Luminous keyboard and backlight module

Abstract

The utility model relates to a luminous keyboard and a backlight module. The backlight module is used for irradiating at least one keycap. The backlight module comprises a light-emitting unit, a light guide plate and a lamp panel. The light guide plate has a light guide plate hole for accommodating the light-emitting unit. The lamp panel is provided with at least one pair of bonding pads connected with the light-emitting units respectively. The lamp panel comprises a first reflecting layer which surrounds the light-emitting unit and at least partially covers the at least one pair of bonding pads. Each bonding pad of the at least one pair of bonding pads is provided with a plurality of branch lines and at least one hollow area. The at least one hollow area overlaps at least a part of the light-emitting unit. At least one light-emitting area is arranged between at least one pair of bonding pads. The utility model can avoid the problem of connection stability of the light-emitting unit and the problem of excessive concentration of emitted light in the adjacent area of the light-emitting unit.

Description

Technical Field

[0001] The utility model relates to a luminous keyboard and a backlight module, in particular to a luminous keyboard and a backlight module capable of improving the consistency of overall luminescence. Background Art

[0002] With the development of technology, keyboard designs are becoming more and more diverse. When users choose a keyboard, in addition to the basic input functions, the visual effect of the keyboard is also valued by users. Currently, luminous keyboards are available on the market. In addition to being visually attractive to users, they can also be used at night or in places with insufficient lighting. In the prior art, luminous keyboards use low-brightness light-emitting diodes to illuminate each square key, which will cause the following problems: 1) The main symbols above the light-emitting diodes are too bright, while the corner symbols of the keycaps are too dark; 2) The brightness of the light around the keycaps is inconsistent; and 3) The overall illumination of a single key and multiple keys is inconsistent. Utility Model Content

[0003] The purpose of the utility model is to provide a light-emitting keyboard and a backlight module which can improve the consistency of the overall light emission, so as to solve the above-mentioned problem.

[0004] In order to achieve the above-mentioned purpose, the utility model proposes a backlight module for illuminating at least one keycap, the backlight module comprising a light-emitting unit, a light guide plate and a lamp board. The light guide plate has a light guide plate hole to accommodate the light-emitting unit; the lamp board has at least one pair of pads, the at least one pair of pads are respectively connected to the light-emitting unit, the lamp board comprises a first reflection layer, the first reflection layer surrounds the light-emitting unit and at least partially covers the at least one pair of pads; wherein each of the at least one pair of pads has a plurality of branch lines and at least one hollow area, the at least one hollow area overlaps at least a portion of the light-emitting unit, and there is at least one light-emitting area between the at least one pair of pads.

[0005] As an optional technical solution, the at least one light-emitting area is a portion of the light board exposed between the at least one pair of solder pads.

[0006] As an optional technical solution, the light-emitting unit includes a plurality of crystal grains, and the light board has a plurality of pairs of pads to respectively connect the plurality of crystal grains.

[0007] As an optional technical solution, the lamp panel has a plurality of sub-conducting wires, and each pair of the plurality of pairs of welding pads is electrically connected to two sub-conducting wires of the plurality of sub-conducting wires.

[0008] As an optional technical solution, the at least one light-emitting area is located between two sub-conductors connected to the same pair of pads; or, the at least one light-emitting area is located between two sub-conductors connected to different pairs of pads.

[0009] As an optional technical solution, the lamp board also has two main conductors electrically connected to the multiple sub-conductors respectively. The lamp board also includes a pair of external microstructure areas spaced apart from each other and located on the first reflective layer. The pair of external microstructure areas are respectively located outside the two main conductors.

[0010] As an optional technical solution, the first reflective layer covers the plurality of sub-conducting wires.

[0011] As an optional technical solution, the light panel further includes a pair of microstructure regions spaced apart from each other, the pair of microstructure regions are located on the first reflective layer, and the pair of microstructure regions do not overlap the plurality of sub-conducting wires.

[0012] As an optional technical solution, the plurality of crystal grains are arranged in succession with their short sides facing short sides or their long sides facing long sides; or, the plurality of crystal grains are arranged relatively tilted.

[0013] As an optional technical solution, the inner ring portion of the first reflective layer at least partially covers the plurality of branch lines and the at least one hollow area, and the inner ring portion reflects and diffuses the light of the light-emitting unit.

[0014] As an optional technical solution, the light board also includes a pair of microstructure areas spaced apart from each other, the pair of microstructure areas are located on the first reflective layer, the pair of microstructure areas jointly surround the at least one pair of pads, and the pair of microstructure areas reflect and diffuse the light transmitted by the light-emitting unit through the light guide plate.

[0015] As an optional technical solution, at least one of the plurality of branch lines is not completely covered by the first reflective layer, and each branch line of each pad reflects and diffuses the light of the light-emitting unit relative to the exposed portion of the first reflective layer.

[0016] As an optional technical solution, at least a portion of the first reflective layer is located in the hole of the light guide plate.

[0017] As an optional technical solution, the backlight module includes a shading plate, the shading plate includes an internal reflection portion, and the internal reflection portion overlaps the first reflection layer.

[0018] As an optional technical solution, at least one of the multiple branch lines of the at least one pair of pads surrounds at least a portion of the light guide plate hole.

[0019] As an optional technical solution, the first reflective layer has a reflective layer hole, and the at least one hollow area of ​​the at least one pair of pads surrounds and / or overlaps the reflective layer hole.

[0020] As an optional technical solution, the first reflective layer has a reflective layer hole, and the reflective layer hole is located between the light-emitting unit and the light guide plate hole.

[0021] As an optional technical solution, the first reflective layer has a reflective layer hole, and a portion of the first reflective layer overlapping the at least one pair of pads is located between the reflective layer hole and the light guide plate hole.

[0022] In addition, the utility model also provides a luminous keyboard, which includes a plurality of keys and the aforementioned backlight module, each key has a key cap; the backlight module is located below the plurality of keys.

[0023] In summary, the various embodiments of the present invention solve the connection stability problem of the light-emitting unit and the problem of excessive light concentration in the vicinity of the light-emitting unit. In addition to using a solder pad with a hollow area to ensure that the light-emitting unit can still be connected smoothly when the component is offset, the solder pad and its hollow area are further used in conjunction with the first reflective layer to form a light homogenization design. In addition, at least one light-emitting area between at least one pair of solder pads can reflect and diffuse the light of the light-emitting unit, and a high degree of uniformity can be achieved in a single key and the entire keyboard range.

[0024] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. 4 is a schematic diagram of a luminous keyboard according to an embodiment of the present invention.

[0026] Figure 2 for Figure 1 A partial top view of the illuminated keyboard in FIG.

[0027] Figure 3 for Figure 1 A partially exploded diagram of the illuminated keyboard in FIG.

[0028] Figure 4 for Figure 1 A partial cross-sectional view of the illuminated keyboard in FIG.

[0029] Figure 5 FIG. 4 is a partial top view of a luminous keyboard according to another embodiment of the present invention.

[0030] Figure 6 for Figure 5 A partial cross-sectional view of the illuminated keyboard in FIG.

[0031] Figure 7 It is a partial cross-sectional view of a luminous keyboard according to another embodiment of the utility model.

[0032] Figure 8 It is a partial cross-sectional view of a luminous keyboard according to another embodiment of the utility model.

[0033] Fig. 9 It is a partial cross-sectional view of a luminous keyboard according to another embodiment of the utility model.

[0034] Fig.10 for Figure 1 Another partial top view of the illuminated keyboard in FIG.

[0035] Fig.11 for Figure 1 Another partial top view of the illuminated keyboard in FIG.

[0036] Fig. 12A It is a top view schematic diagram of the end-to-end connection of the (sub-) wires of the lamp board, the soldering pads and the light-emitting units in another embodiment of the utility model.

[0037] Fig. 12B for Fig. 12A A partial enlarged schematic diagram of an embodiment.

[0038] Fig. 12C for Fig. 12A Schematic top view of the side connection of the embodiment.

[0039] FIG. 13A to FIG. 13F They are respectively top views of the connection structures of the (sub) conductors of the lamp board, the two soldering pads and the light-emitting unit in different embodiments of the present invention.

[0040] Fig.14A It is a partial top view schematic diagram of the optical structure of the backlight module in the surrounding area of ​​the light-emitting unit according to another embodiment of the utility model.

[0041] Fig. 14B for Fig.14A A partial cross-sectional schematic diagram of a backlight module of an embodiment.

[0042] Fig. 14C It is a partial top view schematic diagram of the optical structure of the backlight module in the surrounding area of ​​the light-emitting unit according to yet another embodiment of the present invention.

[0043] Fig.14D For this utility model Fig.14A A partial top view schematic diagram of the optical architecture of the backlight module of a derivative embodiment.

[0044] Fig.15A It is a top view schematic diagram of the (sub) conductors, solder pads and light-emitting units of a lamp board according to another embodiment of the utility model.

