Wafer spin-drying tray
By designing a wafer drying tray with a concave placement area and adjustment components, and using centrifugal force to dry the moisture, the problems of indium phosphide wafer drying efficiency and employee safety are solved, and an efficient and safe drying process is achieved.
Patent Information
- Application Number
- CN202323618716.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-28
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-28
AI Technical Summary
Indium phosphide wafers are inefficient during the grinding and drying process, and manual operations can easily lead to employee injuries.
A wafer-drying tray is designed, including a tray body and an adjustment component. The upper surface of the tray body is provided with a flange along the edge to form a concave placement area, and an arc groove and drainage hole are provided in the concave area. The wafer is fixed by using the adjustment component. The pallet is driven to rotate through the drive mechanism, and the moisture is dried by centrifugal force to avoid manual operation.
Improves chip drying efficiency, avoids employee injuries, reduces production costs, and simplifies the drying process.
Smart Images
Figure CN222190689U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor substrate material manufacturing, in particular to a wafer drying tray. Background Art
[0002] Indium phosphide substrates have an application market in the manufacture of high-frequency and high-power devices, optical fiber communications, wireless transmission, radio astronomy and other RF devices. RF devices made using indium phosphide substrates have demonstrated excellent performance in application scenarios such as satellites and radars. They are highly competitive in the RF front end of radar and communication systems, and analog / mixed signal wide-bandwidth circuits, and are suitable for applications such as high-speed data processing and high-precision wide-bandwidth A / D conversion.
[0003] However, grinding and drying of indium phosphide wafers before polishing is a time-consuming and labor-intensive process. In the prior art, after indium phosphide is ground, it is manually unloaded using an air gun, and then the ground indium phosphide wafers are manually removed from the grinder, manually rinsed with water and blown dry with an air gun, which is inefficient and employees are prone to injury during manual handling. Utility Model Content
[0004] The technical problem to be solved by the utility model is: how to improve the drying efficiency of wafers and avoid injuries to employees.
[0005] In order to solve the above technical problems, the utility model provides a wafer drying tray, comprising:
[0006] A tray body, wherein the upper surface of the tray body is provided with a flange along the edge of the tray body, the flange encloses a concave wafer placement area on the upper surface of the tray body, a plurality of drainage holes are provided between the tray body and the flange, and arc grooves are symmetrically provided in the concave wafer placement area; and
[0007] The adjusting component is arranged in the arc groove and is used for adjusting according to the size of the wafer to achieve clamping and fixing of wafers of different sizes.
[0008] Further preferably, the adjustment component comprises:
[0009] an adjusting member, the adjusting member being an elastic member and being disposed in the arc groove; and
[0010] A spring is arranged at one end of the arc groove, and one end of the spring is in contact with the adjusting member.
[0011] Further preferably, the adjustment assembly further comprises a limiting column disposed at one end in the arc groove, and the spring is sleeved on the limiting column.
[0012] Further preferably, a plurality of blocks are provided on the inner wall of the arc groove along the curvature direction of the arc groove, and one end of the adjusting member away from the spring abuts against any of the blocks.
[0013] Further preferably, it further comprises a baffle, wherein the baffle covers one end of the arc groove where the limiting column is provided.
[0014] Further preferably, the concave wafer placement area is a concave spherical surface area.
[0015] Further preferably, the concave wafer placement area is a concave conical surface area, and its taper θ satisfies:
[0016] 1°≤θ≤10°.
[0017] Further preferably, the tray body is a disc structure, and the plurality of drainage holes are arranged at intervals around the circumference of the tray body.
[0018] Further preferably, the tray body and the flange are an integrally formed structure.
[0019] Further preferably, a slot for a robot to enter is provided on the flange.
[0020] Compared with the prior art, the wafer drying tray provided by the utility model has the following beneficial effects: the utility model provides a flange on the upper surface of the tray body along the edge of the tray body, so that the flange can enclose a concave wafer placement area on the upper surface of the tray body, the wafer to be dried is placed in the concave wafer placement area, and the wafer to be dried is fixed by an adjustment component. When the driving mechanism drives the wafer drying tray to rotate, since the wafer placement area is a concave structure, the bottom of the wafer is not in direct contact with the tray body, which is conducive to the water being thrown out from the drainage hole under the action of centrifugal force. The wafer drying tray has a simple structure and good stability. It uses centrifugal force to dry the water on the wafer, has high drying efficiency, does not require manual operation, and can effectively avoid employee injuries, thereby achieving the purpose of reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of a wafer drying tray described in the utility model.
