Liquid cooling heat dissipation structure of server power supply

Abstract

The utility model discloses a server power supply liquid cooling heat dissipation structure, which relates to the technical field of power supply heat dissipation structures, and comprises a liquid cooling plate which is arranged on the inner wall of a power supply shell and attached to one side of a circuit board, a micro-channel is arranged in the liquid cooling plate, and the micro-channel is arranged in a winding manner in the liquid cooling plate; a quick-release water inlet nozzle and a quick-release water outlet nozzle are arranged on one side, close to the power socket, of the liquid cooling plate, and the quick-release water inlet nozzle and the quick-release water outlet nozzle are respectively communicated with the micro-channel; and the liquid cooling heat conduction plate is arranged in the power supply shell and covers the top of the circuit board, and one side of the liquid cooling heat conduction plate is connected with the liquid cooling plate. According to the liquid cooling heat dissipation structure of the server power supply, the liquid cooling plate and the liquid cooling heat conduction plate are matched to cover most of the heating area of the circuit board, the contact area of a heat source is increased, a heat transfer path is optimized, heat of a heating element can be transferred into a micro-channel more efficiently, the cooling effect is improved, and long-time stable use of high-load equipment is met.

Description

Technical Field

[0001] The utility model relates to the technical field of power supply heat dissipation structures, in particular to a server power supply liquid cooling heat dissipation structure. Background Art

[0002] In the early days, servers usually adopted air cooling because the power consumption of chips and the whole system was relatively low. Air cooling was applied to servers with low power consumption and could meet their usage requirements. Traditional air cooling radiators use the air volume generated by forced convection of DC fans to exchange heat from the heating components through air. The greater the power consumption, the greater the corresponding fan speed and the noise.

[0003] Chinese patent CN201911387813.X discloses a 3U-VPX liquid-cooled power supply housing and method based on liquid cooling. A number of serpentine flow channels are arranged in the cold plate housing. The serpentine flow channel at the head end is long, the serpentine flow channel at the end end is short, and the length of the middle serpentine flow channel is between the serpentine flow channel at the head end and the serpentine flow channel at the end end. One end of the serpentine flow channel at the head end, the serpentine flow channel in the middle, and the serpentine flow channel at the end are flush, and the other ends of the serpentine flow channel at the head end, the serpentine flow channel in the middle, and the serpentine flow channel at the end are in a step-shaped structure. The serpentine flow channel at the head end is connected to the fluid connector to form the circulating liquid inlet end. The serpentine flow channel at the end is connected to the fluid connector to form the circulating liquid outlet end.

[0004] The existing server liquid cooling and air cooling hybrid cooling has problems such as high power consumption, high speed and serious noise. The cooling effect of the liquid cooling structure alone is difficult to meet the needs in high-load equipment. Due to the flow channel structure and heat source coverage problems, the overall cooling efficiency is low and the stable cooling effect cannot be maintained for a long time. Utility Model Content

[0005] The utility model aims to at least solve the technical problem existing in the prior art that "liquid cooling and air cooling mixed heat dissipation has the problems of high power consumption, high rotation speed and serious noise. The heat dissipation effect of a single liquid cooling heat dissipation structure is difficult to meet the demand in high-load equipment and cannot maintain a stable cooling effect for a long time." To this end, the utility model proposes a server power supply liquid cooling heat dissipation structure with a large heat source contact area and optimized flow channel heat transfer, which effectively realizes long-term stable operation of the power supply and meets the use of high-load equipment.

[0006] According to some embodiments of the present invention, a server power supply liquid cooling structure includes a power supply housing, a circuit board is fixedly arranged in the power supply housing, a power socket is arranged at the back of the power supply housing, and the power socket is electrically connected to the circuit board; including:

[0007] A liquid cooling plate is arranged on the inner wall of the power supply housing and is attached to one side of the circuit board. A microchannel is arranged in the liquid cooling plate, and the microchannel is arranged in a winding manner in the liquid cooling plate. A quick-release water inlet nozzle and a quick-release water outlet nozzle are arranged on the side of the liquid cooling plate close to the power socket, and the quick-release water inlet nozzle and the quick-release water outlet nozzle are respectively connected to the microchannel; and,

[0008] A liquid-cooled heat-conducting plate is arranged in the power supply housing and covers the top of the circuit board. One side of the liquid-cooled heat-conducting plate is connected to the liquid cooling plate.

