Circulating cooling electroplating system

Abstract

The utility model provides a circulating cooling electroplating system. The circulating cooling electroplating system comprises an electrolytic bath containing electrolyte; the electrode plate is mounted in the electrolytic bath; a liquid inlet is formed in the top of the cooling tower, and a liquid outlet is formed in the bottom of the cooling tower; the heat dissipation plate is mounted in the cooling tower; the first pipeline is communicated with the electrolytic bath and the liquid inlet; the circulating water pump is mounted on the first pipeline; the second pipeline is communicated with the liquid outlet and the electrolytic bath. Electrolyte and an electrode plate are respectively accommodated in the electrolytic bath, and a workpiece can be hoisted in the electrolytic bath by a crane for electroplating operation. Electrolyte in the electrolytic bath can be transferred into the cooling tower through the circulating water pump, and the electrolyte can be cooled through the heat dissipation plate in the process that the electrolyte falls down from the liquid inlet. And the cooled electrolyte can flow into the electrolytic bath again through the liquid outlet and the second pipeline so as to be recycled. The circulating cooling electroplating system can realize cooling and cyclic utilization of the electrolyte, and has the advantages of low energy consumption, low cooling cost and the like.

Description

Technical Field

[0001] The present application belongs to the field of electroplating technology, and more specifically, relates to a circulating cooling electroplating system. Background Art

[0002] Currently, many large injection molding machine spindles require hard chrome plating to improve their hardness, wear resistance, temperature resistance, and corrosion resistance. Since spindles are typically 2 meters or longer, electroplating requires a crane to hoist the spindle into a plating tank, where the plating solution is passed through.

[0003] The hard chrome plating temperature for spindles is typically around 40°C. Over extended periods of plating and due to the high current and heat generation, the plating bath temperature gradually rises. To maintain the plating temperature, a chiller is typically used for cooling. However, chillers are bulky, energy-intensive, and expensive to cool the electrolyte. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a circulating cooling electroplating system to solve the problems existing in the related art: high energy consumption and high cooling cost of cooling the electrolyte by a refrigerator.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of the present application are:

[0006] A circulating cooling electroplating system is provided, comprising:

[0007] an electrolytic cell containing an electrolyte;

[0008] an electrode plate, installed in the electrolytic cell;

[0009] A cooling tower is spaced apart from the electrolytic cell, wherein a liquid inlet is provided at the top of the cooling tower and a liquid discharge port is provided at the bottom of the cooling tower;

[0010] a heat sink installed in the cooling tower and located below the liquid inlet;

[0011] a first pipe connecting the electrolytic cell and the liquid inlet;

[0012] a circulating water pump, installed on the first pipeline, for transferring the electrolyte in the electrolytic tank to the cooling tower;

[0013] The second pipe is connected with the liquid discharge port and the electrolytic cell.

[0014] In one embodiment, there are multiple heat sinks, which are cross-stacked and arranged between the liquid inlet and the liquid outlet; and each heat sink is arranged to be inclined relative to a horizontal plane.

[0015] In one embodiment, an air inlet is provided at one end of the cooling tower, an air outlet is provided at the other end of the cooling tower, and the heat dissipation plate is provided between the air inlet and the air outlet.

[0016] In one embodiment, the circulating cooling electroplating system further includes an exhaust fan installed in the air inlet and / or the air outlet.

[0017] In one embodiment, a filter element is installed in the cooling tower, and the filter element is arranged between the air outlet and the liquid inlet.

[0018] In one embodiment, the circulating cooling electroplating system further includes a shower head for cleaning the workpiece, and the shower head is disposed above the electrolytic tank.

[0019] In one embodiment, a serpentine groove is provided on the top surface of the heat dissipation plate.

[0020] In one embodiment, a plurality of through holes are provided on the heat dissipation plate at intervals.

[0021] In one embodiment, the heat dissipation plate is detachably connected to the inner wall of the cooling tower.

[0022] In one embodiment, an inserting plate is provided on the heat dissipation plate, and a slot for inserting the inserting plate is provided on the inner side wall of the cooling tower.

