Hot stamping lower die with cooling structure
By introducing a spiral cooling water tank and a circulating cooling structure into the hot stamping mold, the problem of poor heat dissipation is solved, and good cooling effect is achieved, the mold life is extended and the processing quality is improved.
Patent Information
- Application Number
- CN202420998832.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-10
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-05-10
AI Technical Summary
In hot stamping technology, the heat of the material is difficult to dissipate quickly, resulting in a shortening of the mold service life and affecting the processing quality.
A hot stamping lower die with cooling structure is designed, and a spiral cooling water tank and a circulating cooling structure is adopted to ensure good cooling effect and prevent excessive heat from affecting the normal operation of the mold.
Effectively reduce mold fatigue, extend service life, ensure the cooling effect of the stamping process, and ensure product processing quality.
Smart Images

Figure CN222175656U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of stamping dies, in particular to a hot stamping lower die with a cooling structure. Background Art
[0002] Stamping is to apply external force to the workpiece to make it plastically deform or separate, and then form the workpiece. At present, in hot stamping technology, the punching die is installed on the stamping equipment. The upper die of the die is equipped with an ejector cylinder, and the lower die is also equipped with an ejector cylinder. The working process is to place the heated blank in the position of the lower die, and then perform stamping and forming operations on it. Since the material itself has a certain amount of heat, a large amount of heat will be generated during the stamping process, and the punch is in direct contact with the finished product. When there is a large amount of heat that is difficult to dissipate quickly, it will easily shorten the service life of the lower die, affect the service life of the entire set of molds, and also affect the processing quality of the product. Utility Model Content
[0003] The utility model aims to provide a hot stamping lower die with a cooling structure to solve the technical problems in the background technology.
[0004] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions:
[0005] A hot stamping lower die with a cooling structure comprises a lower die pad, a cooling plate, a lower die fixing plate, a lower die base and a lower punch, wherein the cooling plate is fixed below the lower die pad, the cooling plate is fixed above the lower die fixing plate, the lower die base is fixed below the lower die fixing plate, the lower punch penetrates the lower die base, the lower die fixing plate, the cooling plate and the lower die pad in the up and down directions, a water outlet and a water inlet are respectively provided on the left and right sides of the cooling plate, a spiral cooling water trough is provided on the top of the cooling plate, the cooling water trough is communicated with the water inlet and the water outlet through a water transport channel in the cooling plate, and a sealing gasket is installed between the cooling plate and the lower die pad.
[0006] The bottom of the cooling plate is provided with a first step portion extending outward, and the top of the lower mold fixing plate is provided with a concave accommodating groove for placing the cooling plate. A pressure ring is sleeved on the outside of the cooling plate, and a concave pressure groove is provided under the pressure ring to match the shape of the first step portion. The pressure ring is pressed above the first step portion, and the pressure ring is fixedly connected to the lower mold fixing plate by screws. The pressure ring and the lower mold fixing plate are spaced apart, and the water inlet and the water outlet are both between the pressure ring and the lower mold fixing plate.
[0007] The sealing rings are provided with two, respectively located on the inner side and the outer side of the cooling water tank.
[0008] The lower die pad is provided with an inwardly concave surfacing groove, in which a strengthening layer formed by a high-temperature alloy surfacing welding wire is surfacing-welded.
[0009] Compared with the prior art, the hot stamping lower die with a cooling structure in the present application adds a circulating cooling structure inside the die and adopts a spiral cooling water trough. There is no cooling blind spot and the cooling effect is good, which ensures that the stamping die has a good cooling effect during stamping work, effectively prevents excessive heat from affecting the normal production of the die, reduces die fatigue, and ensures the service life of the die. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] Figure 1 : A schematic diagram of the longitudinal half-section structure of the present application;
[0011] Figure 2 : Longitudinal half-section structure diagram of the lower die pad;
[0012] Figure 3 : Cooling plate top view structure;
[0013] Figure 4 : Longitudinal half section of cooling plate;
[0014] Figure 5 : Longitudinal half section of the pressure ring. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0016] Specific embodiment 1: Please refer to Figures 1 to 5 In the embodiment of the utility model, a hot stamping lower die with a cooling structure includes a lower die pad 1, a cooling plate 2, a lower die fixing plate 4, a lower die seat 5 and a lower punch 6. In the embodiment, the lower die pad 1, the cooling plate 2, the lower die fixing plate 4 and the lower die seat 5 are all circular structures. The cooling plate 2 is fixed below the lower die pad 1, the cooling plate 2 is fixed above the lower die fixing plate 4, the lower die seat 5 is fixed below the lower die fixing plate 4, and the lower punch 6 penetrates the lower die seat 5, the lower die fixing plate 4, the cooling plate 2 and the lower die pad 1 in the up and down direction. The cooling plate 2 is provided with water outlets 203 and 204 on the left and right sides, respectively. Water inlet 202, a spiral cooling water trough 201 is provided on the top of the cooling plate 2, the rotation center of the spiral cooling water trough 201 is coaxially arranged with the axis of the cooling plate 2, the cooling water trough 201 is communicated with the water inlet 202 and the water outlet 203 through the water transport channel 204 in the cooling plate 2, a sealing gasket 3 is installed between the cooling plate 2 and the lower mold pad 1, two sealing rings are provided, respectively on the inner and outer sides of the cooling water trough 201, the sealing gasket 3 is close to the cooling water trough 201, and at the same time, in order to prevent the sealing gasket 3 from softening and failing, the cooling plate 2 is made of H13 steel.