[0009] According to some embodiments of the utility model, thermal conductive adhesive is filled between the liquid cooling plate and the circuit board, and the thermal conductive adhesive is filled between the liquid cooling heat conductive plate and the circuit board, and the thermal conductive adhesive is used to fill the gap between the heating element of the circuit board and the liquid cooling plate and the liquid cooling heat conductive plate.

[0010] According to some embodiments of the present utility model, the liquid cooling plate includes a liquid cooling base and a liquid cooling upper cover, the microchannel is arranged in the liquid cooling base, and the liquid cooling upper cover is sealed and connected to the liquid cooling base.

[0011] According to some embodiments of the utility model, the microchannel includes a liquid inlet channel and a liquid return channel, and the liquid inlet channel and the liquid return channel are laid on the surface of the liquid cooling base; one end of the liquid inlet channel is connected to the quick-release water inlet nozzle, and the other end is connected to the end of the liquid return channel, and the liquid return channel is connected to the quick-release water outlet nozzle.

[0012] According to some embodiments of the utility model, heat sinks are provided in the liquid inlet channel and the liquid return channel, and the heat sinks are provided along the extension direction of the channel.

[0013] According to some embodiments of the present invention, the liquid cooling base has an L-shaped structure, the microchannel is arranged on one side of the long side of the liquid cooling base, and the quick-release water inlet nozzle and the quick-release water outlet nozzle are arranged on one side of the short side of the liquid cooling base.

[0014] According to some embodiments of the present invention, the side edges of the liquid-cooled heat-conducting plate are respectively connected to the long side and the short side of the liquid-cooled base.

[0015] According to some embodiments of the present utility model, the power supply housing is further provided with a power supply fixing spring sheet, and the power supply fixing spring sheet is used to fix the installation position of the power supply housing.

[0016] According to some embodiments of the utility model, the power supply housing includes a power supply upper shell and a power supply lower shell, the circuit board and the power socket are fixedly arranged in the power supply lower shell, the liquid cooling plate is arranged on one side of the power supply upper shell, and the power supply upper shell and the power supply lower shell are detachably connected.

[0017] According to some embodiments of the present utility model, limiting spring pieces are disposed on the surfaces of the power supply upper shell and the power supply lower shell.

[0018] The server power supply liquid cooling heat dissipation structure according to some embodiments of the utility model has at least the following beneficial effects: the liquid cooling plate and the liquid cooling heat conductive plate cooperate to cover most of the heating area of ​​the circuit board, increase the heat source contact area, optimize the heat transfer path, and can more efficiently transfer the heat of the heating element to the microchannel, thereby improving the cooling effect and meeting the long-term stable use of high-load equipment.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 This is a three-dimensional schematic diagram of a liquid cooling heat dissipation structure of a server power supply according to an embodiment of the utility model;

[0022] Figure 2 This is an exploded schematic diagram of the liquid cooling heat dissipation structure of the server power supply according to an embodiment of the utility model;

[0023] Figure 3 This is a partial exploded schematic diagram of the server power supply liquid cooling heat dissipation structure according to the utility model embodiment

[0024] Figure 4 This is a schematic diagram of the liquid cooling plate structure of the server power supply liquid cooling heat dissipation structure according to an embodiment of the utility model;

[0025] Figure 5 This is a schematic diagram of the microchannel structure of the liquid cooling heat dissipation structure of the server power supply according to an embodiment of the utility model.

