Radio frequency device

Abstract

The utility model discloses a radio frequency device, comprising a packaging structure packaged with an IC bare chip, the surface of the packaging structure is provided with a plurality of first welding spots, and the plurality of first welding spots are arranged to form a first signal channel extending along the surface of the packaging structure; the surface of the packaging structure is also provided with at least one second welding spot, and the second welding spot is located in the first signal channel. And the second welding spot is connected with the IC bare chip and is used for transmitting a signal into the first signal channel.

Description

Technical Field

[0001] This article relates to radio frequency communication technology, and more particularly to a radio frequency device. Background Art

[0002] With the development of autonomous driving technology, 4D millimeter wave imaging radar has become a future development trend. Its core feature is high resolution, which puts higher requirements on the system's chip cascading, antenna array, waveform design, and super-resolution algorithms. Generally speaking, increasing the antenna aperture can effectively improve the radar's angular resolution, which will also increase the antenna feeder length, which means that under the traditional radar implementation method, the link loss increases, which will shorten the radar detection distance.

[0003] For electromagnetic waves, the transmission loss is mainly composed of metal loss, radiation loss and dielectric loss. Radiation loss can be effectively reduced through careful design of the transmission link. Metal loss is related to the skin depth of electromagnetic wave transmission. Dielectric loss is related to the inherent characteristics of the dielectric material through which the electromagnetic field is transmitted. Therefore, common radars currently use high-frequency materials with low dielectric loss as millimeter wave transmission plates, which also brings expensive prices.

[0004] When the current feeder length of 4D radar is increased significantly, even if expensive high-frequency panels are used, the transmission loss is still a high value, and the deterioration of radar performance is still very large. Therefore, how to effectively reduce the link loss of the radar becomes an urgent problem that needs to be solved. Utility Model Content

[0005] An embodiment of the present application provides a radio frequency device.

[0006] A radio frequency device includes a packaging structure encapsulating an IC bare chip, a plurality of first solder joints are arranged on the surface of the packaging structure, and the plurality of first solder joints are arranged to form a first signal channel extending along the surface of the packaging structure; at least one second solder joint is also arranged on the surface of the packaging structure, and the second solder joint is located in the first signal channel; the second solder joint is connected to the IC bare chip and is used to transmit the signal to the first signal channel.

[0007] Exemplarily, the radio frequency device further includes a PCB board, wherein the packaging structure is mounted on the PCB board via the first solder joint.

[0008] Exemplarily, the first signal channel formed by the first welding point has two ends in the signal transmission direction, namely a first end and a second end. The first end is surrounded by a first welding point for blocking the signal, and the second end is not surrounded by the first welding point as a signal output end.

[0009] Exemplarily, a gap is left between the second welding point and the first end, so that the signal passes through the second welding point and enters the first signal channel and then is transmitted to the second end.

[0010] Exemplarily, the radio frequency device further includes an external metal structure, wherein the external metal structure has a second signal channel therein, and wherein the second signal channel is connected to the first signal channel.

[0011] Exemplarily, the first signal channel surrounded by the first welding points has two ends in the signal transmission direction, namely a first end and a second end, and the first end and the second end are both surrounded by a first welding point;

[0012] The PCB board is provided with a waveguide hole, and one end of the waveguide hole is located in and connected with the first signal channel.

[0013] Exemplarily, a gap is left between the second welding point and the first end, and one end of the waveguide hole is located between the second welding point and the second end.

[0014] A radio frequency device comprises a packaging structure encapsulating an IC bare chip, a plurality of first solder joints are arranged on a surface of the packaging structure, and the plurality of first solder joints are arranged to form a first signal channel extending along the surface of the packaging structure;

[0015] An external signal channel is arranged on the side of the packaging structure, an isolation channel is arranged in the packaging structure on one side close to the external signal channel, the lower end of the isolation channel is connected to the first signal channel, and the isolation channel, the first signal channel and the external signal channel together constitute a complete longitudinally extending signal channel;

[0016] The package structure is also provided with a conductive structure, one end of which is connected to the IC bare chip, and the other end of which extends into the longitudinally extending signal channel. Exemplarily, the conductive structure is a partial structure in the metal layer of the package structure.

