Bonding jig testing device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and provides a bonding jig testing device, which comprises a base, a first testing unit and a second testing unit, the base is provided with a bearing area used for bearing a to-be-measured target. The first testing unit comprises a first driving part, and the second testing unit comprises a lifting driving part, a rotating driving part and a jacking part. The testing device can drive the isolation unit and the clamping unit to move so as to mode the movement of the isolation unit and the clamping unit during actual bonding, so that the testing device is further used for detecting the stability of the bonding jig and is convenient for improving and perfecting the jig.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a bonding fixture testing device. Background Art

[0002] Wafer bonding technology can combine wafers of different materials together. Wafer bonding is an important process for three-dimensional processing of semiconductor devices. The main process steps of wafer bonding include wafer surface treatment, wafer alignment and final wafer bonding. Bonding is not only a packaging technology in microsystem technology, but also an organic part of three-dimensional device manufacturing. It is used in both the front-end and back-end processes of device manufacturing. The most important bonding applications are the bonding of silicon wafers and silicon wafers and the bonding of silicon wafers and glass substrates.

[0003] The aligned wafer needs to be clamped and positioned by a bonding fixture, and then placed in the wafer bonding chamber for pressurization, heating, and cooling processes.

[0004] Existing bonding jigs are usually equipped with an isolation unit and a clamping unit, wherein the isolation unit is used to be inserted between two wafers to be bonded before the wafer bonding chamber is evacuated, and to remove the wafers after evacuation. The clamping unit needs to be clamped between the two wafers after the two wafers to be bonded are aligned to ensure that the two wafers do not move relative to each other after alignment. Therefore, the isolation unit and the clamping unit need to move frequently. Once the isolation unit and the clamping unit are stuck during movement, the wafer bonding process will be interrupted, and even the wafer will be damaged. Therefore, it is particularly important for the isolation unit and the clamping unit to ensure good stability.

[0005] In order to solve the above problems, the utility model provides a bonding jig testing device, which can test various components on the bonding jig to test the stability of each component of the bonding jig. Utility Model Content

[0006] The purpose of the utility model is to provide a bonding jig testing device, which can drive the isolation unit and the clamping unit to move, so as to model the movement of the two during actual bonding, and then be used to detect the stability of the bonding jig, so as to facilitate the improvement and perfection of the jig.

[0007] The utility model provides a bonding fixture testing device, comprising: a base, a first testing unit and a second testing unit;

[0008] The base has a bearing area for bearing the object to be measured;

[0009] The first test unit comprises a first driving member, the first driving member is arranged on the base, and the driving end of the first driving member moves linearly along a direction parallel to the bearing area;

[0010] The second test unit includes a lifting drive member, a rotating drive member and a lifting member. The lifting drive member is arranged on the base, and the driving end of the lifting drive member moves linearly in a direction perpendicular to the bearing area. The rotating drive member is arranged at the driving end of the lifting drive member, and the rotation center axis of the driving end of the rotating drive member is perpendicular to the bearing area. The lifting member is coaxially connected to the driving end of the rotating drive member.

[0011] Optionally, one end of the lifting member is connected to the driving end of the rotary driving member, and the other end of the lifting member is provided with a slot or a protrusion; along the direction of the rotation center axis of the rotary driving member, the projection of the slot or the protrusion is non-circular.

[0012] Optionally, the bonding fixture testing device further comprises a fixing unit for fixing the object to be tested, and the fixing unit is arranged on the base.

[0013] Optionally, the fixing unit includes a vacuum adsorption mechanism; and the vacuum adsorption mechanism is arranged in the carrying area.

[0014] Optionally, the first test unit also includes a second driving member and a follower, the second driving member is arranged on the base and faces the bearing area, the driving end of the second driving member moves linearly in a direction perpendicular to the bearing area, and the follower is connected to the driving end of the second driving member.

[0015] Optionally, one end of the follower is connected to the driving end of the second driving member, and the other end has a driving surface, and the driving surface is arranged at an angle to the movement direction of the follower.

[0016] Optionally, the bonding jig testing device further comprises an image acquisition unit, wherein the image acquisition unit is disposed on the base, and a lens of the image acquisition unit faces the carrying area.

[0017] Optionally, the image acquisition unit includes an acquisition frame and a lens, the acquisition frame is arranged on the base, and the lens is arranged on the acquisition frame to move along a direction perpendicular to the carrying area.

