Stacked chip size packaging structure

Abstract

The utility model discloses a stacked chip size packaging structure, which comprises a packaging box, the upper surface of the packaging box is provided with a placing groove, a chip body is placed in the placing groove, the upper surface of the packaging box abuts against a cover plate, and the lower surface of the cover plate is fixedly provided with an outer surrounding plate and an inner surrounding plate respectively. According to the utility model, after the chip body is placed in the placing groove, along with the cooperation of the transverse line, the vertical line and the guide line, personnel can quickly position the chip body, and then the chip body is covered on the packaging box through a disposable thin film, and the connecting film is sleeved on the outer side of the positioning frame, so that when the cover plate is covered on the packaging box, the chip body can be quickly positioned. The inner coaming can extrude the disposable thin film, so that the disposable thin film can abut against the chip body, the chip body is sealed and fixed, the structure is easy to operate, the chip body can be quickly packaged, and a worker can conveniently stack and package a plurality of chip bodies.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to a stacked chip size packaging structure. Background Art

[0002] With the rapid development of new generation information technology, higher and higher requirements are placed on various technologies in the semiconductor field. As the core support of many technologies, chips have also played an increasingly important role. Some chips with special functions require a cavity structure between the substrate and the packaging process to meet their functions, performance or other special requirements.

[0003] According to a chip packaging structure with publication number CN213340337U, the chip packaging structure includes a bottom shell and an upper cover, the bottom shell and the upper cover are assembled together, and a cavity is formed inside the bottom shell and the upper cover, and a sealing member for sealing is provided at the joint of the bottom shell and the upper cover. In the chip packaging structure described in the present invention, various structures in the sealing member are used in combination, so that the sealing performance of the joint between the upper cover and the bottom shell is better, and impurities such as dust in the air are prevented from entering the packaging structure and affecting the normal use of the chip. The heat dissipation fins in the heat dissipation member are used to guide heat, and are used in combination with the heat dissipation fan to improve the heat dissipation effect of the packaging structure and ensure the service life of the chip. The clamping structure can further fix the chip to ensure the stability of the chip after packaging. The packaging structure is prepared by this method, and the prepared packaging structure has good use effect and long service life. However, there are still some problems in the use of the device, that is, it can only package a single chip, and cannot simultaneously stack and package two to three chips, so that its use flexibility is low, and in the packaging of the chip, its structure is relatively complicated, and the chip cannot be quickly packaged and positioned. For this reason, we propose a stacked chip size packaging structure to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a stacked chip size packaging structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a stacked chip size packaging structure, including a packaging box, a placement groove is provided on the upper surface of the packaging box, a chip body is placed in the placement groove, the upper surface of the packaging box is in contact with a cover plate, and the lower surface of the cover plate is respectively fixedly installed with an outer plate and an inner plate, the outer plate is located inside the groove, the groove is provided on the upper surface of the packaging box, the bottom end of the inner plate is in contact with a disposable film, the disposable film is located inside the placement groove, a connecting film is extended from the edge of the disposable film, the connecting film is sleeved on the outer side of the positioning frame, the positioning frame is fixedly installed on the inner wall of the groove, and the outer side of the positioning frame is in contact with the outer plate.

[0006] As a further preferred embodiment of the technical solution, the disposable film is set to be transparent, the disposable film is closely attached to the upper surface of the packaging box, and the cover plate is pressed on the upper surface of the disposable film.

[0007] As a further preferred embodiment of the present technical solution, the outer plate and the inner plate are respectively arranged in a U-shaped manner on the lower surface of the cover plate, and the two sides of the outer plate are respectively tightly attached to the inner wall of the groove and the outer side of the positioning frame.

[0008] As a further preferred embodiment of the present technical solution, the edge of the lower surface of the cover plate is arranged to be inclined, and four groups of the positioning frames are arranged, and the four groups of the positioning frames are respectively arranged on the inner wall of the groove.

[0009] As a further preferred embodiment of the present technical solution, transverse lines and vertical lines are respectively arranged in the placement groove, the transverse lines and vertical lines are staggered, guide lines are respectively arranged on the transverse lines and vertical lines, and the guide lines are equidistantly distributed on the transverse lines and vertical lines.

[0010] As a further preferred embodiment of the technical solution, a latch is fixedly installed on the lower surface of the packaging box, a socket is opened on the upper surface of the cover plate, a gasket is fixedly installed in the socket, and when the latch is in the socket, the latch is tightly attached to the inner wall of the gasket.

[0011] As a further preferred embodiment of the present technical solution, the bottom end of the latch is configured to be conical in shape.