[0026] Reference numerals:

[0027] The power supply housing 100, the power supply upper housing 110, the power supply lower housing 120, the limiting spring piece 130,

[0028] Circuit board 210, power socket 220, power fixing spring 230,

[0029] Liquid cooling base 310 , liquid inlet channel 311 , liquid return channel 312 , heat sink 313 , liquid cooling upper cover 320 , liquid cooling heat conducting plate 330 , quick-release water inlet nozzle 340 , quick-release water outlet nozzle 350 . DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, top, bottom, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] Reference below Figure 1-Figure 5 The invention describes a server power supply liquid cooling heat dissipation structure according to an embodiment of the utility model.

[0035] like Figure 1-Figure 5 As shown, the server power supply liquid cooling structure includes a power supply housing 100, a circuit board 210 is fixedly arranged in the power supply housing 100, and a power socket 220 is arranged at the back of the power supply housing 100, and the power socket 220 is electrically connected to the circuit board 210. The power supply is connected to the mains through the power socket 220 to supply power to the circuit board 210, and the circuit board 210 rectifies the AC power into DC power and then connects to the electrical components in the device through the wiring port of the circuit board 210.

[0036] The liquid cooling heat dissipation structure of this embodiment mainly includes a liquid cooling plate and a liquid cooling heat conducting plate 330. The liquid cooling plate is arranged on the inner wall of the power supply housing 100, and is fitted with one side of the circuit board 210. A microchannel is arranged in the liquid cooling plate, and the microchannel is arranged in a winding manner in the liquid cooling plate. A quick-release water inlet nozzle 340 and a quick-release water outlet nozzle 350 are arranged on the side of the liquid cooling plate close to the power socket 220, and the quick-release water inlet nozzle 340 and the quick-release water outlet nozzle 350 are respectively connected to the microchannel. The cooling medium enters the microchannel of the liquid cooling plate from the quick-release water inlet nozzle 340, absorbs the heat in the microchannel and is discharged from the quick-release water outlet nozzle 350.

[0037] The liquid-cooled heat-conducting plate 330 is disposed in the power supply housing 100 and covers the top of the circuit board 210. One side of the liquid-cooled heat-conducting plate 330 is connected to the liquid-cooled plate. The liquid-cooled heat-conducting plate 330 covers the top of the circuit board 210 and can cover a large area of ​​the heating area of ​​the circuit board 210. The liquid-cooled heat-conducting plate 330 absorbs the heat of the heating element and transfers it to the liquid-cooled plate, which is then absorbed by the cooling medium.

[0038] The liquid-cooled heat dissipation structure of the server power supply of the present invention realizes a semi-wrapped structure for the circuit board 210 through a cold plate structure composed of a liquid cold plate and a liquid-cooled heat conductive plate 330, which is in effective contact with the heating area of ​​the circuit board 210, and the heat radiation area is increased. The heat generated by the circuit board 210 can be more quickly extracted and transferred to the microchannel for cooling, thereby meeting the needs of long-term operation of the equipment under high load conditions.

[0039] In some embodiments of the utility model, a thermally conductive adhesive (not shown in the drawings) is filled between the liquid cooling plate and the circuit board 210, and a thermally conductive adhesive is filled between the liquid cooling heat conductive plate 330 and the circuit board 210, and the thermally conductive adhesive is used to fill the gap between the heating element of the circuit board 210 and the liquid cooling plate and the liquid cooling heat conductive plate 330. Specifically, since the shapes of the heating elements of the circuit board 210 are different, the thermally conductive adhesive is used to fill the gap between the heating element and the liquid cooling plate and the liquid cooling heat conductive plate 330. The thermal conductivity of the thermally conductive adhesive is high, and it can quickly transfer the working heat to the liquid cooling plate and the liquid cooling heat conductive plate 330, thereby optimizing the heat transfer efficiency.