[0017] Exemplarily, the radio frequency device further includes a PCB board, wherein the packaging structure is mounted on the PCB board.

[0018] Exemplarily, the radio frequency device also includes an external metal structure, wherein the external metal structure has a hollow structure therein, wherein the hollow structure constitutes the external signal channel, and the hollow structure is open on one side facing the packaging structure and is connected to the isolation channel in the packaging structure.

[0019] Exemplarily, the isolation channel includes a first isolation unit and a second isolation unit, wherein:

[0020] The first isolation unit is a metal structure perpendicular to the surface of the PCB, one end of which is connected to each first solder joint, and the other end of which is connected to one end of the second isolation unit;

[0021] The second isolation unit is a metal structure parallel to the surface of the PCB, and the other end of the second isolation unit is located at a side of the packaging structure.

[0022] Exemplarily, the first isolation unit is a metallized through hole in the packaging structure;

[0023] The second isolation unit is a metal structure formed by a portion of metal in the metal layer in the packaging structure.

[0024] Exemplarily, the first signal channel is surrounded by the first welding point, wherein the two ends of the signal transmission channel in the signal transmission direction are respectively a first end and a second end, the first end is surrounded by a first welding point for blocking the signal, and the second end is not provided with the first welding point as a signal output end.

[0025] Exemplarily, the first signal channel further has a communication end arranged between the first end and the second end;

[0026] The external signal channel is a signal channel perpendicular to the PCB surface, wherein the two ends of the signal transmission direction of the external signal channel are respectively a third end and a fourth end, wherein the third end is surrounded by a metal structure for blocking the signal, and the fourth end is connected to the connecting end.

[0027] Exemplarily, the external signal channel is a signal channel extending along the surface of the PCB, wherein the two ends of the signal transmission direction of the external signal channel are respectively a third end and a fourth end, wherein the third end is surrounded by a metal structure for blocking the signal, and the fourth end is connected to the connecting end.

[0028] In the embodiment of the present application, based on the original structure of the packaging structure, a first signal channel is formed by a plurality of first solder joints, so as to realize the purpose of realizing the electromagnetic wave transmission structure by using the solder joints of the packaging structure. In addition, based on the characteristics of the interval arrangement of the solder joints, the electromagnetic wave transmission structure uses the air medium for signal transmission, thereby reducing the transmission loss of the signal. In addition, by multiplexing the solder joints and appropriately reducing the number of solder joints to form the transmission space of the first signal channel, the electromagnetic wave transmission structure is realized without adding any hardware structure, and the hardware cost is low.

[0029] In addition, the second solder joint Q2 located in the first signal channel, or the conductive structure and the external signal channel are used as a transfer medium for signal transmission between the bare chip and the first signal channel to realize electromagnetic wave transmission.

[0030] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by implementing the present application. Other advantages of the present application can be realized and obtained by the schemes described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0032] Figure 1 A schematic diagram of the structure of a radio frequency device provided in an embodiment of the present application;

[0033] Figure 2 A schematic diagram of a first deployment of welding points provided in an embodiment of the present application;

[0034] Figure 3A for Figure 2 A schematic diagram of the structure of the radio frequency device in the solder joint deployment mode shown;

[0035] Figure 3B for Figure 3A for Figure 2 Another schematic diagram of the structure of the radio frequency device in the solder joint deployment mode shown;

[0036] Figure 3C for Figure 3A and Figure 3B Schematic diagram of the distribution of solder joints in the first signal channel of the structure shown.

[0037] Figure 3D for Figure 3A and Figure 3B Another schematic diagram of the distribution of solder joints in the first signal channel of the structure shown;

[0038] Figure 4 A second deployment diagram of welding points provided in an embodiment of the present application;

[0039] Figure 5 for Figure 4 A schematic diagram of the structure of the radio frequency device in the solder joint deployment mode shown;

[0040] Figure 6 for Figure 1 A schematic diagram of the structure of the packaging structure in the radio frequency device shown;

[0041] Figure 7 A schematic diagram of the structure of another radio frequency device provided in an embodiment of the present application;

