Testing dotting device
By using multiple slide stages in the semiconductor testing equipment for continuous detection and drying of the units to be tested, the problem of the waiting time of the units to be tested is solved, and the testing efficiency and efficiency are improved.
Patent Information
- Application Number
- CN202420376281.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-28
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-02-28
AI Technical Summary
In existing semiconductor testing equipment, the waiting time interval between the test, dosing and drying processes of the unit to be tested is too long, resulting in inefficient testing and prolonged cycles.
A test and dot setting device is designed, using multiple slide tables to perform testing and dot marking of the units to be tested, and the continuous detection of the units to be tested is achieved through the movement of the slide table, shortening the waiting time interval, and baking at the baking component. Dry some ink.
The time interval for the unit to be tested is effectively shortened, the testing efficiency is improved, the testing time cost is reduced, and the orderly and continuous detection work of the unit to be tested is realized.
Smart Images
Figure CN222189417U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor testing, in particular to a testing dotting device. Background Art
[0002] The semiconductor testing process usually involves dotting abnormal grains after testing, and then drying the dotting ink through a baking process. In current testing equipment, only when one unit under test completes the testing process, dotting process, and drying process, will the next unit under test undergo the testing process, dotting process, and drying process. This means that the time interval between each unit under test waiting for testing is too long, resulting in a large amount of test time being wasted, greatly reducing test efficiency and extending the test cycle. Utility Model Content
[0003] The main purpose of the utility model is to provide a test dotting device, aiming to solve the technical problems of long waiting test interval and low overall test efficiency faced by the existing test dotting machines.
[0004] To achieve the above purpose, the utility model proposes a test dot device, comprising:
[0005] A test component, wherein the test component has a detection needle, and the detection needle is used to test the unit under test;
[0006] A dotting component, which is arranged at the downstream side of the test component and is used to dot-mark the bad test points of the unit to be tested with ink;
[0007] A plurality of wafer stages, the wafer stages are used to load the unit to be tested, the wafer stages are configured to be able to move between the test assembly and the dot-marking assembly, and to be able to move toward or away from the detection needle to implement the test of the unit to be tested, and to be able to move toward or away from the dot-marking assembly to implement the dot-marking of the unit to be tested;
[0008] Among them, the plurality of wafer carriers move to the test component and the dot marking component in sequence to implement the test and dot marking of the unit to be tested in sequence.
[0009] In some embodiments, a loading assembly is further included, the loading assembly includes a loading position, the loading position is used to store the untested units to be tested, and a plurality of first positioning rods are arranged around the loading position, the first positioning rods are used to position the units to be tested at the loading position;
[0010] The first positioning rod can move toward or away from the loading position to clamp or release the unit to be tested.
[0011] In some embodiments, a first manipulator is further included, wherein the first manipulator has a vacuum adsorption hole, and the vacuum adsorption hole is used to adsorb the unit to be tested, so as to transport the unit to be tested from the loading assembly to the wafer stage;
[0012] The loading assembly can move toward or away from the first manipulator so as to adsorb the unit to be tested to the first manipulator.
[0013] In some embodiments, a calibration component is further included, the calibration component is disposed on the upstream side of the test component, the calibration component includes a calibration camera, and the calibration camera is used to detect the mark position of the unit to be tested;
[0014] The stage can move toward or away from the calibration camera so that the calibration camera can detect the mark position of the unit to be tested, and the stage is driven by a rotating motor to facilitate the calibration camera to perform rotation detection on the unit to be tested.
[0015] In some embodiments, a second manipulator is further included, wherein the second manipulator has a lifting portion, and the lifting portion is used to lift the unit to be tested;
[0016] Among them, the wafer stage is provided with a plurality of first ejector pins, which can be extended or retracted from the wafer stage, and are used to lift or lower the unit to be tested from the wafer stage. When the unit to be tested is in a lifted state, the lifting part can lift the unit to be tested, and when the unit to be tested is in a lowered state, the unit to be tested can be positioned on the wafer stage.
