Vibrating type semiconductor patch material screening machine

Abstract

The utility model relates to the technical field of semiconductor device processing, and discloses a vibrating type semiconductor patch material screening machine which comprises a base, the left side of the top of the base is fixedly connected with a third conical rotating shaft, the outer wall of the third conical rotating shaft is rotationally connected with a small screening plate, and the right side of the top of the base is fixedly connected with a first conical rotating shaft. And first telescopic rods are rotationally connected to the outer walls of the first conical rotating shafts, second conical rotating shafts are rotationally connected to the output ends of the first telescopic rods, the tops of the second conical rotating shafts are fixedly connected to the right side of the bottom of a small screening plate, and a middle screening plate is arranged at the top of the small screening plate. According to the device, the sealing plate, the large screening plate, the first conical rotating shaft, the first telescopic rod, the middle screening plate, the small screening plate, the vibration machine and the like are matched with one another, so that semiconductor attaching of different specifications can be rapidly classified, manual operation of operators is avoided, meanwhile, time and labor are saved, and the screening efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device processing, in particular to a vibration type semiconductor patch material screening machine. Background Art

[0002] The vibrating semiconductor patch material screening machine is a device dedicated to the semiconductor industry, used to screen and separate tiny patch materials to ensure the quality and accuracy of materials in the semiconductor manufacturing process. At the same time, semiconductor patch materials are a type of key materials used in the semiconductor manufacturing process, used to package and connect chips to provide protection, conductivity and heat dissipation functions. These materials play an important role in packaging technology, helping to ensure the stability and reliability of chips under various environmental conditions.

[0003] Most of the existing semiconductor patch materials are screened manually, but manual screening is inefficient and prone to errors, and requires a lot of manpower, thus reducing work efficiency and being inconvenient to use. Utility Model Content

[0004] In order to make up for the above shortcomings, the utility model provides a vibrating semiconductor patch material screening machine, which aims to improve the problem that most of the existing semiconductor patch materials in the prior art are screened manually, but the manual screening efficiency is low and prone to errors, and it also requires a lot of manpower.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a vibrating semiconductor patch material screening machine, comprising a base, a conical rotating shaft three is fixedly connected to the top left side of the base, the outer wall of the conical rotating shaft three is rotatably connected to a small screening plate, a conical rotating shaft one is fixedly connected to the top right side of the base, the outer wall of the conical rotating shaft one is rotatably connected to a telescopic rod one, the output end of the telescopic rod one is rotatably connected to a conical rotating shaft two, the top of the conical rotating shaft two is fixedly connected to the bottom right side of the small screening plate, a middle screening plate is arranged on the top of the small screening plate, a large screening plate is arranged on the top of the middle screening plate, a vibrator is fixedly connected to the rear side of the base, and an assembly mechanism is arranged on the top of the large screening plate.

[0006] As a further description of the above technical solution:

[0007] The assembly mechanism includes a slide groove, which is respectively opened on the left and right sides of the top of the large screening plate, the middle screening plate and the small screening plate. The internal sliding connection of the slide groove is a limit block. The top front and rear sides of the limit block are each provided with a second clamping hole. The top front and rear sides of the large screening plate are each provided with a first clamping hole. A U-shaped buckle is clamped between the inner portions of the first clamping hole and the second clamping hole, and a bolt is threadedly connected to the top of the U-shaped buckle.

[0008] As a further description of the above technical solution:

[0009] The left and right ends of the front sides of the large screening plate, the middle screening plate and the small screening plate are fixedly connected with a rotating shaft 2, the middle part of the outer wall of the rotating shaft 2 is rotatably connected with a telescopic rod 2, the output end of the telescopic rod 2 is rotatably connected with a rotating shaft 1, and the rear side of the rotating shaft 1 is fixedly connected with a rotating plate.

[0010] As a further description of the above technical solution:

[0011] A conical block is fixedly connected to the inner top of the large screening plate.

[0012] As a further description of the above technical solution:

[0013] A sealing plate is arranged on the top of the conical block, and a handle is fixedly connected to the middle of the top end of the sealing plate.

[0014] As a further description of the above technical solution:

[0015] A lighting lamp is fixedly connected to the rear side of the left end of the top of the base, and a storage battery is fixedly connected to the middle part of the front side of the top of the base.

[0016] As a further description of the above technical solution:

[0017] A controller is fixedly connected to the left end of the top front side of the base, and the controller is electrically connected to the telescopic rod 1, the telescopic rod 2, the battery, the lighting lamp and the vibration machine respectively.

[0018] As a further description of the above technical solution:

[0019] The bottom end of the bolt is threadedly connected to the top surface of the large screening plate.

[0020] The utility model has the following beneficial effects:

[0021] 1. In the utility model, the sealing plate, the large screening plate, the conical shaft 1, the telescopic rod 1, the conical shaft 2, the conical shaft 3, the medium screening plate, the small screening plate and the vibrator cooperate with each other, so that semiconductors of different specifications can be quickly classified, avoiding the need for manual operation by operators, saving time and effort, and improving the screening efficiency.