[0045] Fig. 15B It is a top view schematic diagram of the (sub) conductors, solder pads and light-emitting units of a lamp board according to another embodiment of the utility model.

[0046] Fig. 15C It is a top view schematic diagram of the (sub) conductors, solder pads and light-emitting units of a lamp board according to another embodiment of the utility model. DETAILED DESCRIPTION

[0047] In order to provide a further understanding of the purpose, structure, features and functions of the present invention, the present invention is described in detail below with reference to the embodiments.

[0048] The use of low-power light-emitting units such as Mini LED or Micro LED can reduce power consumption, reduce the total heat generated by the backlight module, and reduce the overall thickness of the backlight module, which helps to further thin the overall illuminated keyboard. However, the highly limited light-emitting range of MiniLED or Micro LED poses a great challenge to the uniformity of light emission of a single key on the illuminated keyboard and the entire keyboard range. The embodiment of the utility model first focuses on how to achieve a large proportion of the light from the light-emitting unit entering the light guide plate for lateral transmission, and how to effectively recover the light that passes through the light guide plate during the lateral transmission into the light guide plate for reuse.

[0049] See also Figure 1 , Figure 1 FIG. 4 is a schematic diagram of a luminous keyboard LKB according to an embodiment of the present invention.

[0050] like Figure 1 As shown, the luminous keyboard LKB includes a backlight module BLM and a plurality of keys KS. A base plate SUP is disposed on the backlight module BLM, and the plurality of keys KS are disposed on the base plate SUP. Generally speaking, the plurality of keys KS may include square keys and multiple keys (e.g., blank keys). It should be noted that the number, size, and arrangement of the keys KS may be determined according to actual applications and are not limited to the embodiments shown in the figures.

[0051] The backlight module BLM includes a lamp board LCB, a light guide plate LGP and a light shielding plate SS. The light guide plate LGP is disposed on the lamp board LCB, and the light shielding plate SS is disposed on the light guide plate LGP. Under each key KS on the light-emitting keyboard LKB corresponds to at least one light-emitting unit (e.g., a light-emitting diode) on the lamp board LCB of the backlight module BLM.

[0052] See also Figures 2 to 4 , Figure 2 for Figure 1 A partial top view of the luminous keyboard LKB in FIG. Figure 3 for Figure 1 A partial exploded diagram of the luminous keyboard LKB in FIG. Figure 4 for Figure 1 A partial cross-sectional view of the luminous keyboard LKB.

[0053] like Figures 2 to 4As shown, the light board LCB includes two non-intersecting wires LT and HT, another two non-intersecting wires STa and STb, a light-emitting unit LED, a first reflective layer RL1, and a plurality of microstructure regions MS. The light board LCB may be a lighting circuit board. The light-emitting unit LED is connected between the two non-intersecting wires STa and STb, and the light-emitting unit LED is connected between the two non-intersecting wires LT and HT via the two non-intersecting wires STa and STb. In the present embodiment, the wires LT and HT are the main driving circuits of the light-emitting unit LED, and the wires STa and STb are the sub-driving circuits of the light-emitting unit LED, wherein the wire LT may be a low-potential wire, and the wire HT may be a high-potential wire. The light-emitting unit LED may be a white light emitting diode or a combination of red, green, and blue light-emitting diodes, depending on the actual application. Generally speaking, the wires LT and HT will be the main wires with a larger cross-sectional area, and may span across multiple keys KS. The wires LT and HT do not intersect at least within the range of a single key KS, and may also not intersect within multiple adjacent keys KS and a larger continuous area covering the key gaps. A pair of conductors STa and STb arranged within each single key KS are sub-conductors with smaller cross-sectional areas. Although they may be located on the same straight line, the ends of the conductors STa and STb are respectively connected to the two electrodes of the light-emitting unit LED, so the conductors STa and STb do not overlap.

[0054] The first reflective layer RL1 is arranged on two non-intersecting conductors LT and HT and another two non-intersecting conductors STa and STb. A plurality of microstructure regions MS are formed on the first reflective layer RL1. In the present embodiment, the microstructure region MS may be a concave-convex structure formed on the first reflective layer RL1. For example, the light board LCB may be composed of a flexible circuit board, and a copper mesh is often used to enhance the supporting strength of the circuit board. The first reflective layer RL1 may be formed by spraying reflective paint or coating a reflective film on the surface of the flexible circuit board (including the surface of the copper mesh). The grid structure of the copper mesh will cause the first reflective layer RL1 to form regular concave points (grid points) and convex areas (grid lines). These concave points and convex areas have a reflective function and can reflect light back to the light guide plate LGP; in fact, the copper wire area (conductors LT, HT, STa, STb) can also become a convex linear reflective area. In principle, the copper mesh does not overlap with the conductors LT and HT on the flexible circuit board, nor does it electrically connect the conductors STa and STb. However, the copper mesh has a radio frequency interference shielding effect in application, so the copper mesh can be connected to the ground of the driving circuit. However, in actual operation, not any reflective layer covering the copper mesh and the circuit can produce a concave-convex reflective structure. If the first reflective layer RL1 is an independent thin film element, the thickness of the first reflective layer RL1 must be thin enough, for example, lower than the thickness of the copper foil substrate (including the adjacent flat copper mesh and copper wire area), and the first reflective layer RL1 needs to be highly plastic so that it can form a concave-convex microstructure in the copper mesh and copper wire area when covering the copper foil substrate. If the first reflective layer RL1 is formed by ink coating, the coating thickness, ink consistency, coating area control, etc. must be strictly controlled, otherwise the original hollow part of the copper foil substrate is easily filled with ink flow, reducing the depth of the reflective microstructure and the reflective diffusion effect.

[0055] In addition, even if the circuit of the light board LCB is not a copper foil substrate, and there is neither a thick copper circuit nor a copper mesh to strengthen the structural strength of the light board LCB, a microstructure with a diffusion effect can still be formed on the first reflective layer RL1. For example, printing micro-dot ink on the first reflective layer RL1 forms a concave area / convex area as a microstructure area MS; or, selecting ink with larger reflective particles, when spraying or printing the first reflective layer RL1, the concave area / convex area is simultaneously formed as the microstructure area MS; or, if the first reflective layer RL1 is a reflective film, the reflective film surface can be selected as long as the reflective particles have a medium to low flatness and have an uneven reflective surface, which can be used as the microstructure area MS.

[0056] In this embodiment, within the scope of a single key KS, the plurality of microstructure regions MS include two internal microstructure regions IMS and two external microstructure regions OMS, wherein the two internal microstructure regions IMS are located between the two non-intersecting wires LT and HT, and the two external microstructure regions OMS are located outside the two non-intersecting wires LT and HT. The patterns of the two internal microstructure regions IMS may be different from the patterns of the two external microstructure regions OMS, but are not limited thereto. The light-emitting unit LED is located between the plurality of microstructure regions MS, that is, the light-emitting unit LED is located between the two internal microstructure regions IMS and also between the two external microstructure regions OMS.

[0057] In the present embodiment, the conductors STa and STb divide the two internal microstructure regions IMS, so the conductors STa and STb are also located between the two internal microstructure regions IMS; similarly, the conductors LT and HT divide an external microstructure region OMS and two internal microstructure regions IMS respectively, so it can also be said that the conductors LT and HT are located between an external microstructure region OMS and two internal microstructure regions IMS respectively. In some embodiments, the aforementioned multiple microstructure regions MS, whether the external microstructure region OMS or the internal microstructure region IMS, do not overlap the conductors LT and HT, nor do they overlap the conductors STa and STb; for example, the circuit of the light board LCB does not overlap with the multiple microstructure regions MS when copper wires are matched with copper mesh. In other embodiments, if the microstructure region MS on the first reflective layer RL1 is only surface treated and not formed from the copper mesh or other substrate below, multiple microstructure regions MS / OMS / IMS may overlap the conductors LT and HT, or overlap the conductors STa and STb. The light guide plate LGP has a light guide hole L0, and the light-emitting unit LED is located in the light guide hole L0. The top surface and / or bottom surface of the light guide plate LGP near the light guide hole L0 may have adhesive surrounding the light guide hole L0 to respectively adhere the light shielding plate SS and / or the light board LCB. In addition, the light guide plate LGP also has a plurality of microstructure areas LMS corresponding to the positions of the inner hole Sc and the peripheral holes SUPH of the bottom plate SUP, so as to guide the light transmitted in the light guide plate LGP to emit light upward. Below the orthographic projection of the peripheral holes SUPH of the bottom plate SUP, the microstructure area LMS of the light guide plate LGP may at least partially overlap with the plurality of microstructure areas MS of the first reflective layer RL1 on the light board LCB, which may increase the light emitting effect through the inner hole Sc and the peripheral holes SUPH, and enhance the brightness of the corner symbols (external light-transmitting area KC1) of the keycap KCC. The internal microstructure area IMS on the first reflective layer RL1 of the light board LCB, which is close to the light-emitting unit LED, can be used as an optical adjustment method. When the light output near the light-emitting unit LED is excessively weakened, for example, the internal masking part ML0 of the mask layer ML of the shading plate SS is too large, or the transmittance of the internal reflective part RL0 of the second reflective layer RL2 is too low, the internal microstructure area IMS on the first reflective layer RL1 of the light board LCB, which is close to the light-emitting unit LED, can enhance the light output effect of the light-transmitting area KC0 passing through the inner hole Sc or the internal light-transmitting area KC0 of the keycap KCC.