[0018] Optionally, the bonding fixture testing device further comprises a supporting unit, wherein the supporting unit comprises a supporting leg and an adsorbing member, wherein the supporting leg is connected to the bottom of the base, and the adsorbing member is arranged at the bottom of the supporting leg.

[0019] Optionally, the bearing area is arranged on the top of the base;

[0020] At least a portion of the first test unit is disposed on the top of the base, and at least a portion of the second test unit is disposed on the bottom of the base.

[0021] In summary, the bonding fixture testing device includes: a base, a first test unit and a second test unit; the base has a bearing area for bearing the target to be tested; the first test unit includes a first driving member, the first driving member is arranged on the base, and the driving end of the first driving member moves linearly in a direction parallel to the bearing area; the second test unit includes a lifting driving member, a rotating driving member and a lifting member, the lifting driving member is arranged on the base, the driving end of the lifting driving member moves linearly in a direction perpendicular to the bearing area, the rotating driving member is arranged at the driving end of the lifting driving member, the rotation center axis of the driving end of the rotating driving member is perpendicular to the bearing area, and the lifting member is coaxially connected to the driving end of the rotating driving member.

[0022] With such configuration, the bonding jig test device can drive the isolation unit and the clamping unit to move, so as to simulate the movement of the two during actual bonding, and then be used to detect the stability of the bonding jig. On the one hand, it is used to detect the stability of the first test unit and the second test unit of the bonding jig, and then comprehensively judge the overall performance of the bonding jig, which is conducive to finding out the weak performance or insufficient stability of the bonding jig. On the other hand, it is also conducive to targeted improvement and perfection of the above-mentioned weak or insufficient stability, which is conducive to improving the overall performance of the bonding jig. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the structure of a target to be measured according to an embodiment of the utility model;

[0024] Figure 2 It is a schematic diagram of the three-dimensional structure of a bonding fixture testing device according to an embodiment of the utility model;

[0025] Figure 3 It is a front view structural schematic diagram of a bonding fixture testing device according to an embodiment of the utility model;

[0026] Figure 4 It is a side structural schematic diagram of a bonding fixture testing device according to an embodiment of the utility model.

[0027] In the attached figure:

[0028] 100-target to be measured; 110-substrate; 111-mounting hole; 120-isolation base; 121-driving hole; 122-matching surface; 130-isolating member; 140-clamping member; 150-rotating shaft;

[0029] 10-base; 11-bearing area;

[0030] 20-first test unit; 21-first driving member; 22-second driving member; 23-follower; 231-driving surface; 24-thimble;

[0031] 30-second test unit; 31-lifting drive member; 32-rotation drive member; 33-lifting member; 34-lower mounting plate;

[0032] 40-fixing unit; 41-vacuum adsorption mechanism;

[0033] 50-image acquisition unit; 51-acquisition frame; 511-vertical plate; 512-adjustment plate; 513-hoop; 514-strengthening rib; 52-lens;

[0034] 60-support unit; 61-leg; 62-adsorption member;

[0035] 70-first bracket; 71-leg; 72-mounting plate;

[0036] a-first direction; b-second direction; c-third direction. DETAILED DESCRIPTION

[0037] The bonding fixture proposed by the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer according to the following description. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0038] As used in the present invention, the singular forms "one", "an", and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the terms "at least two" or "a plurality" are usually used to include the meaning of "two or more". In addition, the terms "first", "second", and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or at least two of the features. In addition, as used in the present invention, "installed", "connected", "connected", and one element "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0039] like Figure 1 As shown, the structure of the target to be measured 100 is shown, and the target to be measured can be regarded as a part of the bonding fixture.

[0040] The object to be measured 100 includes a substrate 110 , an isolation base 120 , an isolation member 130 , a clamping member 140 and a rotating shaft 150 .

[0041] The isolation base 120 is a rectangular parallelepiped structure, and the isolation member 130 is a thin sheet structure. One end of the isolation member 130 is connected to the isolation base 120 by screws, and the other end is suspended outside the isolation base 120 in a cantilever structure. A driving hole 121 is provided on the isolation base 120 in a direction perpendicular to the bearing area, and a surface of a side wall of the driving hole 121 serves as a mating surface 122, which is used to cooperate with an external device to drive the isolation base 120 to move; wherein the use of the mating surface 122 is described in the following content in conjunction with the bonding fixture test device of the utility model.