[0017] In some embodiments, a baking assembly is further included, the baking assembly is arranged at the downstream side of the dot marking assembly, the baking assembly includes a baking position, the baking position is used to dry the ink dot marking of the unit to be tested, the baking position is provided with a plurality of second ejector pins, and the second ejector pins can be extended or retracted from the baking position;
[0018] Wherein, when the second ejector pin is in an extended state, the lifting portion places the unit to be tested lifted by the lifting portion on the second ejector pin, and when the second ejector pin is in a retracted state, the unit to be tested is positioned at the baking position.
[0019] In some embodiments, a material unloading assembly is further included, wherein the material unloading assembly includes a material unloading position, wherein the material unloading position is used to store the tested unit to be tested, and a plurality of second positioning rods are arranged around the material unloading position, wherein the second positioning rods are used to position the unit to be tested at the material unloading position;
[0020] The second positioning rod can move toward or away from the material discharge position to clamp or release the unit to be tested.
[0021] In some embodiments, there are at least two dot-marking assemblies, which are respectively arranged on opposite sides of the test assembly to form a first detection path and a second detection path, and the first detection path and the second detection path are both provided with the wafer stage;
[0022] Wherein, when the wafer carrier in the first detection path is at the testing component, the wafer carrier in the second detection path is at the dotting component.
[0023] In some embodiments, a guide rail is also included, and the first manipulator and the second manipulator are arranged on the guide rail so that the first manipulator and the second manipulator can slide along the guide rail.
[0024] In some embodiments, the test component, the dot-marking component and the wafer stage are all provided with position sensors and under-test unit detection sensors.
[0025] Compared with the prior art, the beneficial effects of the utility model are:
[0026] In the technical solution of the utility model, a plurality of wafer carriers for carrying the unit to be tested are arranged in one device. The unit to be tested can move with the wafer carrier to the test component to complete the test, and can also move to the dotting component to complete the dotting marking. The plurality of wafer carriers can enable the detection work of the unit to be tested to be carried out in an orderly and continuous manner.
[0027] The test dotting device provided by the utility model can greatly shorten the time interval for each unit to be tested to wait for testing by being provided with multiple wafer carriers. After the test of the previous unit to be tested is completed, the next unit to be tested can be tested immediately, which saves the waiting time of the units to be tested, effectively improves the test efficiency, and reduces the time cost of the test. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0029] Figure 1 A schematic diagram of the overall structure of a test dot device provided in one embodiment of the utility model;
[0030] Figure 2 for Figure 1 A partial enlarged view of the middle A;
[0031] Figure 3 for Figure 1 A partial enlarged view of point B in the middle;
[0032] Figure 4 for Figure 1 A partial enlarged view of point C in the middle;
[0033] Figure 5 A schematic diagram of the working process of the test dotting device provided in one embodiment of the utility model.
[0034] Description of Figure Numbers:
[0035] 100-test component;
[0036] 110-detection needle;
[0037] 200-dot assembly;
[0038] 300-slide stage;
[0039] 310-first thimble;
[0040] 400-feeding assembly;
[0041] 410-first positioning rod;
[0042] 500-calibration component;
[0043] 510-calibrate the camera;
[0044] 600-baking components;
[0045] 610-second thimble;
[0046] 700- blanking assembly;
[0047] 710 - second positioning rod;
[0048] 800-First manipulator;
[0049] 900-second manipulator;
[0050] 910-lifting department;
[0051] 1000 - Guide rails.
[0052] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0053] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0054] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0055] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0056] The semiconductor testing process usually involves dotting abnormal grains after testing, and then drying the dotting ink through a baking process. In current testing equipment, only when one unit under test completes the testing process, dotting process, and drying process, will the next unit under test undergo the testing process, dotting process, and drying process. This means that the time interval between each unit under test waiting for testing is too long, resulting in a large amount of test time being wasted, greatly reducing test efficiency and extending the test cycle.