[0012] The utility model provides a stacked chip size packaging structure, which has the following beneficial effects:

[0013] After the chip body is placed in the placement groove, the personnel can quickly locate the chip body with the cooperation between the horizontal line, the vertical line and the guide line. Subsequently, a disposable film is covered on the packaging box, and the connecting film is sleeved on the outer side of the positioning frame, so that when the cover plate is closed on the packaging box, the inner enclosure plate can squeeze the disposable film so that the disposable film can contact the chip body, thereby sealing and fixing the chip body. The structure is simple to operate, can quickly package the chip body, and can facilitate personnel to stack and package multiple chip bodies.

[0014] The utility model provides a latch, a socket and a gasket for cooperation, so that after the chip bodies are packaged one by one in the packaging boxes, the packaging boxes can be stacked one by one, so that the latch is inserted into the socket, that is, closely attached to the inner wall of the gasket, so that it is convenient for people to carry and transport the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic top view of the structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the structure of the utility model;

[0017] Figure 3 For this utility model Figure 2 A is a magnified schematic diagram of the structure;

[0018] Figure 4 It is a schematic top view of the structure of the horizontal line and the vertical line of the utility model;

[0019] Figure 5 It is a front view cross-sectional schematic diagram of the structure of the utility model in which the plug is located inside the plug hole.

[0020] In the figure: 1. packaging box; 2. placement groove; 3. chip body; 4. cover plate; 5. outer plate; 6. inner plate; 7. groove; 8. disposable film; 9. connecting film; 10. positioning frame; 11. horizontal line; 12. vertical line; 13. guide line; 14. pin; 15. socket; 16. gasket. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0022] The utility model provides a technical solution: Figure 1 , Figure 2 , Figure 3 and Figure 4As shown in the figure, in this embodiment, a stacked chip size package structure includes a packaging box 1. A placement groove 2 is formed on the upper surface of the packaging box 1. A chip body 3 is placed in the placement groove 2. A cover plate 4 abuts against the upper surface of the packaging box 1. An outer peripheral plate 5 and an inner peripheral plate 6 are respectively and fixedly installed on the lower surface of the cover plate 4. The outer peripheral plate 5 is located inside a groove 7. The groove 7 is formed on the upper surface of the packaging box 1. The bottom end of the inner peripheral plate 6 abuts against a disposable film 8. The disposable film 8 is located inside the placement groove 2. A connecting film 9 extends from the edge of the disposable film 8. The connecting film 9 is sleeved on the outer side of a positioning frame 10. The positioning frame 10 is fixedly installed on the inner wall of the groove 7. The outer side of the positioning frame 10 abuts against the outer peripheral plate 5. After the chip body 3 is placed inside the placement groove 2, with the cooperation among a horizontal line 11, a vertical line 12 and a guiding line 13, personnel can quickly position the chip body 3. Subsequently, with the disposable film 8 covering the packaging box 1 and the connecting film 9 sleeved on the outer side of the positioning frame 10, when the cover plate 4 is closed on the packaging box 1, the inner peripheral plate 6 can extrude the disposable film 8, so that the disposable film 8 can abut against the chip body 3, thereby sealing and fixing the chip body 3. This structure is simple to operate and can quickly package the chip body 3, and it is convenient for personnel to stack and package multiple chip bodies 3. The disposable film 8 is set to be transparent. The disposable film 8 closely adheres to the upper surface of the packaging box 1. The cover plate 4 presses on the upper surface of the disposable film 8. By providing the disposable film 8, after the connecting film 9 is sleeved on the outer side of the positioning frame 10, with the inner peripheral plate 6 pressing down on the disposable film 8, the disposable film 8 can press on the chip body 3 and fix and seal it. The outer peripheral plate 5 and the inner peripheral plate 6 are respectively arranged in a square shape with a hole in the middle on the lower surface of the cover plate 4. The two sides of the outer peripheral plate 5 respectively closely adhere to the inner wall of the groove 7 and the outer side of the positioning frame 10, which can effectively limit the position of the cover plate 4 and at the same time does not affect the subsequent removal of the cover plate 4 by personnel. The edge of the lower surface of the cover plate 4 is set to be inclined. There are four groups of positioning frames 10. The four groups of positioning frames 10 are respectively arranged on the inner wall of the groove 7, which can effectively fasten the position of the disposable film 8 and facilitate the personnel to take the cover plate 4. The placement groove 2 is respectively provided with a horizontal line 11 and a vertical line 12. The horizontal line 11 and the vertical line 12 intersect with each other. Guide lines 13 are respectively arranged on the horizontal line 11 and the vertical line 12. The guide lines 13 are equidistantly distributed on the horizontal line 11 and the vertical line 12. By providing the horizontal line 11, the vertical line 12 and the guiding line 13, when personnel place the chip body 3 inside the placement groove 2, the chip body 3 can respectively abut against the horizontal line 11, the vertical line 12 and the guiding line 13. Thus, the chip body 3 can be adjusted and positioned inside the placement groove 2 to facilitate the subsequent sealing work of the chip body 3's position.