[0042] Fig. 8A A schematic diagram of a third deployment of welding points provided in an embodiment of the present application;

[0043] Figure 8B for Fig. 8A A schematic diagram of the distribution of solder joints in the first signal channel of the structure shown;

[0044] Fig. 9 for Figure 7 Another structural schematic diagram of the radio frequency device shown;

[0045] Fig.10 for Fig. 9 Schematic diagram of the structure of the isolation channel in the radio frequency device shown. DETAILED DESCRIPTION

[0046] The present application describes multiple embodiments, but the description is exemplary rather than restrictive, and it is apparent to those of ordinary skill in the art that there may be more embodiments and implementations within the scope of the embodiments described in the present application. Although many possible feature combinations are shown in the drawings and discussed in the specific embodiments, many other combinations of the disclosed features are also possible. Unless specifically limited, any feature or element of any embodiment may be used in combination with any other feature or element in any other embodiment, or may replace any other feature or element in any other embodiment.

[0047] The present application includes and contemplates combinations of features and elements known to those of ordinary skill in the art. The embodiments, features and elements disclosed in the present application may also be combined with any conventional features or elements to form a unique scheme. Any features or elements of any embodiment may also be combined with features or elements from other schemes to form another unique scheme. Therefore, it should be understood that any feature shown and / or discussed in the present application may be realized individually or in any appropriate combination. Therefore, except for the limitations made according to the attached claims and their equivalents, the embodiments are not subject to other restrictions. In addition, various modifications and changes may be made within the scope of protection of the attached claims.

[0048] In addition, when describing representative embodiments, the specification may have presented the method and / or process as a specific sequence of steps. However, to the extent that the method or process does not rely on the specific order of the steps described herein, the method or process should not be limited to the steps of the specific order described. As will be understood by those of ordinary skill in the art, other sequences of steps are also possible. Therefore, the specific sequence of the steps set forth in the specification should not be interpreted as a limitation to the claims. In addition, the claims for the method and / or process should not be limited to the steps of performing them in the order written, and those skilled in the art can easily understand that these sequences can be changed and still remain within the spirit and scope of the embodiments of the present application.

[0049] Figure 1 FIG. 1 is a schematic diagram of a radio frequency device 1000 provided in an embodiment of the present application. Figure 1 As shown, the radio frequency device 1000 includes a PCB board 100 and a packaging structure 200 encapsulating an IC bare chip 21 , or the radio frequency device only includes the packaging structure 200 but does not include the PCB board 100 .

[0050] In practical applications, the packaging structure 200 is mounted on the PCB board 100. The packaging structure 200 may also include an encapsulation material, a redistribution layer, and a plurality of solder joints.

[0051] exist Figure 1 In the structure shown, the package structure 200 is electrically and mechanically connected to the PCB board 100 through solder joints. Here, the lower surface of the package structure 200 faces the PCB board 100, and specifically extends parallel to the surface of the PCB board 100.

[0052] The IC die 21 may include a monolithic integrated microwave circuit (MMIC, Monolithic Microwave Integrated Circuit). The IC die 21 may operate in different frequency ranges. For example, the IC die 21 may operate in a radio frequency range or a microwave frequency range that may generally be about 10 GHz to about 300 GHz. Therefore, the circuit integrated in the IC die 21 may operate in a frequency range greater than about 10 GHz. Such a microwave circuit may include, for example, a microwave transmitter, a microwave receiver, a microwave transceiver, a microwave sensor, or a microwave detector. The radio frequency device 1000 described herein may be used for radar, and in radar applications, the radio frequency device 1000 may modulate the frequency of a radio frequency signal. Among them, the radio frequency signal output by the radio frequency device 1000 in the radar may be used for target detection or distance measurement operations in automotive applications or industrial applications. For example, an automatic cruise control system or a vehicle collision avoidance system may operate in a microwave frequency range, for example, in a frequency band of 76 GHz to 77 GHz and a frequency band of 77 GHz to 81 GHz.

