Fixator for chip flip film lamination

Abstract

The utility model relates to the technical field of fixers, in particular to a fixer for laminating a chip flip crystal film, which comprises a bearing plate, a support column arranged at the top of the bearing plate, a guide plate fixedly connected to the side surface of the support column, a driving motor mounted at the tail end of the guide plate, and a guide groove formed in the side surface of the guide plate, the output end of the driving motor is fixedly connected with a threaded rod, the threaded rod penetrates through the guide plate and extends into the guide groove, the threaded rod is rotationally connected with the guide groove, a hydraulic telescopic rod is fixedly connected into the mounting groove, the bottom of the hydraulic telescopic rod is fixedly connected with a suction cup, and a suction hole is formed in the bottom of the suction cup. Through cooperative use of the threaded rod, the vacuum machine, the telescopic hose, the hydraulic telescopic rod and the suction cup, after the vacuum machine is started, a crystal film can be adsorbed through the telescopic hose and the suction cup, after the driving motor is started to rotate the threaded rod, the positions of the vacuum machine and the suction cup can be adjusted at the same time through the moving block, working of workers is facilitated, and then the working efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of fixers, in particular to a fixer used for chip flipping film bonding. Background Art

[0002] With the development of the semiconductor industry, wafers are the basic materials for manufacturing semiconductor chips. Technicians can process wafers to make various circuit components. Therefore, the processing and manufacturing of wafers has always been the core research area. Wafers are an optical substrate material, and coating them has become a basic requirement to improve their optical performance. In this industry, the traditional film-laminating method is to fix the periphery of the wafer in a flat position, that is, the wafer is placed horizontally during coating. In order to facilitate the work, a bonding fixture is required.

[0003] Prior art, such as: CN212010929U, a fixing device for wafer coating, can keep the wafer in a vertical state by providing a card table for preventing the wafer from slipping and a baffle for providing vertical support to the wafer. A vacuum hole communicating with the outside is also opened on the top surface of the card table or the side surface of the baffle. The vacuum hole is used to connect with an external vacuum device, and can provide adsorption force for the wafer to maintain a vertical state. When in use, under the condition that the external vacuum device provides a vacuum adsorption force, the wafer can be adsorbed on the top surface of the card table or the side surface of the baffle through the contact surface area, so that the wafer can have a vertical state. The above-mentioned fixing device for wafer coating disclosed in the utility model has a reasonable structural design and is simple to use and operate. The above-mentioned fixing device for wafer coating can be used to make the wafer to be coated in a vertical state for coating operations.

[0004] However, the device still has certain shortcomings during use. When fixing the crystal film, the device needs a vacuum hole to be connected to an external vacuum device to provide adsorption force for the wafer to remain in a vertical state. At the same time, after adsorption, the angle of the crystal film cannot be adjusted, which reduces its practicality. The device can only fix the crystal film alone and cannot fix the semiconductor, thereby reducing practicality and work efficiency. Utility Model Content

[0005] The purpose of the utility model is to provide a fixture for chip flipping film bonding to solve the problem of CN212010929U, a fixing device for wafer coating proposed in the above background technology: when fixing the crystal film, the device needs a vacuum hole to be connected to an external vacuum device to provide adsorption force for the wafer to maintain a vertical state, and after adsorption, the angle of the crystal film cannot be adjusted, thereby reducing practicality. The device can only fix the crystal film alone and cannot fix the semiconductor, thereby reducing practicality and work efficiency.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A fixture for chip flipping film bonding, comprising a carrying plate, a supporting column is provided on the top of the carrying plate, a side of the supporting column is fixedly connected to a guide plate, a driving motor is installed at the end of the guide plate, a guide groove is provided on the side of the guide plate, a threaded rod is fixedly connected to the output end of the driving motor, the threaded rod passes through the guide plate and extends into the guide groove, the threaded rod is rotatably connected to the guide groove, a moving block is threadedly connected to the outer surface of the threaded rod, a clamping plate is fixedly connected to the side of the moving block, a mounting plate is clamped to the side of the clamping plate, a mounting groove is provided on the side of the mounting plate, a hydraulic telescopic rod is fixedly connected in the mounting groove, a suction cup is fixedly connected to the bottom of the hydraulic telescopic rod, a suction hole is provided at the bottom of the suction cup

[0008] As a preferred solution of the utility model, the top of the supporting plate is fixedly connected to an adjusting plate, the top of the adjusting plate is slidably connected to a movable plate, the top of the movable plate is fixedly connected to a processing table, the top of the processing table is provided with a T-slot, and a T-plate is slidably connected in the T-slot.

[0009] As a preferred solution of the utility model, the outer surface of the guide plate is slidably connected to a sliding plate, one side of the sliding plate is fixedly connected to a clamping plate, and the other side of the sliding plate is fixedly connected to a vacuum machine via a fixing plate.