[0057] In order to solve the technical problems of long waiting test interval and low overall test efficiency faced by existing test dotting machines, Figures 1 to 4The utility model provides a test dotting device in one embodiment, including a test component 100, a dotting component 200 and a plurality of wafer carriers 300. The test component 100, the dotting component 200 and the plurality of wafer carriers 300 are arranged in the same frame to improve the integration level of the whole device. The test component 100 has a detection needle 110, and the detection needle 110 is used to test the unit to be tested. The dotting component 200 is arranged on the downstream side of the test component 100, and is used to perform ink dotting on the test defective point of the unit to be tested. Note that the wafer stage 300 is used to load the unit to be tested, and the wafer stage 300 is configured to be able to move between the test component 100 and the dot-marking component 200, and to be able to move toward or away from the detection needle 110 to achieve testing of the unit to be tested, and to be able to move toward or away from the dot-marking component 200 to achieve dot marking of the unit to be tested, wherein a plurality of wafer stages 300 move to the test component 100 and the dot-marking component 200 in turn to achieve testing of the unit to be tested and dot marking in turn.
[0058] Specifically, in this embodiment, a plurality of wafer stages 300 for carrying the unit to be tested are provided in one device. The unit to be tested can move with the wafer stage 300 to the test component 100 to complete the test, and can also move to the dotting component 200 to complete the dotting marking. The plurality of wafer stages 300 can enable the detection work of the unit to be tested to be carried out in an orderly and continuous manner. Exemplarily, for example, it is assumed that the test dotting device has two wafer stages 300, both of which can be loaded with units to be tested, and the two wafer stages 300 are respectively the first wafer stage and the second wafer stage. After the unit to be tested is loaded on the first wafer stage, it can move in the direction of the test component 100, so that the test of the unit to be tested on the first wafer stage can be completed at the test component 100. At the same time, during the test of the unit to be tested on the first wafer stage, the unit to be tested will be loaded onto the second wafer stage. When the test of the unit to be tested on the first wafer stage is completed, the first wafer stage will move in the direction of the dotting component 200, and the test bad points in the unit to be tested on the first wafer stage will be marked with ink dotting. At this time, the second wafer stage will immediately move in the direction of the test component 100, so that the test of the unit to be tested on the second wafer stage can be completed at the test component 100, thereby realizing uninterrupted testing of the unit to be tested.
[0059] The test dotting device provided in this embodiment can greatly shorten the time interval for each unit to be tested to wait for testing by providing multiple wafer stages 300. After the test of the previous unit to be tested is completed, the next unit to be tested can be tested immediately, saving the waiting time for the unit to be tested, effectively improving the test efficiency and reducing the time cost of the test.
[0060] In some embodiments, the test dotting device can be designed as a turntable structure, and the dotting component 200 is arranged on the downstream side of the test component 100. A plurality of wafer stages 300 are arranged on the turntable structure in sequence. The plurality of wafer stages 300 can move along the turntable structure and pass through the test component 100 and the dotting component 200 in sequence. When the previous wafer stage 300 flows from the test component 100 to the dotting component 200, the next wafer stage 300 will follow closely and flow to the test component 100, and so on. Exemplarily, for example, two wafer stages 300 are sequentially arranged on the turntable structure, which are the first wafer stage and the second wafer stage. The first wafer stage and the second wafer stage can move along the turntable structure. First, the first wafer stage will move along the turntable structure to the test component 100 for testing. At this time, the unit to be tested has been loaded on the second wafer stage. After the test of the unit to be tested on the first wafer stage is completed and moves along the turntable structure to the dotting component 200, the second wafer stage will immediately move along the turntable structure to the test component 100. In this way, while ensuring the orderly movement of the first wafer stage and the second wafer stage, the time interval of the test component 100 when waiting for the test unit to be tested can be shortened.