[0053] The IC die 21 may be at least partially embedded in an encapsulation material. For example, the side of the IC die 21 may be covered by an encapsulation material. In another example, additionally, the upper side of the IC die 21 may be at least partially covered by an encapsulation material. The IC die 21 may be protected from external influences such as moisture, leakage current, or mechanical shock by the encapsulation material. The encapsulation material may include, for example, at least one of a molding compound, a laminate, an epoxy, a filled epoxy, a glass fiber filled epoxy, an imide, a thermoplastic, a thermosetting polymer, and a polymer mixture.

[0054] Among them, the redistribution layer of the package structure 200 may include a metal layer or a conductor trace formed on the metal layer, and these conductor traces may extend substantially parallel to the surface of the package structure 200. A plurality of dielectric layers may be arranged between the plurality of conductor traces to electrically insulate the conductor traces from each other. In addition, the metal layers arranged on different planes may be electrically connected to each other, for example, through a plurality of through holes (vias). The conductor traces of the redistribution layer may realize the function of redistribution or rewiring so as to electrically couple the connection terminals of the IC die 21 to the solder joints.

[0055] The solder joints in the package structure 200 may be made of copper or copper alloy or tin (alloy) or other metals, and the solder joints may be specifically solder balls or needles, etc., which are not limited here. Figure 1 The structure shown shows five welding spots by way of example, but the number of welding spots may be different, for example, the number may be more than five.

[0056] It should be noted that a portion of the solder joints in the packaging structure 200 facing the PCB board 100 can be used as a signal transmission medium for transmitting signals between the PCB board 100 and the packaging structure 200; another portion serves as an isolation unit for blocking signals, and is usually arranged around the solder joints that serve as signal transmission media.

[0057] Different from the application method of the above-mentioned solder joints, in the embodiment of the present application, an electromagnetic wave transmission structure is constructed by using solder joints arranged between the packaging structure 200 and the PCB board 100, and the electromagnetic wave transmission structure uses air as the transmission medium. Since the air medium has the lowest known dielectric loss, the electromagnetic wave transmission structure using air as the transmission medium can effectively reduce the transmission loss of the antenna feeder, which has obvious benefits for improving the overall performance of the radar.

[0058] Since solder joints are provided between the package structure 200 and the PCB board 100, it may be required by the package method. For example, in the BGA (Ball Grid Array) package, the I / O terminals of the package method are distributed in the form of circular or columnar solder joints in an array on the side of the package structure 200 facing the PCB board 100. Generally, the BGA pitch is 0.3mm to 0.8mm; such a size and pitch provide the possibility for it to form an electromagnetic wave transmission structure.

[0059] Specifically, the side of the package structure 200 facing the PCB board 100, the side of the PCB board 100 facing the package structure 200, and the BGA arranged in an array can constitute an electromagnetic wave transmission structure. The gap after BGA welding is usually not filled with a dielectric. At this time, such a structure can be equivalent to an air medium SIW (Substrate Integrated Waveguide). Since it is based on air filling, its transmission loss can be very small.

[0060] In addition to the BGA packaging method, other methods that require solder joints to be provided between the packaging structure 200 and the PCB board 100 are applicable to the present application and will not be described in detail here.

[0061] Based on the above principles, Figure 1 In the structure shown, the solder joints in the package structure 200 facing the PCB board 100 include a plurality of first solder joints Q1 and at least one second solder joint Q2; wherein:

[0062] A plurality of first solder joints Q1 are connected to the PCB board 100, and the first solder joints Q1 are arranged to form a first signal channel S1 extending laterally along the surface of the PCB;

[0063] At least one second soldering point Q2 is located in the first signal channel S1 , and the second soldering point Q2 is connected to the IC bare chip 21 for transmitting a signal into the first signal channel S1 .

[0064] exist Figure 1 In the structure shown, based on the array arrangement of the solder joints, a reserved area can be deployed in the array arrangement area of ​​the solder joints, and at least one solder joint is reserved in the reserved area as the second solder joint Q2, that is, the solder joint connected to the IC bare chip 21. The second solder joint Q2 connected to the IC bare chip 21 is used to receive a signal from the IC bare chip 21, and the received signal is transmitted to the transmission space.

