Frame for atomic layer vapor deposition equipment

Abstract

The utility model discloses a rack for atomic layer vapor deposition equipment, the atomic layer vapor deposition equipment is provided with a rectangular working cavity, and the rack comprises a top sealing cover and a rectangular rack body; a clamping groove is formed in the top of the working cavity; an air outlet and an air uniformizing net are arranged at the bottom of the working cavity; the top sealing cover is arranged above the rack body and is fixedly connected with the rack body, a clamping lock catch matched with the clamping groove is arranged on the upper surface of the top sealing cover, and the clamping lock catch is slidably connected with the clamping groove; the wafer rack body is provided with a plurality of layers of carrying discs, the carrying discs are provided with a plurality of bearing grooves suitable for wafer shapes, the middle portions of the bearing grooves penetrate through the carrying discs, and an air inlet space is arranged between every two adjacent layers of carrying discs. Compared with an original loading disc, the loading disc is higher in flexibility and stronger in function, the number of the loading discs can be reduced and increased, the loading disc belongs to a combined rack, various irregular-shaped racks can be flexibly manufactured, the loading disc can be used for products of different shapes, and a large number of products are allowed to be processed and produced at the same time.

Description

Technical Field

[0001] The utility model relates to the technical field of atomic layer vapor deposition, in particular to a sheet rack for atomic layer vapor deposition equipment. Background Art

[0002] ALD (Atomic Layer deposition) is atomic layer vapor deposition technology, which refers to a technology that forms a thin film by alternately passing a gas phase precursor pulse into a reactor and chemically adsorbing and reacting on the deposition substrate. The thin film deposited by ALD has good density, good refractive index, and good film thickness uniformity. It can achieve 360-degree uniform deposition on any irregular substrate surface, and the film thickness is controllable. However, there are also some disadvantages, such as the deposition speed is too slow and the number of products produced at a single time is small. In order to improve the deposition efficiency, improve the film quality, and have a defect-free appearance, some of the purchased atomic layer vapor deposition equipment will undergo internal modifications, and the modified equipment needs to improve the product carrier at the same time. Utility Model Content

[0003] The utility model aims to provide a sheet rack for atomic layer vapor deposition equipment which is suitable for use with modified atomic layer vapor deposition equipment, improves production efficiency, increases the product carrying capacity during single production and ensures quality.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A wafer rack for an atomic layer vapor deposition device, the atomic layer vapor deposition device is provided with a working chamber in the shape of a rectangle, the wafer rack comprises a capping cover and a wafer rack body in the shape of a rectangle; a card slot is provided at the top of the working chamber, and an air outlet and a uniform air net are provided at the bottom of the working chamber; the capping cover is arranged above the wafer rack body and fixedly connected to the wafer rack body, a card lock buckle cooperating with the card slot is provided on the upper surface of the capping cover, and the card lock buckle is slidably connected to the card slot; the wafer rack body is provided with multiple layers of carrier discs, a plurality of bearing slots suitable for the shape of wafers are arranged on the carrier disc, the middle of the bearing slot passes through the carrier disc, and an air intake space is provided between two adjacent layers of carrier discs.

[0006] After the equipment chamber of this scheme is transformed, it is divided into a vacuum chamber and a vacuum reaction chamber, that is, an outer chamber and an inner chamber (working chamber). The space of the outer chamber is enlarged, and the inner chamber can be freely disassembled and replaced. However, the shape of the inner chamber changes after the transformation, from a circle to a rectangle, hexagon, trapezoid, etc.; the upper cover of the inner chamber is suspended, and a card slot for hanging the fixture is reserved on the inner side of the upper cover of the chamber, so a corresponding sample loading fixture (film rack) is designed. Due to various considerations of the yield and efficiency of the process, it is necessary to design a special fixture for sample loading during deposition that matches the transformed equipment chamber, and the whole must be suspended. The film rack is a more suitable loading fixture. The film rack can be connected to the card slot through the capping cover and suspended in the working chamber. The multi-layer carrier set on the film rack can carry a large number of products for simultaneous production. During operation, the gas enters from the bottom of the working chamber and is evenly distributed to the working chamber through the uniform gas net to ensure the quality of the deposited film.