[0042] The substrate 110 has a mounting hole 111 vertically extending therethrough, and the isolation base 120 is disposed in the mounting hole 111. The mounting hole 111 is a square hole as a whole, and the isolation base 120 is also a rectangular parallelepiped slider as a whole, and the width of the isolation base 120 matches the width of the mounting hole 111; the length of the isolation base 120 is smaller than the length of the mounting hole 111, so that the isolation base 120 can slide in the mounting hole 111 along its length direction, thereby driving the isolation member 130 to move horizontally.

[0043] The isolation base 120 and the isolation member 130 serve as isolation units of the bonding fixture. When the isolation base 120 drives the isolation member 130 to move, it has two states, namely an isolation state and a non-isolation state. When the isolation member 130 is in the isolation state, the isolation member 130 moves to the isolation position. At this time, the isolation member 130 is used to isolate between two wafers. When the isolation member 130 is in the non-isolation state, the isolation member 130 is located in the non-isolation position. At this time, the isolation member 130 is pulled out of the wafer.

[0044] Please continue to refer to Figure 1 As shown, the rotating shaft 150 is installed on the substrate 110 so as to be liftable and rotatable in a direction perpendicular to the substrate 110, wherein one end of the rotating shaft 150 is connected to the clamping member 140, and the other end of the rotating shaft 150 passes through the substrate 110, and the end is used to cooperate with the second test unit 30 in the bonding jig test device of the utility model to drive the rotating shaft 150 to be lifted and rotated (the cooperation relationship between the rotating shaft and the bonding jig test device is described in detail in the following content).

[0045] The clamping member 140 and the rotating shaft 150 serve as the clamping unit of the bonding jig. When the clamping member 140 moves, it has two states, one is the clamping state and the other is the releasing state. When the clamping member 140 is in the releasing state, the clamping member 140 rotates to the outside of the wafer and does not cooperate with the wafer. When the clamping member 140 is in the clamping state, the clamping member 140 rotates to the top of the wafer to clamp the wafer. When the clamping member 140 switches from the clamping state to the releasing state, the rotating shaft 150 is first driven to rise, and the clamping member 140 moves upward and separates from the wafer. Then the rotating shaft 150 is driven to rotate. When the clamping member 140 is rotated to the outside of the wafer, the rotating shaft 150 is driven to descend, and the clamping member 140 is in the releasing state. Similarly, when the clamping member 140 switches from the released state to the clamping state, the shaft 150 is first driven to rise and the clamping member 140 moves upward, and then the shaft 150 is driven to rotate. When the clamping member 140 is rotated above the wafer, the shaft 150 is driven to descend and the clamping member 140 presses down on the wafer to form a clamping shape for the wafer. At this time, the clamping member 140 is in a clamping state.

[0046] In order to facilitate the explanation of the principle of the bonding fixture test device in the present invention, the above-mentioned target to be tested 100 proposes an implementation method. In other alternative embodiments, the structure of the isolation member 130 and the motion structure of the clamping member 140 in the target to be tested 100 can be adaptively adjusted based on actual use requirements. It is only necessary to ensure the horizontal linear motion of the isolation member 130 and the rotation and lifting motion of the clamping member 140.

[0047] The above-mentioned target 100 to be measured is a part of a bonding fixture, in which the isolation member is used to be inserted between two wafers to be bonded before the wafer bonding chamber is evacuated, and the wafer is pulled out after evacuation. The clamping member needs to be clamped between the two wafers after the two wafers to be bonded are aligned to ensure that the two wafers do not move relative to each other after alignment. Therefore, the isolation member and the clamping unit need to move frequently. Once the isolation member and the clamping member are stuck during movement, the bonding process of the wafer will be interrupted, and even the wafer will be damaged. Therefore, it is particularly important for the isolation member and the clamping member to ensure good stability.

[0048] Based on this, a bonding fixture testing device is proposed in this embodiment, which is used to test the performance of each component in the bonding fixture.

[0049] Please refer to Figure 2 As shown, the bonding fixture testing device in this embodiment includes: a testing base 10, a first testing unit 20, and a second testing unit 30;

[0050] The test base 10 has a bearing area 11 for bearing the object to be tested; please refer to Figure 2 and Figure 3 As shown, the test base 10 is a rectangular parallelepiped structure with a recessed area on its upper surface, which serves as a bearing area 11. The overall shape of the bearing area 11 is a rectangle that matches the shape of the substrate 110 of the object to be tested 100. The object to be tested 100 can be placed conformably in the bearing area 11. The shape of the bearing area 11 can be adaptively adjusted based on the actual shape of the object to be tested 100.

[0051] The first testing unit 20 includes a first driving member 21 . The first driving member 21 is disposed on the testing base 10 . The driving end of the first driving member 21 moves linearly along a direction parallel to the bearing area 11 .