[0017] A first step portion 205 extending outward is provided at the bottom of the cooling plate 2, and a concave accommodating groove 401 is provided above the lower mold fixing plate 4 for placing the cooling plate 2. A pressure ring 7 is sleeved on the outside of the cooling plate 2, and a concave pressure groove 701 is provided below the pressure ring 7 to match the shape of the first step portion 205. The pressure ring 7 is pressed above the first step portion 205, and the pressure ring 7 is fixedly connected to the lower mold fixing plate 4 by screws. The pressure ring 7 and the lower mold fixing plate 4 are spaced apart, and the water inlet 202 and the water outlet 203 are both between the pressure ring 7 and the lower mold fixing plate 4.
[0018] The lower die pad 1 is provided with an inwardly concave surfacing groove 101, in which a strengthening layer 102 formed by high-temperature alloy surfacing wire is surfacing-welded. The strengthening layer 102 has good oxidation resistance and thermal corrosion resistance, and can improve the service life of the die.
[0019] It should be noted that the cooling medium introduced into the cooling water tank 201 in the present application can be any fluid and is not limited to water.
[0020] Compared with the prior art, the hot stamping lower die with a cooling structure in the present application adds a circulating cooling structure inside the die and adopts a spiral cooling water trough. There is no cooling blind spot and the cooling effect is good, which ensures that the stamping die has a good cooling effect during stamping work, effectively prevents excessive heat from affecting the normal production of the die, reduces die fatigue, and ensures the service life of the die.
[0021] It is obvious to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
[0022] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A hot stamping lower die with a cooling structure, characterized in that: It includes a lower die pad, a cooling plate, a lower die fixing plate, a lower die base and a lower punch, wherein the cooling plate is fixed below the lower die pad, the cooling plate is fixed above the lower die fixing plate, the lower die base is fixed below the lower die fixing plate, and the lower punch penetrates the lower die base, the lower die fixing plate, the cooling plate and the lower die pad in the up and down directions, a water outlet and a water inlet are respectively provided on the left and right sides of the cooling plate, a spiral cooling water trough is provided on the top of the cooling plate, the cooling water trough is communicated with the water inlet and the water outlet through a water transport channel in the cooling plate, and a sealing gasket is installed between the cooling plate and the lower die pad.
2. The hot stamping lower die with a cooling structure according to claim 1, characterized in that: The bottom of the cooling plate is provided with a first step portion extending outward, and the top of the lower mold fixing plate is provided with a concave accommodating groove for placing the cooling plate. A pressure ring is sleeved on the outside of the cooling plate, and a concave pressure groove is provided under the pressure ring to match the shape of the first step portion. The pressure ring is pressed above the first step portion, and the pressure ring is fixedly connected to the lower mold fixing plate by screws. The pressure ring and the lower mold fixing plate are spaced apart, and the water inlet and the water outlet are both between the pressure ring and the lower mold fixing plate.
3. The hot stamping lower die with a cooling structure according to claim 2, characterized in that: The sealing gaskets are provided with two, respectively located on the inner side and the outer side of the cooling water tank.
4. The hot stamping lower die with a cooling structure according to claim 3, characterized in that: The lower die pad is provided with an inwardly concave surfacing groove, in which a strengthening layer formed by a high-temperature alloy surfacing welding wire is surfacing-welded.