[0040] In some embodiments of the present invention, Figure 2 , Figure 4 and Figure 5 As shown, the liquid cooling plate includes a liquid cooling base 310 and a liquid cooling cover 320, the microchannel is arranged in the liquid cooling base 310, and the liquid cooling cover 320 is sealed and connected to the liquid cooling base 310. Specifically, the liquid cooling cover 320 and the liquid cooling base 310 are welded by a brazing process to form a channel. After welding, the liquid cooling plate is tested for air tightness, thermal resistance, and flow resistance performance indicators to ensure that the heat dissipation performance meets the requirements.

[0041] In a further embodiment, the cooling medium may be a single liquid coolant, including deionized water, PG25, EG25, fluorinated liquid, and the like.

[0042] In some embodiments of the present invention, Figure 5 As shown, the microchannel includes a liquid inlet channel 311 and a liquid return channel 312, and the liquid inlet channel 311 and the liquid return channel 312 are laid on the surface of the liquid cooling base 310; one end of the liquid inlet channel 311 is connected to the quick-release water inlet nozzle 340, and the other end is connected to the end of the liquid return channel 312, and the liquid return channel 312 is connected to the quick-release water outlet nozzle 350. Specifically, the liquid inlet channel 311 and the liquid return channel 312 have the same structure, and the ends of the two are connected to each other.

[0043] In a further embodiment, Figure 5 As shown, a heat sink 313 is provided in the liquid inlet channel 311 and the liquid return channel 312, and the heat sink 313 is provided along the extension direction of the channel. Specifically, the heat sink 313 can separate the channel into a plurality of parallel flow channels, and can extend the flow path of the cooling medium in the microchannel, thereby increasing the total heat absorption of the cooling medium. In this embodiment, the heat sink 313 is in a strip shape, and in other embodiments, it can also be in a tooth shape, a column shape, a diamond shape, and the like.

[0044] In some embodiments of the present invention, Figure 2 , Figure 4 and Figure 5 As shown, the liquid cooling base 310 is an L-shaped structure, the microchannel is arranged on one side of the long side of the liquid cooling base 310, and the quick-release water inlet nozzle 340 and the quick-release water outlet nozzle 350 are arranged on one side of the short side of the liquid cooling base 310. Specifically, the L-shaped structure is used to fit the layout of the power supply housing 100, so that the quick-release water inlet nozzle 340 and the quick-release water outlet nozzle 350 are arranged on the same side of the power socket 220, which is conducive to reducing the space occupied by the power supply.

[0045] In a further embodiment, Figure 2 and Figure 4 As shown, the sides of the liquid cooling heat conducting plate 330 are respectively connected to the long side and the short side of the liquid cooling base 310. Specifically, the liquid cooling heat conducting plate 330 and the liquid cooling plate are connected to form a half-shell structure, which can effectively cover the heating area of ​​the heating element on the circuit board 210.

[0046] In some embodiments of the present invention, Figure 1-Figure 3 As shown, the power housing 100 is also provided with a power fixing spring 230, which is used to fix the installation position of the power housing 100. Specifically, after the power housing 100 is installed in the device, the power fixing spring 230 is limitedly connected with the device rack. When the power housing 100 needs to be disassembled, the power fixing spring 230 is pressed to separate the power housing 100 from the device rack.

[0047] In some embodiments of the present invention, Figure 1-Figure 3As shown, the power supply housing 100 includes a power supply upper housing 110 and a power supply lower housing 120, a circuit board 210 and a power socket 220 are fixedly arranged in the power supply lower housing 120, and a liquid cooling plate is arranged on one side of the power supply upper housing 110, and the power supply upper housing 110 and the power supply lower housing 120 are detachably connected. It is convenient to disassemble the power supply housing 100 later to maintain and replace the liquid cooling plate.