[0023] The circulating cooling electroplating system provided by the embodiment of the present application has at least the following beneficial effects: the present application separately accommodates the electrolyte and the electrode plate through the electrolytic cell, and the workpiece can be hoisted by a crane in the electrolytic cell for electroplating operation. The electrolyte in the electrolytic cell can be transferred to the cooling tower by a circulating water pump, and the electrolyte can be cooled by the heat sink during the process of falling from the liquid inlet. The cooled electrolyte can flow back into the electrolytic cell through the drain port and the second pipe to achieve recycling and reuse. In this way, the circulating cooling electroplating system can realize the cooling and recycling of the electrolyte, and has the advantages of low energy consumption and low cooling cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] Figure 1 A schematic diagram of the structure of a circulating cooling electroplating system provided in an embodiment of the present application;

[0026] Figure 2 A schematic structural diagram of a heat dissipation plate provided in an embodiment of the present application;

[0027] Figure 3 A schematic structural diagram of another heat dissipation plate provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the structure of the connection between the heat sink and the cooling tower provided in an embodiment of the present application.

[0029] Among them, the main marks of the drawings in the figure are:

[0030] 1. Electrolytic cell; 2. Electrode plate;

[0031] 3. Cooling tower; 31. Liquid inlet; 32. Liquid outlet; 33. Air inlet; 34. Air outlet; 35. Slot;

[0032] 4. heat sink; 41. serpentine groove; 42. through hole; 43. plug-in board;

[0033] 5. First pipeline; 6. Circulating water pump; 7. Second pipeline; 8. Exhaust fan; 9. Filter element; 10. Sprinkler head; 11. Workpiece; 12. Crane. DETAILED DESCRIPTION

[0034] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0035] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0036] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, "multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0037] In the description of this application, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0039] Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout this specification, not all references are to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0040] See also Figure 1, the circulating cooling electroplating system provided in the embodiment of the present application is now described. The circulating cooling electroplating system includes an electrolytic cell 1, an electrode plate 2, a cooling tower 3, a heat sink 4, a first pipe 5, a circulating water pump 6 and a second pipe 7. The electrolytic cell 1 can contain an electrolyte and an electrode plate 2 respectively. Among them, the number of electrode plates 2 can be two, and the two electrode plates 2 are arranged at intervals, and the interval between the two electrode plates 2 forms a channel for the workpiece 11 to extend into. Among them, the workpiece 11 can be a main shaft, which is not the only limitation here. The workpiece 11 can be hoisted by a crane 12, and then the workpiece 11 can be placed in the electrolyte of the electrolytic cell 1; or, the workpiece 11 can be removed from the electrolyte after electroplating. The cooling tower 3 is arranged at intervals from the electrolytic cell 1, and a liquid inlet 31 is provided at the top of the cooling tower 3, and a liquid outlet 32 ​​is provided at the bottom of the cooling tower 3. The liquid inlet 31 can be connected to the electrolytic cell 1 through the first pipe 5, and the liquid outlet 32 ​​can be connected to the electrolytic cell 1 through the second pipe 7. The heat sink 4 can be installed in the cooling tower 3, and the heat sink 4 is arranged between the liquid inlet 31 and the drain port 32. One end of the heat sink 4 is connected to the inner wall of the cooling tower 3, and the other end of the heat sink 4 is spaced apart from the corresponding inner wall of the cooling tower 3, so that the electrolyte can flow through. The circulating water pump 6 is installed on the first pipe 5, and the circulating water pump 6 can transfer the electrolyte in the electrolytic cell 1 to the cooling tower 3. The electrolyte can enter from the liquid inlet 31, and the electrolyte can fall onto the heat sink 4 for cooling. The cooled electrolyte can be discharged into the electrolytic cell 1 through the drain port 32 and the second pipe 7. In this structure, the electrolyte and the electrode plate 2 are respectively accommodated through the electrolytic cell 1, and the workpiece 11 can be hoisted by the crane 12 in the electrolytic cell 1 for electroplating operations. The electrolyte in electrolytic cell 1 is transferred to cooling tower 3 via circulating water pump 6. As the electrolyte falls from liquid inlet 31, it is cooled by heat sink 4. The cooled electrolyte then flows back into electrolytic cell 1 via drain port 32 and second conduit 7 for recycling. This circulating cooling electroplating system achieves both electrolyte cooling and recycling, with the advantages of low energy consumption and low cooling costs.