[0061] In some other embodiments, the test dotting device can also be designed as a linear structure. In this case, the test component 100 is set in the middle position, and a dotting component 200 can be set on each of the opposite sides of the test component 100, which are the first dotting component and the second dotting component respectively. A first wafer carrier is set between the test component 100 and the first dotting component, and a second wafer carrier is set between the test component 100 and the second dotting component. The first wafer carrier circulates between the test component 100 and the first dotting component, and the second wafer carrier circulates between the test component 100 and the second dotting component. During the cyclic movement of the first wafer stage and the second wafer stage, one and only one wafer stage 300 will move in the direction close to the test component 100. In other words, when the first wafer stage moves in the direction close to the test component 100, the second wafer stage will move in the direction close to the second dot-marking component. When the second wafer stage moves in the direction close to the test component 100, the first wafer stage will move in the direction close to the first dot-marking component. In this way, while ensuring the orderly movement of the first wafer stage and the second wafer stage, the time interval of the test component 100 when waiting for the test unit can be shortened.
[0062] In some embodiments, the unit to be tested is a sheet product whose surface is not easily damaged. For example, the unit to be tested may be a wafer, a printed circuit board (PCBA), or a chip (IC). The wafer stage 300 is provided with vacuum adsorption holes to position the unit to be tested and prevent the unit to be tested from shifting during the movement of the wafer stage 300.
[0063] In some embodiments, reference Figure 1 to Figure 2 The test dotting device further includes a loading assembly 400, which includes a loading position for storing untested units to be tested, and a plurality of first positioning rods 410 are arranged around the loading position, and the first positioning rods 410 are used to position the units to be tested at the loading position. The first positioning rods 410 can move toward or away from the loading position to clamp or release the units to be tested.
[0064] Specifically, in the present embodiment, the unit to be tested is initially placed in the form of a stack at the loading position of the loading assembly 400, so that the unit to be tested is subsequently transported to the wafer stage 300, and the loading assembly 400 can perform preliminary concentric positioning of the unit to be tested through the first positioning rod 410. Exemplarily, for example, the loading assembly 400 can be provided with three first positioning rods 410, and the three first positioning rods 410 are all connected to a three-claw cylinder, and the three first positioning rods 410 are simultaneously driven by the three-claw cylinder to move in a direction close to the loading position, so as to facilitate the centering of the unit to be tested.
[0065] In some embodiments, reference Figure 1 to Figure 2 The test dotting device further includes a first manipulator 800, which has a vacuum adsorption hole for adsorbing the unit to be tested, so as to transport the unit to be tested from the loading assembly 400 to the wafer stage 300. The loading assembly 400 can move toward or away from the first manipulator 800, so as to adsorb the unit to be tested to the first manipulator 800.
[0066] Specifically, in this embodiment, the unit to be tested is transported from the loading position to the wafer carrier 300 by the first manipulator 800. Since the first manipulator 800 grasps the unit to be tested by vacuum adsorption, in order to ensure that the first manipulator 800 can smoothly absorb the unit to be tested from the loading position, the loading assembly 400 is designed to be a liftable structure. Specifically, the loading assembly 400 can be driven by a lifting cylinder to achieve the lifting of the loading assembly 400. When the first manipulator 800 needs to absorb the unit to be tested, the first manipulator 800 will first move to the top of the loading position, and then the loading assembly 400 will move in the direction close to the first manipulator 800 to push the unit to be tested upward. As the unit to be tested continues to rise, the suction force of the first manipulator 800 on the unit to be tested becomes greater and greater. Finally, the first manipulator 800 vacuum adsorbs the unit to be tested, so as to facilitate the subsequent transfer of the unit to be tested.
[0067] In some embodiments, reference Figure 1The test dotting device further includes a calibration component 500, which is disposed on the upstream side of the test component 100. The calibration component 500 includes a calibration camera 510, which is used to detect the mark position of the unit to be tested. The wafer stage 300 can move toward or away from the calibration camera 510 to enable the calibration camera 510 to detect the mark position of the unit to be tested, and the wafer stage 300 is driven by a rotating motor so that the calibration camera 510 can perform rotation detection on the unit to be tested.