[0007] As a preferred solution of the utility model, the sheet rack body is provided with four studs, the carrier plate is provided with through holes matching the four studs, and a plurality of the carrier plates are layered up and down and connected in series and fixed on the studs. The carrier plates of this solution can be reasonably allocated according to the required number, and are connected in series and fixed on the studs to ensure that the carrier plates do not shake during the production process.

[0008] As a preferred solution of the utility model, a plurality of evenly distributed isolation columns are provided on one side of the carrier, and the carrier adjacent to the capping cover and the two adjacent carriers are separated by isolation columns to form an air intake space. The air intake space of this solution can ensure that there is enough gas deposition space on the surface of the wafers and other products on each layer of the carrier, thereby ensuring the product yield.

[0009] As a preferred solution of the utility model, a card strip is provided at the top of the working chamber, the card strip is provided with a full-length T-shaped card slot, the card lock buckle is a T-shaped strip, and the sheet rack body is suspended on the card strip through the card lock buckle. The cooperation between the T-shaped card slot and the T-shaped strip of this solution not only facilitates the movement of the card lock buckle, but also ensures that the sheet rack is located in the center of the working chamber without shaking.

[0010] As a preferred solution of the utility model, the sheet frame is made of aluminum alloy.

[0011] This solution provides a sheet rack for loading samples during thin film deposition after the ALD equipment is modified, which is suitable for production of the modified equipment. The difference between the equipment and the original structure is that the originally purchased equipment has only one chamber with a circular size of 6 inches. When loading samples, it has a corresponding carrier. A separate mechanical arm is used to drag the carrier directly into the vacuum chamber. There are three 5 mm diameter ejectors inside to support the carrier, and then the thin film deposition begins. The carrier can accommodate up to 3 samples. Only one carrier can be transferred into the chamber at a time to wait for the film deposition to be completed. The air intake method is from bottom to top without a uniform air net. For optical products, the appearance requirements are strict. The air intake method will affect the appearance and present an uneven color distribution. The film removal temperature must be lowered to room temperature, otherwise the transmission system will be damaged. The purchased equipment is modified, and the corresponding sample loading fixture also needs to be designed and manufactured separately. The modified equipment adds an outer cavity, and then the 6-inch vacuum cavity is changed to a 30mm×50mm rectangular inner chamber. The inner chamber carries a horizontal air intake uniform air net, the transmission system is cancelled, and an aluminum transmission is used instead. The sheet rack for carrying samples of the present invention is completely in line with the modified chamber. It is different from the original carrier in that each layer is in a rectangular disc structure, and the middle of the sample slot is suspended. For samples that need to form a thin film on one side, two back-to-back samples can be placed in the sample slot, so that a large number of production products can be placed. There is a gap between the layers, which is supported by 4 screws, which complements the chamber gas network. The gap is convenient for gas entry, avoids product appearance defects, and improves the film quality. The material is aluminum alloy with fast heat dissipation. The temperature can be ignored when taking the film, and the transmission system and the sheet rack will not be damaged. The top layer of the sheet rack is sealed with a top layer, and a lock is made to match the inner slot of the chamber cover. In order to avoid shaking, the overall structure is connected with cylindrical screws around the sealing top layer to penetrate and lock it firmly. The overall structure is a rectangular body and is placed in the working chamber in a spatial suspension type. After the upper cover is closed, it is in the center of the chamber space, which assists the modified equipment in thin film deposition, effectively improves product yield and production efficiency, and most importantly, it can become an exclusive accessory for the operation of the modified equipment without causing equipment waste.

[0012] Compared with the prior art, the beneficial effects of the utility model are: higher flexibility and stronger functions than the original carrier plate, the number of carrier plates can be reduced and increased, it is a combined sheet rack, and a variety of irregular-shaped sheet racks can be flexibly manufactured, and it can take into account the use of products of different shapes, allowing a large number of products to be processed and produced at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0014] Figure 2 The utility model is a structural schematic diagram of a carrier plate.

[0015] Figure 3The utility model is a structural schematic diagram of the capping cover.

[0016] Figure 4 The utility model is a structural schematic diagram of the card strip.

