Laser de-bonding platform suitable for multi-specification sheet rings
By designing a laser debonding platform of multi-specimen chip rings, the combination of support cylinders and clamping cylinders can achieve automatic clamping and fixing of different specifications of chip rings, which solves the problem that existing equipment cannot adapt to different specifications of chip rings, and improves the problem that existing equipment cannot adapt to different specifications of chip rings. Universality of the equipment and efficiency of the debonding process.
Patent Information
- Application Number
- CN202323620506.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-27
AI Technical Summary
The existing wafer laser debonding equipment cannot automatically adapt to chip rings of different specifications, resulting in limited versatility and inability to effectively support and fix chip rings of different sizes, affecting the efficiency and accuracy of the debonding process.
A laser debonding platform including a circular tabletop and multiple positioning support components is designed. Through the combination of support cylinders, support members and clamping cylinders, automatic clamping and fixing of sheet rings of different specifications, and the movable support members are achieved. The synchronous adjustment of the step surface and the clamping cylinder is suitable for plate rings of different specifications.
It realizes stable clamping of sheet rings of different specifications, improves the versatility and adaptability of laser debonding equipment, and ensures understanding of the reliability and efficiency of the bonding process.
Smart Images
Figure CN222190634U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer debonding equipment, in particular to a laser debonding platform suitable for wafer rings of multiple specifications. Background Art
[0002] During the wafer manufacturing process, due to the thinness of the wafer, the wafer needs to be temporarily bonded to a glass carrier, and then deposition, etching and other processes are performed on the wafer surface, and various microcircuit structures are manufactured on the wafer surface. After the wafer is processed, the wafer and the glass carrier need to be debonded to separate the wafer and the glass carrier before the subsequent wafer dicing process can be carried out.
[0003] At present, conventional wafer laser debonding is for wafers without wafer rings. After debonding, the wafer enters the cleaning process alone. However, some wafers must be equipped with wafer rings, otherwise the wafer may warp, so the wafer ring also needs to enter the debonding station together. Different specifications of wafers have different sizes of wafer rings. Therefore, the laser debonding table should have the function of automatically clamping wafer rings of different sizes, otherwise the versatility of the laser debonding equipment will be affected. Utility Model Content
[0004] In order to solve the above problems, the utility model provides a laser debonding platform suitable for sheet rings of multiple specifications, which can automatically switch to clamp sheet rings of different sizes.
[0005] To this end, the technical solution of the utility model is: a platform for laser debonding suitable for sheet rings of multiple specifications, including a base, a circular table top is provided on the base, and a plurality of positioning support assemblies are provided on the outside of the circular table top, the positioning support assembly includes a supporting base, a supporting cylinder, a supporting member, a clamping member and a clamping cylinder, the supporting cylinder is installed below the circular table top, the supporting base is connected to the supporting cylinder, and is slidably installed on the outside of the circular table top; the supporting member and the clamping cylinder are installed above the supporting base, and the clamping member is installed on the clamping cylinder; a supporting step surface is provided above the supporting member.
[0006] On the basis of the above scheme and as a preferred scheme of the above scheme: a slide rail is provided below the circular table top, and a slider is provided above the support base to slide with the slide rail.
[0007] On the basis of the above scheme and as a preferred scheme of the above scheme: two support members are provided on the support base, and the clamping member is located between the two support members.
[0008] On the basis of the above scheme and as a preferred scheme of the above scheme: 4 groups of positioning support components are evenly arranged on the outer side of the circular table top, the 4 groups of positioning support components are opposite to each other, and the supporting step surfaces of all the supporting members are located at the same height.
[0009] On the basis of the above scheme and as a preferred scheme of the above scheme: the cylinder rod of the supporting cylinder is connected to the supporting base through a connecting seat, and the four supporting cylinders are stacked in a criss-cross shape under the circular table top.
[0010] Compared with the prior art, the beneficial effects of the utility model are as follows: the supporting step surface on the supporting member can be used to support the sheet ring on the outside of the wafer, and the clamping member can be clamped on the sheet ring under the action of the clamping cylinder, thereby fixing the sheet ring; the supporting member is arranged on a movable supporting base, so that each supporting member can move toward or away from each other, and the spacing between the supporting step surfaces can be adjusted, which is suitable for supporting sheet rings of different specifications, and the clamping cylinder moves synchronously with the supporting member, and the clamping member can fix sheet rings of different specifications, and has strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings.
[0012] Figure 1 It is a structural schematic diagram of the utility model;
[0013] Figure 2 This is a structural schematic diagram of the positioning support assembly of the utility model;
[0014] Figure 3 It is a schematic diagram of the use of the utility model;
[0015] Figure 4 This is a diagram of the clamping state of an 8-inch sheet ring of the utility model;
[0016] Figure 5 This is a bottom view of the 8-inch sheet ring of the utility model in a clamping state;
[0017] Figure 6 This is a diagram of the clamping state of a 12-inch sheet ring of the utility model;
[0018] Figure 7 This is a bottom view of the 12-inch sheet ring of the utility model in the clamping state.