[0068] Specifically, in this embodiment, before the unit to be tested is tested at the test assembly 100, the mark position of the unit to be tested needs to be aligned first. During the alignment of the mark position of the unit to be tested, the stage 300 first moves in the direction close to the calibration camera 510, so that the unit to be tested is aligned with the calibration camera 510, so that the calibration camera 510 can be used to detect the mark position of the unit to be tested. Then the stage 300 drives the unit to be tested to rotate. During the rotation of the unit to be tested, the calibration camera 510 searches for the mark position. When the mark position is found, it is the rotation position of the unit to be tested. The position of the calibration camera 510 is pre-set. If the position of the calibration camera 510 needs to be adjusted, it can be adjusted by adjusting the motor and the fine-tuning knob.
[0069] In some embodiments, in order to reduce the overall volume of the test dotting device and improve the integration level of the test dotting device, the correction components 500 and the dotting components 200 can be set in one body, and the number of correction components 500 and the number of dotting components 200 are set correspondingly.
[0070] In some embodiments, reference Figure 1 to Figure 2 The test dotting device also includes a second manipulator 900, which has a lifting portion 910. The lifting portion 910 is used to lift the unit to be tested, wherein the wafer stage 300 is provided with a plurality of first ejector pins 310, which can be extended or retracted from the wafer stage 300, and are used to lift or drop the unit to be tested from the wafer stage 300. When the unit to be tested is in a lifted state, the lifting portion 910 can lift the unit to be tested, and when the unit to be tested is in a dropped state, the unit to be tested can be positioned on the wafer stage 300.
[0071] Specifically, in this embodiment, after the unit to be tested is subjected to power-on parameter testing at the test assembly 100, the unit to be tested that fails the parameter test will be transferred to the dotting assembly 200 for ink dotting marking. Since the ink will not dry immediately after the unit to be tested is dotted with ink, the first manipulator 800 can no longer be used to transfer the unit to be tested by vacuum adsorption. The lifting portion 910 of the second manipulator 900 can only be used to contact the side of the unit to be tested that is not dotted with ink, "shovel up" the unit to be tested, and transfer it to the subsequent workstation. Under normal conditions, the unit to be tested is placed on the wafer stage 300 and is in direct contact with the wafer stage 300. When the unit to be tested that has been marked with ink needs to be transferred, the first ejector pin 310 on the wafer stage 300 extends and lifts the unit to be tested, so that there is a gap between the unit to be tested and the wafer stage 300. At this time, the lifting portion 910 extends into the above gap to lift the unit to be tested and transfer it to other processes.
[0072] In some embodiments, in order to ensure the stability of the unit under test during the lifting process, the wafer stage 300 may be provided with three first ejector pins 310, and the ends of the three first ejector pins 310 are generally arranged in a circle to stably lift the unit under test.
[0073] In some embodiments, reference Figure 1 and Figure 4 The test dotting device further includes a baking assembly 600, which is disposed at the downstream side of the dotting assembly 200. The baking assembly 600 includes a baking position, which is used to dry the ink dotting marks of the unit to be tested. The baking position is provided with a plurality of second ejector pins 610, which can be extended or retracted from the baking position. When the second ejector pins 610 are in an extended state, the lifting portion 910 places the lifted unit to be tested on the second ejector pins 610, and when the second ejector pins 610 are in a retracted state, the unit to be tested is positioned at the baking position.
