Semiconductor wafer thickness detection device

Abstract

The utility model relates to the field of semiconductor detection devices, and discloses a semiconductor wafer thickness detection device, which comprises a base and a wafer to be detected, a fixing mechanism is fixedly arranged at the upper end of the base, the fixing mechanism comprises an operation table, two threaded blocks and four fixing blocks, two sliding rods are fixedly arranged on the inner surface of the operation table, and the two threaded blocks and the four fixing blocks are fixedly arranged on the base. The portion, close to the front end, of the operation table is rotationally sleeved with a two-way lead screw, the front end of the two-way lead screw is fixedly connected with a control knob, the portion, close to the front end, of a rod body of the two-way lead screw is fixedly sleeved with a clockwork spring, telescopic rods are fixedly arranged on the two sides of two threaded blocks, and a detection mechanism is fixedly arranged at the portion, close to the rear end, of the upper end of the base. The detection mechanism comprises a protection frame and a fixing plate. According to the utility model, the fixing mechanism and the detection mechanism are arranged in the detection device, the fixing mechanism can ensure the stability of the wafer in the detection process, and the detection mechanism can effectively prevent the wafer from being extruded and damaged.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor detection devices, in particular to a semiconductor wafer thickness detection device. Background Art

[0002] Semiconductor wafers are one of the most important raw materials of LEDs. They are the light-emitting components of LEDs and the core part of LEDs. The quality of the wafers will directly determine the performance of LEDs. Most wafers are square and are mainly composed of III and V group compound semiconductor materials. Before the wafers are put into use, they need to be tested and evaluated, including size measurement. Given the small size of the chips, special thickness detection equipment is required to measure them.

[0003] As for the current thickness detection device, the wafer to be tested usually needs to be placed manually on the operating table. However, during the detection process, the wafer may undergo slight position changes, or there may be slight deviations in the manual placement position. These factors may affect the accuracy of the detection results. In addition, during the detection process, the operator needs to manually move the detection structure downward until the detection head contacts the upper end of the wafer. This operation method is often difficult to accurately control the moving distance. If the moving distance is insufficient, it may cause large errors in the detection results. If the moving distance is too large, it may cause damage to the wafer, which may affect the entire detection process.

[0004] Therefore, those skilled in the art provide a semiconductor wafer thickness detection device to solve the problems raised in the above background technology. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a semiconductor wafer thickness detection device, in which a fixing mechanism and a detection mechanism are provided. The fixing mechanism can ensure the stability of the wafer during the detection process, and the detection mechanism can effectively prevent the wafer from being squeezed and damaged.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A semiconductor wafer thickness detection device comprises a base and a wafer to be tested, wherein a fixing mechanism is fixedly arranged on the upper end of the base, wherein the fixing mechanism comprises an operating table, two threaded blocks and four fixed blocks, wherein two sliding rods are fixedly arranged on the inner surface of the operating table, wherein a bidirectional screw rod is arranged near a front end rotating sleeve of the operating table, wherein a control knob is fixedly connected to the front end of the bidirectional screw rod, wherein a spring spring is arranged near the front end fixed sleeve of the bidirectional screw rod, wherein telescopic rods are fixedly arranged on both sides of the two threaded blocks, wherein connecting rods are fixedly arranged at the lower ends of the four fixed blocks, wherein the lower ends of the four connecting rods are fixedly connected to sliding blocks;

[0008] A detection mechanism is fixedly arranged at the upper end of the base near the rear end, and the detection mechanism includes a protection frame and a fixing plate. An electric screw is fixedly arranged inside the protection frame, a support rod is fixedly arranged at the lower end of the fixing plate, and a plurality of telescopic ejectors are fixedly arranged at the lower end of the fixing plate near the middle.

[0009] Through the above technical solution, a fixing mechanism and a detection mechanism are provided in the detection device. The fixing mechanism can fix the wafer through a plurality of fixing blocks, wherein the bidirectional lead screw can be manually rotated and the clockwork spring can restore it to its original state, and the detection mechanism can detect the thickness of the wafer by contracting the telescopic ejector pin, wherein the distance that the fixing plate moves up and down is fixed, which can effectively avoid errors in the detection process caused by deviations in the moving distance.

[0010] Furthermore, the two threaded blocks are respectively threadedly sleeved on the bidirectional screw rod body near the front and rear ends, the four fixed blocks are slidably arranged on the upper end of the operating table, and sponge pads are fixedly arranged on opposite sides of the four fixed blocks;

[0011] Through the above technical solution, when the bidirectional screw rotates, the two threaded blocks can move in two directions along the screw, the fixed block can move along the slide groove on the operating table, and the sponge pad is located between the fixed block and the chip to play a buffering and protective role.

