High-speed waveform transformation module with stable installation

Abstract

The utility model relates to the technical field of high-speed waveform transformation modules, and discloses a high-speed waveform transformation module with stable installation, which comprises a high-speed waveform transformation module and a support device. Time domain signals can be converted into frequency domain signals for spectral analysis through the high-speed waveform conversion module, the high-speed waveform conversion module can be supported through the supporting device, damping can be conducted on the bottom of a circuit board through the damping assembly, and the circuit board can be clamped through the two clamping assemblies. The high-speed waveform conversion module and the supporting device can be fixed or disengaged, the damping effect on the circuit board is further improved through the multiple damping springs and the multiple sponge pads, the effects of damping and rapid assembly of the high-speed waveform conversion module can be achieved, and the problem that the high-speed waveform conversion module does not have the damping function and cannot be assembled rapidly is solved. And the connecting part is easily abraded due to vibration, so that the stable effect of installation is influenced.

Description

Technical Field

[0001] The utility model belongs to the technical field of high-speed waveform conversion modules, and in particular relates to a high-speed waveform conversion module with stable installation. Background Art

[0002] The high-speed waveform transformation module generally refers to a module implemented using a fast Fourier transform algorithm for converting a time domain signal into a frequency domain signal for spectrum analysis.

[0003] The high-speed waveform conversion module is usually an independent circuit board, which is used to provide the frequency domain analysis function of the high-speed signal. When the high-speed waveform conversion module needs to be installed, the existing installation method of the high-speed waveform conversion module is often to fix it with screws at the four corners. When the high-speed waveform conversion module is subjected to vibration, because the high-speed waveform conversion module is fixed by screws, it is easy for the components of the high-speed waveform conversion module to be damaged, and the connection parts to be worn, resulting in weakened installation effect, insufficient stability, and failure to make the high-speed waveform conversion module have a shock-absorbing function. The problem with the above technology is that the high-speed waveform conversion module does not have a shock-absorbing function, and it is easy for the connection parts to be worn when subjected to vibration, which affects the stability of the installation. Utility Model Content

[0004] In view of the problems existing in the prior art, the utility model provides a high-speed waveform conversion module with stable installation, which can overcome the above problems or at least partially solve the above problems.

[0005] The utility model is implemented as follows: a high-speed waveform conversion module with stable installation includes a high-speed waveform conversion module and a supporting device, wherein the high-speed waveform conversion module includes a circuit board and a plurality of components, wherein the plurality of components are installed on the top of the circuit board, wherein the supporting device includes four plug-in rods, four sockets and a base, wherein the surfaces of the four plug-in rods are respectively plug-connected with the four corners inside the circuit board, wherein the insides of the four sockets are respectively plug-connected with the bottoms of the four plug-in rods, wherein the bottoms of the four sockets are respectively fixedly connected with the four corners of the top of the base, and wherein a shock absorbing assembly is arranged at the opposite ends of the circuit board and the base;

[0006] The high-speed waveform conversion module is used to convert the time domain signal into a frequency domain signal for spectrum analysis;

[0007] The supporting device is used to support the high-speed waveform conversion module.

[0008] In order to enable the high-speed waveform conversion module to be connected and fixed to the supporting device, preferably, the four corners inside the base can be fixed by bolts, the insides of the four sockets can be plugged and connected with fixing rods, the surfaces of the four fixing rods can be plugged and connected with the bottoms inside the four plug-in rods, the left and right sides of the top of the base are fixedly connected with matching blocks, the insides of the two matching blocks are each provided with a cavity, the insides of the two cavities are each provided with a clamping assembly, the sides of the four fixing rods close to the two matching blocks are plugged and connected with the two matching blocks and in close contact, and the two clamping assemblies are used in conjunction with the four fixing rods in the two cavities to achieve a fixed connection between the two matching blocks and the four fixing rods.

