Semiconductor processing clamping tool

Abstract

The utility model discloses a clamping tool for semiconductor processing, which comprises a machine base, a groove and clamping grooves are arranged on the upper side of the machine base, a connecting seat is rotatably arranged in the middle of the groove through a connecting shaft, a plurality of clamping plates are fixedly arranged on the outer side of the connecting seat, and each clamping plate is slidably arranged in the corresponding clamping groove. A plurality of clamping plates are fixedly arranged on the outer side of the connecting base, each clamping plate is arranged in the corresponding clamping groove in a sliding mode, one end of each connecting shaft is in transmission connection with a first air cylinder through a gear and rack set, a pushing and discharging mechanism is arranged on the inner wall of each clamping groove, and the machine base is arranged to be a round base. One end of the connecting shaft is in transmission connection with a first air cylinder through a gear rack set, so that the connecting shaft is driven by the first air cylinder and the gear rack set to rotate forwards and backwards for adjustment, the clamping plates can be turned over and adjusted, the two sides of a semiconductor placed in the clamping groove can be clamped and fixed, and a plurality of semiconductor pieces can be clamped and fixed at a time; and the semiconductor processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a semiconductor processing clamping tool. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. Semiconductors need to be clamped and fixed during semiconductor processing.

[0003] A clamping and feeding tool for semiconductor preparatory processing with application number 201920834439.2 in the prior art includes a clamping block base, a threaded through hole and a tightening handwheel; a rectangular groove is provided in the middle of the upper end surface of the clamping block base, and a motor is installed on the bottom end surface inside the rectangular groove; a pointer fixing block and a scale are respectively installed on the upper parts of the two movable clamping blocks, which is conducive to measuring the distance between the opposite surfaces of the two movable clamping blocks through a pointer fixedly connected to the pointer fixing block, thereby detecting the diameter of the cylindrical semiconductor clamped between the opposite surfaces of the two movable clamping blocks, thereby improving the practicability of the clamping and feeding tooling and reducing the occurrence of unqualified device quality caused by the use of cylindrical semiconductors with unqualified diameters. However, the stability of the clamping and fixing is general, and multiple semiconductor parts cannot be clamped and fixed at one time, which affects the efficiency of semiconductor processing. Utility Model Content

[0004] The utility model aims to provide a semiconductor processing clamping tool to solve the problem that the clamping and fixing in the prior art is generally stable and cannot clamp and fix multiple semiconductor parts at one time, which affects the efficiency of semiconductor processing.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor processing clamping tool, including a machine base, a groove and a clamping groove are provided on the upper side of the machine base, a connecting seat is rotatably provided in the middle part of the groove through a connecting shaft, a plurality of clamping plates are fixedly provided on the outer side of the connecting seat, and a single clamping plate is slidably arranged in the corresponding clamping groove, one end of the connecting shaft is connected to a first cylinder through a gear rack group, and a pushing and unloading mechanism is provided on the inner wall of the clamping groove.

[0006] Furthermore, the machine base is configured as a circular base, and a PLC control cabinet is provided outside the machine base.

[0007] Furthermore, the gear rack assembly includes a driven gear arranged at one end of the connecting shaft, and a driving rack is provided at one end of the first cylinder, and the driven gear and the driving rack are meshed and connected.

[0008] Furthermore, the gear rack assembly and the first cylinder are fixedly arranged in a cavity of the machine base, and a heat dissipation hole is provided at the lower part of the cavity.

[0009] Furthermore, a first protective layer is provided on one side of the clamping plate, and a second protective layer is provided on the inner wall of one end of the clamping groove.

[0010] Furthermore, the material pushing and unloading mechanism includes a pushing plate arranged on the bottom wall of the clamping groove through a second cylinder, and one end of the pushing plate is provided with a guide rod slidably arranged with a guide block.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] 1. The utility model has a plurality of clamping plates fixedly provided on the outside of a connecting seat, and a single clamping plate is slidably arranged in a corresponding clamping groove. One end of a connecting shaft is connected to a first cylinder through a gear rack group transmission, so that the connecting shaft is driven by the first cylinder and the gear rack group to rotate forward and reversely, thereby being able to flip and adjust the clamping plates, and being able to clamp and fix both sides of a semiconductor placed in the clamping groove. The clamping and fixing has a high stability, and multiple semiconductor parts can be clamped and fixed at one time, thereby improving the efficiency of semiconductor processing.

[0013] 2. The utility model provides a first protective layer on one side of the clamping plate, and a second protective layer on the inner wall of one end of the clamping groove, and both the first protective layer and the second protective layer are made of rubber layers, which increases the anti-slip properties of the clamping plate and the inner wall of one end of the clamping groove, which is beneficial to improving the stability of semiconductor clamping and fixing.

[0014] 3. The utility model is provided with a pushing and unloading mechanism through the inner wall of the clamping groove, and the pushing and unloading mechanism includes a pushing plate arranged on the bottom wall of the clamping groove through the second cylinder, and a guide rod slidably arranged with the guide block is provided at one end of the pushing plate, so that the pushing plate is driven by the second cylinder to move and adjust, thereby being able to adjust the depth of the semiconductor clamped and fixed in the clamping groove, and the processed semiconductor can be pushed outward for unloading, and the unloading is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0016] Figure 1 It is a top view of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the main cross section of the machine base of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the push-unloading mechanism of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the gear rack assembly of the utility model.