[0074] Specifically, in this embodiment, in order to make the ink mark on the unit to be tested dry as quickly as possible and shorten the natural drying time of the ink mark, so as to facilitate the subsequent collection of the unit to be tested and not affect the normal progress of the entire process, a baking component 600 is provided at the downstream side of the dotting component 200. After the unit to be tested is marked with ink at the dotting component 200, the unit to be tested will be transferred to the baking component 600 by the second manipulator 900 for ink drying. In the process of the unit to be tested falling to the baking position, the second ejector pin 610 first extends to wait for the material to be received, and at the same time, the second manipulator 900 will hold the unit to be tested and move to the center of the baking component 600, and transfer the unit to be tested to the second ejector pin 610, and the second ejector pin 610 will lift the unit to be tested, and then the second manipulator 900 will retreat and withdraw, and finally the second ejector pin 610 will retract, and the unit to be tested will slowly fall, so as to achieve the placement of the unit to be tested in the baking position for ink mark drying.
[0075] Furthermore, in order to facilitate the alignment of the baking assembly 600 and the second manipulator 900, the baking assembly 600 can be driven by a lifting cylinder, and the lifting cylinder drives the baking assembly 600 to move up and down in a direction close to or away from the second manipulator 900. The baking assembly 600 can be provided with three second ejector pins 610, and the ends of the three second ejector pins 610 are generally arranged in a circle to stably lift the unit under test.
[0076] Preferably, the baking component 600 can be provided with multiple baking positions. When the first baking position starts baking, the second manipulator 900 can continue to place the unit to be tested at the second baking position. During the baking process, if the baking time is relatively long, the first manipulator 800 can also continue to load the unit to be tested stored in the loading component 400 to the wafer carrier 300 to save testing time.
[0077] In some embodiments, reference Figure 1 and Figure 4 The test dotting device further includes a material discharge assembly 700, which includes a material discharge position for storing the tested unit to be tested, and a plurality of second positioning rods 710 are arranged around the material discharge position, and the second positioning rods 710 are used to position the unit to be tested at the material discharge position. The second positioning rods 710 can move toward or away from the material discharge position to clamp or release the unit to be tested.
[0078] Specifically, in this embodiment, after the unit to be tested is baked, the second ejector pin 610 extends upward and lifts the unit to be tested, and the second manipulator 900 is inserted under the unit to be tested, and the baked unit to be tested is lifted up by the second manipulator 900, and is placed on the unloading assembly 700 in sequence. In the process of the unit to be tested falling to the unloading position, in order to enable the unit to be tested to be smoothly transferred from the second manipulator 900 to the unloading assembly 700, when the second manipulator 900 is above the unloading assembly 700, four second positioning pins are used. The rod 710 can limit and prevent the unit to be tested from sliding out of the unloading assembly 700, and the second positioning rod 710 can move toward the center of the lower material position and hold up the wafer. At this time, the second manipulator 900 retreats and withdraws, and the unloading assembly 700 moves upward to approach the unit to be tested, and then the second positioning rod 710 moves in the opposite direction, so that the unit to be tested is separated from the second positioning rod 710 and falls into the unloading position, completing the transfer of the unit to be tested from the second manipulator 900 to the unloading assembly 700, thereby placing the unit to be tested at the unloading position for material collection. Since the ink mark on the unit to be tested has been dried, the unit to be tested can be stacked at the unloading position.
[0079] Furthermore, the unloading component 700 is also provided with a through-beam sensor. When the unloading component 700 moves up and down, the through-beam sensor can identify the relative highest position of the unloading component 700, thereby judging the upward movement distance of the unloading component 700 and maintaining the spacing between the unloading component 700 and the unit to be tested on the second positioning rod 710 to prevent collision of the unit to be tested.
[0080] In some embodiments, reference Figure 1 There are at least two dotting assemblies 200, which are respectively arranged on opposite sides of the test assembly 100 to form a first detection path and a second detection path, and both the first detection path and the second detection path are provided with a wafer stage 300. When the wafer stage 300 in the first detection path is at the test assembly 100, the wafer stage 300 in the second detection path is at the dotting assemblies 200.