[0041] In one embodiment, see Figure 1 As a specific implementation of the circulating cooling electroplating system provided in the embodiment of the present application, there are multiple heat sinks 4, and the multiple heat sinks 4 are cross-stacked and arranged, and the multiple heat sinks 4 are arranged between the liquid inlet 31 and the liquid outlet 32; each heat sink 4 is arranged obliquely to the horizontal plane. Specifically, take two adjacent heat sinks 4 as an example: the left end of the heat sink 4 located above is connected to the left inner wall of the cooling tower 3, and the right end of the heat sink 4 is spaced apart from the right inner wall of the cooling tower 3; the left end of the heat sink 4 located below is spaced apart from the left inner wall of the cooling tower 3, and the right end of the heat sink 4 is connected to the right inner wall of the cooling tower 3. In this structure, an S-shaped liquid passage is formed between the multiple heat sinks 4, which can extend the length of the cooling channel of the electrolyte, thereby improving the cooling effect on the electrolyte.

[0042] In one embodiment, see Figure 1 As a specific implementation of the circulating cooling electroplating system provided in an embodiment of the present application, an air inlet 33 is provided at one end of the cooling tower 3, an air outlet 34 is provided at the other end of the cooling tower 3, and a heat sink 4 is provided between the air inlet 33 and the air outlet 34. Specifically, the liquid inlet 31 can be opened at the top position on the left side of the cooling tower 3, and the liquid outlet 32 ​​can be opened at the bottom position on the left side of the cooling tower 3. The air inlet 33 can be opened at the bottom position on the right side of the cooling tower 3, and the air outlet 34 can be opened at the top position of the cooling tower 3. With this structure, the cold air entering from the air inlet 33 can pass through multiple heat sinks 4 in sequence and be discharged from the air outlet 34. The incoming cold air can assist in cooling the electrolyte, which can further improve the cooling effect.

[0043] In one embodiment, see Figure 1 As a specific embodiment of the cyclic cooling electroplating system provided in an embodiment of the present application, the cyclic cooling electroplating system includes an exhaust fan 8 , which can be installed at the air inlet 33 ; alternatively, the exhaust fan 8 can be installed at the air outlet 34 ; alternatively, an exhaust fan 8 can be installed at both the air inlet 33 and the air outlet 34 . This structure accelerates air circulation through the exhaust fan 8 , thereby increasing the cooling rate and thus the cooling efficiency.

[0044] In one embodiment, the circulating cooling electroplating system can also be connected to an external exhaust duct, which is not the only limitation here.

[0045] In one embodiment, see Figure 1 As a specific embodiment of the circulating cooling electroplating system provided in this embodiment, a filter element 9 is installed in the cooling tower 3, located between the air outlet 34 and the liquid inlet 31. With this structure, air entering through the air inlet 33 cools the electrolyte, leaving the air mixed with electrolyte vapor. This air mixed with electrolyte vapor is filtered by the filter element 9, thereby reducing environmental pollution.

[0046] In one embodiment, the filter element 9 may include a filter mesh box and filter cotton installed in the filter mesh box. The filter mesh box can be removably mounted on the inner wall of the cooling tower 3. Specifically, the filter mesh box can be fastened to the inner wall of the cooling tower 3 using fasteners such as screws; alternatively, the filter mesh box can be mounted on the inner wall of the cooling tower 3 using hooks, although this is not intended to be the only limitation. This structure allows the filter mesh box to accommodate the filter cotton. The filter mesh box is removably connected to the cooling tower 3, allowing the filter element 9 to be disassembled for maintenance and replacement.

[0047] In one embodiment, see Figure 1 , as a specific implementation of the circulating cooling electroplating system provided in an embodiment of the present application, the circulating cooling electroplating system also includes a spray head 10, which is arranged above the electrolytic cell 1. Specifically, the spray head 10 can be connected to an external water pipe. In this structure, when the workpiece 11 is electroplated, the water sprayed by the spray head 10 can clean the workpiece 11 during the process of the crane 12 lifting the workpiece 11 from the electrolyte. Moreover, the water sprayed by the spray head 10 can make up for the water evaporated due to the high temperature of electroplating. The electrolyte in the electrolytic cell 1 can be discharged to the cooling tower 3 by the circulating water pump 6 for cooling and filtering, and then flow back into the electrolytic cell 1 for recycling; the filter element 9 can filter the electrolyte vapor generated by high temperature, thereby achieving zero pollution discharge.

[0048] Optionally, there may be multiple spray heads 10 , which are spaced apart. The multiple spray heads 10 can improve the cleaning effect on the workpiece 11 .