[0009] In order to achieve shock absorption on the circuit board, preferably, the shock absorption assembly includes four limiting blocks, two movable blocks, four movable rods, two sliders and three shock absorption springs, the interiors of the four limiting blocks are respectively plugged and connected with the left and right sides of the front and rear sides of the circuit board, the four limiting blocks are fixedly connected to the two movable blocks on one side close to the two movable blocks, the tops of the four movable rods are movably connected to the surfaces of the two movable blocks, the bottoms of the four movable rods are movably connected to the tops of the surfaces of the two sliders, the bottoms of the two sliders are in close contact with the top of the base, and the two sliders are fixedly connected to the three shock absorption springs on one side close to the three shock absorption springs. Through the shock absorption assembly, the four limiting blocks and the two movable blocks will move when the circuit board shakes, the two movable blocks will cause the four movable rods to drive the two sliders to move, and the two sliders will cause the three shock absorption springs to deform, and under the elastic action of the three shock absorption springs, shock absorption of the circuit board is achieved.

[0010] In order to fix or disengage the two fixing rods from the matching block, preferably, the clamping assembly on the left side includes a U-shaped block, two pull blocks and an elastic spring. The surfaces of the U-shaped block and the two pull blocks are movably connected to the inside of the cavity. The front and rear sides of the left side of the U-shaped block are fixedly connected to the right sides of the two pull blocks. The right side of the elastic spring is fixedly connected to the center of the left side of the U-shaped block. The left side of the elastic spring is fixedly connected to the left side of the inner wall of the cavity. Through the clamping assembly, the right side of the U-shaped block can be moved to the inside of the two fixing rods. The elastic spring plays a fixing and rebounding role, so that the U-shaped block and the two pull blocks can automatically rebound to their original positions after moving.

[0011] In order to further improve the shock-absorbing effect on the circuit board, preferably, sponge pads are fixedly connected to the four corners of the top and bottom of the circuit board, the interiors of the multiple sponge pads are slidably connected to the surfaces of the four plug-in rods, the tops of the four plug-in rod surfaces are sleeved with damping springs, the sides of the four damping springs close to the four plug-in rods are fixedly connected to the four plug-in rods, and the sides of the four damping springs close to the multiple sponge pads are fixedly connected to the multiple sponge pads. Through the multiple sponge pads and the four damping springs, under the elastic action of the four damping springs, shock absorption of the circuit board is achieved, and the use of multiple sponge pads plays a protective role to avoid wear during the vibration process.

[0012] In order to limit the moving range of the two sliders, preferably, the front and rear sides of the two sliders are slidably connected with baffles and in close contact, and the tops of the opposite ends of the two baffles are fixedly connected with cover plates. Through the two baffles and the cover plates, the two sliders can only move to the left or right. The cover plates can make the two baffles more stable and can protect the three shock-absorbing springs.

[0013] In order to make the U-shaped block and the two pulling blocks move better, preferably, the interiors of the two L-shaped blocks are slidably connected with round rods and in close contact, and the two round rods are fixedly connected to the cavity on one side close to the inner wall of the cavity, and the right side of the U-shaped block passes through the matching block and the two fixing rods in sequence through the cavity and extends to the interior of the two fixing rods. Through the two round rods, the U-shaped block and the two pulling blocks can only move to the left or right inside the cavity, and the surface of the U-shaped block is in close contact with the interiors of the matching block and the two fixing rods.

[0014] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0015] The utility model provides structural components such as a high-speed waveform conversion module, a circuit board, components, a supporting device, a plug-in rod, a socket and a base. The high-speed waveform conversion module can convert a time domain signal into a frequency domain signal for spectrum analysis, the high-speed waveform conversion module can be supported by the supporting device, the bottom of the circuit board can be damped by a damping component, the high-speed waveform conversion module can be fixed to or out of contact with the supporting device by two clamping components, and the damping effect on the circuit board is further improved by multiple damping springs and multiple sponge pads, thereby achieving the effect of damping the high-speed waveform conversion module and quickly assembling it. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of a three-dimensional structure provided by an embodiment of the utility model;

[0017] Figure 2 This is a front perspective structural diagram of a circuit board provided by an embodiment of the utility model;

[0018] Figure 3 It is a three-dimensional structural diagram of a shock absorbing assembly provided by an embodiment of the utility model;

[0019] Figure 4 It is a three-dimensional structural diagram of two fixing rods and a matching block separated from each other provided by an embodiment of the utility model;

[0020] Figure 5 It is a detailed stereogram of a local structure provided by an embodiment of the utility model;

[0021] Figure 6 It is a top sectional view of a matching block provided by an embodiment of the utility model.