[0019] Marked in the figure are: base 1, circular table 2, slide rail 21, positioning support assembly 3, support base 31, support cylinder 32, support member 33, clamping member 34, clamping cylinder 35, connecting seat 36, slider 37, support step surface 38, laser debonding device 4, guide rail 41, first ring 5, second ring 6. DETAILED DESCRIPTION
[0020] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.
[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" and "a number" is two or more, unless otherwise clearly and specifically defined.
[0022] See the attached drawings. The laser debonding platform of this embodiment comprises a base 1, on which a circular table 2 is disposed, and four groups of positioning support components 3 are evenly disposed outside the circular table 2, and the four groups of positioning support components 3 are opposite to each other.
[0023] The positioning support assembly 3 includes a support base 31, a support cylinder 32, a support member 33, a clamping member 34 and a clamping cylinder 35. The support cylinder 32 is installed below the circular table 2. Four support cylinders 32 are stacked in a tic-tac-toe pattern below the circular table 2. A connecting seat 36 is provided on the cylinder rod of the support cylinder 32, and the connecting seat 36 is connected to the support base 31. Four sets of slide rails 21 are provided below the circular table 2, and each set of slide rails 21 has two rails. Slide blocks 37 are provided on both sides above the support base 31, which can slide with the slide rails 21. The height of the connecting seat can be different, as long as the slide blocks on the support base can be matched with the slide blocks.
[0024] Two support members 33 are mounted on the support base 31. The top of the support member 33 is provided with a support step surface 38. The support step surfaces 38 of all the support members are located at the same height. The clamping cylinder 35 is mounted on the support base 31. The clamping cylinder 35 is located between the two support members 33. The clamping member 34 is mounted on the cylinder rod of the clamping cylinder 35 and is also located between the two support members 33.
[0025] This embodiment is used in a laser debonding device 4, in which a guide rail 41 is provided, and a moving block is provided under the base 1, so that the base 1 can enter and exit the laser debonding device 4 along the guide rail 41. When in use, the position of the supporting base 31 is adjusted according to the specifications of the wafer / sheet ring, and the commonly used sheet rings in China correspond to 8-inch wafers and 12-inch wafers.
[0026] like Figure 4 , 5 As shown, for the first ring 5 of the 8-inch wafer, the supporting cylinder 32 contracts, driving the supporting base 31 to move inward, reducing the distance of the supporting step surface 38, so that the annular supporting area formed by it matches the first ring 5. When the robot places the wafer on the table, the first ring is placed on the supporting step surface; then the clamping cylinder 35 drives the clamping member 34 to move inward and clamp on the first ring 5 to complete the fixation of the first ring.
[0027] like Figure 6 , 7 As shown, for the second ring 6 of the 12-inch wafer, the supporting cylinder 32 extends, driving the supporting base 31 to move outward, expanding the distance of the supporting step surface 38, so that the annular supporting area formed by it matches the second ring 6. When the robot places the wafer on the table, the second ring 6 is placed on the supporting step surface 38; then the clamping cylinder 35 drives the clamping member 34 to move inward and clamp on the second ring 6 to complete the fixation of the second ring.
[0028] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.
Claims
1. A laser debonding platform suitable for multiple specifications of rings, characterized by: It includes a base, a circular table top is provided on the base, and a plurality of positioning support components are provided on the outer side of the circular table top, wherein the positioning support components include a supporting base, a supporting cylinder, a supporting member, a clamping member and a clamping cylinder, wherein the supporting cylinder is installed below the circular table top, and the supporting base is connected to the supporting cylinder and is slidably installed on the outer side of the circular table top; the supporting member and the clamping cylinder are installed above the supporting base, and the clamping member is installed on the clamping cylinder; and a supporting step surface is provided above the supporting member.
2. The laser debonding platform applicable to multi-specification rings according to claim 1, characterized in that: A slide rail is provided below the circular table top, and a sliding block is provided above the support base, which is slidably matched with the slide rail.
3. The laser debonding platform applicable to multi-specification rings according to claim 1, characterized in that: The support base is provided with two support members, and the clamping member is located between the two support members.
4. The laser debonding platform applicable to multi-specification rings according to claim 1, characterized in that: Four groups of positioning support components are evenly arranged on the outer side of the circular table top, and the four groups of positioning support components are opposite to each other in pairs, and the supporting step surfaces of all the supporting members are located at the same height.
5. The laser debonding platform applicable to multi-specification rings according to claim 1, characterized in that: The cylinder rod of the supporting cylinder is connected to the supporting base through a connecting seat, and four supporting cylinders are stacked in a tic-tac-toe shape under the circular table top.