, the side of the protective layer away from the substrate is attached to the packaging film, and the bonding force between the protective layer and the substrate is greater than 150N / cm 2 .

[0018] In summary, this application has the following beneficial effects:

[0019] 1. In the present application, since the surface of the packaging film will come into contact and separate from other objects during mine operations, electrostatic induction will be generated. When the static charge accumulates to a certain extent, static electricity will leak through the air or contact other objects, which can easily cause danger when encountering flammable and explosive gases in the mine. The present application sets the outermost antistatic layer to exhibit specific different surface resistance value ranges under different humidity conditions. On the one hand, it can achieve that water molecules can be adsorbed on the surface of the packaging film to form a surface conductive path under appropriate humidity, thereby reducing the surface resistance value and further improving the antistatic performance of the packaging film; on the other hand, it can also prevent corrosion or electrolysis on the surface of the packaging film caused by excessive humidity, which leads to a decrease in the antistatic performance of the packaging film.

[0020] 2. In the present application, a first adhesive layer of polyurethane is coated on the upper surface of the support layer to achieve a closer fit between the antistatic layer and the support layer, thereby preventing the film layers from falling off due to aging after long-term use. At the same time, a second adhesive layer of a certain thickness can be added between the support layer and the protective layer to adapt to different processing methods, and the second adhesive layer can also be used to bond the upper and lower film structures more tightly, which can improve the integrity and reliability of the product packaging film as a whole; it can also make the product packaging film have a certain buffering capacity, thereby reducing the damage to the light-emitting device inside the protective layer due to the external force on the film surface;

[0021] 3. In the present application, by controlling the thickness parameters of each layer in the packaging film, it is possible to effectively ensure that the product packaging film has a good light transmittance, so that the light-emitting device in the protective layer can effectively radiate light outside the film, thereby ensuring that the display module prepared therefrom has a good lighting capability without affecting the comprehensive performance of the product packaging film. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic cross-sectional structure diagram of an antistatic packaging film embodiment 1 in the present application;

[0023] Figure 2 is a schematic cross-sectional structure diagram of an antistatic packaging film embodiment 2 in the present application;

[0024] Figure 3 is a schematic cross-sectional structure diagram of a display module embodiment 3 in the present application;

[0025] Figure 4 It is a schematic cross-sectional structure diagram of a display module embodiment 4 in the present application.

[0026] Description of reference numerals:

[0027] 1. Antistatic layer; 2. Support layer; 3. First adhesive layer; 4. Second adhesive layer; 5. Light-emitting module; 51. Substrate; 52. Light-emitting device; 53. Protective layer. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-4 This application is described in further detail.

[0029] The embodiment of the present application discloses an antistatic packaging film, which comprises, from top to bottom, an antistatic layer 1 and a support layer 2. At the same time, a first adhesive layer is also coated on one side of the support layer 2 close to the antistatic layer 1.

[0030] Among them, the antistatic layer 1 is mainly to evenly mix the antistatic agent into the main glue liquid, and ensure the uniformity of the antistatic agent dispersed in the main glue liquid through stirring, yarn grinding and other processing methods, further ensure that the antistatic layer 1 after molding has good surface resistance uniformity, and then solidify the main glue liquid-antistatic agent blend into a film through curing, thereby forming an antistatic film layer. Among them, the main glue liquid includes one or more of acrylic acid and epoxy resin, and acrylic acid and epoxy resin can also be compounded. The specific compounding ratio of acrylic acid and epoxy resin is (1~5):1. The antistatic agent includes one or more of JL-E24 and JL-BXS. The antistatic agent used is an internal addition type, which has charged groups of various structures, stable conductive properties, and good compatibility with other additives, so that it can continuously exert an antistatic effect. At the same time, the amount of antistatic agent added or the compounding ratio is reasonably adjusted to control the volume resistivity of the antistatic layer 1 to 2.7×10 15 ~2.7×10 16 Ω·cm, the surface resistance of the antistatic layer 1 is controlled at 10 7 ~10 11 Ω, and when the antistatic layer 1 is under different humidity conditions, its surface can reflect different surface resistance values, thereby controlling the antistatic performance of the product packaging film. Specifically, when the antistatic layer 1 controls the relative humidity at (30±5)%, the surface resistance value is <10 11 Ω; When the relative humidity of the antistatic layer 1 is controlled at (50±5)%, the surface resistance value is <10 9Ω. At the same time, the transmittance of the antistatic layer 1 can be controlled within 50-90%, and the thickness of the antistatic layer 1 can be controlled within 20-50 μm. Specifically, the thickness range of the antistatic layer 1 is controlled within 20-50 μm. On the one hand, if the thickness of the antistatic layer 1 is less than 20 μm, it is difficult to meet conventional production requirements, and the amount of the antistatic agent added relative to the main glue will increase while maintaining the same antistatic performance, resulting in an imbalance in the ratio of the two, making the viscosity of the obtained blend too large, and the coating appearance uneven, further affecting the performance parameters such as the surface hardness and gloss of the product packaging film; on the other hand, if the thickness of the antistatic layer 1 is greater than 50 μm, the film surface of the antistatic layer 1 will be at risk of being fragile, which will have an adverse effect on the protective effect of the display module under the packaging film. The transmittance of the antistatic layer 1 is controlled in the range of 50-90%. When the transmittance is greater than 90%, the production requirements will be significantly increased, and a balance will be achieved between controlling reasonable production costs and better product performance; when the transmittance is less than 50%, the light extraction efficiency of the product packaging film will be very low (light extraction efficiency = luminous brightness after packaging / luminous brightness of the display module itself), resulting in the product packaging film not meeting the lighting standards for mine operations.