[0010] As a preferred solution of the utility model, the output end of the vacuum machine is fixedly connected with a telescopic suction tube, and the end of the telescopic suction tube is fixedly connected to the suction cup.

[0011] As a preferred solution of the utility model, a limiting bolt is arranged on the top of the T-shaped plate, and the limiting bolt passes through the T-shaped plate and extends into the processing table.

[0012] As a preferred solution of the utility model, a plug-in piece is inserted into the side of the movable plate, and the suction cup is located above the processing table.

[0013] As a preferred solution of the utility model, a connecting plate is fixedly connected to the bottom of the supporting column, and the bottom of the connecting plate is fixedly connected to the bearing plate.

[0014] As a preferred solution of the utility model, an auxiliary plate is fixedly connected to the side of the support column, and the bottom of the auxiliary plate is fixedly connected to the connecting plate.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. In the utility model, by setting the coordinated use of the threaded rod, the vacuum machine, the telescopic hose, the hydraulic telescopic rod and the suction cup, after starting the vacuum machine, the crystal film can be adsorbed by the telescopic hose and the suction cup, and after starting the driving motor to rotate the threaded rod, the positions of the vacuum machine and the suction cup can be adjusted simultaneously by the moving block, which is convenient for the work of the staff and thus improves the work efficiency.

[0017] 2. In the utility model, a processing table, a movable plate, a T-plate and a limiting bolt are used in combination, and the semiconductor is limited by the sliding connection between the T-plate and the T-slot, and the T-plate is fixed by the limiting bolt. Since the movable plate is slidably connected to the processing table, the processing table can be adjusted relative to the position of the crystal film, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the exploded side structure of the guide plate of the utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure of the vacuum machine of the utility model;

[0021] Figure 4 It is a schematic diagram of the explosion structure of the top of the processing table of the utility model.

[0022] In the figure: 1. load-bearing plate; 2. support column; 3. guide plate; 4. drive motor; 5. sliding plate; 6. telescopic suction tube; 7. auxiliary plate; 8. connecting plate; 9. adjustment plate; 10. processing table; 11. threaded rod; 12. moving block; 13. clamping plate; 14. mounting plate; 15. mounting groove; 16. hydraulic telescopic rod; 17. vacuum machine; 18. fixing plate; 19. suction cup; 20. suction hole; 21. moving plate; 22. insert; 23. T-slot; 24. T-plate; 25. limit bolt; 26. guide groove. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0024] For examples, see Figure 1-4 , the utility model provides a technical solution:

[0025] In this embodiment, Figure 1 , Figure 2 and Figure 3 As shown, a fixture for chip flipping film bonding includes a carrier plate 1, a support column 2 is arranged on the top of the carrier plate 1, a guide plate 3 is fixedly connected to the side of the support column 2, a driving motor 4 is installed at the end of the guide plate 3, a guide groove 26 is opened on the side of the guide plate 3, a threaded rod 11 is fixedly connected to the output end of the driving motor 4, the threaded rod 11 passes through the guide plate 3 and extends into the guide groove 26, the threaded rod 11 is rotatably connected to the guide groove 26, a moving block 12 is threadedly connected to the outer surface of the threaded rod 11, and a clamping plate 13 is fixedly connected to the side of the moving block 12. A mounting plate 14 is clamped to the side of the clamping plate 13, a mounting groove 15 is provided on the side of the mounting plate 14, a hydraulic telescopic rod 16 is fixedly connected in the mounting groove 15, a suction cup 19 is fixedly connected to the bottom of the hydraulic telescopic rod 16, a suction hole 20 is provided at the bottom of the suction cup 19, the outer surface of the guide plate 3 is slidably connected to the sliding plate 5, one side of the sliding plate 5 is fixedly connected to the clamping plate 13, the other side of the sliding plate 5 is fixedly connected to the vacuum machine 17 through the fixing plate 18, the output end of the vacuum machine 17 is fixedly connected to the telescopic suction pipe 6, and the end of the telescopic suction pipe 6 is fixedly connected to the suction cup 19.

[0026] Among them, the T-shaped plate 24 is fixed by tightening the limit bolt 25 to prevent the T-shaped plate 24 from moving during work. After starting the drive motor 4 to rotate the threaded rod 11, the positions of the vacuum machine 17 and the suction cup 19 can be adjusted at the same time through the moving block 12, and the suction cup 19 after fixing the crystal film can be adjusted to facilitate the work of the staff, thereby improving work efficiency.