[0049] In one embodiment, see Figure 2 As a specific embodiment of the circulating cooling electroplating system provided in the present application, a serpentine groove 41 is provided on the top surface of the heat sink 4. This structure and the serpentine groove 41 can increase the flow path of the electrolyte on the heat sink 4, thereby improving the cooling time and cooling effect of the electrolyte.

[0050] In one embodiment, see Figure 3 As a specific embodiment of the cyclic cooling electroplating system provided in an embodiment of the present application, a plurality of through-holes 42 are spaced apart on the heat sink 4. This structure allows electrolyte to pass through the plurality of through-holes 42, thereby accelerating the flow of the electrolyte. When there are multiple heat sinks 4, the through-holes 42 on the upper heat sink 4 are spaced apart vertically from the through-holes 42 on the lower heat sink 4, thereby extending the flow path of the electrolyte.

[0051] In one embodiment, the diameters of the plurality of through holes 42 gradually increase along the flow direction of the electrolyte on the heat sink 4, that is, the diameter of the through hole 42 located at one end of the heat sink 4 is the smallest, and the diameter of the through hole 42 located at the other end of the heat sink 4 is the largest, which can effectively improve the cooling effect of the electrolyte.

[0052] In one embodiment, as a specific implementation of the circulating cooling electroplating system provided in the embodiment of the present application, the heat sink 4 is detachably connected to the inner wall of the cooling tower 3. This structure enables the detachable connection of the heat sink 4, thereby facilitating maintenance and replacement of the heat sink 4.

[0053] In one embodiment, see Figure 4As a specific embodiment of the circulating cooling electroplating system provided in the present application, a heat sink 4 is provided with an insert plate 43, and a slot 35 for inserting the insert plate 43 is provided on the inner wall of the cooling tower 3. This structure, through the cooperation between the insert plate 43 and the slot 35, allows the heat sink 4 to be mounted on the inner wall of the cooling tower 3, facilitating the installation and removal of the heat sink 4.

[0054] In one embodiment, the heat sink 4 can also be fastened to the inner wall of the cooling tower 3 by fasteners such as screws; or, a clamping hole is opened on the heat sink 4, and a clamping plate inserted into the clamping hole is provided on the inner wall of the cooling tower 3.

[0055] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A circulating cooling electroplating system, characterized in that: include: An electrolytic cell containing an electrolyte; An electrode plate, installed in the electrolytic cell; A cooling tower is arranged at a distance from the electrolytic cell, a liquid inlet is provided at the top of the cooling tower, and a liquid discharge port is provided at the bottom of the cooling tower; A heat sink, installed in the cooling tower and located below the liquid inlet; A first pipeline connecting the electrolytic cell and the liquid inlet; a circulating water pump, installed on the first pipeline, for transferring the electrolyte in the electrolytic cell to the cooling tower; The second pipe is connected with the liquid discharge port and the electrolytic cell.

2. The circulating cooling electroplating system according to claim 1, characterized in that: There are multiple heat sinks, which are cross-stacked and arranged between the liquid inlet and the liquid outlet; each heat sink is inclined to a horizontal plane.

3. The circulating cooling electroplating system according to claim 1, characterized in that: An air inlet is provided at one end of the cooling tower, an air outlet is provided at the other end of the cooling tower, and the heat sink is arranged between the air inlet and the air outlet.

4. The circulating cooling electroplating system according to claim 3, characterized in that: The circulating cooling electroplating system also includes an exhaust fan installed in the air inlet and / or the air outlet.

5. The circulating cooling electroplating system according to claim 3, characterized in that: A filter element is installed in the cooling tower, and the filter element is arranged between the air outlet and the liquid inlet.

6. The circulating cooling electroplating system according to any one of claims 1 to 5, characterized in that: The circulating cooling electroplating system also includes a spray head for cleaning workpieces, and the spray head is arranged above the electrolytic tank.

7. The circulating cooling electroplating system according to any one of claims 1 to 5, characterized in that: The top surface of the heat dissipation plate is provided with a serpentine groove.

8. The circulating cooling electroplating system according to any one of claims 1 to 5, characterized in that: The heat dissipation plate is provided with a plurality of through holes at intervals.

9. The circulating cooling electroplating system according to any one of claims 1 to 5, characterized in that: The heat sink is detachably connected to the inner wall of the cooling tower.

10. The circulating cooling electroplating system according to claim 9, characterized in that: The heat sink is provided with an inserting plate, and the inner wall of the cooling tower is provided with a slot for inserting the inserting plate.

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