[0022] Figure 2 It is a top view of a wafer drying tray described in the utility model.
[0023] Figure 3 It is a partial schematic diagram of a wafer drying tray described in the utility model.
[0024] Figure 4 This utility model Figure 2 Cross-sectional view of section AA.
[0025] In the figure: 100, wafer drying tray; 101, tray body; 102, flange; 103, concave wafer placement area; 104, robot entering the slot; 105, drainage hole; 106, arc groove; 107, adjustment part; 108, spring; 109, baffle; 110, block; 111, limit column. DETAILED DESCRIPTION
[0026] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0027] In the description of the present invention, it should be understood that the terms "upper", "lower", "inside", "outside", "between", "close to", "circumferential" and the like used in the present invention to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0028] In addition, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0029] like Figure 1-Figure 4 As shown, this embodiment provides a wafer spin-drying tray, which includes a tray body 101 and an adjustment component, wherein the wafers to be dried are placed on the tray body 101, and the adjustment component is used to adjust according to the size of the wafer to achieve clamping and fixing of wafers of different sizes.
[0030] In a specific embodiment, a flange 102 is provided on the upper surface of the tray body 101 along the edge of the tray body 101, and the flange 102 forms a concave chip placement area 103 on the upper surface of the tray body 101. A plurality of drainage holes 105 are provided between the tray body 101 and the flange 102, and arc grooves 106 are symmetrically provided in the concave chip placement area 103; an adjusting component is provided in the arc groove 106, so that the chip to be dried is placed in the concave chip placement area 103, and the chip to be dried is fixed by the adjusting component. When the driving mechanism drives the chip drying tray 100 to rotate, since the chip placement area is a concave structure, the bottom of the chip is not in direct contact with the tray body 101, which is conducive to the water being thrown out from the drainage holes 105 under the action of centrifugal force, the drying efficiency is high, and no manual operation is required, which can effectively avoid employee injuries, thereby achieving the purpose of reducing costs.
[0031] In some embodiments, the tray body 101 is a disc structure, and the plurality of drainage holes 105 are arranged at intervals around the circumference of the tray body 101 .
[0032] In other embodiments, the tray body 101 may also be in a polygonal structure, such as a rectangle, a pentagon, a hexagon, etc., but the concave wafer placement area 103 should be in a circular structure to facilitate fixing the wafer.
[0033] In some embodiments, the concave chip placement area 103 is a concave spherical surface area, so that when the chip is placed in the concave chip placement area 103, the bottom of the chip is not in direct contact with the tray body 101, which is conducive to the water being thrown out from the drainage hole 105 under the action of centrifugal force.
[0034] In another embodiment, the concave chip placement area 103 is a concave conical surface area, and its taper θ satisfies: 1°≤θ≤10°. Thus, the concave conical surface area can also prevent the bottom of the chip from directly contacting the tray body 101, thereby facilitating the water to be thrown out from the drainage hole 105 under the action of centrifugal force; in this embodiment, θ=10° is preferably set to avoid the cone angle being too large to prevent the internal water from being unable to be thrown out.
[0035] In some embodiments, the tray body 101 and the flange 102 are an integrally formed structure. The integrally formed structure can ensure that the tray body 101 and the flange 102 will not separate during the rotation and drying process. At the same time, it can avoid the presence of a gap between the tray body 101 and the flange 102 to cause water to accumulate, thereby ensuring that the moisture attached to the chip can be discharged from the drainage hole 105.
[0036] In some embodiments, a robot entry slot 104 may be provided on the flange 102 so that the robot can automatically place the wafers to be dried in the concave wafer placement area 103, or take out the dried wafers from the concave wafer placement area 103, thereby improving the degree of automation of the drying process, improving production efficiency and reducing manpower.
[0037] In some embodiments, the adjustment component includes an adjustment member 107 and a spring 108, wherein the adjustment member 107 is an elastic member and is placed in the arc groove 106, the spring 108 is arranged at one end in the arc groove 106, and one end of the spring 108 is in contact with the adjustment member 107, so that the position of the adjustment member 107 can be adjusted by the spring 108, so that the adjustment member 107 can fix wafers of different sizes to be dried, and at the same time prevent the wafers from falling off and being damaged during the drying process.
