Wafer jig for electroplating wafer surface

Abstract

The utility model discloses a wafer jig for electroplating the surface of a wafer, which comprises a jig body and a positioning and clamping assembly, and the jig body is provided with an accommodating groove for placing the wafer; one side, facing the wafer, of the clamping block is sequentially provided with a positioning surface, an extrusion guide surface and a pressing surface from top to bottom, the extrusion guide surface is an upward inclined surface, the positioning surface and the extrusion guide surface are jointed through a first edge, and the first edge is located at the top of the extrusion guide surface. The minimum distance between the first edge and the center of the accommodating groove is equal to the radius of the wafer; the pressing surface is obliquely arranged downwards, and when the wafer is clamped, the pressing surface is in abutting contact with the side edge of the wafer; the pressing blocks are uniformly arranged along the accommodating groove in a surrounding manner, and the wafer is clamped under the action of the elastic piece, so that the stress uniformity of wafer fixation is improved; in addition, through specific arrangement of the positioning surface and the first edge, preliminary positioning of the position of the wafer can be realized before the wafer is completely placed in the accommodating groove.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer electroplating equipment, in particular to a wafer fixture used for electroplating the surface of a wafer. Background Art

[0002] As a surface treatment technology, electroplating is based on the principle of electrolysis. Through the electrolysis process, a layer of metal or alloy is deposited on the surface of the conductive material to form a metal film, thereby improving the surface properties, corrosion resistance, conductivity, etc. of the material. In the field of semiconductor manufacturing, the wafer electroplating process is an indispensable part and plays a vital role in improving the quality and performance of wafers.

[0003] However, in practical applications, the design and use of wafer electroplating fixtures often have many shortcomings. Most of the wafer electroplating fixtures on the market are currently fixed with screws or pressing plates. This fixing method not only has complicated operating procedures, but also has low disassembly and assembly efficiency, which affects the efficiency of electroplating production. In addition, it is difficult to accurately control the tightness of the screws and the strength of the pressing plate, which will cause uneven pressure distribution on the wafer during the electroplating process, and then make the thickness of the wafer electroplating layer inconsistent. This thickness unevenness not only affects the aesthetics of the wafer, but more importantly, it may cause the wafer to have unstable performance and shortened life during subsequent use, which seriously restricts the development and application of wafer electroplating technology.

[0004] Therefore, in view of the above-mentioned problems existing in the existing wafer electroplating fixtures, there is an urgent need for a new type of wafer fixture that can simplify the operating procedures, ensure the uniformity of the thickness of the wafer electroplating layer, and improve the efficiency and quality of the wafer electroplating process. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, the utility model provides a wafer fixture for electroplating on the surface of a wafer and which ensures the uniformity of the thickness of the electroplated layer of the wafer.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a wafer fixture for electroplating on the surface of a wafer, comprising a fixture body, a receiving groove for placing a wafer on the fixture body, and a positioning clamping assembly, wherein the positioning clamping assembly comprises a clamping block, a guide mechanism for guiding the movement of the clamping block, and an elastic member for providing a clamping force for the clamping block, wherein the clamping block is at least partially located in the receiving groove, and n clamping blocks are provided around the circumference of the receiving groove, wherein n is not less than 3, and the clamping blocks can squeeze the wafer along the guide of the guide mechanism under the action of the elastic member;

[0007] The clamping block has a positioning surface, an extrusion guide surface and a pressing surface in sequence from top to bottom on the side facing the wafer. The extrusion guide surface is an inclined surface inclined upward. The positioning surface and the extrusion guide surface are connected by a first edge, and the first edge is located at the top of the extrusion guide surface. When the elastic member is in the initial state, the minimum distance between the first edge and the center of the accommodating groove is equal to the radius of the wafer. The pressing surface is arranged to be inclined downward, and when the wafer is clamped, the pressing surface is pressed and contacted with the side edge of the wafer.

[0008] By evenly arranging clamping blocks around the accommodating groove, the wafer is squeezed and clamped along the guide of the guide mechanism under the action of the elastic member, thereby improving the uniformity of the force applied to the wafer fixation, while achieving limited pressing of wafers of different thicknesses, and ensuring the uniformity of the thickness of the wafer electroplating layer; in addition, by the specific arrangement of the positioning surface and the first edge, the wafer position can be initially positioned before the wafer is completely placed in the accommodating groove, and the wafer can be prevented from deflecting when the guide surface is squeezed due to position offset during the process of being placed in the accommodating groove, thereby reducing the influence of uneven force on the wafer placement efficiency, and also reducing the influence on the service life of the extrusion guide surface due to improper extrusion.

