Wafer transportation device

Abstract

The utility model relates to a wafer transportation device, which comprises a base, a driving mechanism, a seat body, a first connecting rod, a second connecting rod, a first mounting plate arranged on the base, and a second mounting plate arranged on the first mounting plate, the motor rotates to enable the lead screw to drive the sliding base to move in the second direction, the air cylinder can drive the base body to move in the first direction, and then the first connecting rod and the second connecting rod on the base body are driven to move in the first direction and the second direction; compared with a previous manual carrying mode, the wafer conveying device has the advantage that the efficiency of the carrying mode is higher.

Description

Technical Field

[0001] The utility model relates to a wafer transport device. Background Art

[0002] Indium phosphide substrates have an application market in the fields of manufacturing high-frequency and high-power devices, optical fiber communications, wireless transmission, radio astronomy and other RF devices. RF devices made using indium phosphide substrates have shown excellent performance in application scenarios such as satellites and radars. They are highly competitive in the RF front-end of radar and communication systems, analog / mixed signal wide-bandwidth circuits, and are suitable for applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion. In addition, indium phosphide-based RF device-related devices such as low-noise amplifiers, modules and receivers are also widely used in satellite communications, millimeter-wave radars, active and passive millimeter-wave imaging and other equipment. At bandwidth levels above 100GHz, the use of indium phosphide-based RF devices has obvious advantages in wireless transmission in backhaul networks and point-to-point communication networks. In the future, in 6G communication and even 7G communication wireless transmission networks, indium phosphide substrates are expected to become the mainstream substrate material for RF devices.

[0003] Currently, the loading and unloading and transfer of indium phosphide are all done manually. The employee first checks the chip information and turns on the inspection equipment. After completing the preparation, he selects the program, checks the time, speed and pressure of each step, and transfers the indium phosphide wafer to the corresponding process. The employee holds the plug containing the indium phosphide wafer with both hands for transfer. This operation has low work efficiency and causes great wear and tear on the wafer. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer transport device which can realize automatic wafer transport.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a wafer transport device, which comprises: a base, a driving mechanism, a base body, a first connecting rod, a second connecting rod, a first mounting plate arranged on the base, and a second mounting plate arranged on the first mounting plate; the driving mechanism comprises: a cylinder, a motor, a lead screw and a sliding frame;

[0006] A mounting cavity is formed between the first mounting plate and the second mounting plate; the motor is arranged in the mounting cavity; the output shaft of the motor is coaxially connected to the lead screw; the sliding frame is threadedly connected to the lead screw; the cylinder is connected to the sliding frame; the seat body is connected to the output shaft of the cylinder; the first connecting rod and the second connecting rod are respectively connected to the seat body; the first connecting rod is provided with a first vacuum suction cup for adsorbing a wafer; the second connecting rod is provided with a second vacuum suction cup for adsorbing a wafer;

[0007] Wherein, the cylinder output shaft extends along a first direction, and the lead screw extends along a second direction; the first direction intersects with the second direction.

[0008] Optionally, the driving mechanism, the seat body, the first connecting rod and the second connecting rod are multiple in number and are arranged in one-to-one correspondence.

[0009] Optionally, a plurality of the driving mechanisms, the seat body, the first connecting rod and the second connecting rod are respectively arranged on opposite sides of the installation cavity.

[0010] Optionally, the first connecting rod and the second connecting rod extend along the first direction respectively.

[0011] Optionally, the first connecting rod and the second connecting rod are in the shape of a rectangular parallelepiped; the first connecting rod has a first supporting surface facing vertically upward, the first supporting surface is provided with a first recessed portion, and the first vacuum suction cup is provided in the first recessed portion; the second connecting rod has a second supporting surface facing vertically upward, the second supporting surface is provided with a second recessed portion, and the second vacuum suction cup is provided in the second recessed portion.

[0012] Optionally, it further includes: a first photoelectric sensor and a second photoelectric sensor; the first photoelectric sensor is arranged on the first connecting rod; and the second photoelectric sensor is arranged on the second connecting rod.

[0013] Optionally, a first pad is provided on the first connecting rod; and a second pad is provided on the second connecting rod.

[0014] Optionally, a first through hole corresponding to the first recessed portion is formed on the first pad body, and a second through hole corresponding to the second recessed portion is formed on the second pad body.