[0022] 2. In the utility model, bolts, U-shaped buckles, a clamping hole, a second clamping hole, a limit block and a slide groove cooperate with each other, so that it is convenient for operators to clean the debris and stains on the screening plate, and the practicability of the equipment is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1This is a front perspective view of the base of a vibration type semiconductor patch material screening machine proposed by the utility model;

[0024] Figure 2 This is a structural breakdown diagram of a large screening plate of a vibrating semiconductor patch material screening machine proposed by the utility model;

[0025] Figure 3 This is a structural diagram of a rotating plate of a vibrating semiconductor patch material screening machine proposed by the utility model;

[0026] Figure 4 This is a diagram showing the structure of a vibration machine of a vibration-type semiconductor patch material screening machine proposed in the utility model.

[0027] Legend:

[0028] 1. Base; 2. Assembly mechanism; 201. Clamp hole 1; 202. U-shaped buckle; 203. Bolt; 204. Slide; 205. Clamp hole 2; 206. Limit block; 3. Controller; 4. Light; 5. Battery; 6. Conical shaft 1; 7. Telescopic rod 1; 8. Conical shaft 2; 9. Handle; 10. Sealing plate; 11. Conical block; 12. Large screening plate; 13. Medium screening plate; 14. Small screening plate; 15. Conical shaft 3; 16. Rotating shaft 1; 17. Telescopic rod 2; 18. Rotating shaft 2; 19. Rotating plate; 20. Vibrator. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Please refer to the attached Figure 1 - Attachment Figure 3The utility model provides an embodiment: a vibrating semiconductor patch material screening machine, comprising a base 1, a conical rotating shaft 3 15 is fixedly connected to the left side of the top of the base 1, a small screening plate 14 is rotatably connected to the outer wall of the conical rotating shaft 3 15, a conical rotating shaft 1 6 is fixedly connected to the right side of the top of the base 1, a telescopic rod 1 7 is rotatably connected to the outer wall of the conical rotating shaft 1 6, a conical rotating shaft 2 8 is rotatably connected to the output end of the telescopic rod 1 7, the top of the conical rotating shaft 2 8 is fixedly connected to the right side of the bottom of the small screening plate 14, and the small screening plate A middle screening plate 13 is arranged on the top of 14, a large screening plate 12 is arranged on the top of the middle screening plate 13, a vibrating machine 20 is fixedly connected to the rear side of the base 1, an assembly mechanism 2 is arranged on the top of the large screening plate 12, a rotating shaft 2 18 is fixedly connected to the left and right ends of the front sides of the large screening plate 12, the middle screening plate 13 and the small screening plate 14, a telescopic rod 2 17 is rotatably connected to the middle of the outer wall of the rotating shaft 2 18, a rotating shaft 16 is rotatably connected to the output end of the telescopic rod 2 17, and a rotating plate 19 is fixedly connected to the rear side of the rotating shaft 16;

[0031] Specifically, the base 1 is the core part of the whole equipment, and a conical rotating shaft 3 15 is fixedly connected to the left side of the top thereof, and a small screening plate 14 is rotatably connected to the outer wall of the conical rotating shaft 3 15, so that the conical rotating shaft 3 15 can drive the small screening plate 14 to rotate, and a conical rotating shaft 1 6 is fixedly connected to the right side of the top of the base 1. These three screening plates together constitute a multi-stage screening device for classifying semiconductor patches according to particle size. The vibrator 20 can drive the whole equipment to vibrate, so that the material is more evenly distributed during the screening process.

[0032] Please refer to the attached Figure 2 The assembly mechanism 2 includes a slide groove 204, which is respectively arranged on the left and right sides of the top of the large screening plate 12, the middle screening plate 13 and the small screening plate 14. The slide groove 204 is internally slidably connected to a limit block 206. The limit block 206 is provided with a second clamping hole 205 on the front and rear sides of the top. The large screening plate 12 is provided with a first clamping hole 201 on the front and rear sides of the top. A U-shaped buckle 202 is engaged between the first clamping hole 201 and the second clamping hole 205. The top of the U-shaped buckle 202 is threadedly connected with a bolt 203, and the bottom end of the bolt 203 is threadedly connected to the top surface of the large screening plate 12;

[0033] Specifically, this design enables a sliding connection between the slide 204 and the stop block 206, and a stable connection between the stop block 206 and the large screening plate 12. The design of the first clamping hole 201 and the second clamping hole 205 enables the U-shaped clamp 202 to be stably clamped between the two, thereby ensuring the stability of the connection. The threaded connection design of the bolt 203 enables it to be easily installed and disassembled, and also ensures the tightness of the connection, so that it is convenient for operators to disassemble it and clean the screening plate.