[0009] Preferably, the positioning surface is an inclined surface inclined upward, and its slope is smaller than the slope of the extrusion guide surface to facilitate the placement of the wafer.

[0010] Preferably, the extrusion guide surface is a convex arc surface, which cooperates with the first edge to form a step area, which can produce a temporary stop in the step area during the wafer placement process, and continue to move toward the accommodating groove after the wafer is positioned, further ensuring the accurate placement of the wafer.

[0011] Preferably, the clamping block is an arc block bent around the center of the receiving groove, and the bending radius of the arc block is not greater than the radius of the wafer; through the setting of the arc block, different from the single-sided contact between the plane and the side edge of the wafer, the arc block can be in bilateral contact with the side edge of the wafer, thereby further improving the clamping effect

[0012] Preferably, the guiding mechanism is a guide platform provided on the fixture body and a guide rod passing through the guide platform, one end of the guide rod is connected to the clamping block, and the other end passes through the guide platform and is fixed with a pull handle, by which the clamping block can be opened and the wafer can be placed.

[0013] Preferably, the elastic member is a spring sleeved on the guide rod, and two ends of the spring are respectively abutted against the guide platform and the clamping block.

[0014] Preferably, the guide rod is a non-circular rod.

[0015] Preferably, the guide platform is an annular platform arranged around the accommodating groove, and a plurality of guide grooves are provided on the guide platform along the circumferential direction. The number of the guide grooves is greater than the number of the clamping blocks, and guide rods are correspondingly provided in at least some of the guide grooves. The number of guide rods and clamping blocks can be increased or decreased as needed to further adapt to the clamping requirements of wafers of different qualities.

[0016] The technical effect of the utility model is as follows: by evenly arranging clamping blocks along the accommodating groove, the wafer is squeezed and clamped along the guide of the guide mechanism under the action of the elastic member, thereby improving the uniformity of the force applied to the wafer fixation, and at the same time achieving the limited pressing of wafers of different thicknesses, thereby ensuring the uniformity of the thickness of the wafer electroplating layer; in addition, through the specific arrangement of the positioning surface and the first edge, the preliminary positioning of the wafer position can be achieved before the wafer is completely placed in the accommodating groove, and the wafer can be prevented from deflecting when the extrusion guide surface is squeezed due to position offset during the process of being placed in the accommodating groove, thereby reducing the influence of uneven force on the wafer placement efficiency, and also reducing the influence on the service life of the extrusion guide surface due to improper extrusion. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the utility model.

[0018] Figure 2 It is a cross-sectional schematic diagram of the utility model.

[0019] The main technical features in the figure are marked as follows: 1. fixture body; 11. wafer; 2. receiving groove; 31. guide platform; 32. guide rod; 33. guide groove; 34. pull handle; 4. clamping block; 41. positioning surface; 42. extrusion guide surface; 43. pressing surface; 5. first edge. DETAILED DESCRIPTION

[0020] The present invention will be further described below through specific implementation modes and accompanying drawings.

[0021] like Figure 1~2 As shown, a wafer 11 fixture for electroplating the surface of the wafer 11 includes a fixture body 1 and a positioning clamping assembly. The fixture body 1 is made of polytetrafluoroethylene and is provided with a receiving groove 2.

[0022] Specifically, the positioning and clamping assembly is a clamping block 4, a guiding mechanism and an elastic member, the guiding mechanism is a guide platform 31 and a guide rod 32, the guide platform 31 is an annular platform arranged circumferentially and concentrically on the accommodating groove 2, and a plurality of guide grooves 33 are evenly opened on it along the circumferential direction, and the number of the guide grooves 33 is not less than 3. According to actual needs, the guide rods 32 are inserted into the corresponding guide grooves 33, and the guide rods 32 are evenly distributed along the circumferential direction of the accommodating groove 2, one end of which is detachably connected to the clamping block 4 by bolts, and the other end is passed through the guide platform 31 and fixed with a handle, the guide rod 32 is a rectangular rod or other polygonal rod, and at least 3 of them are provided; the elastic member is a spring, which is sleeved on the guide rod 32 and its two ends are respectively abutted against the guide platform 31 and the clamping block 4.