[0022] In the figure: 1, high-speed waveform conversion module; 1a, circuit board; 1b, components; 2, supporting device; 2a, plug-in rod; 2b, socket; 2c, base; 3, fixing rod; 4, matching block; 5, cavity; 6, clamping assembly; 601, U-shaped block; 602, pulling block; 603, elastic spring; 7, shock absorbing assembly; 701, limiting block; 702, movable block; 703, movable rod; 704, slider; 705, shock absorbing spring; 8, sponge pad; 9, damping spring; 10, baffle; 11, cover plate; 12, round rod. DETAILED DESCRIPTION

[0023] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0024] The structure of the utility model is described in detail below in conjunction with the accompanying drawings.

[0025] like Figures 1 to 6As shown, an embodiment of the utility model provides a high-speed waveform transformation module with stable installation, including a high-speed waveform transformation module 1 and a supporting device 2. The high-speed waveform transformation module 1 includes a circuit board 1a and multiple components 1b, and the multiple components 1b are all installed on the top of the circuit board 1a. The supporting device 2 includes four plug-in rods 2a, four sockets 2b and a base 2c. The surfaces of the four plug-in rods 2a are plug-connected with the four corners inside the circuit board 1a respectively, and the insides of the four sockets 2b are plug-connected with the bottoms of the four plug-in rods 2a. The bottoms of the four sockets 2b are fixedly connected with the four corners of the top of the base 2c respectively. The opposite ends of the circuit board 1a and the base 2c are provided with a shock absorbing component 7; the high-speed waveform transformation module 1 is used to convert a time domain signal into a frequency domain signal Perform spectrum analysis; the supporting device 2 is used to support the high-speed waveform conversion module 1. In order to enable the high-speed waveform conversion module 1 to be connected and fixed to the supporting device 2, the four corners inside the base 2c can be fixed by bolts, and the four sockets 2b can be plugged and connected with fixing rods 3. The surfaces of the four fixing rods 3 can be plugged and connected with the bottoms of the four plug-in rods 2a. The left and right sides of the top of the base 2c are fixedly connected with matching blocks 4, and the two matching blocks 4 are provided with cavities 5. The two cavities 5 are provided with clamping components 6. The sides of the four fixing rods 3 close to the two matching blocks 4 are plugged and connected with the two matching blocks 4 and are in close contact with them. Through the two clamping components 6, the two clamping components 6 are connected to the four fixing rods in the two cavities 5. The rods 3 are used in coordination to realize the fixed connection between the two coordination blocks 4 and the four fixed rods 3. In order to achieve the shock absorption effect on the circuit board 1a, the shock absorption assembly 7 includes four limiting blocks 701, two movable blocks 702, four movable rods 703, two sliders 704 and three shock absorption springs 705. The interiors of the four limiting blocks 701 are respectively plugged and connected with the left and right sides of the front and rear sides of the circuit board 1a, and the sides of the four limiting blocks 701 close to the two movable blocks 702 are fixedly connected with the two movable blocks 702. The tops of the four movable rods 703 are movably connected with the surfaces of the two movable blocks 702, and the bottoms of the four movable rods 703 are movably connected with the tops of the surfaces of the two sliders 704. The bottoms of the two sliders 704 are connected to the top of the base 2c. The two sliders 704 are in close contact with the three damping springs 705, and the sides of the two sliders 704 close to the three damping springs 705 are fixedly connected to the three damping springs 705. Through the damping assembly 7, when the circuit board 1a shakes, the four limiting blocks 701 and the two movable blocks 702 will move. The two movable blocks 702 will make the four movable rods 703 drive the two sliders 704 to move. The two sliders 704 will cause the three damping springs 705 to deform. Under the elastic action of the three damping springs 705, the damping of the circuit board 1a is achieved. In order to fix or disengage the two fixing rods 3 from the matching block 4, the left clamping assembly 6 includes a U-shaped block 601, two pulling blocks 602 and an elastic spring 603. The surfaces of the U-shaped block 601 and the two pulling blocks 602 are movably connected to the inside of the cavity 5.The front and rear sides of the left side of the U-shaped block 601 are fixedly connected to the right sides of the two pull blocks 602, the right side of the elastic spring 603 is fixedly connected to the center of the left side of the U-shaped block 601, and the left side of the elastic spring 603 is fixedly connected to the left side of the inner wall of the cavity 5. Through the clamping component 6, the right side of the U-shaped block 601 can be moved to the inside of the two fixing rods 3. The elastic spring 603 plays a fixing and rebounding role, so that the U-shaped block 601 and the two pull blocks 602 can automatically rebound to their original positions after moving, in order to further improve the shock absorption effect on the circuit board 1a. The four corners of the top and bottom of the circuit board 1a are fixedly connected with sponge pads 8, the interiors of the multiple sponge pads 8 are slidably connected to the surfaces of the four plug-in rods 2a, the tops of the surfaces of the four plug-in rods 2a are sleeved with damping springs 9, the sides of the four damping springs 9 close to the four plug-in rods 2a are fixedly connected to the four plug-in rods 2a, the sides of the four damping springs 9 close to the multiple sponge pads 8 are fixedly connected to the multiple sponge pads 8, through the multiple sponge pads 8 and the four damping springs 9, under the elastic action of the four damping springs 9, the circuit board 1a is realized. Shock absorption, the use of multiple sponge pads 8 plays a protective role to avoid wear during the vibration process. In order to limit the moving range of the two sliders 704, the front and rear sides of the two sliders 704 are slidably connected with baffles 10 and in close contact. The tops of the opposite ends of the two baffles 10 are fixedly connected with cover plates 11. Through the two baffles 10 and the cover plates 11, the two sliders 704 can only move to the left or right. The cover plates 11 can make the two baffles 10 more stable and can protect the three shock-absorbing springs 705. In order to make the U-shaped block 601 and The two pull blocks 602 can move better. The insides of the two L-shaped blocks are slidably connected with round rods 12 and are in close contact. The sides of the two round rods 12 close to the inner wall of the cavity 5 are fixedly connected to the cavity 5. The right side of the U-shaped block 601 passes through the cavity 5 and sequentially penetrates the matching block 4 and the two fixed rods 3 and extends to the inside of the two fixed rods 3. Through the two round rods 12, the U-shaped block 601 and the two pull blocks 602 can only move to the left or right in the cavity 5. The surface of the U-shaped block 601 is in close contact with the inside of the matching block 4 and the two fixed rods 3.