[0081] Specifically, in the present embodiment, the test dotting device adopts a linear structure design, and the test component 100 is set in the middle position at this time, and a dotting component 200 can be set on each of the two opposite sides of the test component 100, which are the first dotting component and the second dotting component respectively. A first wafer carrier is set between the test component 100 and the first dotting component, and a second wafer carrier is set between the test component 100 and the second dotting component. The first wafer carrier circulates between the test component 100 and the first dotting component, and the second wafer carrier circulates between the test component 100 and the second dotting component. During the cyclic movement of the first wafer stage and the second wafer stage, one and only one wafer stage 300 will move in the direction close to the test component 100. In other words, when the first wafer stage moves in the direction close to the test component 100, the second wafer stage will move in the direction close to the second dot-marking component. When the second wafer stage moves in the direction close to the test component 100, the first wafer stage will move in the direction close to the first dot-marking component. This ensures that the first wafer stage and the second wafer stage move in an orderly manner without interfering with each other, and at the same time, the time interval of the test component 100 waiting for the test unit can be shortened.
[0082] The test dotting device adopts a linear structure, which can effectively reduce the overall footprint of the device, save space for the device, ensure that more devices can be installed in the factory at the same time, and improve the production efficiency of the entire production line.
[0083] In some embodiments, reference Figure 1 The test dotting device further includes a guide rail 1000 , and the first manipulator 800 and the second manipulator 900 are disposed on the guide rail 1000 so that the first manipulator 800 and the second manipulator 900 can slide along the guide rail 1000 .
[0084] Specifically, in this embodiment, the first manipulator 800 and the second manipulator 900 can slide along the guide rail 1000 to transport the unit to be tested to each station, so as to achieve loading, testing, dotting, baking, unloading, etc. of the unit to be tested. The guide rail 1000 provides a guide for the movement of the first manipulator 800 and the second manipulator 900. The first manipulator 800 and the second manipulator 900 can perform linear motion along the guide rail 1000, reduce shaking in other directions, and improve the stability of the first manipulator 800 and the second manipulator 900 during the sliding process.
[0085] In some embodiments, the test component 100, the dotting component 200, the wafer stage 300, the loading component 400, the calibration component 500, the baking component 600, and the unloading component 700 are all provided with position sensors and detection sensors of the unit to be tested. The operation status of each component is obtained through a variety of position sensors and detection sensors, and the actions of each component are correctly controlled to prevent errors. For example, when the loading component 400 is out of material, an alarm will be issued to remind the material to be discharged, and when the unloading component 700 is full, an alarm will be issued to remind the material to be taken, so as to ensure that the material is placed and taken away in time to prevent the phenomenon of no material and material blockage.
[0086] Reference Figure 5 The test dotting device provided in this embodiment uses the first manipulator 800 to suck the unit to be tested from the loading assembly 400 with the preliminary concentric function onto the wafer stage 300, and the wafer stage 300 is then moved to the calibration assembly 500 to find the mark. After the first manipulator 800 places the unit to be tested on the first wafer stage, the first manipulator 800 then places the next unit to be tested from the loading assembly 400 on the second wafer stage. When the first wafer stage enters the test assembly 100 for the needle test, the second wafer stage moves to the calibration assembly 500 to find the mark. Move to the correction component 500 to find the mark and wait. After the test is completed, dot the abnormal grains. Since there are ink marks on the surface of the unit to be tested after dotting, the first robot 800 cannot directly contact the surface at this time. It is necessary to raise three pins through the carrier stage 300 to lift the unit to be tested, and then the second robot 900 will lift the unit to be tested, and the second robot 900 will move the unit to be tested to the baking component 600. After baking, the second robot 900 will move the unit to be tested to the unloading component 700.
[0087] The test dotting device provided in this embodiment combines multiple processes of testing, dotting, and baking with dual workstations through structural optimization, so that one machine can complete multiple actions, improve work efficiency, reduce the number of machines, save space and machine cost.
[0088] It should be noted that other contents of the test dotting device disclosed in the present utility model can be found in the prior art and will not be described in detail here.
