Novel temperature measuring head packaging assembly
By using a combination design of thermal sensitive components, copper studs and epoxy resin glue in the temperature measuring head packaging assembly, the problems of poor contact and poor waterproof performance of existing temperature measuring heads in the medium frequency furnace environment are solved, and the problem of poor waterproof performance of existing temperature measuring heads is achieved. Real-time temperature measurement and convenient disassembly in harsh environments.
Patent Information
- Application Number
- CN202420153006.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-22
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-01-22
AI Technical Summary
The existing temperature measuring heads have problems such as poor contact, insensitive reaction, large temperature measurement error, poor waterproof performance, and cumbersome disassembly and inconvenient replacement. It is especially difficult to meet the real-time temperature measurement needs in the harsh environment of the medium-frequency furnace.
A new thermometer packaging assembly was designed, including a thermosensitive element, a package, a connector and a connecting wire. The thermosensitive element is encapsulated in the packaging and is filled and connected by copper studs and epoxy resin glue. Ensure electrical connection and waterproof performance, while using an independent butt structure for easy disassembly and assembly and replacement.
It realizes anti-collision and waterproofing in harsh environments, is convenient to disassemble and assemble, safe and stable, has high adaptability, avoids the risk of short circuit, and is suitable for real-time temperature measurement in high-temperature and high voltage environments such as medium-frequency furnaces.
Smart Images

Figure CN222166342U_ABST