[0026] The working principle of this utility model:

[0027] When it is necessary to disengage the two fixing rods 3 from the matching block 4, the two pulling blocks 602 are pulled to the left by manpower and the U-shaped block 601 is moved to the left, so that the right side of the U-shaped block 601 is moved out from the inside of the two fixing rods 3. At this time, the two fixing rods 3 can be pulled to move in the opposite direction and move out from the inside of the matching block 4, the two sockets 2b and the two plug-in rods 2a, so that the circuit board 1a can be moved upward and disengaged from the base 2c. First, the two plug-in rods 2a are plugged and connected with the two sockets 2b, and then the two fixing rods 3 are inserted into the two sockets 2b, the two plug-in rods 2a and the matching block 4 in turn. The movement of the U-shaped block 601 to the left will cause the elastic spring 603 to deform. After releasing the two pulling blocks 602, Under the elastic action of the elastic spring 603, the two pulling blocks 602 will drive the U-shaped block 601 to rebound to the inside of the two fixing rods 3, so that the circuit board 1a can be fixed to the base 2c. When the circuit board 1a shakes, the four limiting blocks 701 and the two movable blocks 702 will move. The two movable blocks 702 will cause the four movable rods 703 to drive the two sliders 704 to move. The two sliders 704 will cause the three shock-absorbing springs 705 to deform. Under the elastic action of the three shock-absorbing springs 705, the circuit board 1a is damped. When the circuit board 1a shakes, under the elastic action of the four damping springs 9, the circuit board 1a is damped. The use of multiple sponge pads 8 plays a protective role to avoid wear during the vibration process.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0029] The above description is only a preferred embodiment of the utility model, and does not constitute any form of limitation to the utility model. Although the utility model has been disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this patent will not depart from the scope of the technical solution of the utility model.