[0031] The support layer 2 is mainly made of an organic polymer film, including a film of polyethylene terephthalate (PET) and polycarbonate (PC) or a composite film of several of them. The support layer 2 needs to meet the measurement conditions of relative humidity of (30±5)% and (50±5)%, and its surface resistance value is greater than 10 12 When the surface hardness of the support layer 2 is controlled at 3H, the support effect as the main film material in the composite layer structure is better. When the thickness of the support layer 2 is controlled at 50-150μm, the support layer 2 has a better support structure effect as the main film layer in the composite film layer, and will not cause adverse effects on the transmittance.

[0032] It should be understood that the side of the support layer 2 coated with the first adhesive layer 3 can also be provided with a variety of regularly arranged special-shaped structures on its side by processing methods such as embossing, such as a plurality of prism structures arranged in sequence along the length direction of the support layer 2 itself, the length of the prism structure is the same as the width of the support layer 2, and the length direction of the prism structure is perpendicular to the length direction of the support layer 2, the protrusion height of the prism structure is controlled at 5-8μm, and the width of the prism structure is controlled at 3-5μm. At the same time, there are also multi-faceted pyramidal and hemispherical structures for the special-shaped structure, the purpose of which is to ensure that the light transmittance of the support layer 2 is controlled within 80-95%, and the adhesion between the support layer 2 and the antistatic layer 1 is improved by arranging the protruding structure evenly, and further cooperate with the first adhesive layer 3 to achieve the effect of preventing slippage between the layers, thereby improving the integrity of the packaging film; at the same time, the special-shaped structure can also converge the light emitted by the lower light-emitting device 52 through its own structural characteristics or arrangement method, thereby achieving a brightening effect.

[0033] The first adhesive layer 3 is evenly coated on the side of the support layer 2 close to the antistatic layer 1, and the first adhesive layer 3 is preferably a polyurethane adhesive layer. Specifically, the polyurethane adhesive can be evenly coated on the surface of the support layer 2 by brushing, spraying, rolling and other processing methods, and then the antistatic layer 1 is covered on one side of the support film coated with the polyurethane adhesive, and laminated and cured to achieve a close connection between the antistatic layer 1 and the support layer 2. The auxiliary agent formula in the polyurethane adhesive system can be adjusted according to the specific curing method, such as thermal curing, light curing, etc. By arranging the polyurethane first adhesive layer 3 between the antistatic layer 1 and the support layer 2, the first adhesive layer 3 has high adhesion and good chemical resistance, and can resist the erosion of various acids, alkalis, salts and other chemical substances; and has excellent mechanical properties, such as high tensile strength, toughness and impact resistance, thereby further improving the types of working conditions applicable to the product packaging film during mine operations. And through multiple experimental tests, polyurethane adhesive as the first adhesive layer 3 is more suitable for the antistatic layer 1 and the support layer 2 in this application, and can control the average bonding force between the first adhesive layer 3 and the support layer 2 to be >100N / cm, and the average bonding force between the first adhesive layer 3 and the antistatic layer 1 to be >80N / cm. At the same time, when the thickness of the first adhesive layer 3 is controlled to be 1-10μm, it can not only ensure a good bonding effect, but also minimize the impact on the overall light transmittance of the packaging film.

