Feeding device of wafer laser de-bonding machine

Abstract

The utility model discloses a feeding device of a wafer laser de-bonding machine. The feeding device comprises a feeding box, a positioning platform, a clamping mechanism and a transferring mechanism, the positioning platform is located on the side face of the feeding box, a positioning strip capable of being opened and closed is arranged on the positioning platform, and the clamping mechanism is installed on the positioning platform and comprises a clamping part and a first linear motion module driving the clamping part to move horizontally; the transfer mechanism is located above the positioning platform and provided with a plurality of suction cups. According to the utility model, the first positioning strip and the second positioning strip which can be opened and closed are arranged on the positioning platform, so that wafers of different specifications can be positioned, and the universality is high; a plurality of feeding boxes can be arranged, the positioning platform moves among the feeding boxes, and the feeding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer debonding equipment, in particular to a feeding device of a wafer laser debonding machine. Background Art

[0002] During the wafer manufacturing process, due to the thinness of the wafer, the wafer needs to be temporarily bonded to a glass carrier, and then deposition, etching and other processes are performed on the wafer surface, and various microcircuit structures are manufactured on the wafer surface. After the wafer is processed, the wafer and the glass carrier need to be debonded to separate the wafer and the glass carrier before the subsequent wafer dicing process can be carried out.

[0003] At present, laser debonding uses a loading robot. The wafer and glass carrier are placed in a loading box together, taken out of the loading box by the loading robot, and placed on a positioning platform for positioning. The existing positioning platform is only suitable for positioning wafers of a single specification. When wafers of different specifications need to be debonded, the positioning platform needs to be replaced, which is very cumbersome. Utility Model Content

[0004] In order to solve the above problems, the utility model provides a loading device for a wafer laser debonding machine, which can be applicable to laser debonding loading operations on wafers of various specifications.

[0005] To this end, the technical solution of the utility model is: a loading device for a wafer laser debonding machine, comprising a loading box, a positioning platform, a clamping mechanism and a transfer mechanism; the positioning platform is located on the side of the loading box, and a positioning strip that can be opened and closed is provided on the positioning platform. The clamping mechanism is installed on the positioning platform, and comprises a clamping part and a first linear motion module that drives the clamping part to move horizontally; the transfer mechanism is located above the positioning platform, and the transfer mechanism is provided with multiple suction cups.

[0006] On the basis of the above scheme and as a preferred scheme of the above scheme: the loading boxes are provided in plurality, and the side of the positioning platform is provided with a movable track and a second linear motion module driving the positioning platform to move on the side of each loading box.

[0007] On the basis of the above solution and as a preferred solution of the above solution: a third linear motion module arranged vertically is also provided on the side of the positioning platform, which can drive the positioning platform to rise and fall.

[0008] On the basis of the above scheme and as a preferred scheme of the above scheme: a first positioning bar and a second positioning bar are provided on the positioning platform, and a driving mechanism for driving the first positioning bar and the second positioning bar to close and separate is provided under the positioning platform.

[0009] On the basis of the above scheme and as a preferred scheme of the above scheme: the driving mechanism includes a driving motor, a driving pulley, a belt and a driven pulley, the driving motor drives the driving pulley to rotate, and the driving pulley is connected to the driven pulley through a belt; sliders are provided under the first positioning bar and the second positioning bar, and the two sliders are respectively fixed on the belts on both sides.

[0010] On the basis of the above scheme and as a preferred scheme of the above scheme: the first linear motion module is installed on the side of the positioning platform, and the clamping part extends to the upper middle of the positioning platform; the clamping part can move between the positioning platforms of the loading box.

[0011] During use, the wafer to be debonded is placed in the loading box, the positioning platform moves to the side of the corresponding loading box, the clamping part moves to the loading box to clamp the wafer, and clamps the wafer on the positioning platform. The clamping part determines the front and rear positions of the wafer, and the first positioning strips and the second positioning strips on both sides are closed under the drive of the driving mechanism to limit the left and right positions of the wafer. After the positioning is completed, the transfer mechanism uses a suction cup to take away the wafer and enters the laser debonding process.

[0012] Compared with the prior art, the beneficial effects of the utility model are: a first positioning bar and a second positioning bar that can be opened and closed are provided on the positioning platform, which can position wafers of different specifications and has strong versatility; multiple loading boxes can be set, and the positioning platform moves between each loading box to improve loading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The following is a further detailed description of the embodiments of the present invention in conjunction with the accompanying drawings.