[0015] Optionally, the first pad body is a first perfluororubber pad; the second pad body is a second perfluororubber pad.

[0016] Compared with the prior art, the wafer transport device of the present utility model has the following beneficial effects:

[0017] The present application can rotate the motor to make the lead screw drive the sliding seat to move along the second direction, and the cylinder can drive the seat body to move along the first direction, and then drive the first connecting rod and the second connecting rod on the seat body to move along the first direction and the second direction, so that the wafer transport device of the present application can realize the transportation of the wafer. Compared with the previous manual transportation method, the transportation method of the present application is more efficient. Secondly, the present application adopts the first connecting rod and the second connecting rod to support the wafer. On the one hand, it can improve the supporting force of the wafer, and on the other hand, it can use the principle of two straight lines to determine a plane so that the wafer can be stably supported on the first connecting rod and the second connecting rod to prevent the wafer from falling. Furthermore, the first vacuum suction cup is set on the first connecting rod and the second vacuum suction cup is set on the second connecting rod to realize the adsorption of the wafer, so as to further improve the stability of the wafer during the movement of the first connecting rod and the second connecting rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram in an embodiment of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the driving mechanism in the embodiment of the utility model;

[0020] Figure 3 It is a schematic diagram of the connection relationship between the seat body, the first connecting rod and the second connecting rod in the embodiment of the utility model.

[0021] In the figure, 1, base; 2, driving mechanism; 21, cylinder; 22, motor; 23, screw; 24, sliding frame; 3, seat body; 4, first connecting rod; 41, first supporting surface; 411, first recessed portion; 5, second connecting rod; 51, second supporting surface; 511, second recessed portion; 6, first mounting plate; 7, second mounting plate; 8, mounting cavity; 9, first photoelectric sensor; X, first direction; Y, second direction. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0023] First, it should be noted that the top, bottom, upward, downward and other directions mentioned in this article are defined relative to the directions in the respective drawings, and they are relative concepts, and therefore can be changed according to different positions and different practical states. Therefore, these or other directions should not be understood as restrictive terms.

[0024] It should be noted that the term "comprising" does not exclude other elements or steps and "a" or "an" does not exclude a plurality.

[0025] In addition, it should be pointed out that any single technical feature described or implied in the embodiments of this document, or any single technical feature shown or implied in the accompanying drawings, can still be combined between these technical features (or their equivalents) to obtain other embodiments of the present application that are not directly mentioned in this document.

[0026] It should also be understood that the terms "first", "second", etc. are used herein to describe various information, but such information should not be limited to these terms, which are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0027] It should be noted that in different drawings, the same reference numerals denote the same or substantially the same components.

[0028] like Figure 1-Figure 3 As shown, a wafer transport device according to a preferred embodiment of the utility model comprises: a base 1, a driving mechanism 2, a base body 3, a first connecting rod 4, a second connecting rod 5, a first mounting plate 6 arranged on the base 1, and a second mounting plate 7 arranged on the first mounting plate 6. The driving mechanism 2 comprises: a cylinder 21, a motor 22, a lead screw 23 and a sliding frame 24.

[0029] An installation cavity 8 is formed between the first installation plate 6 and the second installation plate 7. The motor 22 is disposed in the installation cavity 8, the output shaft of the motor 22 is coaxially connected to the lead screw 23, the slide frame 24 is threadedly connected to the lead screw 23, the cylinder 21 is connected to the slide frame 24, the seat body 3 is connected to the output shaft of the cylinder 21, the first connecting rod 4 and the second connecting rod 5 are respectively connected to the seat body 3, the first connecting rod 4 is provided with a first vacuum suction cup for adsorbing a wafer, and the second connecting rod 5 is provided with a second vacuum suction cup for adsorbing a wafer.

[0030] The output shaft of the cylinder 21 extends along a first direction X, and the lead screw 23 extends along a second direction Y; the first direction X and the second direction Y intersect.