[0089] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A test dot device, characterized in that: include: A test component, wherein the test component has a detection needle, and the detection needle is used to test the unit under test; A dotting component, which is arranged at the downstream side of the test component and is used to dot-mark the bad test points of the unit to be tested with ink; A plurality of wafer stages, the wafer stages are used to load the unit to be tested, the wafer stages are configured to be able to move between the test assembly and the dot-marking assembly, and to be able to move toward or away from the detection needle to implement the test of the unit to be tested, and to be able to move toward or away from the dot-marking assembly to implement the dot-marking of the unit to be tested; Among them, the plurality of wafer carriers move to the test component and the dot marking component in sequence to implement the test and dot marking of the unit to be tested in sequence.
2. The test dotting device according to claim 1, characterized in that: It also includes a loading assembly, the loading assembly includes a loading position, the loading position is used to store the untested unit to be tested, and a plurality of first positioning rods are arranged around the loading position, the first positioning rods are used to position the unit to be tested at the loading position; The first positioning rod can move toward or away from the loading position to clamp or release the unit to be tested.
3. The test dot device according to claim 2, characterized in that: It also includes a first manipulator, wherein the first manipulator has a vacuum adsorption hole, and the vacuum adsorption hole is used to adsorb the unit to be tested, so as to transport the unit to be tested from the loading assembly to the wafer stage; The loading assembly can move toward or away from the first manipulator so as to adsorb the unit to be tested to the first manipulator.
4. The test dotting device according to claim 1, characterized in that: It also includes a calibration component, which is arranged on the upstream side of the test component, and the calibration component includes a calibration camera, which is used to detect the mark position of the unit to be tested; The stage can move toward or away from the calibration camera so that the calibration camera can detect the mark position of the unit to be tested, and the stage is driven by a rotating motor to facilitate the calibration camera to perform rotation detection on the unit to be tested.
5. The test dot device according to claim 3, characterized in that: It also includes a second manipulator, wherein the second manipulator has a lifting portion, and the lifting portion is used to lift the unit to be tested; Among them, the wafer stage is provided with a plurality of first ejector pins, which can be extended or retracted from the wafer stage, and are used to lift or lower the unit to be tested from the wafer stage. When the unit to be tested is in a lifted state, the lifting part can lift the unit to be tested, and when the unit to be tested is in a lowered state, the unit to be tested can be positioned on the wafer stage.
6. The test dot device according to claim 5, characterized in that: The device further comprises a baking component, which is arranged at the downstream side of the dot-marking component, and comprises a baking position, which is used to dry the ink dot-marking marks of the unit to be tested, and the baking position is provided with a plurality of second ejector pins, which can be extended or retracted from the baking position; Wherein, when the second ejector pin is in an extended state, the lifting portion places the unit to be tested lifted by the lifting portion on the second ejector pin, and when the second ejector pin is in a retracted state, the unit to be tested is positioned at the baking position.
7. The test dotting device according to claim 1, characterized in that: It also includes a material unloading component, the material unloading component includes a material unloading position, the material unloading position is used to store the tested unit to be tested, and a plurality of second positioning rods are arranged around the material unloading position, the second positioning rods are used to position the unit to be tested at the material unloading position; The second positioning rod can move toward or away from the material discharge position to clamp or release the unit to be tested.
8. The test dotting device according to claim 1, characterized in that: There are at least two dot-marking assemblies, which are respectively arranged on two opposite sides of the test assembly to form a first detection path and a second detection path, and the first detection path and the second detection path are both provided with the wafer stage; Wherein, when the wafer carrier in the first detection path is at the testing component, the wafer carrier in the second detection path is at the dotting component.
9. The test dotting device according to claim 5, characterized in that: It also includes a guide rail, and the first manipulator and the second manipulator are arranged on the guide rail so that the first manipulator and the second manipulator can slide along the guide rail.
10. The test dot device according to any one of claims 1 to 9, characterized in that: The test component, the dot-marking component and the wafer stage are all provided with position sensors and detection sensors for units to be tested.