Claims

1. A high-speed waveform conversion module with stable installation, comprising a high-speed waveform conversion module (1) and a supporting device (2), characterized in that: The high-speed waveform conversion module (1) comprises a circuit board (1a) and a plurality of components (1b), wherein the plurality of components (1b) are mounted on the top of the circuit board (1a); the support device (2) comprises four plug-in rods (2a), four sockets (2b) and a base (2c); the surfaces of the four plug-in rods (2a) are respectively plug-connected to the four corners inside the circuit board (1a); the insides of the four sockets (2b) are respectively plug-connected to the bottoms of the four plug-in rods (2a); the bottoms of the four sockets (2b) are respectively fixedly connected to the four corners of the top of the base (2c); and a shock absorbing assembly (7) is provided at the opposite ends of the circuit board (1a) and the base (2c); The high-speed waveform conversion module (1) is used to convert the time domain signal into a frequency domain signal for spectrum analysis; The supporting device (2) is used to support the high-speed waveform conversion module (1).

2. A high-speed waveform conversion module with stable installation as claimed in claim 1, characterized in that: The four corners of the base (2c) can be fixed by bolts, the four sockets (2b) can be plugged with fixing rods (3), the surfaces of the four fixing rods (3) can be plugged with the bottoms of the four plug-in rods (2a), the left and right sides of the top of the base (2c) are fixedly connected with matching blocks (4), the two matching blocks (4) are provided with cavities (5), the two cavities (5) are provided with clamping components (6), and the sides of the four fixing rods (3) close to the two matching blocks (4) are plugged with the two matching blocks (4) and in close contact.

3. A high-speed waveform conversion module with stable installation as claimed in claim 1, characterized in that: The shock absorbing assembly (7) comprises four limiting blocks (701), two movable blocks (702), four movable rods (703), two sliders (704) and three shock absorbing springs (705); the interiors of the four limiting blocks (701) are respectively plug-connected with the left and right sides of the front and rear sides of the circuit board (1a); the sides of the four limiting blocks (701) close to the two movable blocks (702) are fixedly connected to the two movable blocks (702); the tops of the insides of the four movable rods (703) are movably connected to the surfaces of the two movable blocks (702); the bottoms of the insides of the four movable rods (703) are movably connected to the tops of the surfaces of the two sliders (704); the bottoms of the two sliders (704) are in close contact with the tops of the base (2c); and the sides of the two sliders (704) close to the three shock absorbing springs (705) are fixedly connected to the three shock absorbing springs (705).

4. A high-speed waveform conversion module with stable installation as claimed in claim 2, characterized in that: The clamping assembly (6) on the left side comprises a U-shaped block (601), two pulling blocks (602) and an elastic spring (603); the surfaces of the U-shaped block (601) and the two pulling blocks (602) are movably connected to the inside of the cavity (5); the front side and the rear side of the left side of the U-shaped block (601) are fixedly connected to the right sides of the two pulling blocks (602); the right side of the elastic spring (603) is fixedly connected to the center of the left side of the U-shaped block (601); and the left side of the elastic spring (603) is fixedly connected to the left side of the inner wall of the cavity (5).

5. A high-speed waveform conversion module with stable installation as claimed in claim 1, characterized in that: The four corners of the top and bottom of the circuit board (1a) are fixedly connected with sponge pads (8); the interiors of the plurality of sponge pads (8) are slidably connected with the surfaces of the four plug-in rods (2a); the tops of the surfaces of the four plug-in rods (2a) are sleeved with damping springs (9); the sides of the four damping springs (9) close to the four plug-in rods (2a) are fixedly connected with the four plug-in rods (2a); and the sides of the four damping springs (9) close to the plurality of sponge pads (8) are fixedly connected with the plurality of sponge pads (8).

6. A high-speed waveform conversion module with stable installation as claimed in claim 3, characterized in that: The front and rear sides of the two sliding blocks (704) are both slidably connected to baffles (10) and in close contact with each other, and the tops of the opposite ends of the two baffles (10) are fixedly connected to cover plates (11).

Images