[0034] An antistatic packaging film disclosed in an embodiment of the present application further has a second adhesive layer 4 attached to the other side of the support layer 2 away from the first adhesive layer 3. The second adhesive layer 4 is selected from one or more of epoxy resin adhesives, acrylic adhesives, ethylene-vinyl acetate copolymer (EVA) adhesives and polyolefin (POE) adhesives. If a compounding scheme is selected, the compounding ratio can be arbitrarily adjusted. Among them, epoxy resins and acrylics, as well as compounding adhesive schemes of the two are preferred, because the prepared second adhesive layer 4 has better compatibility with the upper and lower film layers. The thickness of the second adhesive layer 4 is controlled at 50 to 100 μm, and the transmittance of the second adhesive layer 4 is controlled at 80 to 95%, so that it has a better bonding effect and will not adversely affect the overall transmittance of the packaging film. At the same time, the bonding force between the second adhesive layer 4 and the support layer 2 is maintained at >80N / cm 2 , so that the packaging film is in a state to be bonded, and can be effectively attached to the surface of the relevant light-emitting device without peeling or slipping.

[0035] For the antistatic packaging film in this application, its thickness is set to 100-300μm, the haze is set to 30-100%, the hardness is set to 2-4H, and the 60° gloss is set to 10-50. Among them, the surface resistance of the antistatic packaging film is tested by a surface resistance tester (quick4990d), the bonding force between the layers is tested by a tensile test method, the haze and transmittance of the antistatic packaging film are tested by a color spectrum transmittance haze tester (TH-09), the hardness is tested by a pencil hardness tester, and the gloss is tested by a gloss tester (standard up to 515s). Specifically, the thickness range of the antistatic packaging film is controlled to be 100-300μm. When the thickness is greater than 300μm, the attenuation of the light emitted by the lower display module increases when passing through, which causes the transmittance to decrease. If the film thickness of the product packaging film is too high, it will indirectly increase its weight, adding an extra weight burden to the workers in the mine operation. When the thickness is less than 100μm, it will directly lead to a decrease in the mechanical strength of the product packaging film, and the film surface of the packaging film is easily damaged during mining operations, further weakening its protective effect on the underlying display module. If the film thickness of the product packaging film is too thin, it may also cause uneven light transmission due to uneven stress distribution inside the film body, thereby affecting the appearance and performance of the product packaging film. The haze of the antistatic packaging film is controlled at 30-100%. When the haze is too high, it will cause more scattering inside the product packaging film when the light passes through it, thereby reducing the light transmittance. At the same time, it will also affect the color reproduction of the display module, causing the color of the indicative light of other colors emitted by it to be distorted; when the haze is too low, it will affect the appearance of the product packaging film, making any defects on the film surface more significant. The hardness of the antistatic packaging film is controlled within the range of 2 to 4H. When the hardness is greater than 4H, stress concentration will occur on the surface of the product packaging film when it is subjected to local loads, further causing cracks or ruptures on the surface of the film; when the hardness is less than 2H, the surface of the product packaging film will deform under temperature changes or external forces, further affecting the sealing and stability of the product packaging film. The 60° glossiness of the antistatic packaging film is controlled within the range of 10 to 50, which can directly reflect the matte effect of the outer layer of the product packaging film. When the 60° glossiness is too high, it may cause the surface of the film to reflect more light, and strong reflections may occur during mine operations, thereby affecting the visual effect or causing glare; when the 60° glossiness is too low, it will cause more scattering of light in the packaging film body and affect the light transmittance.

[0036] The embodiment of the present application also discloses a display module for mine lighting, including a light-emitting module 5 and a packaging film, and the packaging film is attached to one side of the surface of the light-emitting module 5. The light-emitting module 5 includes a substrate 51, a protective layer 53 and a plurality of light-emitting devices 52, each of which is electrically connected to the surface of the substrate 51 and can be arranged at equal intervals according to a certain arrangement rule. Specifically, each light-emitting device 52 can be arranged in the warp and weft directions without affecting each other, while ensuring that the luminous efficiency reaches the standard level required for mine operations. The protective layer 53 is evenly attached to one side of the substrate 51 on which a plurality of light-emitting devices 52 are installed. The protective layer 53 is preferably a film layer structure formed by curing an epoxy resin adhesive, and the thickness of the protective layer 53 can be specifically controlled to be 100 to 1000 μm according to the protrusion height of the light-emitting device 52. At the same time, the side of the protective layer 53 facing away from the substrate 51 is attached to the side of the packaging film away from the antistatic layer 1, and the bonding force between the two is greater than 80 N / cm 2 , and the bonding force between the protective layer 53 and the substrate 51 is greater than 150N / cm 2 .