[0052] Please refer to Figure 2 and Figure 4As shown, the first driving member 21 adopts a cylinder, and the first driving member 21 is installed on the front side of the test base 10, and its driving end moves along the front-to-back direction (first direction a) of the bonding fixture test device. The driving end of the first driving member 21 is connected to a pin 24, and the pin 24 is used to move along the first direction a with the first driving member 21 to drive the isolation base 120 to make a linear motion. In this embodiment, the pin 24 is a cylindrical structure, and the setting of the pin 24 is to cooperate with the isolation base 120. For example, if a driving part is provided on the isolation base 120, the pin 24 cooperates with the driving part to drive the isolation base 120 to move. The specific structure of the pin 24 can be adjusted based on the structural adaptability of the driving part on the isolation base 120.

[0053] Combination Figure 4 As shown, when the ejector pin 24 moves to the left along the first direction a with the first driving member 21, the ejector pin 24 contacts the isolation base 120 and drives the isolation base 120 to move to the left, and the isolation member 130 moves from the non-isolation position to the isolation position with the isolation base 120. When the ejector pin 24 moves to the right along the first direction a with the first driving member 21, the ejector pin 24 releases the driving force on the isolation base 120.

[0054] In this embodiment, in order to further detect the motion state of the isolation base 120 driving the isolation member 130 to move from the isolation position to the non-isolation position ( Figure 4 In the state where the test unit 20 moves rightward along the first direction a), a second driving member 22 and a follower member 23 are further provided in the first test unit 20.

[0055] Please continue to refer to Figure 2 and Figure 4 As shown, the second driving member 22 is arranged on the test base 10 and is located directly above the bearing area 11. The driving end of the second driving member 22 moves linearly along a direction (third direction c) perpendicular to the bearing area 11, and the follower 23 is connected to the driving end of the second driving member 22.

[0056] The test base 10 is provided with a first bracket 70, which includes a support arm 71 and a mounting plate 72, wherein the support arm 71 is approximately L-shaped as a whole, one right-angled side of the support arm 71 is fixedly connected to the base plate, and the other right-angled side of the support arm 71 extends vertically, two support arms 71 are provided and arranged along the length direction (second direction b) of the test base 10, and the mounting plate 72 is fixedly connected between the two support arms 71. The mounting plate 72 is located directly above the bearing area 11. The second driving member 22 adopts a cylinder, and the second driving member 22 is fixedly connected to the mounting plate 72, and the output end of the second driving member 22 faces downward to the bearing area 11, and can perform linear motion in a direction perpendicular to the bearing area 11 (third direction c).

[0057] When the second driving member 22 drives the follower 23 to move along the third direction c, the follower 23 adaptively moves up and down linearly. The follower 23 is used to cooperate with the matching surface 122 on the isolation base 120 to drive the isolation base 120 to drive the isolation member 130 to move to the non-isolation position.

[0058] Please combine Figure 4 As shown, one end of the follower 23 is connected to the driving end of the second driving member 22, and the other end of the follower 23 ( Figure 4 The lower end of the follower 23 has a driving surface 231. When the follower 23 moves downward, the driving surface 231 contacts the matching surface 122 and exerts an influence on the isolation base 120. Figure 4 The driving force for moving rightward along the first direction a.

[0059] In this embodiment, the driving surface 231 is an inclined surface, and the driving surface 231 is set at an angle with the movement direction of the follower 23. The setting of the driving surface 231 makes the follower 23 as a whole present a wedge-shaped structure with a larger top and a smaller bottom. When the follower 23 moves downward, the follower 23 is inserted into the driving hole 121, and the driving surface 231 contacts the mating surface 122, and the isolation base 120 is moved downward. Figure 4 The driving force for rightward movement along the first direction a drives the isolation member 130 to move to the non-isolation position.

[0060] In this embodiment, the mating surface 122 is a plane and a vertical surface, and the driving surface 231 is a plane and a wedge-shaped surface. The linkage between the follower 23 and the isolation base 120 is achieved through the coordination of the vertical surface and the wedge-shaped surface, thereby realizing the linkage between the pressing process of the pressing head of the bonding equipment and the isolation member 130.

[0061] In other alternative embodiments, the mating surface 122 and the driving surface 231 can be set as curved surfaces, or one can be set as a curved surface and the other can be set as a plane, or both can be set as wedge-shaped surfaces; in this embodiment, the driving surface 231 of the test device can be adaptively adjusted based on the mating surface 122 of the bonding fixture.