[0034] Please refer to the attached Figure 3 - Attachment Figure 4 A conical block 11 is fixedly connected to the inner top of the large screening plate 12, a sealing plate 10 is arranged on the top of the conical block 11, a handle 9 is fixedly connected to the middle of the top of the sealing plate 10, a lighting lamp 4 is fixedly connected to the rear side of the top left end of the base 1, a battery 5 is fixedly connected to the middle of the top front side of the base 1, and a controller 3 is fixedly connected to the left end of the top front side of the base 1, and the controller 3 is electrically connected to the telescopic rod 1 7, the telescopic rod 2 17, the battery 5, the lighting lamp 4 and the vibrator 20 respectively;

[0035] Specifically, a lighting lamp 4 is fixedly connected to the rear side of the top left end of the base 1, and the lighting lamp 4 can provide sufficient lighting to make the operation clearer and more convenient. A battery 5 is fixedly connected to the middle of the top front side of the base 1, and the battery 5 can provide power for other equipment, making the entire device more flexible and convenient. A controller 3 is fixedly connected to the left end of the top front side of the base 1. This design makes the entire device more intelligent and automated, and can be easily controlled and operated.

[0036] Working principle: Usually when the semiconductor patches need to be screened, the sealing plate 10 is opened and placed on the large screening plate 12. At this time, the telescopic rod 17 on the conical shaft 16 is turned to start, so as to cooperate with the telescopic rod 17 to push the conical shaft 2 8 upward, and cooperate with the conical shaft 3 15 to make the large screening plate 12, the medium screening plate 13 and the small screening plate 14 present an inclined state. The above operation is repeated, so that the larger semiconductor patches will remain on the large screening plate 12, the medium ones will remain on the medium screening plate 13, and so on. Finally, the vibration machine 20 is started, so that In conjunction with the vibration screening again, it is possible to quickly classify semiconductors of different specifications, avoiding the need for manual operation by operators, saving time and effort, and improving the efficiency of screening. Subsequently, the U-shaped buckle 202 is released from the inner side of the card hole 1 201 and the card hole 2 205 by twisting the bolt 203, and then the limit block 206 is pulled out from the inside of the slide groove 204, thereby releasing the limit on the large screening plate 12, the medium screening plate 13 and the small screening plate 14, thereby making it easy for operators to clean the debris and stains on the screening plate, and at the same time improving the practicability of the equipment.

[0037] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A vibrating semiconductor patch material screening machine, comprising a base (1), characterized in that: The left side of the top of the base (1) is fixedly connected with a conical rotating shaft three (15), and the outer wall of the conical rotating shaft three (15) is rotatably connected with a small screening plate (14). The right side of the top of the base (1) is fixedly connected with a conical rotating shaft one (6), and the outer wall of the conical rotating shaft one (6) is rotatably connected with a telescopic rod one (7). The output end of the telescopic rod one (7) is rotatably connected with a conical rotating shaft two (8), and the top of the conical rotating shaft two (8) is fixedly connected to the right side of the bottom of the small screening plate (14). The top of the small screening plate (14) is provided with a middle screening plate (13), and the top of the middle screening plate (13) is provided with a large screening plate (12). The rear side of the base (1) is fixedly connected with a vibrator (20), and the top of the large screening plate (12) is provided with an assembly mechanism (2).

2. A vibrating semiconductor patch material screening machine according to claim 1, characterized in that: The assembly mechanism (2) comprises a slide groove (204), wherein the slide groove (204) is respectively arranged on the left and right sides of the top of the large screening plate (12), the middle screening plate (13) and the small screening plate (14); the slide groove (204) is internally slidably connected to a limit block (206); the limit block (206) is provided with a second clamping hole (205) on the front and rear sides of the top; the large screening plate (12) is provided with a first clamping hole (201) on the front and rear sides of the top; a U-shaped clamping buckle (202) is clamped between the insides of the first clamping hole (201) and the second clamping hole (205), and a bolt (203) is threadedly connected to the top of the U-shaped clamping buckle (202).

3. A vibrating semiconductor patch material screening machine according to claim 1, characterized in that: The left and right ends of the front sides of the large screening plate (12), the middle screening plate (13) and the small screening plate (14) are all fixedly connected to a second rotating shaft (18); a second telescopic rod (17) is rotatably connected to the middle of the outer wall of the second rotating shaft (18); an output end of the second telescopic rod (17) is rotatably connected to a first rotating shaft (16); and a rotating plate (19) is fixedly connected to the rear side of the first rotating shaft (16).

4. A vibrating semiconductor patch material screening machine according to claim 2, characterized in that: A conical block (11) is fixedly connected to the inner top of the large screening plate (12).

5. A vibrating semiconductor patch material screening machine according to claim 4, characterized in that: A sealing plate (10) is provided on the top of the conical block (11), and a handle (9) is fixedly connected to the middle of the top end of the sealing plate (10).

6. A vibrating semiconductor patch material screening machine according to claim 1, characterized in that: A lighting lamp (4) is fixedly connected to the rear side of the left end of the top of the base (1), and a storage battery (5) is fixedly connected to the middle part of the front side of the top of the base (1).

7. The vibrating semiconductor chip material screening machine according to claim 1, characterized in that: A controller (3) is fixedly connected to the left end of the top front side of the base (1), and the controller (3) is electrically connected to the telescopic rod 1 (7), the telescopic rod 2 (17), the storage battery (5), the lighting lamp (4) and the vibrator (20) respectively.

8. The vibrating semiconductor chip material screening machine according to claim 2, characterized in that: The bottom end of the bolt (203) is threadedly connected to the top surface of the large screening plate (12).

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