[0037] Example 1

[0038] Reference Figure 1 , Example 1 of the present application discloses an antistatic packaging film. The antistatic layer 1 is specifically prepared using an acrylic main glue and a JL-E24 antistatic agent. By controlling the curing conditions and the sizing process, the thickness of the antistatic layer 1 after curing is set to 35 μm. After testing, when the relative humidity is 30%, the surface resistance value of the antistatic layer 1 in this embodiment is less than 1.6×10 10 Ω; when the relative humidity is 50%, the surface resistance value is less than 3.6×10 7 Ω; the support layer 2 specifically uses a PET layer, and the thickness of the support layer 2 is set to 100 μm by controlling the processing method; the first adhesive layer 3 uses a polyurethane adhesive layer, and the thickness of the first adhesive layer 3 is set to 5 μm; and the second adhesive layer 4 uses an epoxy resin adhesive layer, and the thickness of the second adhesive layer 4 is set to 75 μm.

[0039] In this embodiment, the thickness of the antistatic packaging film is specifically 215 μm, the haze is specifically 73%, the hardness is specifically 3H, and the 60° glossiness is specifically 40.

[0040] The preparation method of the antistatic packaging film in this embodiment is as follows: first, spray the prepared polyurethane adhesive onto the side of the PET support layer 2 that has undergone preliminary surface treatment to form a first adhesive layer 3, and then evenly adhere the prepared antistatic layer 1 to the side of the PET support layer 2 coated with the first adhesive layer 3, control the vacuum time to 75 seconds, control the temperature to 70°C, and directly press for 75 seconds under a pressure of 5kg to form an antistatic layer-support layer integrated film. If the first adhesive layer 3 contains a light-curing formula component, it is also necessary to control the exposure intensity to 600mj / cm 2 Conditions, and control the light curing time to 50min for light curing treatment. During the preparation process, the constant pressure and related curing conditions are controlled to control the size and thickness of the antistatic packaging film to ensure its lamination consistency and flatness. Finally, a preliminary surface treatment is performed on the other side of the support layer 2 in the antistatic layer-support layer integrated film away from the first adhesive layer 3, and then an epoxy resin adhesive is applied to form a second adhesive layer 4 with uniform thickness, and the second adhesive layer 4 is kept in an uncured state to be attached to the relevant substrate for lamination.

[0041] Example 2

[0042] Reference Figure 2 , Example 2 of the present application discloses an antistatic packaging film. The difference between this example and Example 1 is that the second adhesive layer 4 is not provided on the other side of the support layer 2 in the antistatic packaging film away from the first adhesive layer 3. Among them, the antistatic layer 1 is specifically prepared using epoxy resin main glue and JL-BXS antistatic agent. The thickness of the antistatic layer 1 after curing is set to 50μm. After testing, the surface resistance value of the antistatic layer 1 in this example is less than 5.3×10 10 Ω; when the relative humidity is 50%, the surface resistance value is less than 8.6×10 7 Ω; the support layer 2 specifically uses a PC layer, and the film thickness of the support layer 2 is set to 150μm; and the first adhesive layer 3 is still a polyurethane adhesive layer, and the thickness of the first adhesive layer 3 is set to 10μm.

[0043] In this embodiment, the thickness of the antistatic packaging film is specifically 210 μm, the haze is specifically 85%, the hardness is specifically 4H, and the 60° glossiness is specifically 45.

[0044] Example 3

[0045] Reference Figure 3 , Example 3 of the present application discloses a display module for mine lighting, wherein the packaging film is selected as the packaging film in Example 1; the light emitting device 52 is selected as an LED lamp group; and the thickness of the protective layer 53 is set to 300 μm.

[0046] In this embodiment, the epoxy resin adhesive is first evenly filled into the gaps between the light-emitting devices 52 through a dispensing process, and the thickness of the protective layer 53 is always kept greater than the protrusion height of the light-emitting device 52, so that each light-emitting device 52 is buried inside the protective layer 53, further enhancing the protective buffering effect of the protective layer 53 on the precision light-emitting device 52 chip.