[0062] Please continue to refer to Figure 2 and Figure 3 As shown, the second testing unit 30 includes a lifting driving member 31 , a rotating driving member 32 and a lifting member 33 .

[0063] The second testing unit 30 is used to realize the lifting and rotating drive of the clamping member 140 .

[0064] like Figure 2 and Figure 3 As shown, a lower mounting plate 34 is provided at the bottom of the test base 10 . The lower mounting plate 34 is a rectangular plate. The lifting drive member 31 is installed on the lower mounting plate 34 . The lifting drive member 31 adopts a cylinder.

[0065] The driving end of the lifting driving member 31 moves linearly along a direction (third direction c) perpendicular to the carrying area 11 , and the rotating driving member 32 is arranged at the driving end of the lifting driving member 31 and can be driven by the lifting driving member 31 to perform lifting motion.

[0066] The rotating driving member 32 is a rotating cylinder, and the rotation center axis of the driving end of the rotating driving member 32 is perpendicular to the bearing area 11, that is, the rotation axis of the rotating driving member 32 extends along the third-party direction c. The lifting member 33 is coaxially connected to the driving end of the rotating driving member 32, so the lifting member 33 can be driven to rotate.

[0067] The lifting member 33 is mainly used to cooperate with the bottom of the rotating shaft 150, and is used to drive the rotating shaft 150 to rise and fall on one hand, and to drive the rotating shaft 150 to rotate on the other hand.

[0068] In this embodiment, one end of the lifting member 33 is connected to the driving end of the rotating drive member 32, and the other end of the lifting member 33 is provided with a slot or a protrusion; along the direction of the rotation center axis of the rotating drive member 32, the projection of the slot or the protrusion is non-circular. The non-circular structure is set to form a transmission matching relationship between the lifting member 33 and the rotating shaft 150.

[0069] For example, a cross-shaped groove is provided on the lifting member 33, and a cross-shaped protrusion adapted to the cross-shaped groove is provided at the bottom of the rotating shaft 150. When the lifting member 33 is raised, the cross protrusion is inserted into the cross-shaped groove, and when the lifting member 33 rotates, the rotating shaft 150 is driven to rotate.

[0070] The lifting member 33 may also be provided with a straight groove, a rectangular groove, an elliptical groove or other non-circular grooves; in addition, the lifting member 33 may also be provided with a straight protrusion, a rectangular protrusion, an elliptical protrusion or other non-circular protrusions. The lifting member 33 may be provided with grooves or protrusions adaptively based on actual needs, and the shape of the grooves or protrusions may be adjusted based on actual matching needs. They will not be described one by one here.

[0071] In this embodiment, the lifting member 33 and the driving end of the rotary driving member 32 are two relatively independent components. In other alternative embodiments, the lifting member 33 can be integrally formed with the driving end of the rotary driving member 32.

[0072] During the detection process, when the simulated clamping member 140 rotates from the clamping state to the released state, the lifting drive member 31 first drives the rotating drive member 32 and the lifting member 33 to rise, and the lifting member 33 moves upward to contact and cooperate with the rotating shaft 150, and the lifting member 33 continues to move upward and drives the rotating shaft 150 to rise. After the clamping member 140 is raised with the rotating shaft 150, the lifting member 33 is driven to rotate by the rotating drive member 32, and then the rotating shaft 150 drives the clamping member 140 to rotate to a position outside the wafer, and then the lifting drive member 31 drives the rotating drive member 32 and the lifting member 33 to lower, and the rotating shaft 150 and the clamping member 140 are lowered to the released state. Similarly, when the simulated clamping member 140 rotates from the released state to the clamping state, it is similar to the above-mentioned driving method and will not be described in detail here.

[0073] In this embodiment, the first driving member 21, the second driving member 22, the lifting driving member 31 and the rotating driving member 32 are all cylinders, and the structure, movement principle and installation method of each cylinder are all existing technologies and are not described here. In other alternative embodiments, the above-mentioned driving members can be replaced by other existing driving structures such as hydraulic cylinders and motors.