[0023] Furthermore, the side of the clamping block 4 facing the wafer 11 is composed of three surfaces, namely a positioning surface 41, an extrusion guide surface 42 and a pressing surface 43, which are assembled from top to bottom. The positioning surface 41 is an inclined surface inclined upward, and its inclination is smaller than the inclination of the extrusion guide surface 42, and its inclination is 5°; the extrusion guide surface 42 is a convex arc surface inclined upward, and the positioning surface 41 and the extrusion guide surface 42 are connected by a first edge 5, and the first edge 5 is located at the top of the extrusion guide surface 42. When the elastic member is in the initial state, the minimum distance between the first edge 5 and the center of the accommodating groove 2 is equal to the radius of the wafer 11; the pressing surface 43 is arranged to be inclined downward, and its top edge is combined with the extrusion guide surface 42.

[0024] Furthermore, the clamping block is an arc-shaped block bent around the center of the accommodating groove 2 , and the bending radius of the arc-shaped block is not greater than the radius of the wafer 11 .

[0025] The specific implementation process of the utility model is as follows: the wafer 11 is placed along the depth direction of the accommodating groove 2, the side edge of the wafer 11 will stop at the step surface area where the first edge 5 is located, and will be preliminarily positioned under the action of the positioning surface 41, and the wafer 11 will continue to be placed, and the bottom edge of the wafer 11 will squeeze the guide surface 42, and the clamping block 4 will squeeze the spring to retract under the guidance of the guide mechanism until the wafer 11 is pressed down to below the clamping surface 43, and the wafer 11 is squeezed and clamped under the action of the spring; when the wafer 11 needs to be removed, the handle 34 is pulled to open the clamping block to take out the wafer 11.

[0026] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. The present invention can be used on similar products. Any changes or modifications made by any technician in the field of the present invention are covered by the patent scope of the present invention.

Claims

1. A wafer fixture for electroplating a wafer surface, comprising a fixture body (1), wherein the fixture body (1) is provided with a receiving groove (2) for placing a wafer (11), wherein: It also includes a positioning clamping assembly, the positioning clamping assembly including a clamping block (4), a guide mechanism for guiding the movement of the clamping block (4), and an elastic member for providing a clamping force for the clamping block (4), the clamping block (4) being at least partially located in the receiving groove (2), and n clamping blocks (4) are provided around the circumference of the receiving groove (2), and n is not less than 3, and the clamping blocks (4) can extrude the wafer (11) along the guide of the guide mechanism under the action of the elastic member; The clamping block (4) is provided with a positioning surface (41), an extrusion guide surface (42) and a pressing surface (43) in order from top to bottom on the side facing the wafer (11); the extrusion guide surface (42) is an inclined surface inclined upward; the positioning surface (41) and the extrusion guide surface (42) are connected by a first edge (5), and the first edge (5) is located at the top of the extrusion guide surface (42); in the initial state of the elastic member, the minimum distance between the first edge (5) and the center of the accommodating groove (2) is equal to the radius of the wafer (11); the pressing surface (43) is arranged to be inclined downward, and when the wafer (11) is clamped, the pressing surface (43) is in pressing contact with the side edge of the wafer (11).

2. The wafer fixture for wafer surface electroplating according to claim 1, characterized in that: The positioning surface (41) is an inclined surface inclined upward, and its inclination is smaller than the inclination of the extrusion guide surface (42).

3. The wafer fixture for wafer surface electroplating according to claim 1, characterized in that: The extrusion guide surface (42) is a convex arc surface.

4. The wafer fixture for wafer surface electroplating according to claim 1, characterized in that: The clamping block is an arc-shaped block bent around the center of the accommodating groove (2), and the bending radius of the arc-shaped block is not greater than the radius of the wafer (11).

5. The wafer fixture for wafer surface electroplating according to claim 1, characterized in that: The guiding mechanism comprises a guide platform (31) arranged on the fixture body (1) and a guide rod (32) passing through the guide platform (31); one end of the guide rod (32) is connected to the clamping block (4), and the other end passes through the guide platform (31) and is fixedly connected to a pull handle.

6. The wafer fixture for wafer surface electroplating according to claim 5, characterized in that: The elastic member is a spring sleeved on the guide rod (32), and its two ends are respectively in contact with the guide platform (31) and the clamping block (4).

7. The wafer fixture for wafer surface electroplating according to claim 5, characterized in that: The guide rod (32) is a non-circular rod.

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