[0047] The preparation method of the display module in this embodiment is as follows: first, the protective layer 53 is pressed for 120 seconds under a pressure of 5 kg while controlling the vacuum time to be 120 seconds and the temperature to be 150°C to achieve preliminary curing of the protective layer 53; then the display module is placed on a platform, and the side of the packaging film of Example 1 having the uncured second adhesive layer 4 is adhered to the side of the protective layer 53 in the display module, and the temperature is controlled to be 70°C under vacuum conditions and pressed for 40 minutes under a pressure of 3 kg to prepare the display module.

[0048] Example 4

[0049] Reference Figure 4 , Embodiment 4 of the present application discloses a display module for mine lighting. The difference between this embodiment and Embodiment 3 is that the packaging film in this embodiment is selected as the packaging film in Embodiment 2; and the thickness of the protective layer 53 is set to 700 μm.

[0050] The preparation method of the display module in this embodiment is as follows: first, a packaging film is placed on a platform, and the side of the packaging film containing the support film is placed upward; then, the side of the support film facing away from the first adhesive layer 3 is surface treated, and the epoxy resin adhesive is evenly applied to the side of the support film by brushing to form an uncured, preliminary protective layer 53; finally, the side of the substrate 51 on which a plurality of light-emitting devices 52 are mounted is adhered to the protective layer 53, and under vacuum conditions, the temperature is controlled to 80°C and pressed for 120 minutes at a pressure of 4 kg to prepare the display module.

[0051] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. An antistatic packaging film, characterized in that: The invention comprises an antistatic layer (1) and a supporting layer (2), wherein a first adhesive layer (3) is arranged on a side of the supporting layer (2) close to the antistatic layer (1), and the surface resistance value of the antistatic layer (1) is set to 10 7 ~10 11 Ω, the volume resistivity of the antistatic layer (1) is 2.7×10 15 ~2.7×10 16 Ω·cm, when the relative humidity of the antistatic layer (1) is controlled at (30±5)%, the surface resistance value is less than 10 11 Ω; when the relative humidity of the antistatic layer (1) is controlled at (50±5)%, the surface resistance value is <10 9 Ω.

2. The antistatic packaging film according to claim 1, characterized in that: The thickness of the first adhesive layer (3) is set to 1-10 μm, the bonding force between the first adhesive layer (3) and the support layer (2) is greater than 100 N / cm, and the bonding force between the first adhesive layer (3) and the antistatic layer (1) is greater than 80 N / cm.

3. The antistatic packaging film according to claim 2, characterized in that: The first adhesive layer (3) is a polyurethane adhesive layer.

4. The antistatic packaging film according to claim 1, characterized in that: The thickness of the antistatic layer (1) is set to 20 to 50 μm, and the thickness of the support layer (2) is set to 50 to 150 μm.

5. The antistatic packaging film according to claim 4, characterized in that: The light transmittance of the antistatic layer (1) is set to 50-90%, and the light transmittance of the support layer (2) is set to 80-95%.

6. The antistatic packaging film according to claim 1, characterized in that: The invention also comprises a second adhesive layer (4), wherein the second adhesive layer (4) is attached to a side of the support layer (2) facing away from the first adhesive layer (3).

7. The antistatic packaging film according to claim 6, characterized in that: The thickness of the second adhesive layer (4) is set to 50-100 μm, the light transmittance of the second adhesive layer (4) is set to 80-95%, and the bonding force between the second adhesive layer (4) and the support layer (2) is greater than 80 N / cm 2 .

8. The antistatic packaging film according to claim 1, characterized in that: The thickness of the antistatic packaging film is set to 100-300 μm, the haze is set to 30-100%, the hardness is set to 2-4H, and the 60° glossiness is set to 10-50.

9. A display module for mine lighting, characterized in that: It comprises a light-emitting module (5) and a packaging film, wherein the packaging film is attached to the light-emitting module (5), and the packaging film is selected from the antistatic packaging film according to any one of claims 1 to 8.

10. A display module for mine lighting according to claim 9, characterized in that: The light-emitting module (5) comprises a substrate (51), a protective layer (53) and a light-emitting device (52); the light-emitting device (52) is arranged on the substrate (51); the protective layer (53) is attached to the substrate (51); the light-emitting device (52) is buried inside the protective layer (53); a side of the protective layer (53) facing away from the substrate (51) is attached to the packaging film; and the bonding force between the protective layer (53) and the substrate (51) is greater than 150 N / cm 2 .

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