[0048] In some embodiments of the present invention, Figure 1-Figure 3 As shown, the surfaces of the power supply upper shell 110 and the power supply lower shell 120 are both provided with limit springs 130. Specifically, the limit springs 130 can abut against the upper and lower sides of the equipment rack to relatively fix the positions of the power supply housing 100 and the equipment rack to prevent the power supply housing 100 from loosening.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A server power supply liquid cooling heat dissipation structure, comprising a power supply housing (100), a circuit board (210) being fixedly arranged in the power supply housing (100), a power socket (220) being arranged at the back of the power supply housing (100), and the power socket (220) being electrically connected to the circuit board (210); characterized in that: include: A liquid cooling plate is arranged on the inner wall of the power supply housing (100) and is in contact with one side of the circuit board (210); a microchannel is arranged in the liquid cooling plate, and the microchannel is arranged in a winding manner in the liquid cooling plate; a quick-release water inlet nozzle (340) and a quick-release water outlet nozzle (350) are arranged on one side of the liquid cooling plate close to the power socket (220); the quick-release water inlet nozzle (340) and the quick-release water outlet nozzle (350) are respectively connected to the microchannel; and, A liquid-cooled heat-conducting plate (330) is arranged in the power supply housing (100) and covers the top of the circuit board (210); one side of the liquid-cooled heat-conducting plate (330) is connected to the liquid cooling plate.

2. The server power supply liquid cooling heat dissipation structure according to claim 1, characterized in that: The liquid cooling plate and the circuit board (210) are filled with heat-conducting glue, and the liquid cooling heat-conducting plate (330) and the circuit board (210) are filled with the heat-conducting glue. The heat-conducting glue is used to fill the gap between the heating element of the circuit board (210) and the liquid cooling plate and the liquid cooling heat-conducting plate (330).

3. The server power supply liquid cooling heat dissipation structure according to claim 1, characterized in that: The liquid cooling plate comprises a liquid cooling base (310) and a liquid cooling upper cover (320), the microchannel is arranged in the liquid cooling base (310), and the liquid cooling upper cover (320) is sealedly connected to the liquid cooling base (310).

4. The server power supply liquid cooling heat dissipation structure according to claim 3, characterized in that: The micro-channel comprises a liquid inlet channel (311) and a liquid return channel (312); the liquid inlet channel (311) and the liquid return channel (312) are laid on the surface of the liquid cooling base (310); one end of the liquid inlet channel (311) is connected to the quick-detachable water inlet nozzle (340), and the other end is connected to the end of the liquid return channel (312); the liquid return channel (312) is connected to the quick-detachable water outlet nozzle (350).

5. The server power supply liquid cooling heat dissipation structure according to claim 4, characterized in that: Heat dissipation blocks (313) are arranged in the liquid inlet flow channel (311) and the liquid return flow channel (312), and the heat dissipation blocks (313) are arranged along the extension direction of the flow channel.

6. The server power supply liquid cooling heat dissipation structure according to claim 3, characterized in that: The liquid cooling base (310) is in an L-shaped structure, the microchannel is arranged on one side of the long side of the liquid cooling base (310), and the quick-detachable water inlet nozzle (340) and the quick-detachable water outlet nozzle (350) are arranged on one side of the short side of the liquid cooling base (310).

7. The server power supply liquid cooling heat dissipation structure according to claim 6, characterized in that: The side edges of the liquid-cooled heat-conducting plate (330) are respectively connected to the long side and the short side of the liquid-cooled base (310).

8. The server power supply liquid cooling heat dissipation structure according to any one of claims 1 to 7, characterized in that: The power supply housing (100) is also provided with a power supply fixing spring sheet (230), and the power supply fixing spring sheet (230) is used to fix the installation position of the power supply housing (100).

9. The server power supply liquid cooling heat dissipation structure according to any one of claims 1 to 7, characterized in that: The power supply housing (100) comprises a power supply upper housing (110) and a power supply lower housing (120); the circuit board (210) and the power supply socket (220) are fixedly arranged in the power supply lower housing (120); the liquid cooling plate is arranged on one side of the power supply upper housing (110); and the power supply upper housing (110) and the power supply lower housing (120) are detachably connected.

10. The server power supply liquid cooling heat dissipation structure according to claim 9, characterized in that: Limiting spring sheets (130) are provided on the surfaces of the power supply upper shell (110) and the power supply lower shell (120).

Images