Wafer grinding fluid spraying device

Abstract

The utility model provides a wafer grinding fluid spraying device, and belongs to the technical field of wafer grinding. The wafer grinding fluid spraying device comprises a spraying assembly. The spraying assembly comprises a lifting part, a sliding connecting ring, a sliding block, a locking bolt, a gooseneck pipe, a telescopic hose and a spray head, during use, the lifting part can be fixed to the grinding device and can drive the sliding connecting ring to move up and down, the position of the spray head can be finely adjusted by pulling the gooseneck pipe, then the locking bolt is detached, and the spray head is fixed to the grinding device. The locking bolt does not abut against the sliding connecting ring, then the sliding block can be moved along the sliding connecting ring, the sliding block can drive the gooseneck pipe and the spray head to move, then the spray head can move around a grinding disc of the grinding device, and the position of the spray head can be adjusted; and the position of the spray head can be adjusted according to the requirements or habits of polishing workers, and practicability is high.

Description

Technical Field

[0001] The present application relates to the field of wafer grinding, and in particular to a wafer grinding liquid spraying device. Background Art

[0002] The chip is one of the most important raw materials of LED, the light-emitting component of LED, and the most core part of LED. The quality of the chip will directly determine the performance of LED. The chip will be polished during the production and processing process, and the chip needs to be sprayed with grinding fluid through a spraying device during the polishing process. In the relevant grinding fluid spraying device technology, the nozzle is directly fixed on the polishing device, and the position of the nozzle is fixed. The position of the nozzle cannot be adjusted according to the needs or habits of the polishing workers, and the practicality is low. Utility Model Content

[0003] In order to make up for the above shortcomings, the present application provides a wafer polishing liquid spraying device, which aims to improve the problem that the position of the nozzle cannot be adjusted according to the needs or habits of the polishing workers and has low practicality.

[0004] An embodiment of the present application provides a wafer polishing liquid spraying device, including a spraying component.

[0005] The spray assembly includes a lifting member, a sliding connection ring, a sliding block, a locking bolt, a gooseneck tube, a telescopic hose and a spray head. The sliding connection ring is connected to the lifting end of the lifting member, the sliding block is slidably sleeved on the ring body of the sliding connection ring, the locking bolt thread penetrates the top wall of the sliding block, the locking bolt is tightly pressed against the sliding connection ring, the gooseneck tube is fixedly connected to the sliding block, the spray head is fixedly connected to the gooseneck tube, and the spray head is communicated with the telescopic hose.

[0006] In a specific embodiment, the lifting member includes a fixed plate, a threaded rod, a lifting block and a rotating handwheel, the threaded rod is rotatably connected to the fixed plate, the lifting block is slidably connected to the fixed plate, the lifting block is threadedly connected to the threaded rod, and the rotating handwheel is fixedly connected to the top end of the threaded rod.

[0007] In a specific implementation manner, a connecting plate is provided at the bottom end of the fixing plate, and connecting holes are provided at four corners of the connecting plate.

[0008] In a specific implementation manner, a sliding groove is provided inside the fixing plate, the threaded rod is rotatably connected to the inside of the sliding groove, and the top end of the threaded rod is rotatably passed through the top wall of the sliding groove.

[0009] In a specific implementation manner, the lifting block is slidably connected to the inside of the sliding groove, and the lifting block is threadedly sleeved on the rod body of the threaded rod.

[0010] In a specific implementation, a connecting rod is provided on the outer ring wall of the sliding connecting ring, and one end of the connecting rod is fixedly connected to the lifting block.

[0011] In a specific embodiment, a through slot is provided on one side of the sliding block, and the through slot is slidably sleeved on the rod body of the connecting rod.

[0012] In a specific embodiment, the gooseneck is located inside the sliding connection ring, and the telescopic hose runs through the inside of the gooseneck.