[0012] Furthermore, two slide grooves are provided at the upper end of the operating table, and the upper ends of the four connecting rods are slidably sleeved in the two slide grooves respectively;

[0013] Through the above technical solution, the width of the slide groove is the same as the diameter of the connecting rod, and the slide groove can be used for sliding of the connecting rod.

[0014] Furthermore, the four sliding blocks are fixedly connected to the four telescopic rods respectively, and the four sliding blocks are slidably sleeved on the outer surfaces of the two sliding rods respectively;

[0015] Through the above technical solution, the telescopic rod can drive the sliding block to slide along the sliding rod, and the telescopic rod is telescoped while driving the sliding block to move.

[0016] Further, one end of the spring close to the interior is fixedly connected to the outer surface of the bidirectional screw rod, and one end of the spring close to the exterior is fixedly connected to the interior of the operating table;

[0017] Through the above technical solution, the clockwork spring has a certain elasticity, and its two ends are respectively connected to the bidirectional lead screw and the operating table. After the bidirectional lead screw rotates a certain angle, it can rotate back to its original state under the action of the clockwork spring.

[0018] Furthermore, the operating table is fixedly arranged at a position near the middle of the upper end of the base, the wafer to be tested is movably placed at the upper end of the operating table, and the lower end of the protection frame is fixedly arranged at a position near the rear end of the upper end of the base;

[0019] Through the above technical solution, the operating table supports the wafer to be tested, which is convenient for detecting the thickness of the wafer, and the protective frame stably fixes the electric screw on the base.

[0020] Furthermore, a sensor is fixedly provided on the upper end of the fixing plate, and the plurality of telescopic ejector pins are electrically connected to the sensor;

[0021] Through the above technical solution, the sensor can convert the contraction displacement of the telescopic ejector pin into a digital signal, which is convenient for users to read the data directly and the data is accurate.

[0022] Furthermore, a threaded plate is fixedly provided at the rear end of the fixing plate, and the rear end of the threaded plate is threadedly sleeved on the electric lead screw;

[0023] Through the above technical solution, the threaded plate can move up and down as the electric screw rotates, and at the same time the threaded plate can drive the fixed plate to move up and down.

[0024] The utility model has the following beneficial effects:

[0025] 1. The utility model proposes a semiconductor wafer thickness detection device, in which a fixing mechanism is provided. During use, the control knob in the fixing mechanism can adjust the rotation of the bidirectional lead screw, thereby triggering the linkage of the internal structure and finally driving the movement of the fixed block. The clockwork spring can make the bidirectional lead screw rotate in the opposite direction to restore it to its original state. Such a design can realize fast fixation of the wafer and is easy to operate. It not only improves the stability of the wafer during detection, but also ensures the accuracy of the wafer position, thereby effectively reducing the error of wafer thickness detection.

[0026] 2. The utility model proposes a semiconductor wafer thickness detection device, in which a detection mechanism is provided. During use, a fixed plate in the detection mechanism can move up and down with the rotation of the lead screw, and the moving distance is fixed. The telescopic ejector pin can be retracted according to the wafer thickness to realize thickness detection. This design effectively avoids the error caused by manually moving the detection structure, thereby reducing the possibility of wafer damage or detection error, and ensuring the smooth progress of the detection process and the accuracy of the detection data. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a top-down axial schematic diagram of the utility model;

[0028] Figure 2 It is a bottom-view axial side schematic diagram of the utility model;

[0029] Figure 3 It is a schematic diagram of the axial side of the fixing mechanism in the utility model;

[0030] Figure 4 It is a cross-sectional axial schematic diagram of the fixing mechanism in the utility model;

[0031] Figure 5 for Figure 4 The enlarged schematic diagram of point A in the middle;

[0032] Figure 6 It is an axial schematic diagram of the detection mechanism in the utility model.

[0033] Legend:

[0034] 1. Base; 2. Wafer to be tested; 3. Fixing mechanism; 301. Operating table; 302. Control knob; 303. Spring; 304. Bidirectional lead screw; 305. Threaded block; 306. Telescopic rod; 307. Sliding block; 308. Connecting rod; 309. Fixing block; 310. Sponge pad; 311. Sliding rod; 312. Slide groove; 4. Detection mechanism; 401. Protection frame; 402. Electric lead screw; 403. Threaded plate; 404. Fixing plate; 405. Support rod; 406. Telescopic ejector pin; 407. Sensor. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0036] Reference Figure 1-6 , the utility model provides an embodiment: a semiconductor wafer thickness detection device, including a base 1 and a wafer to be tested 2, the upper end of the base 1 is fixedly provided with a fixing mechanism 3, the fixing mechanism 3 includes an operating table 301, two threaded blocks 305 and four fixed blocks 309, the inner surface of the operating table 301 is fixedly provided with two sliding rods 311, the operating table 301 is provided with a bidirectional screw rod 304 near the front end rotation sleeve, the front end of the bidirectional screw rod 304 is fixedly connected with a control knob 302, the rod body of the bidirectional screw rod 304 is provided with a clockwork spring 303 near the front end fixed sleeve, both sides of the two threaded blocks 305 are fixedly provided with telescopic rods 306, the lower ends of the four fixed blocks 309 are fixedly provided with connecting rods 308, and the lower ends of the four connecting rods 308 are fixedly connected with sliding blocks 307;

[0037] The operating table 301 is fixedly arranged at a position near the middle of the upper end of the base 1, and the wafer 2 to be tested is movably placed at the upper end of the operating table 301. Two threaded blocks 305 are respectively threadedly sleeved on the positions of the rod body of the bidirectional screw 304 near the front and rear ends. Four fixed blocks 309 are all slidably arranged on the upper end of the operating table 301. Sponge pads 310 are fixedly arranged on the opposite sides of the four fixed blocks 309. Two slide grooves 312 are provided at the upper end of the operating table 301. The upper ends of the rod bodies of four connecting rods 308 are respectively slidably sleeved in the two slide grooves 312. Four sliding blocks 307 are respectively fixedly connected to the four telescopic rods 306. The four sliding blocks 307 are respectively slidably sleeved on the outer surfaces of the two sliding rods 311. One end of the clockwork spring 303 close to the inside is fixedly connected to the outer surface of the bidirectional screw 304, and one end of the clockwork spring 303 close to the outside is fixedly connected to the inside of the operating table 301.

[0038] The device is provided with a fixing mechanism 3, and the base 1 supports the entire structure of the upper end to ensure the stability of the device during the detection process. The wafer 2 to be tested is mostly square and needs to be manually placed at the intersection of the two slide grooves 312 for thickness detection. The fixing mechanism 3 can stably fix the wafer in the middle position to ensure the accuracy of the detection data. The operating table 301 has the function of supporting the wafer and fixing the internal structure. The control knob 302 can manually control the rotation of the bidirectional screw rod 304, and the rotation of the bidirectional screw rod 304 can drive the threaded block 305 to move a short distance back and forth. The telescopic rod 306 can extend while driving the sliding block 307 to slide, and then drive the movement of the fixed block 309 through the connecting rod 308 to facilitate the placement of the wafer. The bidirectional screw rod 304 can be rotated and restored to its original state under the action of the clockwork spring 303. The sliding rod 311 can facilitate the sliding of the sliding block 307, and the slide groove 312 is mainly for the movement of the connecting rod 308;

[0039] A detection mechanism 4 is fixedly provided at the upper end of the base 1 near the rear end, and the detection mechanism 4 includes a protection frame 401 and a fixing plate 404. An electric screw 402 is fixedly provided inside the protection frame 401. A support rod 405 is fixedly provided at the lower end of the fixing plate 404. A plurality of telescopic ejectors 406 are fixedly provided at the lower end of the fixing plate 404 near the middle. The lower end of the protection frame 401 is fixedly provided at a position near the rear end of the upper end of the base 1. A sensor 407 is fixedly provided at the upper end of the fixing plate 404. The plurality of telescopic ejectors 406 are electrically connected to the sensor 407. A threaded plate 403 is fixedly provided at the rear end of the fixing plate 404. The rear end of the threaded plate 403 is threadedly sleeved on the electric screw 402.

[0040] The detection device is provided with a detection mechanism 4, which is used for multi-point thickness detection. The protection frame 401 is mainly used to fix the electric screw 402. The threaded plate 403 can move up and down with the rotation of the screw. The electric screw 402 can control the threaded plate 403 and the fixed plate 404 to move up and down a fixed length. The support rod 405 is supported between the operating table 301 and the fixed plate 404. The telescopic ejector pin 406 can shrink to a certain length when it contacts the wafer. The sensor 407 is a digital sensor that can detect displacement, which can convert the shrinkage displacement in the ejector pin into a numerical value, so that the user can directly read the data.