[0074] In this embodiment, by observing the actions of the above-mentioned driving members, it is judged whether the movement of each component is smooth. In addition, in order to more accurately detect the movement state of each driving member, a position sensor can be set on each driving member to detect the action position of the driving end corresponding to each driving member. For example, a position sensor is set on the first driving member 21, the second driving member 22 and the lifting driving member 31, and an angle sensor is set on the driving end of the rotating driving member 32, so as to judge whether the driving end of the driving member is in action and whether it is in place when it moves. If the driving end of the driving member does not reach the specified position, it is considered that the corresponding component of the target 100 to be measured is stuck in motion, and the system issues an alarm. The sensor on each driving member can be, for example, a beam sensor or a contact sensor, and inductive, capacitive, ultrasonic or Hall sensors can be selected according to the principle. The installation and use of position sensors are prior art and will not be described in detail here.

[0075] Please continue to refer to Figure 2 As shown, the bonding fixture testing device further includes a fixing unit 40 for fixing the object to be tested, and the fixing unit 40 is disposed on the testing base 10 .

[0076] In this embodiment, the fixing unit 40 includes a vacuum adsorption mechanism 41 ; the vacuum adsorption mechanism 41 is disposed in the carrying area 11 .

[0077] like Figure 2As shown, the vacuum suction mechanism 41 is a vacuum suction nozzle, and a plurality of vacuum suction nozzles are arranged in an array in the carrying area 11. When the substrate 110 of the target 100 to be measured is placed in the carrying area 11, it can be sucked and fixed by the vacuum suction nozzle. The substrate 110 is fixed, and the movement state of each component can be detected in the scenario where the substrate 110 is fixed. The fixing of the substrate 110 is used to simulate the scene in which the bonding fixture is sucked and fixed by the wafer alignment device and the bonding device during wafer alignment or bonding, so as to truly restore the use scenario of the bonding fixture, and then test various functions in this use scenario.

[0078] In other alternative embodiments, the fixing unit 40 may also be a vacuum groove integrated on the surface of the carrying area 11, or the fixing unit 40 may be a mechanical fixing structure, such as a fixing structure such as a buckle. Preferably, the fixing unit 40 is consistent with the structure used to fix the bonding jig on the existing wafer alignment equipment to truly restore the actual use scenario of the bonding jig.

[0079] When the isolation base 120, the isolation member 130, the clamping member 140 and the rotating shaft 150 are driven to move, the torque generated by them will affect the stability of the substrate 110. Therefore, in this embodiment, an image acquisition unit 50 is further provided, and the image acquisition unit 50 is disposed on the test base 10, and the lens of the image acquisition unit 50 faces the bearing area 11, and is used to observe the stability of the substrate 110 of the target 100 to be tested.

[0080] Please continue to refer to Figure 2 and Figure 3 As shown, the image acquisition unit 50 includes an acquisition frame 51 and a lens 52 . The acquisition frame 51 is disposed on the test base 10 , and the lens 52 is disposed on the acquisition frame 51 to move along a direction perpendicular to the carrying area 11 .

[0081] The collection frame 51 includes a vertical plate 511, an adjustment plate 512, a hoop 513 and a reinforcing rib 514. The vertical plate 511 is L-shaped, one right-angle side of the vertical plate 511 is connected to the test base 10, the other right-angle side of the vertical plate 511 extends vertically (along the third direction c), and the reinforcing rib 514 is perpendicular to the two right-angle sides of the vertical plate 511, and the reinforcing rib 514 is connected to the two right-angle sides of the vertical plate 511. In this way, the collection frame 51 is ensured to have a high structural strength and rigidity.

[0082] The clamp 513 is arranged on the adjustment plate 512, and the lens 52 is connected to the adjustment plate 512 through the clamp 513, and the clamp 513 is an existing standard part. The adjustment plate 512 is in contact with the vertical edge of the vertical plate 511, and the adjustment plate 512 can be adjusted vertically relative to the vertical plate 511. The vertical plate 511 is provided with a plurality of waist-shaped holes, which extend vertically, and the adjustment plate 512 is connected to the vertical plate 511 by bolts passing through the waist-shaped holes, so as to achieve the purpose of adjusting the position of the lens 52 vertically on the acquisition frame 51.

[0083] The lens 52 is used to obtain the relative position image between the substrate 110 of the target 100 to be tested and the test base 10 of the test device, so as to determine whether the target 100 to be tested has relative motion, and then to test the stability of the target 100 to be tested. The lens 52 can be selected based on actual needs, such as focal length, frame, etc.; the lens 52 can be directly purchased from an existing camera, which will not be described in detail here.

[0084] In other alternative embodiments, the acquisition frame 51 may adopt a track-type lifting structure, a screw-nut lifting structure, a scissor-fork lifting structure or other known lifting structures to drive the lens 52 to move along the third direction c. The lens 52 may be connected to the acquisition frame 51 by screw fastening, welding or the like.