[0031] Based on the above structure, the present application can rotate the motor 22 to make the lead screw 23 drive the sliding seat to move along the second direction Y, and the cylinder 21 can drive the seat body 3 to move along the first direction X, and then drive the first connecting rod 4 and the second connecting rod 5 on the seat body 3 to move along the first direction X and the second direction Y, so that the wafer transport device of the present application can realize the transportation of the wafer. Compared with the previous manual transportation method, the transportation method of the present application is more efficient. Secondly, the present application adopts the first connecting rod 4 and the second connecting rod 5 to support the wafer. On the one hand, it can improve the supporting force of the wafer, and on the other hand, it can use the principle of two straight lines to determine a plane so that the wafer can be stably supported on the first connecting rod 4 and the second connecting rod 5 to prevent the wafer from falling. Furthermore, the first vacuum suction cup is set on the first connecting rod 4 and the second vacuum suction cup is set on the second connecting rod 5 to realize the adsorption of the wafer, so as to further improve the stability of the wafer during the movement of the first connecting rod 4 and the second connecting rod 5.

[0032] It can be understood that the present application can set a tray externally to support the wafer, and a slot for inserting the first connecting rod 4 and the second connecting rod 5 is set on the tray to facilitate the insertion of the first connecting rod 4 and the second connecting rod 5 to support the wafer on the first connecting rod 4 and the second connecting rod 5.

[0033] Specifically, the first direction X and the second direction Y are perpendicular to each other.

[0034] Further, see Figure 2 The number of the driving mechanism 2, the seat body 3, the first connecting rod 4 and the second connecting rod 5 is multiple and they are arranged in one-to-one correspondence.

[0035] Furthermore, the plurality of driving mechanisms 2 , the seat body 3 , the first connecting rod 4 , and the second connecting rod 5 are respectively arranged on opposite sides of the installation cavity 8 .

[0036] Specifically, see Figure 2 The number of the driving mechanism 2, the base body 3, the first connecting rod 4 and the second connecting rod 5 is four, and two of them are arranged on both sides of the installation cavity 8 along the first direction X. In the second direction Y, the motors 22 of the two groups of driving mechanisms 2 are arranged at two ends far away from each other to avoid the two motors 22 being arranged on the same side, so as to improve the space utilization inside the installation cavity 8.

[0037] In a possible embodiment, the first connecting rod 4 and the second connecting rod 5 extend respectively along the first direction X, and there is a gap between the first connecting rod 4 and the second connecting rod 5, so as to avoid excessive support parts from contacting the chip and causing chip wear when the first connecting rod 4 and the second connecting rod 5 provide sufficient supporting force.

[0038] In one possible embodiment, see Figure 2 and Figure 3 , the first connecting rod 4 and the second connecting rod 5 are in the shape of a rectangular parallelepiped, the first connecting rod 4 has a first supporting surface 41 facing vertically upward, the first supporting surface 41 is provided with a first recessed portion 411, the first vacuum suction cup is provided in the first recessed portion 411, the second connecting rod 5 has a second supporting surface 51 facing vertically upward, the second supporting surface 51 is provided with a second recessed portion 511, and the second vacuum suction cup is provided in the second recessed portion 511. Among them, the first supporting surface 41 and the second supporting surface 51 are planes and are on the same horizontal plane, so that when the first supporting surface 41 and the second supporting surface 51 support the wafer, the wafer is in a horizontal position to prevent the wafer from falling. Secondly, the present application prevents the first vacuum suction cup and the second vacuum suction cup from protruding from the first supporting surface 41 and the second supporting surface 51 by respectively arranging the first vacuum suction cup and the second vacuum suction cup in the first recessed portion 411 and the second recessed portion 511.

[0039] In one possible embodiment, see Figure 3 , the present application also includes: a first photoelectric sensor 9 and a second photoelectric sensor. The first photoelectric sensor 9 is arranged on the first connecting rod 4; the second photoelectric sensor is arranged on the second connecting rod 5. The first photoelectric sensor 9 and the second photoelectric sensor can determine whether the wafer is in place according to the intensity change of the light signal. When one of the first photoelectric sensors 9 does not detect the intensity change of the light signal, that is, the wafer is not in place, the motor 22 and the cylinder 21 are controlled to stop working to prevent the wafer from falling.

[0040] Furthermore, a first pad is provided on the first connecting rod 4, and a second pad is provided on the second connecting rod 5. The first connecting rod 4 and the second connecting rod 5 are in contact with the wafer via the first pad and the second pad, respectively, to prevent the wafer from sliding.