[0023] like Figure 5 As shown, a latch 14 is fixedly installed on the lower surface of the packaging box 1, and a socket 15 is opened on the upper surface of the cover plate 4. A gasket 16 is fixedly installed in the socket 15. When the latch 14 is inside the socket 15, the latch 14 is tightly attached to the inner wall of the gasket 16. Through the cooperation between the latch 14, the socket 15 and the gasket 16, after the chip bodies 3 are respectively packaged inside the packaging box 1 one by one, the packaging boxes 1 can be stacked up one by one, so that the latch 14 is inserted into the socket 15, that is, it is tightly attached to the inner wall of the gasket 16, so that it is convenient for people to carry and transport it. The bottom end of the latch 14 is set to a cone shape, which can help the latch 14 to be smoothly inserted into the inside of the latch 14.

[0024] The utility model provides a stacked chip size packaging structure, and the specific working principle is as follows:

[0025] When the device is used, the chip body 3 is placed inside the placement groove 2 so that the chip body 3 can contact the horizontal line 11, the vertical line 12 and the guide line 13, thereby positioning the chip body 3 at the exact center of the placement groove 2, and then the disposable film 8 is covered on the packaging box 1, and the connecting film 9 extending from the outside of the disposable film 8 is sleeved on the outside of the positioning frame 10, so that the disposable film 8 is tightly stretched above the chip body 3, and then the cover plate 4 is covered above the packaging box 1, so that the bottom end of the inner panel 6 can squeeze the upper surface of the disposable film 8. The outer plate 5 can be inserted into the groove 7, and the two sides of the outer plate 5 can be respectively close to the inner wall of the groove 7 and the outer side of the positioning frame 10. As the inner plate 6 presses the disposable film 8 downward, the disposable film 8 can be subsequently close to the outer side of the chip body 3, thereby fastening the position of the chip body 3. Finally, when the chip bodies 3 are packaged one by one in the packaging box 1, the packaging boxes 1 can be stacked up one by one, so that the pin 14 is inserted into the inside of the hole 15, that is, close to the inner wall of the gasket 16, so as to facilitate personnel to carry and transport it.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A stacked chip size package structure, characterized in that: The invention comprises a packaging box (1), wherein a placement groove (2) is provided on the upper surface of the packaging box (1), a chip body (3) is placed in the placement groove (2), the upper surface of the packaging box (1) is in contact with a cover plate (4), the lower surface of the cover plate (4) is respectively fixedly mounted with an outer plate (5) and an inner plate (6), the outer plate (5) is located inside a groove (7), the groove (7) is provided on the upper surface of the packaging box (1), the bottom end of the inner plate (6) is in contact with a disposable film (8), the disposable film (8) is located inside the placement groove (2), a connecting film (9) is extended from the edge of the disposable film (8), the connecting film (9) is sleeved on the outer side of a positioning frame (10), the positioning frame (10) is fixedly mounted on the inner wall of the groove (7), and the outer side of the positioning frame (10) is in contact with the outer plate (5).

2. The stacked chip size package structure according to claim 1, characterized in that: The disposable film (8) is configured to be transparent, the disposable film (8) is closely attached to the upper surface of the packaging box (1), and the cover plate (4) is pressed against the upper surface of the disposable film (8).

3. The stacked chip size package structure according to claim 1, characterized in that: The outer plate (5) and the inner plate (6) are respectively arranged in a U-shaped manner on the lower surface of the cover plate (4), and the two sides of the outer plate (5) are respectively closely attached to the inner wall of the groove (7) and the outer side of the positioning frame (10).

4. The stacked chip size package structure according to claim 1, characterized in that: The edge of the lower surface of the cover plate (4) is arranged in an inclined shape, and four groups of the positioning frames (10) are arranged, and the four groups of the positioning frames (10) are respectively arranged on the inner wall of the groove (7).

5. The stacked chip size package structure according to claim 1, characterized in that: The placement groove (2) is provided with a transverse line (11) and a vertical line (12), the transverse line (11) and the vertical line (12) are staggered, and the transverse line (11) and the vertical line (12) are provided with guide lines (13), the guide lines (13) are distributed on the transverse line (11) and the vertical line (12) at equal distances.

6. The stacked chip size package structure according to claim 1, characterized in that: A latch (14) is fixedly mounted on the lower surface of the packaging box (1), a plug hole (15) is opened on the upper surface of the cover plate (4), a gasket (16) is fixedly mounted inside the plug hole (15), and when the latch (14) is inside the plug hole (15), the latch (14) is tightly attached to the inner wall of the gasket (16).

7. The stacked chip size package structure according to claim 6, characterized in that: The bottom end of the latch pin (14) is configured to be in a cone shape.

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