[0085] Please continue to refer to Figures 2 to 4 As shown, the bonding fixture testing device further includes a supporting unit 60 , and the supporting unit 60 includes a supporting leg 61 and an adsorbing member 62 . The supporting leg 61 is connected to the bottom of the testing base 10 , and the adsorbing member 62 is disposed at the bottom of the supporting leg 61 .

[0086] The legs 61 are cylindrical in structure, and are provided with four legs and distributed at four corners. The adsorbent 62 is connected to the bottom of the legs 61 and is used to adsorb the legs 61 on the workbench to fix the entire test device. In this embodiment, the adsorbent 62 adopts a disc-shaped magnetic structure. In other alternative embodiments, the adsorbent 62 can adopt a vacuum suction cup or other known adsorption structures.

[0087] By disposing the supporting unit 60 , there is enough space below the test base 10 , which is convenient for the overall layout of various components in the test device.

[0088] In other alternative embodiments, the structure, quantity and location of the legs 61 can be adaptively adjusted based on the requirements of stability and the spatial layout of the components of the testing device.

[0089] Combine the following Figures 1 to 4 The testing process of the bonding fixture testing device in this embodiment is described.

[0090] First, the entire test device is placed on the test table, and the test device is fixed on the test table by adsorption by the adsorption member 62. The target 100 to be tested is placed on the carrying area 11, and the substrate 110 of the target 100 to be tested is fixed by adsorption by the fixing unit 40.

[0091] The first driving member 21 moves, and its output end touches the isolation base 120 and drives the isolation base 120 to move. The isolation base 120 moves from the non-isolation position to the isolation position with the isolation member 130. The isolation base 120 is subjected to friction during the movement, and the friction ensures that the posture of the isolation base 120 remains stable after the driving force of the first driving member 21 is unloaded. This action simulates the state in which the isolation member moves to the isolation position to be inserted between the two wafers.

[0092] After the isolation base 120 slides into place, the driving end of the first driving member 21 is reset, and the lifting driving member 31 moves, driving the rotating driving member 32 and the lifting member 33 to move upward. After the lifting member 33 contacts and cooperates with the rotating shaft 150 of the target 100 to be measured, the rotating shaft 150 and the clamping member 140 are driven to rise. Then the rotating driving member 32 rotates, driving the rotating shaft 150 and the clamping member 140 to rotate. After the clamping member 140 rotates into place, the driving end of the lifting driving member 31 is lowered, driving the rotating shaft 150 and the clamping member 140 to lower and press on the isolation member 130. In this way, the position conversion of the clamping member 140 from the released state to the clamped state is realized. This action simulates the action of the clamping member 140 clamping two wafers.

[0093] The second driving member 22 drives the follower 23 downward, and the follower 23 is inserted into the driving hole 121, and the driving surface 231 contacts the mating surface 122, and exerts a driving force to move the isolation base 120, thereby driving the isolation member 130 to move to the non-isolation position. This action simulates the action of the isolation member pulling away from the wafer when two wafers are bonded.

[0094] The lifting drive member 31 moves, driving the rotating drive member 32 and the lifting member 33 upward. After the lifting member 33 contacts and cooperates with the rotating shaft 150 of the target 100 to be measured, the rotating shaft 150 and the clamping member 140 are driven to rise. Then the rotating drive member 32 rotates, driving the rotating shaft 150 and the clamping member 140 to rotate. After the clamping member 140 rotates to the right position, the driving end of the lifting drive member 31 is lowered, driving the rotating shaft 150 and the clamping member 140 to be lowered, and the clamping member 140 is reset. In this way, the position conversion of the clamping member 140 from the clamping state to the released state is realized. At this point, a complete test cycle is completed, and the next action cycle can be carried out.

[0095] During the above test process, the following items are tested:

[0096] After observing a series of movements of the target 100 through the image acquisition unit 50 , whether the substrate 110 of the target 100 has a sub-micron offset relative to the test base 10 of the test device is detected, thereby detecting the stability of the bonding fixture.

[0097] During a series of actions, will the first driving member 21, the second driving member 22, the lifting driving member 31 and the rotating driving member 32 get stuck during long-term operation? If no jamming occurs, it proves that the various components of the test device are running smoothly; if jamming occurs, it proves that the various components of the test device are not running smoothly, thereby locating the stuck components, analyzing the causes of the jamming, and making corresponding improvements.