[0058] Furthermore, a better way to optimize the configuration of the aforementioned multiple microstructure areas MS / OMS / IMS is to set the wires STa, STb, LT, and HT to overlap with any rib area or frame area of ​​the base plate SUP (such as the annular rib Sr0, the bridging rib Sr1, and the support frame Sf) as much as possible. In this way, the aforementioned multiple microstructure areas MS / OMS / IMS will be able to correspond to the microstructure area LMS of the light guide plate LGP, and also to the peripheral hole SUPH or the inner hole Sc of the base plate SUP, and even to the internal light-transmitting area KC0 and the external light-transmitting area KC1 of the keycap KCC. In addition, multiple microstructure areas MS / OMS / IMS may also overlap the annular rib Sr0, the bridging rib Sr1 or the support frame Sf of the bottom plate SUP. Although these positions cannot emit light, the microstructure areas MS / OMS / IMS can help guide the light that escapes from the light guide plate LGP into the light guide plate LGP for recycling, which helps the subsequent light emission effect of the outer side of the external light-transmitting area KC1 or even another adjacent key KS. Of course, the aforementioned microstructure area MS / OMS / IMS can also overlap with the second reflective layer RL2 of the shading plate SS, including overlapping with the internal reflective portion RL0 and the outer frame portion of the second reflective layer RL2, which helps to recycle the light to the light guide plate LGP.

[0059] The light shielding plate SS is disposed above the plurality of microstructure regions MS. The light shielding plate SS comprises a mask layer ML, a second reflective layer RL2 and a protective layer PL, wherein the mask layer ML, the second reflective layer RL2 and the protective layer PL can be stacked on each other in various ways. For example, any one of the mask layer ML, the second reflective layer RL2 and the protective layer PL can be stacked on the top, the middle or the bottom to form the light shielding plate SS. The mask layer ML is opaque. The second reflective layer RL2 can have both reflective and translucent properties, that is, the second reflective layer RL2 can reflect part of the light and allow part of the light to pass through. The mask layer ML can be black paint, and the second reflective layer RL2 can be white paint, but is not limited thereto. In the present embodiment, the mask layer ML has a mask layer hole MLH and an internal mask portion ML0 located in the mask layer hole MLH, and the second reflective layer RL2 has a reflective layer hole RLH and an internal reflective portion RL0 located in the reflective layer hole RLH. The mask layer hole MLH may be larger, equal to or smaller than the reflective layer hole RLH, and the internal mask portion ML0 may be larger, equal to or smaller than the internal reflective portion RL0, depending on the desired lighting effect. The internal mask portion ML0 and the internal reflective portion RL0 are located above the light-emitting unit LED. In this embodiment, the internal mask portion ML0 and / or the internal reflective portion RL0 above the light-emitting unit LED are at least partially projected between the two non-intersecting wires LT, HT or the two non-intersecting wires STa, STb.

[0060] Each key KS includes a portion of the base plate SUP. In the present embodiment, the base plate SUP has an inner hole Sc, an annular rib Sr0, a plurality of bridging ribs Sr1, and a support frame Sf, wherein the annular rib Sr0 surrounds the inner hole Sc, and the plurality of bridging ribs Sr1 connect the annular rib Sr0 and the support frame Sf. In addition, there are a plurality of peripheral holes SUPH between the bridging ribs Sr1, the annular ribs Sr0, and the support frame Sf. In the present embodiment, the two internal microstructure areas IMS at least partially overlap with the projection of the inner hole Sc, the annular rib Sr0, the plurality of bridging ribs Sr1, and / or the support frame Sf. In addition, the two external microstructure areas OMS at least partially overlap with the projection of the annular rib Sr0, the plurality of bridging ribs Sr1, and / or the support frame Sf.

[0061] The key KS includes a keycap KCC, a supporting device SSR, a circuit board MEM and a bottom plate SUP. The keycap KCC is arranged relative to the bottom plate SUP. The keycap KCC has an internal light-transmitting area KC0 and multiple external light-transmitting areas KC1, wherein the areas around the internal light-transmitting area KC0 and the areas around the external light-transmitting area KC1 are opaque areas KC2. The positions of the internal light-transmitting area KC0 and the external light-transmitting area KC1 correspond to the positions of the inner hole Sc and the peripheral hole SUPH of the bottom plate SUP, respectively, so that the light emitted by the light-emitting unit LED can be projected from the internal light-transmitting area KC0 and the external light-transmitting area KC1 of the keycap KCC through the light guide plate LGP, the shading plate SS, the inner hole Sc and the peripheral hole SUPH of the bottom plate SUP. The supporting device SSR is arranged between the keycap KCC and the bottom plate SUP. When the keycap KCC is pressed, the keycap KCC will move vertically toward the bottom plate SUP along with the supporting device SSR. In addition, a reset member (not shown in the figure), such as a rubber dome, is disposed between the key cap KCC and the base plate SUP, but not limited thereto. The circuit board MEM has a switch corresponding to the key KS, such as a membrane switch or other trigger switch.

[0062] From the top view, the light-emitting unit LED, the light guide hole L0, the internal reflection part RL0, the internal mask part ML0, the inner hole Sc, the internal light-transmitting area KC0 and the adhesive around the light guide hole L0 can be located between the two non-intersecting wires LT, HT and / or the two non-intersecting wires STa, STb.

[0063] From the top view, the light emitting unit LED, the light guide hole L0, the internal reflection portion RL0, the internal mask portion ML0, the inner hole Sc, the internal light transmission area KC0 and the adhesive around the light guide hole L0 may be located between the two internal microstructure areas IMS.

[0064] like Figure 4As shown, the backlight module BLM also includes a protruding structure BP, wherein the position of the protruding structure BP corresponds to the position of the light-emitting unit LED, and the protruding structure BP is located between two non-intersecting wires LT and HT. In addition, the protruding structure BP is also located between a plurality of microstructure regions MS, that is, the protruding structure BP is located between two internal microstructure regions IMS and between two external microstructure regions OMS. In the present embodiment, the protruding structure BP is formed on the light board LCB, and the protruding structure BP forms a groove IP to accommodate the light-emitting unit LED, so that the upper surface of the light-emitting unit LED is flush with or lower than the upper surface of the light guide plate LGP and higher than the lower surface of the light guide plate LGP. Since the light shielding plate SS is disposed on the light guide plate LGP, the upper surface of the light-emitting unit LED will also be flush with or lower than the lower surface of the light shielding plate SS, so that the light shielding plate SS can remain flat and will not be pushed by the light-emitting unit LED and partially enter the inner hole Sc of the bottom plate SUP. Thereby, the amount of light emitted by the light-emitting unit LED entering the light guide plate LGP can be increased, thereby improving the consistency of the overall light emission. Furthermore, the circuit board MEM may have a switch disposed corresponding to the inner hole Sc of the bottom plate SUP, so that the switch can partially enter the inner hole Sc of the bottom plate SUP without interfering with the shading plate SS and the light emitting unit LED thereunder.

[0065] See also Figure 5 as well as Figure 6 , Figure 5 FIG. 2 is a partial top view of a light emitting keyboard LKB according to another embodiment of the present invention. Figure 6 for Figure 5 A partial cross-sectional view of the luminous keyboard LKB.

[0066] like Figure 5 and Figure 6As shown, the base plate SUP may not have the above-mentioned inner hole Sc. At this time, the shading plate SS remains flat and will not be pushed by the light-emitting unit LED. When the base plate SUP does not have the inner hole Sc, the keycap KCC may not have an internal light-transmitting area KC0. However, if the keycap KCC has an internal light-transmitting area KC0, the peripheral holes SUPH around the central area of ​​the keycap KCC can be used to emit light, so that the light is projected from the internal light-transmitting area KC0. In this embodiment, the two non-intersecting wires HT and LT may overlap with the projection of at least one of at least one external light-transmitting area KC1. As long as the two non-intersecting wires HT and LT meet at least one of the following three conditions, the wires HT and LT will not affect the luminescence of the external light-transmitting area KC1 of the keycap KCC. Condition 1: The two non-intersecting wires HT and LT overlap with the projection of the annular rib Sr0, the bridging rib Sr1 and / or the support frame Sf of the base plate SUP. Condition 2: The projection of the two non-intersecting wires HT and LT overlaps with the mask layer ML and / or the second reflective layer RL2 of the light shielding plate SS. Condition 3: The projection of the two non-intersecting wires HT and LT overlaps with the opaque region KC2 of the keycap KCC.

[0067] See also Figure 7 , Figure 7 FIG. 4 is a partial cross-sectional view of a luminous keyboard LKB according to another embodiment of the present invention.