[0020] In the figure: 1. machine base; 2. clamping groove; 3. groove; 4. connecting shaft; 5. connecting seat; 6. clamping plate; 7. first protective layer; 8. second protective layer; 9. push plate; 10. second cylinder; 11. guide block; 12. driven gear; 13. driving rack; 14. first cylinder; 15. PLC control cabinet; 16. guide rod; 17. cavity. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1 , Figure 2 , Figure 3 , Figure 4 In the embodiment of the utility model, a semiconductor processing clamping tool comprises a machine base 1, a groove 3 and a clamping groove 2 are arranged on the upper side of the machine base 1, a connecting seat 5 is rotatably arranged in the middle of the groove 3 through a connecting shaft 4, a plurality of clamping plates 6 are fixedly arranged on the outer side of the connecting seat 5, and a single clamping plate 6 is slidably arranged in the corresponding clamping groove 2, and one end of the connecting shaft 4 is connected to a first cylinder 14 through a gear rack group transmission, so that the connecting shaft 4 is driven by the first cylinder 14 and the gear rack group to rotate forward and reversely, so that the clamping plate 6 can be flipped and adjusted, and the clamping plate 6 can be placed. It is placed in the clamping groove 2 for clamping and fixing on both sides of the semiconductor, and can clamp and fix multiple semiconductor parts at one time, thereby improving the efficiency of semiconductor processing. The gear rack group includes a driven gear 12 arranged at one end of the connecting shaft 4, and an active rack 13 is arranged at one end of the first cylinder 14, and the driven gear 12 and the active rack 13 are meshed and connected. The gear rack group and the first cylinder 14 are fixedly arranged in the cavity 17 of the machine base 1, and the lower part of the cavity 17 is provided with a heat dissipation hole. The machine base 1 is arranged as a circular base, and a PLC control cabinet 15 is arranged on the outside of the machine base 1.

[0023] like Figure 1 and Figure 3 As shown, in order to realize the rapid unloading of the processed semiconductor, a pushing and unloading mechanism is provided on the inner wall of the clamping groove 2, and the pushing and unloading mechanism includes a pushing plate 9 arranged on the inner bottom wall of the clamping groove 2 by the second cylinder 10, and a guide rod 16 slidingly arranged with the guide block 11 is provided at one end of the pushing plate 9, so that the pushing plate 9 is driven by the second cylinder 10 to move and adjust, thereby being able to adjust the depth of the semiconductor clamped and fixed in the clamping groove 2, and the processed semiconductor can be pushed outward for unloading, and the unloading is convenient and quick.

[0024] like Figure 1 As shown, in order to improve the stability of semiconductor clamping and fixing, a first protective layer 7 is provided on one side of the clamping plate 6, and a second protective layer 8 is provided on the inner wall of one end of the clamping groove 2, which increases the anti-slip properties of the clamping plate 6 and the inner wall of one end of the clamping groove 2, which is beneficial to improving the stability of semiconductor clamping and fixing.

[0025] The working principle and use process of the utility model are as follows: when in use, a connecting seat 5 is rotatably provided in the middle part of the groove 3 on the upper side of the machine base 1 through a connecting shaft 4, a plurality of clamping plates 6 are fixedly provided on the outer side of the connecting seat 5, and a single clamping plate 6 is rotatably and slidably arranged in the corresponding clamping groove 2, and one end of the connecting shaft 4 is connected to the first cylinder 14 through a gear rack group transmission, so that the connecting shaft 4 is driven by the first cylinder 14 and the gear rack group to rotate forward and reversely, so that the clamping plate 6 can be flipped and adjusted, and both sides of the semiconductor placed in the clamping groove 2 can be clamped and fixed, and multiple semiconductor parts can be clamped and fixed at one time, thereby improving the efficiency of semiconductor processing.

[0026] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor processing clamping tool, comprising a base (1), characterized in that: A groove (3) and a clamping groove (2) are provided on the upper side of the machine base (1); a connecting seat (5) is rotatably provided in the middle of the groove (3) via a connecting shaft (4); a plurality of clamping plates (6) are fixedly provided on the outer side of the connecting seat (5); and a single clamping plate (6) is slidably provided in a corresponding clamping groove (2); one end of the connecting shaft (4) is connected to a first cylinder (14) via a gear rack set; and a material pushing and unloading mechanism is provided on the inner wall of the clamping groove (2).

2. A semiconductor processing clamping tool according to claim 1, characterized in that: The machine base (1) is configured as a circular base, and a PLC control cabinet (15) is provided outside the machine base (1).

3. The semiconductor processing clamping tool according to claim 1, characterized in that: The gear rack assembly comprises a driven gear (12) arranged at one end of the connecting shaft (4), and a driving rack (13) is arranged at one end of the first cylinder (14), and the driven gear (12) and the driving rack (13) are meshed and connected.

4. A semiconductor processing clamping tool according to claim 3, characterized in that: The gear rack assembly and the first cylinder (14) are fixedly arranged in a cavity (17) of the machine base (1), and a heat dissipation hole is provided at the lower part of the cavity (17).

5. The semiconductor processing clamping tool according to claim 1, characterized in that: A first protective layer (7) is provided on one side of the clamping plate (6), and a second protective layer (8) is provided on the inner wall of one end of the clamping groove (2).

6. The semiconductor processing clamping tool according to claim 1, characterized in that: The material pushing and unloading mechanism comprises a material pushing plate (9) arranged on the inner bottom wall of the clamping groove (2) through a second cylinder (10), and one end of the material pushing plate (9) is provided with a guide rod (16) slidably arranged with a guide block (11).

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