[0098] The test device is running for a long time to find out where the performance of the target to be tested is weak or the stability is insufficient, so that improvements can be made before the formal fixture is made.

[0099] After the test, the entire target 100 to be tested can be placed in a high temperature environment for baking to simulate the actual bonding environment, and then taken out and cooled for testing to determine the stability after high temperature.

[0100] In summary, the bonding fixture testing device includes: a test base 10, a first test unit 20 and a second test unit 30; the test base 10 has a bearing area 11 for bearing the target to be tested; the first test unit 20 includes a first driving member 21, the first driving member 21 is arranged on the test base 10, and the driving end of the first driving member 21 moves linearly in a direction parallel to the bearing area 11; the second test unit 30 includes a lifting driving member 31, a rotating driving member 32 and a lifting member 33, the lifting driving member 31 is arranged on the test base 10, the driving end of the lifting driving member 31 moves linearly in a direction perpendicular to the bearing area 11, the rotating driving member 32 is arranged at the driving end of the lifting driving member 31, the rotation center axis of the driving end of the rotating driving member 32 is perpendicular to the bearing area 11, and the lifting member 33 is coaxially connected to the driving end of the rotating driving member 32.

[0101] With such configuration, the bonding jig test device can drive the isolation unit and the clamping unit to move, so as to simulate the movement of the two during actual bonding, and then be used to detect the stability of the bonding jig. On the one hand, it is used to detect the stability of the first test unit 20 and the second test unit 30 of the bonding jig, and then comprehensively judge the overall performance of the bonding jig, which is conducive to finding out the weak performance or insufficient stability of the bonding jig. On the other hand, it is also conducive to targeted improvement and perfection of the above-mentioned weak or insufficient stability, which is conducive to improving the overall performance of the bonding jig.

[0102] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0103] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A bonding fixture testing device, characterized in that: include: a base, a first test unit and a second test unit; The base has a bearing area for bearing the object to be measured; The first test unit comprises a first driving member, the first driving member is arranged on the base, and the driving end of the first driving member moves linearly along a direction parallel to the bearing area; The second test unit includes a lifting drive member, a rotating drive member and a lifting member. The lifting drive member is arranged on the base, and the driving end of the lifting drive member moves linearly in a direction perpendicular to the bearing area. The rotating drive member is arranged at the driving end of the lifting drive member, and the rotation center axis of the driving end of the rotating drive member is perpendicular to the bearing area. The lifting member is coaxially connected to the driving end of the rotating drive member.

2. The bonding jig testing device according to claim 1, characterized in that: One end of the lifting member is connected to the driving end of the rotary driving member, and the other end of the lifting member is provided with a slot or a protrusion; along the direction of the rotation center axis of the rotary driving member, the projection of the slot or the protrusion is non-circular.

3. The bonding fixture testing device according to claim 1, characterized in that: The bonding fixture testing device further includes a fixing unit for fixing the object to be tested, and the fixing unit is arranged on the base.

4. The bonding jig testing device according to claim 3, characterized in that: The fixing unit comprises a vacuum adsorption mechanism; the vacuum adsorption mechanism is arranged in the carrying area.

5. The bonding fixture testing device according to claim 1, characterized in that: The first test unit also includes a second driving member and a follower. The second driving member is arranged on the base and faces the bearing area. The driving end of the second driving member moves linearly in a direction perpendicular to the bearing area. The follower is connected to the driving end of the second driving member.

6. The bonding jig testing device according to claim 5, characterized in that: One end of the follower is connected to the driving end of the second driving member, and the other end has a driving surface, and the driving surface is arranged at an angle with the moving direction of the follower.

7. The bonding jig testing device according to claim 3, characterized in that: The bonding jig testing device further includes an image acquisition unit, which is disposed on the base, and a lens of the image acquisition unit faces the bearing area.

8. The bonding jig testing device according to claim 7, characterized in that: The image acquisition unit includes an acquisition frame and a lens. The acquisition frame is arranged on the base. The lens is arranged on the acquisition frame to move along a direction perpendicular to the bearing area.

9. The bonding fixture testing device according to claim 1, characterized in that: The bonding fixture testing device further includes a supporting unit, which includes a supporting leg and an adsorbing member, wherein the supporting leg is connected to the bottom of the base, and the adsorbing member is arranged at the bottom of the supporting leg.

10. The bonding jig testing device according to any one of claims 1 to 9, characterized in that: The bearing area is arranged on the top of the base; At least a portion of the first test unit is disposed on the top of the base, and at least a portion of the second test unit is disposed on the bottom of the base.

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