[0068] like Figure 7 As shown, the protruding structure SP of the backlight module BLM can be formed on the shading plate SS, wherein the light-emitting unit LED is located below the protruding structure SP. The position of the protruding structure SP corresponds to the position of the light-emitting unit LED, and the protruding structure SP is located between two non-intersecting wires LT and HT. In addition, the protruding structure SP is also located between a plurality of microstructure regions MS, that is, the protruding structure SP is located between two internal microstructure regions IMS, and also between two external microstructure regions OMS. In the present embodiment, the protruding structure SP may be lower than or slightly enter the inner hole Sc of the base plate SUP, and the upper surface of the light-emitting unit LED is flush with or lower than the upper surface of the light guide plate LGP or the lower surface of the shading plate SS. It should be noted that the protruding structure SP can be pressed back so that the top of the shading plate SS below the base plate SUP has a flat surface. Figure 7 In the figure, the effect of the protruding structure SP formed on the shading plate SS can come from the fact that the second reflective layer RL2 on the shading plate SS above the light-emitting unit LED is formed with a curved surface or a slope due to the protruding structure SP; because the reflection angle provided by the straight second reflective layer RL2 is small, it is more difficult to guide the upward irradiated light to directly enter the hole wall of the light guide hole L0 of the light guide plate LGP.

[0069] See also Figure 8 , Figure 8 FIG. 4 is a partial cross-sectional view of a luminous keyboard LKB according to another embodiment of the present invention.

[0070] like Figure 8 As shown, the upper surface of the light-emitting unit LED may be higher than the upper surface of the light guide plate LGP and lower than the lower surface of the light shielding plate SS, that is, the upper surface of the light-emitting unit LED may be located between the upper surface of the light guide plate LGP and the lower surface of the light shielding plate SS. In other words, if necessary, the light-emitting unit LED may also exceed the upper surface of the LGP, for example, the protruding structure SP is convex to allow the thickness of the light shielding plate SS itself and the thickness of the upper and lower adhesive layers of the light shielding plate SS to provide space for accommodating the light-emitting unit LED; at this time, the upper surface of the light-emitting unit LED will be located between the lower surface of the bottom plate SUP and the upper surface of the LGP. Thus, when the upper surface of the light-emitting unit LED is higher than the upper surface of the light guide plate LGP, the protruding structure SP may provide space for accommodating the light-emitting unit LED to prevent the light-emitting unit LED from interfering with the light shielding plate SS.

[0071] See also Fig. 9 , Fig. 9 FIG. 4 is a partial cross-sectional view of a luminous keyboard LKB according to another embodiment of the present invention.

[0072] like Fig. 9 As shown, the luminous keyboard LKB may not include Figure 4 The highlighted structures BP or Figure 7 In this embodiment, the upper surface of the light emitting unit LED is flush with or lower than the upper surface of the light guide plate LGP and higher than the lower surface of the light guide plate LGP. In this way, the amount of light emitted by the light emitting unit LED entering the light guide plate LGP can be increased, thereby improving the consistency of the overall light emission.

[0073] See also Fig.10 , Fig.10 for Figure 1 Another partial top view of the luminous keyboard LKB.

[0074] like Fig.10As shown, multiple microstructure areas MS / OMS / IMS at least partially overlap with the projection of the gaps Gx and Gy between any two adjacent keys KS1, KS2, and KS3. Three adjacent keys KS1, KS2, and KS3 may have three adjacent external microstructure areas OMS, wherein the three adjacent external microstructure areas OMS are combined together in the X and Y directions. The two external microstructure areas OMS outside the two non-intersecting wires of the light board LCB arranged under a key KS may have the same pattern, and they may have the same size, the same shape, and the same distance (outside the wire) in the two same areas. Within the projection range of a single key KS (for example, a square key), the two external microstructure areas OMS may have different patterns defined by the key KS. For two keys KS adjacent in the Y direction, the two adjacent external microstructure areas OMS may have different patterns defined by the two adjacent keys KS.

[0075] See also Fig.11 , Fig.11 for Figure 1 Another partial top view of the luminous keyboard LKB.

[0076] like Fig.11As shown, a plate hole BH can be opened on the lamp board LCB, wherein the plate hole BH is used for fixing or heat dissipation. A mask portion MP can be set on the lamp board LCB, wherein the mask portion MP surrounds the plate hole BH and is used to shield and absorb light to prevent light from leaking from the plate hole BH. In actual operation, the mask portion MP can be a light-absorbing or opaque substrate from the lamp board LCB, that is, the first reflective layer RL1, the circuit layer, and the insulating layer (if necessary) above the substrate of the lamp board LCB are all opened with holes larger than the plate hole BH so as to expose the mask portion MP surrounding the plate hole BH. Another approach in actual operation is to coat the upper surface of the first reflective layer RL1 of the lamp board LCB with a layer of mask portion MP surrounding the plate hole BH, and at this time, the hole size of the first reflective layer RL1 is similar to that of the plate hole BH. The plate hole BH and the mask portion MP on the lamp board LCB can correspond to the plate hole and the mask portion (not shown in the figure) on the shading plate SS. The hole glue HA on the light board LCB can be set on the mask part MP and surround the board hole BH. The hole HC does not overlap with the external microstructure area OMS or any microstructure. The hole HC without the first reflective layer RL1 can be defined between the first reflective layer RL1 and the board hole BH. The hole HC without adhesive can be defined between the hole glue HA and the board hole BH. The internal microstructure area IMS (between two non-intersecting wires HT, LT and / or between two non-intersecting wires STa, STb) does not overlap with the board hole BH, the hole glue HA and / or the hole HC. A plurality of adjacent keys KS1, KS2, KS3 in the X direction and / or the Y direction may have adjacent external microstructure areas OMS that jointly surround the mask part MP, the board hole BH, the hole glue HA and / or the hole HC. The mask part MP, the board hole BH, the hole glue HA and / or the hole HC are located between the wires HT, LT of the corresponding key KS1 and the wires HT, LT of the corresponding keys KS2, KS3. Furthermore, the mask portion MP, the plate hole BH, the hole glue HA and / or the hole HC may be located between the wire LT corresponding to the key KS1 and the wire HT corresponding to the keys KS2 and KS3. Fig.11 However, the definitions of the mask portion MP, the pore glue HA and the pore HC can be clearly known based on the above description.

[0077] In summary, the utility model makes the multiple microstructure areas on the light board not overlap with the two non-intersecting wires, so that the specially configured microstructure areas on the light board can be used to recycle light or assist light emission, thereby improving the consistency of overall light emission. In addition, although the technical solution of the utility model is based on solving the application problem of low-power light-emitting units, the utility model is also applicable to the application of medium and high-power light-emitting units in backlight modules.

[0078] In one embodiment, since the low-power light-emitting unit is too small, when it is installed on the light board, the melting of solder paste easily causes the position of the light-emitting unit to shift, resulting in the failure of smooth electrical connection between the light-emitting unit and the light board. The following embodiments of the utility model will introduce several technical solutions through special pad design to ensure smooth connection between the light-emitting unit and the light board.

[0079] See also FIG. 12A to FIG. 12C , Fig. 12A This is a top view schematic diagram of the end-to-end connection of the (sub) wires of the lamp board, the soldering pads and the light-emitting units in another embodiment of the utility model. Fig. 12B for Fig. 12A A partial enlarged schematic diagram of an embodiment, Fig. 12C for Fig. 12A Schematic top view of the side connection of the embodiment.

[0080] Fig. 12A and Fig. 12B In the embodiment, two (sub) conductors STa / STb (see the above embodiment and Figure 3 , Figure 8 , Fig. 9 ) extend respectively along the wire direction Dt, and the ends of the two (sub) wires STa / STb respectively have a pad FP, and there is a pad gap FG between the two pads FP. Each pad FP can be directly integrated with the circuit of the light board LCB (such as the wires HT / LT / STa / STb) by printing conductive wires, or it can be integrated with the circuit of the light board LCB by a copper foil substrate etching process; however, each pad FP can also be secondary molded, or the material of the circuit of the light board LCB is different. The two pads FP are respectively at their respective intersection endpoints IE (specifically, for example, the intersection endpoints of each branch line (described in detail below)) as the end, and the distance between the two intersection endpoints IE is also the shortest distance between the two pads FP. There is a pad gap FG between the two intersection endpoints IE, and the pad gap FG is smaller than the long side size of the light-emitting unit LED. For example, the gap between the two intersection endpoints IE is close to 0.5 times the long side size of the light-emitting unit LED or shorter. The two intersection endpoints IE can actually be the final points of the two pads FP at the adjacent ends, or can be the geometric center points of the two pads FP at the adjacent ends. The two pads FP of the utility model each have at least two branch lines Br (branch), and the at least two branch lines Br each extend outward from the corresponding intersection endpoint IE, thereby defining at least one hollow area Ha / Hb. Fig. 12A / Fig. 12BIn the embodiment shown, each pad FP has three branch lines Br, wherein the middle branch line Br extends straight outward from the intersection end point IE (e.g., along the conductor direction Dt) to connect the corresponding (sub) conductor STa / STb, and the remaining left and right branch lines Br extend outward from the intersection end point IE in an L-shaped path and also connect the corresponding (sub) conductor STa / STb. The three branch lines Br of each pad FP jointly define two hollow areas Ha / Hb, and the border of the two hollow areas Ha / Hb extends along the middle branch line Br.