[0013] The beneficial effects of the utility model are as follows: the utility model obtains a wafer grinding liquid spraying device through the above-mentioned design. When in use, the lifting part can be fixed on the grinding device, and then the spraying assembly can be fixed on the grinding device, the lifting part can drive the sliding connecting ring to move up and down, and then the sliding connecting ring can be sleeved on the outside of the grinding disk of the grinding device, the telescopic hose is connected with the pipeline for providing grinding liquid from the outside, and the position of the nozzle can be fine-tuned by pulling the gooseneck tube, and then the locking bolt is removed so that the locking bolt is no longer tightly against the sliding connecting ring, and then the sliding block can be moved along the sliding connecting ring, the sliding block can drive the gooseneck tube and the nozzle to move, and then the nozzle can be moved around the grinding disk of the grinding device, and then the position of the nozzle can be adjusted, and then the position of the nozzle can be adjusted according to the needs or habits of the grinding workers, and the practicality is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the drawings required for use in the implementation methods will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic structural diagram of a wafer polishing liquid spraying device provided in an embodiment of the present application;

[0016] Figure 2 A schematic diagram of the lifting member structure provided for the implementation mode of the present application;

[0017] Figure 3 A schematic diagram of a connecting rod structure provided in an embodiment of the present application;

[0018] Figure 4 A schematic diagram of the through slot structure provided in an embodiment of the present application.

[0019] In the figure: 100-spraying assembly; 110-lifting member; 111-fixed plate; 1111-sliding groove; 112-threaded rod; 113-lifting block; 114-rotating hand wheel; 120-sliding connecting ring; 121-connecting rod; 130-sliding block; 131-through groove; 140-locking bolt; 150-gooseneck; 160-telescopic hose; 170-spray nozzle; 180-connecting plate; 181-connecting hole. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0021] In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in conjunction with the drawings in the implementation methods of this application. Obviously, the described implementation methods are part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] See also Figure 1 The present application provides a wafer polishing liquid spraying device, including a spraying component 100.

[0023] See also Figure 1-4 The spray assembly 100 includes a lifting member 110, a sliding connection ring 120, a sliding block 130, a locking bolt 140, a gooseneck 150, a telescopic hose 160 and a nozzle 170. The lifting member 110 includes a fixed plate 111, a threaded rod 112, a lifting block 113 and a rotating hand wheel 114. A connecting plate 180 is provided at the bottom end of the fixed plate 111. Connecting holes 181 are provided at the four corners of the connecting plate 180. The connecting plate 180 can be fixed to the grinding device. The connecting holes 181 can make it more convenient to fix the connecting plate 180 by screws. The threaded rod 112 is rotatably connected to the fixed plate 111. A sliding groove 1111 is provided inside the fixed plate 111. The threaded rod 112 is rotatably connected to the inside of the sliding groove 1111. The top of the threaded rod 112 rotates and penetrates the top wall of the sliding groove 1111.

[0024] In this embodiment, the lifting block 113 is slidably connected to the fixed plate 111, the lifting block 113 is threadedly connected to the threaded rod 112, the lifting block 113 is slidably connected to the inside of the sliding groove 1111, the lifting block 113 is threadedly sleeved on the rod body of the threaded rod 112, and the rotating hand wheel 114 is fixedly connected to the top of the threaded rod 112.

[0025] In the present application, the sliding connecting ring 120 is connected to the lifting end of the lifting member 110, and a connecting rod 121 is provided on the outer ring wall of the sliding connecting ring 120. One end of the connecting rod 121 is fixedly connected to the lifting block 113. The sliding block 130 is slidably sleeved on the ring body of the sliding connecting ring 120. A through groove 131 is provided on one side of the sliding block 130. The through groove 131 is slidably sleeved on the rod body of the connecting rod 121. The through groove 131 prevents the connecting rod 121 from affecting the sliding of the sliding block 130.

[0026] In this embodiment, the locking bolt 140 is threadedly passed through the top wall of the sliding block 130, and the locking bolt 140 is tightly pressed against the sliding connecting ring 120. The locking bolt 140 can fix the sliding block 130. The gooseneck 150 is fixedly connected to the sliding block 130, and the gooseneck 150 is located inside the sliding connecting ring 120. The nozzle 170 is fixedly connected to the gooseneck 150, and the nozzle 170 is connected to the telescopic hose 160. The telescopic hose 160 passes through the inside of the gooseneck 150, and the telescopic hose 160 is connected to a pipeline for providing grinding fluid to the outside.