[0017] In the figure: 1, film rack 2, capping cover 3, film rack body 4, card slot

[0018] 5. Lock buckle 6. Carrying plate 7. Carrying slot 8. Air intake space

[0019] 9. Studs 10. Spacer columns 11. Card strips. DETAILED DESCRIPTION

[0020] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0023] See also Figure 1-Figure 4 , the utility model provides a technical solution:

[0024] A wafer rack for an atomic layer vapor deposition device, the atomic layer vapor deposition device is provided with a working chamber in the shape of a rectangle, the wafer rack 1 comprises a capping cover 2 and a wafer rack body 3 in the shape of a rectangle; a card slot 4 is provided at the top of the working chamber, and an air outlet and a uniform air net are provided at the bottom of the working chamber; the capping cover 2 is provided above the wafer rack body 3 and is fixedly connected to the wafer rack body 3, a card locking buckle 5 cooperating with the card slot 4 is provided on the upper surface of the capping cover 2, and the card locking buckle 5 is slidably connected to the card slot 4; the wafer rack body 3 is provided with a multi-layer carrier 6, a plurality of bearing grooves 7 suitable for the shape of wafers are provided on the carrier 6, the middle of the bearing groove 7 passes through the carrier 6, and an air intake space 8 is provided between two adjacent layers of the carrier 6.

[0025] The sheet rack body 3 is provided with four studs 9 , and the carrier plate 6 is provided with through holes matched with the four studs 9 . A plurality of carrier plates 6 are layered up and down and are serially connected and fixed on the studs 9 .

[0026] A plurality of evenly distributed isolation columns 10 are disposed on one side of the carrier plate 6 , and the carrier plates 6 adjacent to the capping cover 2 and two adjacent carrier plates 6 are separated from each other by the isolation columns 10 to form an air intake space 8 .

[0027] A clamping strip 11 is provided on the top of the working chamber. The clamping strip 11 is provided with a through-length T-shaped clamping slot 4. The clamping lock buckle 5 is a T-shaped strip. The sheet rack body 3 is suspended on the clamping strip 11 through the clamping lock buckle 5 .

[0028] The sheet frame 1 is made of aluminum alloy.

[0029] The working process of the utility model is as follows: before production, according to the number of products, a capping cover 2 and a suitable number of carriers 6 are prepared, and the wafers to be processed are placed on the carriers 6. After a plurality of carriers 6 are layered and connected in series on four studs 9, the capping cover 2 is placed on the uppermost layer and fixed to complete the assembly of the entire wafer rack 1. The carriers 6 and the capping cover 2 are separated from each other by isolation columns 10 to form an air intake space. Then the wafer rack 1 is placed in the working chamber of the equipment. The wafer rack body 3 is suspended on the T-shaped slot 4 of the card strip 11 through the locking buckle 5 on the capping cover 2. Finally, the equipment is closed for atomic layer vapor deposition.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A sheet holder for an atomic layer vapor deposition device, Features: The atomic layer vapor deposition equipment is provided with a rectangular working chamber, and the wafer rack comprises a capping cover and a rectangular wafer rack body; The top of the working chamber is provided with a card slot, and the bottom of the working chamber is provided with an air outlet and an air-uniform net; The capping cover is arranged above the sheet frame body and fixedly connected to the sheet frame body, and a locking buckle cooperating with the card slot is arranged on the upper surface of the capping cover, and the locking buckle is slidably connected to the card slot; The wafer rack body is provided with multiple layers of carrier plates, and the carrier plates are provided with a plurality of carrier slots suitable for the shape of wafers, the middle of the carrier slots passes through the carrier plates, and an air intake space is provided between two adjacent layers of carrier plates.

2. A sheet holder for an atomic layer vapor deposition device according to claim 1, Features: The sheet rack body is provided with four studs, the carrier plate is provided with through holes matched with the four studs, and a plurality of carrier plates are layered up and down and are serially connected and fixed on the studs.

3. The sheet holder for atomic layer vapor deposition equipment according to claim 1, Features: A plurality of evenly distributed isolation columns are arranged on the side surface of one side of the carrier plate, and the carrier plate adjacent to the capping cover and two adjacent carrier plates are separated from each other by the isolation columns to form an air intake space.

4. The sheet holder for atomic layer vapor deposition equipment according to claim 1, Features: A clamping strip is arranged on the top of the working chamber, the clamping strip is provided with a through-length T-shaped clamping groove, the clamping lock is a T-shaped strip, and the sheet rack body is suspended on the clamping strip through the clamping lock.

5. The sheet holder for atomic layer vapor deposition equipment according to claim 1, Features: The sheet frame is made of aluminum alloy.

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