[0041] Furthermore, the first pad body is provided with a first through hole corresponding to the first recessed portion 411, and the second pad body is provided with a second through hole corresponding to the second recessed portion 511, so that the first vacuum suction cup and the second vacuum suction cup can be exposed when the first pad body and the second pad body are installed.

[0042] Furthermore, the first pad body is a first perfluororubber pad, and the second pad body is a second perfluororubber. The perfluororubber pad can reduce contamination of the wafer (eg, contamination caused by particles) when in contact with the wafer.

[0043] In summary, the embodiment of the utility model provides a wafer transport device, which can rotate through the motor 22 so that the lead screw 23 drives the sliding seat to move along the second direction Y, and the cylinder 21 can drive the seat body 3 to move along the first direction X, and then drive the first connecting rod 4 and the second connecting rod 5 on the seat body 3 to move along the first direction X and the second direction Y, so that the wafer transport device of the present application can realize the transportation of the wafer. Secondly, the present application adopts the first connecting rod 4 and the second connecting rod 5 to support the wafer, on the one hand, it can improve the supporting force of the wafer, and on the other hand, it can use the principle of two straight lines to determine a plane so that the wafer can be stably supported on the first connecting rod 4 and the second connecting rod 5 to prevent the wafer from falling. Furthermore, the first vacuum suction cup is set on the first connecting rod 4 and the second vacuum suction cup is set on the second connecting rod 5 to realize the adsorption of the wafer, so as to further improve the stability of the wafer during the movement of the first connecting rod 4 and the second connecting rod 5.

[0044] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.

Claims

1. A wafer transport device, characterized in that: include: A base, a driving mechanism, a seat body, a first connecting rod, a second connecting rod, a first mounting plate arranged on the base, and a second mounting plate arranged on the first mounting plate; the driving mechanism includes: a cylinder, a motor, a lead screw and a sliding frame; A mounting cavity is formed between the first mounting plate and the second mounting plate; the motor is arranged in the mounting cavity; the output shaft of the motor is coaxially connected to the lead screw; the sliding frame is threadedly connected to the lead screw; the cylinder is connected to the sliding frame; the seat body is connected to the output shaft of the cylinder; the first connecting rod and the second connecting rod are respectively connected to the seat body; the first connecting rod is provided with a first vacuum suction cup for adsorbing a wafer; the second connecting rod is provided with a second vacuum suction cup for adsorbing a wafer; Wherein, the cylinder output shaft extends along a first direction, and the lead screw extends along a second direction; the first direction intersects with the second direction.

2. The wafer transport device according to claim 1, characterized in that: The number of the driving mechanism, the seat body, the first connecting rod and the second connecting rod is plural and they are arranged in one-to-one correspondence.

3. The wafer transport device according to claim 2, characterized in that: The plurality of driving mechanisms, the seat body, the first connecting rod and the second connecting rod are respectively arranged on two opposite sides of the installation cavity.

4. The wafer transport device according to claim 1, characterized in that: The first connecting rod and the second connecting rod extend along the first direction respectively.

5. The wafer transport device according to claim 1, characterized in that: The first connecting rod and the second connecting rod are in the shape of a rectangular parallelepiped; the first connecting rod has a first supporting surface facing vertically upward, the first supporting surface is provided with a first recessed portion, and the first vacuum suction cup is provided in the first recessed portion; the second connecting rod has a second supporting surface facing vertically upward, the second supporting surface is provided with a second recessed portion, and the second vacuum suction cup is provided in the second recessed portion.

6. The wafer transport device according to claim 1, characterized in that: Also includes: A first photoelectric sensor and a second photoelectric sensor; the first photoelectric sensor is arranged on the first connecting rod; The second photoelectric sensor is disposed on the second connecting rod.

7. The wafer transport device according to claim 5, characterized in that: A first pad is arranged on the first connecting rod; and a second pad is arranged on the second connecting rod.

8. The wafer transport device according to claim 7, characterized in that: The first pad body is provided with a first through hole corresponding to the first recessed portion, and the second pad body is provided with a second through hole corresponding to the second recessed portion.

9. The wafer transport device according to claim 8, characterized in that: The first pad body is a first perfluororubber pad; the second pad body is a second perfluororubber pad.

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