[0027] Specifically, the working principle of the wafer grinding liquid spraying device is as follows: when in use, the connecting plate 180 can be fixed on the grinding device, and then the spraying assembly 100 can be fixed on the grinding device, and the hand wheel 114 and the threaded rod 112 can be rotated, and the threaded rod 112 can drive the lifting block 113 and the sliding connecting ring 120 to move up and down, and then the sliding connecting ring 120 can be sleeved on the outside of the grinding disk of the grinding device, and the telescopic hose 160 is connected to the pipeline for providing grinding liquid from the outside, and the gooseneck tube 150 can be turned to spray The position of the nozzle head 170 can be fine-tuned, and then the locking bolt 140 can be removed so that the locking bolt 140 is no longer pressed against the sliding connecting ring 120. Then the sliding block 130 can be moved along the sliding connecting ring 120, and the sliding block 130 can drive the gooseneck tube 150 and the nozzle 170 to move, so that the nozzle 170 can be moved around the grinding disk of the grinding device, and then the position of the nozzle 170 can be adjusted. The position of the nozzle 170 can be adjusted according to the needs or habits of the grinder, and the practicality is high.

[0028] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0029] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A wafer polishing liquid spraying device, characterized in that: include A spray assembly (100), the spray assembly (100) comprising a lifting member (110), a sliding connection ring (120), a sliding block (130), a locking bolt (140), a gooseneck tube (150), a telescopic hose (160) and a spray head (170), the sliding connection ring (120) being connected to the lifting end of the lifting member (110), the sliding block (130) being slidably sleeved on the ring body of the sliding connection ring (120), the locking bolt (140) being threadedly penetrated through the top wall of the sliding block (130), the locking bolt (140) being tightly pressed against the sliding connection ring (120), the gooseneck tube (150) being fixedly connected to the sliding block (130), the spray head (170) being fixedly connected to the gooseneck tube (150), and the spray head (170) being communicated with the telescopic hose (160).

2. A wafer polishing liquid spraying device according to claim 1, characterized in that: The lifting member (110) comprises a fixed plate (111), a threaded rod (112), a lifting block (113) and a rotating hand wheel (114); the threaded rod (112) is rotatably connected to the fixed plate (111); the lifting block (113) is slidably connected to the fixed plate (111); the lifting block (113) is threadedly connected to the threaded rod (112); and the rotating hand wheel (114) is fixedly connected to the top end of the threaded rod (112).

3. A wafer polishing liquid spraying device according to claim 2, characterized in that: A connecting plate (180) is provided at the bottom end of the fixing plate (111), and connecting holes (181) are provided at four corners of the connecting plate (180).

4. A wafer polishing liquid spraying device according to claim 2, characterized in that: A sliding groove (1111) is provided inside the fixing plate (111), the threaded rod (112) is rotatably connected to the inside of the sliding groove (1111), and the top end of the threaded rod (112) is rotatably passed through the top wall of the sliding groove (1111).

5. A wafer polishing liquid spraying device according to claim 4, characterized in that: The lifting block (113) is slidably connected to the inside of the sliding groove (1111), and the lifting block (113) is threadedly sleeved on the rod body of the threaded rod (112).

6. A wafer polishing liquid spraying device according to claim 2, characterized in that: The outer ring wall of the sliding connection ring (120) is provided with a connection rod (121), and one end of the connection rod (121) is fixedly connected to the lifting block (113).

7. A wafer polishing liquid spraying device according to claim 6, characterized in that: A through slot (131) is provided on one side of the sliding block (130), and the through slot (131) is slidably sleeved on the rod body of the connecting rod (121).

8. A wafer polishing liquid spraying device according to claim 1, characterized in that: The gooseneck tube (150) is located inside the sliding connection ring (120), and the telescopic hose (160) runs through the inside of the gooseneck tube (150).

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