[0081] The positive and negative electrodes of the light-emitting unit LED are electrically connected to the two pads FP through a conductive layer CL, and the connection position is located at the two intersection points IE or their adjacent areas. The conductive layer CL is implemented, for example, with solder paste or its alternative material. The thickness and area of ​​the conductive layer CL will affect the degree of deviation of the light-emitting unit LED during the component bonding. Therefore, the printing of the conductive layer CL must be concentrated as much as possible at the intersection point IE of the two pads FP, and extend to a limited extent along the branch line Br. The connection direction of the positive and negative electrodes of the light-emitting unit LED, or the long side of the light-emitting unit LED, is parallel or nearly parallel to the wire direction Dt. The width of the two pads FP (flat side, or relative straight side) can be set to be at least greater than or equal to 0.8-1.5 times the size of the short side of the LED. If the light-emitting unit LED is offset along the normal direction Dn of the wire STa / STb or along the short side direction of the light-emitting unit LED, there is still a considerable chance that the positive and negative electrodes of the light-emitting unit LED can ensure electrical connection to the two pads FP. If the light-emitting unit LED is offset along the wire direction Dt of the wire STa / STb or along the long side direction of the light-emitting unit LED, the offset must be more than 0.5 times the long side dimension of the light-emitting unit LED, so that the light-emitting unit LED cannot be electrically connected to the two pads FP at the same time. Further, no matter how the light-emitting unit LED is offset, the light-emitting unit LED overlaps at least partially with one of the hollow areas Ha or Hb of one of the pads FP, for example, the corner or one side of the light-emitting unit LED overlaps with at least one hollow area Ha or Hb. The overall size of the two pads FP (including the hollow area Ha or Hb, the branch line Br and the pad gap FG) can be set to be at least 1.2 times larger than the light-emitting unit LED; or, the two pads FP each have at least one branch line Br to form a pair of parallel flat edges, and the size of the short side of the light-emitting unit LED is preferably smaller than the size of the pair of flat edges of the two pads FP (such as the size along the normal direction Dn). In this way, even in the case of maximum offset, the light-emitting unit LED (either side) does not exceed the outermost periphery of any pad FP. In an ideal situation where there is no component offset, all four corners of the light-emitting unit LED can overlap with the corresponding hollow area Ha or Hb. Furthermore, under the premise that the process parameters are highly stable, the size of the flat side of the aforementioned pad FP may be less than or equal to the size of the short side of the light-emitting unit LED; even so, at least the light-emitting unit LED (such as a side or corner) must be able to overlap the hollow area Ha / Hb to maintain the basic offset prevention mechanism.

[0082] The first significance of the existence of the hollow area Ha / Hb is to provide at least two branch lines Br for each pad FP to connect the positive / negative electrodes of the light-emitting unit LED. Secondly, the intersection endpoint IE of the intersection of the branch lines Br (or the end of the intersection of the two hollow areas Ha / Hb) can be used as the positioning point of the light-emitting unit LED in the automated process. Furthermore, the conductive layer CL tends to flow along the branch line Br when it is melted, and the existence of the hollow area Ha / Hb prevents the conductive layer CL from flowing toward the hollow area Ha / Hb when it is melted to a considerable extent. In addition, the width of each branch line Br can be only 0.5 times or thinner than the short side size of the light-emitting unit LED, so as to limit the range / angle of the melting flow of the conductive layer CL from spreading, and further limit the angle / path of the light-emitting unit LED deviation. In this way, it can be ensured that the light-emitting unit LED will deviate along the branch line Br, thereby improving the yield of the light-emitting unit LED electrically connecting the two pads FP and the two wires STa / STb.

[0083] Please also see FIG. 12A to FIG. 12C , Fig. 12A and Fig. 12B The middle conductors STa / STb are in an end-to-end relative state, and their two hollow areas Ha and two hollow areas Hb are respectively arranged perpendicular to the conductor direction Dt. Fig. 12C The conductors STa / STb partially overlap in the direction perpendicular to the conductor direction Dt and face each other side by side, so the positions of the two pads FP are relatively Fig. 12A and Fig. 12B The embodiment shown is rotated 90 degrees, and the two hollow areas Ha and the two hollow areas Hb are arranged along the wire direction Dt. Regardless of end-to-end or edge-to-edge connection, the hollow areas Ha / Hb and the branch lines Br of the pad FP can effectively improve the yield of the light-emitting unit LED electrically connecting the two pads FP and the two wires STa / STb.

[0084] See also FIG. 13A to FIG. 13F , and refer to FIG. 12A to FIG. 12C . FIG. 13A to FIG. 13F They are respectively top views of the connection structures of the (sub) conductors STa / STb of the lamp board LCB, the two soldering pads FP and the light-emitting unit LED in different embodiments of the present invention.

[0085] FIG. 12A to FIG. 12C In the embodiment, three branch lines Br form a T-shape, and each branch line Br is at least partially parallel to the short side and / or the long side of the light emitting unit LED, but the present invention is not limited thereto. Fig.13A In the embodiment, each pad FP has only two branch lines Br, and the two branch lines Br extend obliquely outward from the intersection end IE, and the two branch lines Br of each pad FP form an obtuse angle. The branch lines Br of each pad FP finally define a hollow area Ha / Hb with the corresponding two wires STa / STb. Fig.13A The light-emitting unit LED still at least partially overlaps the hollow area Ha and / or Hb, but because the distance between the two branch lines Br on the same side of different pads FP will become larger and larger when the light-emitting unit LED shifts left and right along the normal direction Dn, the obtuse angle between the two branch lines Br of each pad FP should not be too small, for example, between 150 degrees and 180 degrees, so as to avoid the light-emitting unit LED shifting beyond the size of the two pads FP in the normal direction Dn. Fig.13A But a better implementation is for example Fig. 13B As shown, the pad FP is also similar to a triangle, and the two angular branch lines Br are formed with a flat side opposite to the flat side formed by the branch line Br of another pad FP, so that the problem of the distance between the two branch lines Br on the same side of different pads FP changing will not occur when the light-emitting unit LED is offset (for example, along the normal direction Dn). In addition, Fig. 13B The width of the middle conductor STa / STb is relatively narrow (for example, the copper wire formed by etching the copper foil substrate is relatively narrow). Fig.13A The width of the conductive wires STa / STb is relatively wide (for example, they are made by printing a metal paste with lower conductivity than the etched copper wire), and they have no direct influence on the electrical connection effect between the pad FP and the light-emitting unit LED.

[0086] Fig. 13C In the figure, both pads FP have three branch lines Br, and the configuration is the same as Fig. 12A , Fig. 12B The middle branch line Br extends straight outward from the intersection end IE (along the conductor direction Dt) to connect the corresponding (sub) conductor STa / STb, and the remaining two left and right branch lines Br extend outward from the intersection end IE in a U-shaped path and also connect the corresponding (sub) conductor STa / STb. Fig. 13C The width of the middle conductor STa / STb is narrower. Fig. 12A , Fig. 12B The width of the conductor STa / STb is relatively wide, but as mentioned above, the width of the conductor STa / STb has little effect on the electrical connection effect between the pad FP and the light-emitting unit LED.

[0087] Fig.13D In the figure, both pads FP have three branch lines Br, and the configuration is also the same as Fig. 13C similar. Fig.13D In the figure, the middle branch line Br extends straight outward from the intersection end IE (along the wire direction Dt) to connect the (sub) wire STa / STb, and the remaining two branch lines Br extend outward from the intersection end IE in a U-shaped path and also connect the corresponding (sub) wire STa / STb. The difference is the shape of the pad FP. Fig.13D The shape of the middle pad FP is closer to a semicircle, that is, Fig.13DThe two branch lines Br on the left and right have arc-shaped guide angles, which is more in line with the above Figure 3 or subsequent FIG. 14A to FIG. 14D The middle light guide hole L0 has more arcs, which can better match and increase the amount of light entering from the side of the light guide plate LGP. Fig.13E Only the central branch line Br is connected to the corresponding (sub) conductor STa / STb, and the left and right branch lines Br extend outward from the intersection end point IE along the normal direction Dn to form a straight line path with flat edges, and do not extend to the corresponding (sub) conductor STa / STb nor connect to the corresponding conductor STa / STb. However, the central branch line Br can still define hollow areas Ha / Hb with the left and right branch lines Br, respectively, so that the light-emitting unit LED at least partially overlaps one of the hollow areas Ha / Hb.