[0038] In the above embodiment, in order to fix chips of different sizes, a plurality of blocks 110 are provided on the inner wall of the arc groove 106 along the curvature direction of the arc groove 106, and the end of the adjusting member 107 away from the spring 108 abuts against any block 110. The deformation curvature of the adjusting member 107 can be adjusted by the abutment between the adjusting member 107 and different blocks 110 until it matches a chip of a specific size, thereby achieving stable clamping of the chip.
[0039] In some embodiments, the adjustment component also includes a limiting column 111 disposed at one end of the arc groove 106, and the spring 108 is sleeved on the limiting column 111. The limiting column 111 is used to limit the spring 108 in the vertical direction to prevent the spring 108 from popping out of the arc groove 106 under the squeezing of the adjustment member 107 and affecting the fixation of the chip. The limiting column 111 can limit the force of the spring 108 to always be given to the adjustment member 107 to ensure that the adjustment member 107 does not dislocate when it abuts against the block 110, thereby achieving stable clamping of the chip.
[0040] In some embodiments, the chip spin drying tray also includes a baffle 109, which covers one end of the arc groove 106 where a limiting column 111 is provided, and is used to cover the limiting column 111, and can further limit the spring 108 to prevent the spring 108 from popping out and damaging the chip after the limiting column 111 is damaged.
[0041] In summary, the embodiment of the utility model provides a wafer drying tray, which is provided with a flange 102 on the upper surface of the tray body 101 along the edge of the tray body 101, so that the flange 102 can enclose a concave wafer placement area 103 on the upper surface of the tray body 101, and the wafer to be dried is placed in the concave wafer placement area 103, and the wafer to be dried is fixed by an adjustment component. When the driving mechanism drives the wafer drying tray 100 to rotate, since the wafer placement area is a concave structure, the bottom of the wafer is not in direct contact with the tray body 101, which is conducive to the water being thrown out from the drainage hole 105 under the action of centrifugal force. The wafer drying tray 100 has a simple structure and good stability, and uses centrifugal force to dry the water on the wafer, with high drying efficiency, and no manual operation is required, which can effectively avoid employee injuries, thereby achieving the purpose of reducing costs.
[0042] The above is only a preferred embodiment of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the utility model, and these improvements and substitutions should also be regarded as the protection scope of the utility model. The above shows and describes the basic principles, main features and advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above preferred embodiments. The embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, so it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims in the utility model.
[0043] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A wafer drying tray, characterized in that: include: A tray body, wherein the upper surface of the tray body is provided with a flange along the edge of the tray body, the flange forms a concave wafer placement area on the upper surface of the tray body, a plurality of drainage holes are provided between the tray body and the flange, and arc grooves are symmetrically provided in the concave wafer placement area; as well as The adjusting component is arranged in the arc groove and is used for adjusting according to the size of the wafer to achieve clamping and fixing of wafers of different sizes.
2. A wafer drying tray according to claim 1, characterized in that: The adjustment component comprises: an adjusting member, the adjusting member being an elastic member and being disposed in the arc groove; and A spring is arranged at one end of the arc groove, and one end of the spring is in contact with the adjusting member.
3. A wafer drying tray according to claim 2, characterized in that: The adjustment component also includes a limiting column arranged at one end of the arc groove, and the spring is sleeved on the limiting column.
4. A wafer drying tray according to claim 3, characterized in that: A plurality of blocks are arranged on the inner wall of the arc groove along the arc direction of the arc groove, and one end of the adjusting member away from the spring abuts against any of the blocks.
5. A wafer drying tray according to claim 4, characterized in that: It also includes a baffle plate, which covers one end of the arc groove where a limiting column is provided.
6. The wafer drying tray according to claim 1, characterized in that: The concave wafer placement area is a concave spherical surface area.
7. The wafer drying tray according to claim 1, characterized in that: The concave wafer placement area is a concave cone area, and its taper θ satisfies: 1°≤θ≤10°.
8. The wafer drying tray according to claim 1, characterized in that: The tray body is a disc structure, and a plurality of drainage holes are arranged at intervals around the circumference of the tray body.
9. The wafer drying tray according to claim 1, characterized in that: The tray body and the flange are an integrally formed structure.
10. The wafer drying tray according to claim 1, characterized in that: The flange is provided with a slot for a robot to enter.