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 It is a top view of the structure of the utility model;

[0016] Figure 3 This is a structural diagram of the positioning platform of the utility model;

[0017] Figure 4 It is a bottom view of the structure of the positioning platform of the utility model.

[0018] Marked in the figure are: loading box 1, positioning platform 2, second linear motion module 21, third linear motion module 22, first positioning bar 23, second positioning bar 24, driving motor 25, belt 26, driven pulley 27, clamping mechanism 3, clamping part 31, first linear motion module 32, transfer mechanism 4. DETAILED DESCRIPTION

[0019] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" and "a number" is two or more, unless otherwise clearly and specifically defined.

[0021] See the attached drawings. The loading device of the wafer laser debonding machine described in this embodiment includes a loading box 1, a positioning platform 2, a clamping mechanism 3 and a transfer mechanism 4; the loading box 1 is provided with multiple, the positioning platform 2 is located on the side of the loading box 1, and the side of the positioning platform 2 is provided with a second linear motion module 21 that drives the positioning platform to move along the side of each loading box. The side of the positioning platform 2 is also provided with a vertically arranged third linear motion module 22 that can drive the positioning platform 2 to rise and fall.

[0022] The positioning platform 2 is provided with a first positioning bar 23 and a second positioning bar 24, and a driving mechanism for driving the first positioning bar 23 and the second positioning bar 24 to close and separate is provided below the positioning platform 2. The driving mechanism includes a driving motor 25, a driving pulley, a belt 26 and a driven pulley 27. The driving motor 25 drives the driving pulley to rotate, and the driving pulley is connected to the driven pulley 27 through the belt 26; sliders are provided below the first positioning bar 23 and the second positioning bar 24, and the two sliders are respectively fixed on the belts 26 on both sides.

[0023] The clamping mechanism 3 is installed on the positioning platform 2, and includes a clamping part 31 and a first linear motion module 32 that drives the clamping part to move horizontally; the first linear motion module 32 is installed on the side of the positioning platform 2, and the clamping part 31 extends to the upper middle of the positioning platform 2; the clamping part 31 can move between the positioning platforms of the loading box and can clamp the wafer.

[0024] The transfer mechanism 4 is located above the positioning platform and is provided with a plurality of suction cups.

[0025] During use, the wafer to be debonded is placed in the loading box 1, the positioning platform 2 moves to the side corresponding to the loading box 1, the clamping part 31 moves to the loading box 1 to clamp the wafer, and clamps the wafer on the positioning platform 2. The clamping part 31 determines the front and rear positions of the wafer, and the first positioning strips 23 and the second positioning strips 24 on both sides are closed under the drive of the driving mechanism to limit the left and right positions of the wafer. After the positioning is completed, the transfer mechanism 4 uses a suction cup to take away the wafer and enters the laser debonding process.

[0026] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A loading device for a wafer laser debonding machine, Features: It includes a loading box, a positioning platform, a clamping mechanism and a transfer mechanism; the positioning platform is located on the side of the loading box, and a positioning strip that can be opened and closed is provided on the positioning platform. The clamping mechanism is installed on the positioning platform, and includes a clamping part and a first linear motion module that drives the clamping part to translate; the transfer mechanism is located above the positioning platform, and the transfer mechanism is provided with multiple suction cups.

2. A loading device for a wafer laser debonding machine as claimed in claim 1, Features: There are multiple loading boxes, and the side of the positioning platform is provided with a moving track and a second linear motion module that drives the positioning platform to move on the side of each loading box.

3. A loading device for a wafer laser debonding machine as claimed in claim 2, Features: A third linear motion module is also vertically arranged on the side of the positioning platform, which can drive the positioning platform to rise and fall.

4. A loading device for a wafer laser debonding machine as claimed in claim 1, Features: The positioning platform is provided with a first positioning bar and a second positioning bar, and a driving mechanism for driving the first positioning bar and the second positioning bar to close and separate is provided below the positioning platform.

5. A loading device for a wafer laser debonding machine as claimed in claim 4, Features: The driving mechanism includes a driving motor, a driving pulley, a belt and a driven pulley. The driving motor drives the driving pulley to rotate, and the driving pulley is connected to the driven pulley through a belt. Slide blocks are provided under the first positioning bar and the second positioning bar, and the two slide blocks are respectively fixed on the belts on both sides.

6. A loading device for a wafer laser debonding machine as claimed in claim 1, Features: The first linear motion module is installed on the side of the positioning platform, and the clamping part extends to the upper middle of the positioning platform; the clamping part can move between the positioning platforms of the loading box.

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