[0088] Fig.13F and Fig.13D The pad FP is similar, but the middle branch line Br is missing. Only the left and right branch lines Br extend outward from the intersection end point IE in a U-shaped path and also connect to the corresponding (sub) wires STa / STb. Fig.13F In the two pads FP, the branch lines Br also form a pair of flat sides parallel to each other, the two pads FP each have only one hollow area Ha / Hb, and the light-emitting unit LED at least partially overlaps at least one of the hollow areas Ha / Hb. Fig.13F The two short sides of the middle light-emitting unit LED respectively cross the hollow area Ha / Hb, which is also similar to Fig.13A , Fig. 13B The triangular pad FP, however Fig.13F The pad FP and the hollow area Ha / Hb are both higher than Fig.13A , Fig. 13B Big. Furthermore, FIG. 13A to FIG. 13F In the embodiment, although each pair of pads FP is connected to the light-emitting unit LED in an end-to-end structure, in actual operation, based on the description of the above embodiments, the present invention FIG. 13A to FIG. 13F Different types of pads FP can be applied to similar Fig. 12C The side-to-side connection architecture.

[0089] In addition, the area around the adjacent low-power light-emitting unit is the area with the highest brightness. Expanding the light reflection angle in this area is the key to increasing the amount of light entering the side of the light guide plate, improving the lateral transmission ratio, and promoting the uniformity of light emission. However, the area around the adjacent light-emitting unit is the physical connection area between the light-emitting unit LED and the light board LCB circuit. How to achieve electrical connection between the light-emitting unit LED and the light board LCB circuit while expanding the light reflection angle is a major issue in the design of the light-emitting unit LED electrical connection structure.

[0090] See also FIG. 14A to FIG. 14C , Fig.14AIt is a partial top view schematic diagram of the optical structure of the backlight module in the surrounding area of ​​the light-emitting unit according to another embodiment of the utility model. Fig. 14B for Fig.14A A partial cross-sectional schematic diagram of a backlight module of an embodiment. Fig. 14C It is a partial top view schematic diagram of the optical structure of the backlight module in the surrounding area of ​​the light-emitting unit according to yet another embodiment of the present invention. Fig.14D For this utility model Fig.14A A partial top view schematic diagram of the optical architecture of the backlight module of a derivative embodiment.

[0091] Fig.14A and Fig. 14B In the embodiment, the height difference between the six branch lines Br of the two pads FP and the four hollow areas Ha / Hb produces a concave-convex structure, and the reflective first reflective layer RL1 is covered, so that the entire area of ​​each pad FP can constitute a core microstructure area cMS surrounding at least a part of the light-emitting unit LED, wherein the concave area (hollow area Ha / Hb) and the convex area (branch line Br) can respectively play the role of the microstructure area MS. These pads FP and the core microstructure area cMS are located below the internal reflection part RL0 of the light shielding plate SS. In addition, even if there are no special pads FP and their hollow areas Ha / Hb and branch lines Br, as long as the first reflective layer RL1 covering the light-emitting unit LED has the aforementioned concave-convex structure, the core microstructure area cMS can still be formed around the light-emitting unit LED. Therefore, one or more core microstructure areas cMS surrounding the light-emitting unit LED can further reflect and diffuse the light reflected downward by the internal reflection part RL0 of the light shielding plate SS upward, increase the amount of light entering the side of the light guide plate hole L0, and thus improve the lateral transmission ratio and promote the overall luminous uniformity of the key KS and the light-emitting keyboard LKB.

[0092] From the overall structure, with the light-emitting unit LED as the center, the backlight module BLM of the embodiment of the utility model provides multiple light-homogenizing zones for achieving a uniform light-emitting effect. The multiple light-homogenizing zones of the backlight module BLM include at least a first zone Z1 and a second zone Z2. The first zone Z1 surrounds the light-emitting unit LED. The first zone Z1 includes an inner ring portion RL1i of the first reflective layer RL1 and a pair of pads FP. The pair of pads FP is located on the light board LCB for connecting the light-emitting unit LED. The inner ring portion RL1i of the first reflective layer RL1 at least partially covers the pair of pads FP, so that the inner ring portion RL1i of the first reflective layer RL1 reflects and diffuses the light of the light-emitting unit LED. The second zone Z2 surrounds the first zone Z1. The second zone Z2 includes a pair of microstructure regions MS spaced apart from each other and located on the first reflective layer RL1. The pair of microstructure regions MS jointly surround the pair of pads FP. The pair of microstructure regions MS reflects and diffuses the light transmitted by the light-emitting unit LED through the first zone Z1.

[0093] The first zone Z1 closest to the light-emitting unit LED provides one or more core microstructure areas cMS around the light-emitting unit LED through two pads FP on the light board LCB and the first reflective layer RL1. For example, the combination of the branch line Br and the hollow area Ha / Hb makes the first zone Z1 have a concave-convex structure. Since the pad FP and its core microstructure area cMS overlap with the internal reflective part RL0 of the light shielding plate SS at least partially in the Z direction, it can be used to reflect, diffuse and open the angle of the light from the internal reflective part RL0, and incident toward the side of the light guide plate hole L0. In the first zone Z1, the reflective layer hole RLH1 may overlap the two pads FP and its hollow area Ha / Hb, the branch line Br and the core microstructure area cMS, and the light guide plate hole L0 may also overlap the two pads FP and its hollow area Ha / Hb, the branch line Br and the core microstructure area cMS.

[0094] Secondly, the second zone Z2 surrounds the light emitting unit LED at a further distance, and also surrounds the light guide plate hole L0 and the reflective layer hole RLH1. The second zone Z2 includes two internal microstructure areas IMS separated by a pair of non-intersecting (sub) conductors STa / STb on the light board LCB (refer to the aforementioned embodiment for details). Figure 3 , Fig.10 and Fig.11 ), the two internal microstructure regions IMS are located on the upper surface of the first reflective layer RL1, and they jointly surround at least a portion of the first zone Z1. Although the two internal microstructure regions IMS may only partially overlap the internal reflection portion RL0 of the light shielding plate SS, the internal reflection portion RL0 directly from the light shielding plate SS rarely reaches the internal microstructure region IMS, but during the lateral transmission of light in the light guide plate LGP, light rays with a light angle less than the critical angle will not be able to continue to be totally reflected inside the light guide plate LGP and pass through the lower surface of the light guide plate LGP. These rays can be recovered by the two internal microstructure regions IMS, and then incident on the light guide plate LGP through reflection diffusion to continue lateral transmission.

[0095] Furthermore, the backlight module BLM may further include a third zone Z3 between the first zone Z1 and the second zone Z2, and the third zone Z3 may overlap at least partially with the first zone Z1 and / or the second zone Z2 in the Z direction. Fig.14A The glue layer Ah above the light board LCB (such as Fig. 14B Although there is a need to use adhesive to position the backlight module BLM layers, the adhesive should also be considered in the optical design; first, the adhesive material Ah1 / Ah2 is transparent and has good optical coupling. Although the excessive concentration of light around the light-emitting unit LED is the original problem of low-brightness light-emitting units, it is also possible to overcorrect in the implementation process, such as causing Figure 3The inner light-transmitting area KC0 closer to the center of the keycap KCC does not emit enough light. At this time, the glue layer Ah1 / Ah2 can be used to fine-tune and increase the light intensity as a means of later correction. In detail, the glue layer Ah1 can surround the light guide plate hole L0, the reflective layer hole RLH1 and the light-emitting unit LED and be set on the upper surface of the light guide plate LGP (or between the light guide plate LGP and the light shielding plate SS), and the glue layer Ah2 can surround the light guide plate hole L0, the reflective layer hole RLH1 and the light-emitting unit LED and be set on the lower surface of the light guide plate LGP (or between the light guide plate LGP and the light board LCB).

[0096] The glue layer Ah / Ah1 / Ah2 is not suitable to be too close to the light-emitting unit LED. Firstly, the optical coupling effect of the glue layer Ah / Ah1 / Ah2 will make the light of the light-emitting unit LED too concentrated and unable to diffuse. Secondly, if the glue layer Ah / Ah1 / Ah2 contacts the light-emitting unit LED for some reason during the manufacturing process, its viscosity may cause the light-emitting unit LED to peel off. Therefore, the glue layer Ah / Ah1 / Ah2 must be used under proper control, including setting a glue-free area CA or reducing the width of the glue layer. The glue-free area CA can be set between the glue layer Ah / Ah1 / Ah2 and the light guide plate hole L0, or between the glue layer Ah / Ah1 / Ah2 and the reflective layer hole RLH1. In the Z direction, the glue-free area CA can be set on the upper surface of the light guide plate LGP (or between the light guide plate LGP and the light shielding plate SS), and the glue-free area CA can also be set on the lower surface of the light guide plate LGP (or between the light guide plate LGP and the light board LCB). In actual operation, the glue layers Ah1 / Ah2 can be set one by one or at the same time. Colloid gap AP is another adjustment method using the glue layers Ah1 / Ah2. If there is a need to increase the contour halo of the keycap KCC or the brightness of the outer characters (external light-transmitting area KC1) in a certain position, a colloid gap AP can be opened in the glue layer Ah1 / Ah2 to correspond to the required position or light-transmitting area. The colloid gap AP allows more light to continue to be transmitted horizontally outward smoothly, thereby improving the light output brightness of that position.