[0027] In this embodiment, Figure 1 and Figure 4 As shown, an adjusting plate 9 is fixedly connected to the top of the carrying plate 1, a movable plate 21 is slidably connected to the top of the adjusting plate 9, a processing table 10 is fixedly connected to the top of the movable plate 21, a T-slot 23 is provided on the top of the processing table 10, a T-plate 24 is slidably connected in the T-slot 23, a limiting bolt 25 is provided on the top of the T-plate 24, the limiting bolt 25 passes through the T-plate 24 and extends into the processing table 10, an insert 22 is inserted into the side of the movable plate 21, a suction cup 19 is located above the processing table 10, a connecting plate 8 is fixedly connected to the bottom of the supporting column 2, the bottom of the connecting plate 8 is fixedly connected to the carrying plate 1, an auxiliary plate 7 is fixedly connected to the side of the supporting column 2, and the bottom of the auxiliary plate 7 is fixedly connected to the connecting plate 8.

[0028] Among them, since the movable plate 21 is slidably connected to the processing table 10, the staff can also adjust the processing table 10 relative to the position of the crystal film. The position of the movable plate 21 can be fixed by the insert 22 to prevent the movable plate 21 from moving during work, thereby improving practicality.

[0029] The working process of the utility model is as follows: when the fixing device for chip flipping film bonding designed by the present invention is used, first check whether the device is used normally, fix the device in a suitable working area, put the film on the processing table 10, start the hydraulic telescopic rod 16 to drive the suction cup 19 to abut against the film, start the vacuum machine 17, absorb the film through the telescopic suction pipe 6 and the suction cup 19, and then rise, put the semiconductor on the top of the processing table 10 through the sliding T-plate 24, the T-plate 24 is limited to the semiconductor, and the limiting bolt 25 is screwed. The T-shaped plate 24 is fixed to prevent it from moving during operation. After starting the drive motor 4 to rotate the threaded rod 11, the positions of the vacuum machine 17 and the suction cup 19 can be adjusted simultaneously through the moving block 12. The suction cup 19 after the crystal film is fixed can be adjusted to facilitate the work of the staff and thus improve the work efficiency. Since the moving plate 21 is slidably connected to the processing table 10, the staff can also adjust the processing table 10 relative to the position of the crystal film. The position of the moving plate 21 can be fixed by the insert 22 to prevent the moving plate 21 from moving during operation, thereby improving practicality.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A fixture for chip flipping film bonding, comprising a carrier plate (1), characterized in that: A support column (2) is arranged on the top of the bearing plate (1), the side of the support column (2) is fixedly connected to a guide plate (3), a drive motor (4) is installed at the end of the guide plate (3), a guide groove (26) is opened on the side of the guide plate (3), a threaded rod (11) is fixedly connected to the output end of the drive motor (4), the threaded rod (11) passes through the guide plate (3) and extends into the guide groove (26), the threaded rod (11) is rotatably connected to the guide groove (26), and the guide plate (3) is provided with a guide groove (26). The outer surface of the threaded rod (11) is threadedly connected to a moving block (12); a side of the moving block (12) is fixedly connected to a clamping plate (13); a side of the clamping plate (13) is clamped to a mounting plate (14); a side of the mounting plate (14) is provided with a mounting groove (15); a hydraulic telescopic rod (16) is fixedly connected in the mounting groove (15); a suction cup (19) is fixedly connected to the bottom of the hydraulic telescopic rod (16); a suction hole (20) is provided at the bottom of the suction cup (19).

2. A fixture for chip flipping film bonding according to claim 1, characterized in that: The top of the carrying plate (1) is fixedly connected to an adjusting plate (9), the top of the adjusting plate (9) is slidably connected to a moving plate (21), the top of the moving plate (21) is fixedly connected to a processing table (10), the top of the processing table (10) is provided with a T-shaped slot (23), and a T-shaped plate (24) is slidably connected in the T-shaped slot (23).

3. The fixture for chip flipping film bonding according to claim 1, characterized in that: The outer surface of the guide plate (3) is slidably connected to the sliding plate (5), one side of the sliding plate (5) is fixedly connected to the clamping plate (13), and the other side of the sliding plate (5) is fixedly connected to the vacuum machine (17) via a fixing plate (18).

4. The fixture for chip flipping film bonding according to claim 3, characterized in that: The output end of the vacuum machine (17) is fixedly connected to a telescopic suction tube (6), and the end of the telescopic suction tube (6) is fixedly connected to a suction cup (19).

5. The fixture for chip flipping film bonding according to claim 2, characterized in that: A limiting bolt (25) is arranged on the top of the T-shaped plate (24), and the limiting bolt (25) passes through the T-shaped plate (24) and extends into the processing table (10).

6. The fixture for chip flipping film bonding according to claim 2, characterized in that: An insert sheet (22) is inserted into the side of the movable plate (21), and the suction cup (19) is located above the processing table (10).

7. The fixture for chip flipping film bonding according to claim 1, characterized in that: A connecting plate (8) is fixedly connected to the bottom of the support column (2), and the bottom of the connecting plate (8) is fixedly connected to the bearing plate (1).

8. The fixture for chip flipping film bonding according to claim 1, characterized in that: An auxiliary plate (7) is fixedly connected to the side of the support column (2), and the bottom of the auxiliary plate (7) is fixedly connected to a connecting plate (8).

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