[0041] Working principle: When the device is needed to detect the thickness of the wafer, first, the control knob 302 is turned, and the bidirectional screw rod 304 is rotated, and the two threaded blocks 305 move to the front and rear ends respectively, and one end of the telescopic rod 306 moves under the influence of the threaded block 305. Since the telescopic direction of the telescopic rod 306 remains unchanged, the telescopic rod 306 moves and retracts while moving, and the other end of the telescopic rod 306 can drive the sliding block 307 while moving. The four sliding blocks 307 will slide outward along the two sliding rods 311, and drive the four fixed rods 311 to move outward through the four connecting rods 308. The fixed block 309 moves outward, and then the wafer 2 to be tested is placed in the middle position of the upper ends of the four operating tables 301. Then the control knob 302 is released, and the bidirectional screw rod 304 rotates to restore to its original state under the action of the spring spring 303. The two threaded blocks 305 move to their original positions, and the telescopic rod 306 and the sliding block 307 are linked accordingly. The four fixed blocks 309 move relative to each other to clamp and fix the wafer 2 to be tested. The sponge pad 310 is located between the fixed block 309 and the wafer to protect it, and the wafer 2 to be tested is stably fixed on the operating table 301.

[0042] After the wafer is fixed, the electric screw 402 is started, and the threaded plate 403 moves downward with the rotation of the screw until the lower end of the support rod 405 reaches the upper end of the operating table 301. The original length of the telescopic ejector pin 406 is the same as the length of the support rod 405. The wafer has a movable thickness, and the telescopic ejector pin 406 contracts accordingly. The sensor 407 can detect the telescopic length of multiple telescopic ejector pins 406, and then obtain the average thickness of the wafer, thereby realizing the thickness detection of the wafer.

[0043] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer thickness detection device, comprising a base (1) and a wafer to be detected (2), characterized in that: A fixing mechanism (3) is fixedly arranged at the upper end of the base (1), and the fixing mechanism (3) comprises an operating table (301), two threaded blocks (305) and four fixed blocks (309); two sliding rods (311) are fixedly arranged on the inner surface of the operating table (301); a bidirectional screw rod (304) is arranged near the front end rotating sleeve of the operating table (301); a control knob (302) is fixedly connected to the front end of the bidirectional screw rod (304); a spring (303) is arranged near the front end fixing sleeve of the bidirectional screw rod (304); telescopic rods (306) are fixedly arranged on both sides of the two threaded blocks (305); connecting rods (308) are fixedly arranged at the lower ends of the four fixed blocks (309); and sliding blocks (307) are fixedly connected to the lower ends of the four connecting rods (308); A detection mechanism (4) is fixedly arranged at the upper end of the base (1) near the rear end, and the detection mechanism (4) comprises a protection frame (401) and a fixing plate (404). An electric screw rod (402) is fixedly arranged inside the protection frame (401), a support rod (405) is fixedly arranged at the lower end of the fixing plate (404), and a plurality of telescopic ejector pins (406) are fixedly arranged at a position near the middle of the lower end of the fixing plate (404).

2. A semiconductor wafer thickness detection device according to claim 1, characterized in that: The two threaded blocks (305) are respectively threadedly sleeved on the bidirectional screw rod (304) near the front and rear ends of the rod body, and the four fixed blocks (309) are all slidably arranged on the upper end of the operating table (301), and sponge pads (310) are fixedly arranged on opposite sides of the four fixed blocks (309).

3. A semiconductor wafer thickness detection device according to claim 1, characterized in that: Two slide grooves (312) are provided at the upper end of the operating platform (301), and the upper ends of the four connecting rods (308) are slidably sleeved in the two slide grooves (312) respectively.

4. A semiconductor wafer thickness detection device according to claim 1, characterized in that: The four sliding blocks (307) are respectively fixedly connected to the four telescopic rods (306), and the four sliding blocks (307) are respectively slidably sleeved on the outer surfaces of the two sliding rods (311).

5. A semiconductor wafer thickness detection device according to claim 1, characterized in that: One end of the spring spring (303) close to the interior is fixedly connected to the outer surface of the bidirectional lead screw (304), and one end of the spring spring (303) close to the exterior is fixedly connected to the interior of the operating table (301).

6. A semiconductor wafer thickness detection device according to claim 1, characterized in that: The operating table (301) is fixedly arranged at a position close to the middle of the upper end of the base (1), the wafer to be tested (2) is movably placed at the upper end of the operating table (301), and the lower end of the protection frame (401) is fixedly arranged at a position close to the rear end of the upper end of the base (1).

7. A semiconductor wafer thickness detection device according to claim 1, characterized in that: A sensor (407) is fixedly arranged on the upper end of the fixing plate (404), and the plurality of telescopic ejector pins (406) are electrically connected to the sensor (407).

8. A semiconductor wafer thickness detection device according to claim 1, characterized in that: A threaded plate (403) is fixedly provided at the rear end of the fixing plate (404), and the rear end of the threaded plate (403) is threadedly sleeved on the electric lead screw (402).

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