[0097] In general, from the perspective of the Z direction, the first zone Z1, the second zone Z2, and the third zone Z3 respectively cover different blocks and different areas of the light-emitting unit LED within a 360-degree range. In accordance with the different configurations of the optical elements therein, the upward light output of the first zone Z1 / the second zone Z2 / the third zone Z3 can be relatively close. In addition, there are other elements that can be used as adjustment means. For example, the microstructure area MS on the surface of the light guide plate LGP can be used in combination with the core microstructure area cMS, the internal microstructure area IMS, and the external microstructure area OMS of the first reflective layer RL1 of the light board LCB to increase the reflection and diffusion effects. In addition, covering the glue layer Ah1 / Ah2 with the internal reflective part RL0 of the shading plate SS can also reduce the light loss caused by the glue layer Ah1 / Ah2 and recycle the light.

[0098] From the Z direction, Fig.14A , Fig. 14B In the embodiment, the hole L0 of the light guide plate is larger than the hole RLH1 of the reflective layer of the first reflective layer RL1, and the hole RLH1 of the reflective layer is larger than the light-emitting unit LED, that is, the hole wall of the reflective layer hole RLH1 surrounds the light-emitting unit LED and does not completely cover the two pads FP. In other words, the hole RLH1 of the reflective layer is located between the light-emitting unit LED and the hole L0 of the light guide plate, and a part (the innermost ring area) of the first reflective layer RL1 is located between the hole RLH1 of the reflective layer and the hole L0 of the light guide plate. In this way, the two pads FP are at least partially exposed in the hole RLH1 of the reflective layer. The exposed range of the pad FP directly affects the range in which the light-emitting unit LED can be smoothly connected even if it is offset during the punching, so the more pads FP are exposed, the smooth connection between the light-emitting unit LED and the pad FP can be ensured. At the same time, exposing the pad FP means that there is no reflection provided by the first reflective layer RL1, but this does not mean that the reflection diffusion effect cannot be provided in the hole RLH1 of the reflective layer. First, since the pad FP is copper or copper alloy (or other alternative metals), for example, at least one of the multiple branch lines Br is not completely covered by the first reflective layer RL1, the reflective layer hole RLH1 can provide a reflective diffusion effect in the light guide plate hole L0 through the branch line Br line segments exposed by the two pads FP (located between the light-emitting unit LED and the reflective layer hole RLH1). Secondly, the hollowed-out areas of the exposed areas of the two pads FP (including the hollowed-out areas Ha / Hb and the pad gap FG) usually expose the substrate of the light board LCB (located below the circuit and the pad FP). As long as the exposed upper surface of the substrate can reflect light, whether the upper surface of the substrate itself is reflective, or there is a metal solder / conductive layer there, or there is a colloid that ensures the fixation of the light-emitting unit LED, it can also provide a reflective diffusion effect.

[0099] refer to Fig. 14C, when the mass production yield has stabilized, and the punching accuracy, punching temperature, conductive layer flow, and punching offset of the light-emitting unit LED are well controlled, a smaller reflective layer hole RLH1 can be used. The smaller the reflective layer hole RLH1 is, even when the light-emitting unit LED is surrounded by the hole wall of the reflective layer hole RLH1 on all four sides, the first reflective layer RL1 can cover the light board LCB in the range of the light guide plate hole L0 almost in its entirety, without exposing any part of the pad FP. At this time, the two completely covered pads FP, their branch lines Br and multiple hollow areas Ha / Hb, can form multiple microstructures with complete shapes and larger areas, and constitute the core microstructure area cMS surrounding the light-emitting unit LED. The larger the area of ​​the core microstructure area cMS, the more light can be diffused in the early stage, so that more light can enter smoothly from the side wall of the light guide plate hole L0. The core microstructure area cMS may be partially located within the range of the light guide plate hole L0, and partially located outside the hole wall of the light guide plate hole L0. Of course, the size and shape of the reflective layer hole RLH1 is similar to that of the light-emitting unit LED, or slightly larger than the light-emitting unit LED, which can also achieve a similar effect.

[0100] Based on the configuration of the aforementioned embodiment, FIG. 14A to FIG. 14C In the embodiment, a portion of the multiple branch lines Br of the two pads FP together surround at least a portion of the light guide plate hole L0; a plurality of hollow areas Ha / Hb of the two pads FP together surround and / or overlap the reflective layer hole RLH1; an inner ring portion RL1i of a portion of the first reflective layer RL1 located between the reflective layer hole RLH1 and the light guide plate hole L0 overlaps at least a portion of the two pads FP, respectively, so that the local first reflective layer RL1 exposed in the light guide plate hole L0 can form a concave-convex reflective diffusion structure with the local pads FP, such as a core microstructure area cMS. Finally, although each pad FP of each embodiment of the utility model is taken as an example of connecting the corresponding (sub) wire STa / STb, in actual applications, each pad FP can also be selectively directly connected to the aforementioned embodiments and Figures 2 to 11 Mentioned (main) conductor HT / LT.

[0101] refer to Fig.14D, the light-emitting unit LED encapsulates three-color crystals and can provide three-color light (such as red, green and blue). In order to achieve a good light mixing effect for the three-color crystals of the light-emitting unit LED, the aforementioned core microstructure area cMS surrounding the light-emitting unit LED is also formed in the inner ring part RL1i of the first reflective layer RL1 (regardless of the presence or absence of the aforementioned pad FP or the type of the pad FP), so as to improve the reflection and diffusion effects and increase the light mixing effect of the three-color crystals of the light-emitting unit LED. In addition, the arrangement of the three-color crystals can be arranged in a long-side to long-side sequence (or the short side of each of the three-color crystals is arranged along the Y direction). The advantage is that the overall size of the light-emitting unit LED is shorter, and the offset of the punching is less likely to interfere with the small-sized light guide plate hole L0, but the disadvantage is that the light mixing effect is poor; because the long side of the crystal with a larger light output is blocked by the long side of the adjacent crystal, it is difficult for different colors of light to be transmitted in an interlaced manner. Another method is as follows Fig.14D As shown, each long side of the three-color crystal is parallel to the long side of the entire light-emitting unit LED, that is, each long side of the three-color crystal is arranged along the Y direction, or the three-color crystals are arranged in succession with their short sides facing the short sides. In this way, the long sides of the crystals with large light output and large light output range are all facing the X direction in the figure, overlapping and staggered with each other, and a better mixed light effect can be obtained in the two larger fan-shaped ranges in the X direction; at the same time, in the Y direction, because the short sides of the crystals are adjacent, and the light output of the short sides of the crystals is small and the light output range is small, the light blocked by the short sides of the crystals is also small, and the polarization problem caused is also small.

[0102] See also Fig.15A , Fig.15A It is a top view schematic diagram of the (sub) conductors, solder pads and light-emitting units of a lamp board according to another embodiment of the utility model.

[0103] As in the aforementioned embodiment, the light-emitting unit LED has a pair of electrodes to electrically connect to a pair of pads FP on the lamp board LCB. In practical applications, this is not limited to this. In another embodiment, the light-emitting unit LED may include a plurality of light-emitting elements, and the lamp board LCB may have a plurality of pairs of pads correspondingly, and the plurality of pairs of pads are respectively connected to the plurality of light-emitting elements. The light-emitting elements may be grains or single LEDs, etc., and each light-emitting element may have a pair of electrodes. When the light-emitting element is a grain, a plurality of grains may be packaged together in the same light-emitting unit LED, and the light-emitting unit LED may have a plurality of pairs of electrodes; or, each of the plurality of grains is electrically connected directly to the pads on the lamp board LCB. The lamp board LCB has a plurality of sub-wires, and each pair of the plurality of pairs of pads is respectively electrically connected to two of the plurality of sub-wires. Fig.15AAs shown, the light-emitting unit LED may include two dies DIE1 and DIE2, and the lamp board LCB may have two pairs of pads FP1 and FP2, and the two pairs of pads FP1 and FP2 are respectively connected to the two dies DIE1 and DIE2. At this time, the lamp board LCB has two sub-conductors STa and two sub-conductors STb. Each pair of pads FP1 and FP2 is electrically connected to two sub-conductors STa and STb (i.e., one sub-conductor STa and one sub-conductor STb). In the present embodiment, the two dies DIE1 and DIE2 are arranged in series with their short sides facing the short sides (such as arranged along the wire direction Dt). The two sub-conductors STa and the two sub-conductors STb can be connected to the above-mentioned wires LT and HT in different directions (for example, in the opposite direction). In another embodiment, the two sub-conductors STa and the two sub-conductors STb can also be connected to the above-mentioned wires LT and HT in the same direction by appropriate circuit configuration. In addition, in another embodiment, the two dies DIE1 and DIE2 can also be arranged in series with their long sides facing the long sides. Furthermore, in another embodiment, when the light emitting element is a die, the number of the die is not limited to Fig.15A The two shown are limited, and the light emitting unit LED may also include Fig.14D Therefore, the orientation of the sub-conductors, the arrangement of the dies, and the number of dies can be determined according to actual applications.

[0104] exist Fig.15A The working principle of the components with the same symbols as above is roughly the same, and will not be repeated here. In this embodiment, there is at least one light-emitting area between at least one pair of pads. Fig.15A As shown, there are four light-emitting areas LA1 and LA2 (specifically, two light-emitting areas LA1 and two light-emitting areas LA2) between the two pairs of pads FP1 and FP2. As described above, the exposed substrate of the light board LCB can reflect light, so the light-emitting areas LA1 and LA2 can be a part of the light board LCB exposed between the two pairs of pads FP1 and FP2. In addition, the first reflective layer RL1 can cover the plurality of sub-conductors STa, STb and the substrate of the light board LCB to form light-emitting areas LA1 and LA2 between the pads FP1 and FP2. The light-emitting areas LA1 and LA2 can reflect and diffuse the light of the light-emitting unit LED, and can achieve a high degree of uniformity in a single key and the entire keyboard range.

[0105] In this embodiment, the light emitting area may be located between two sub-conductors connected to the same pair of pads and / or between two sub-conductors connected to different pairs of pads. Fig.15AAs shown, one light-emitting area LA1 is located between two sub-conductors STa and STb connected to the same pair of pads FP1, and another light-emitting area LA1 is located between two sub-conductors STa and STb connected to the same pair of pads FP2. In addition, one light-emitting area LA2 is located between two sub-conductors STa connected to different pairs of pads FP1 and FP2, and another light-emitting area LA2 is located between two sub-conductors STb connected to different pairs of pads FP1 and FP2.

[0106] See also Fig. 15B , Fig. 15B It is a top view schematic diagram of the (sub) conductors, solder pads and light-emitting units of a lamp board according to another embodiment of the utility model.

[0107] Fig. 15B and Fig.15A The main differences between the illustrated embodiments are the arrangement of the pads FP1 and FP2 and the orientation of the sub-conductors STa and STb. Fig.15A In the embodiment, two sub-conductors corresponding to a pair of pads may be non-intersecting sub-conductors, and the flat sides of the pair of pads are opposite to each other; Fig. 15B In the embodiment, two sub-conductors corresponding to a pair of pads may form an angle, and the flat sides of a pair of pads may form an angle. In other words, the present invention can adjust the arrangement of pads FP1 and FP2 and the orientation of sub-conductors STa and STb according to the actual circuit configuration required. Fig. 15B As shown, there are still four light emitting areas LA1 and LA2 between the two pairs of pads FP1 and FP2.

[0108] See also Fig. 15C , Fig. 15C It is a top view schematic diagram of the (sub) conductors, solder pads and light-emitting units of a lamp board according to another embodiment of the utility model.

[0109] Fig. 15C and Fig. 15B The main difference between the embodiments shown is the arrangement of the grains DIE1 and DIE2. Fig. 15C As shown, the dies DIE1 and DIE2 can be arranged relatively tilted. Further, there is an angle θ between the connecting lines of the intersection points IE of the pads FP1 and FP2 of the dies DIE1 and DIE2.

[0110] In actual operation, based on the description of the above embodiments, the present invention FIG. 12A to FIG. 13F Different types of pads FP can be applied to FIG. 15A to FIG. 15C In addition, FIG. 15A to FIG. 15C The multi-die architecture can also be applied to Figure 2 , Fig.11 , FIG. 14A to FIG. 14C The light emitting unit LED.

[0111] Based on the above, the utility model FIG. 12A to FIG. 15C The various embodiments provided solve the connection stability problem of the light-emitting unit and the problem of excessive light concentration in the adjacent area of ​​the light-emitting unit. In addition to using a solder pad with a hollow area to ensure that the light-emitting unit can still be connected smoothly when the component is offset, the solder pad and its hollow area are further used in combination with the first reflective layer to form a light homogenization design for the first area; in addition, in combination with the internal microstructure area of ​​the light board in the second area, the glue layer and the glue-free area in the third area, the utility model provides different light homogenization schemes for different blocks along the light path outward from the light-emitting unit, and can achieve a high degree of uniformity in the character brightness and keycap halo of a single key, and even in the entire keyboard range. Furthermore, at least one light-emitting area between at least one pair of solder pads can reflect and diffuse the light of the light-emitting unit, and can achieve a high degree of uniformity in both a single key and the entire keyboard range.

[0112] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and deformations based on the present invention, but these corresponding changes and deformations should all fall within the scope of protection of the claims attached to the present invention.

Claims

1. A backlight module for illuminating at least one keycap, characterized in that The backlight module includes: Light emitting unit; A light guide plate having a light guide plate hole for accommodating the light emitting unit; as well as A light board having at least one pair of pads, the at least one pair of pads being respectively connected to the light-emitting unit, the light board comprising a first reflective layer, the first reflective layer surrounding the light-emitting unit and at least partially covering the at least one pair of pads; Each of the at least one pair of pads has a plurality of branch lines and at least one hollow area. The at least one hollow area overlaps at least a portion of the light-emitting unit. There is at least one light-emitting area between the at least one pair of pads.

2. The backlight module according to claim 1, characterized in that: The at least one light emitting area is a portion of the light board exposed between the at least one pair of solder pads.

3. The backlight module according to claim 1, characterized in that: The light emitting unit comprises a plurality of crystal grains, and the lamp board has a plurality of pairs of welding pads for respectively connecting the plurality of crystal grains.

4. The backlight module according to claim 3, characterized in that: The lamp panel has a plurality of sub-conductors, and each pair of the plurality of pairs of solder pads is electrically connected to two of the plurality of sub-conductors.

5. The backlight module according to claim 4, characterized in that: The at least one light-emitting region is located between two sub-conductors connected to the same pair of pads; or, the at least one light-emitting region is located between two sub-conductors connected to different pairs of pads.

6. The backlight module according to claim 4, characterized in that: The lamp panel also has two main conductors electrically connected to the plurality of sub-conductors respectively. The lamp panel also includes a pair of external microstructure areas spaced apart from each other and located on the first reflective layer. The pair of external microstructure areas are respectively located outside the two main conductors.

7. The backlight module according to claim 4, characterized in that: The first reflective layer covers the plurality of sub-conducting lines.

8. The backlight module according to claim 4, characterized in that: The light panel also comprises a pair of microstructure regions spaced apart from each other, the pair of microstructure regions are located on the first reflective layer, and the pair of microstructure regions do not overlap the plurality of sub-conducting wires.

9. The backlight module according to claim 3, characterized in that: The plurality of crystal grains are arranged in a row with their short sides facing each other or their long sides facing each other; or, the plurality of crystal grains are arranged in a relatively inclined manner.

10. The backlight module according to claim 1, characterized in that: The inner ring portion of the first reflective layer at least partially covers the plurality of branch lines and the at least one hollow area, and the inner ring portion reflects and diffuses the light of the light-emitting unit.

11. The backlight module according to claim 1, characterized in that: The light board also includes a pair of microstructure areas spaced apart from each other, the pair of microstructure areas are located on the first reflective layer, the pair of microstructure areas jointly surround the at least one pair of pads, and the pair of microstructure areas reflect and diffuse the light transmitted by the light-emitting unit through the light guide plate.

12. The backlight module according to claim 1, characterized in that: At least one of the plurality of branch lines is not completely covered by the first reflective layer, and each branch line of each pad reflects and diffuses the light of the light emitting unit relative to the exposed portion of the first reflective layer.

13. The backlight module according to claim 1, characterized in that: At least a portion of the first reflective layer is located in the light guide plate hole.

14. The backlight module according to claim 1, characterized in that: The backlight module comprises a shading plate, the shading plate comprises an internal reflection part, and the internal reflection part overlaps the first reflection layer.

15. The backlight module according to claim 1, characterized in that: At least one of the plurality of branch lines of the at least one pair of pads surrounds at least a portion of the light guide plate hole.

16. The backlight module according to claim 1, characterized in that: The first reflective layer has a reflective layer hole, and the at least one hollow area of ​​the at least one pair of pads surrounds and / or overlaps the reflective layer hole.

17. The backlight module according to claim 1, characterized in that: The first reflective layer has a reflective layer hole, and the reflective layer hole is located between the light emitting unit and the light guide plate hole.

18. The backlight module according to claim 1, characterized in that: The first reflective layer has a reflective layer hole, and a portion of the first reflective layer overlapping the at least one pair of pads is located between the reflective layer hole and the light guide plate hole.

19. A luminous keyboard, characterized in that Include: A plurality of keys, each key having a key cap; and The backlight module as claimed in any one of claims 1 to 18, wherein the backlight module is located below the plurality of keys.

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