[0065] Furthermore, a group of solder joints, i.e., a group of first solder joints Q1, are arranged around the second solder joint Q2, wherein the first solder joints Q1 can prevent the second solder joints Q2 from blocking the signal of the IC die 21 from leaking to other spaces. The package structure 200, the plurality of first solder joints Q1 surrounding the second solder joint Q2, and the PCB board 100 form a semi-enclosed transmission space as an electromagnetic wave transmission structure, wherein the semi-enclosed transmission space is relative to the enclosed space, i.e., the unenclosed area in the semi-enclosed transmission space can provide a transmission outlet for the signal transmitted by the second solder joint Q2.

[0066] from Figure 1It can be seen from the structure shown that the electromagnetic wave transmission structure is realized by using the solder joints of the packaging structure 200. On the basis of the original structure of the packaging structure 200, the array arrangement of the solder joints is optimized, and a first signal channel S1 is formed by a plurality of first solder joints Q1. The second solder joint Q2 located in the first signal channel S1 is used as a transfer medium for signal transmission between the bare chip and the first signal channel S1 to realize the electromagnetic wave transmission structure. In addition, based on the characteristics of the interval arrangement of the solder joints, the electromagnetic wave transmission structure uses the air medium for signal transmission, which reduces the transmission loss of the signal. In addition, by multiplexing the solder joints and appropriately reducing the number of solder joints to form the transmission space of the first signal channel S1, the electromagnetic wave transmission structure is realized without adding any hardware structure, and the hardware cost is low.

[0067] In an implementation of the first signal channel S1, a semi-enclosed transmission space may be realized by a plurality of first solder joints Q1, that is, there is at least one area around the second solder joint Q2 without shielding, thereby realizing a signal transmission operation.

[0068] Specifically, there may be at least one area around the second welding point Q2 where the first welding point Q1 is not provided, and the side where the first welding point Q1 is not provided is used as the signal output end of the first signal channel S1.

[0069] Figure 2 This is a schematic diagram of the first deployment of solder joints provided in an embodiment of the present application. Figure 2 As shown, the transmission space formed by the multiple first solder joints Q1 is the first signal channel S1. It can be seen from the extension direction of the first signal channel S1 that the two ends of the signal transmission direction of the first signal channel S1 are respectively the first end S11 and the second end S12, wherein the first end S11 is provided with the first solder joint Q1 for blocking the signal, so the signal cannot be output through the first end S11; and the second end S12 is not provided with the first solder joint Q1 for blocking the signal, so the signal can be output through the second end S12, and the second end S12 can be used as the signal output end of the first signal channel S1.

[0070] Due to the shielding of the package structure 200 and the PCB, the signal of the second solder joint Q2 can only be transmitted in the transmission space between the package structure 200 and the PCB board 100 along the horizontal direction of the surface of the PCB board 100. Furthermore, since the second end S12 of the first signal channel S1 formed by the plurality of first solder joints Q1 is not provided with the first solder joint Q1, the signal received by the second solder joint Q2 from the IC bare die 21 can only be transmitted between the package structure 200 and the PCB board 100 to the second end S12 in the first signal channel S1.

[0071] Combination Figure 1 and Figure 2As can be seen from the structure shown, based on the structural characteristics of the radio frequency structure and the arrangement of the solder joints, an electromagnetic wave transmission structure can be constructed between the packaging structure 200 and the PCB board 100 using the solder joints.

[0072] exist Figure 2 In the structure shown, the first signal channel S1 is a waveguide feeding method, the second welding point Q2 serves as a feeding point in the first signal channel S1, and the first end S11 serves as a short-circuit end for blocking the signal. Based on the working characteristics of the waveguide feeding method, the distance between the feeding point and the short-circuit end is approximately one-quarter of the wavelength. Therefore, a gap is left between the second welding point Q2 and the first end S11, so that the signal entering the first signal channel S1 through the second welding point Q2 can be transmitted normally.

[0073] Based on the above description, it can be known that the first signal channel S1 constructed by using solder joints can realize normal transmission of the signal of the IC bare chip 21 between the packaging structure 200 and the PCB board 100, and provides a new electromagnetic wave transmission structure.

[0074] In order to fully utilize the signal in the first signal channel S1 and effectively control the signal to be transmitted to the desired transmission angle, another signal channel can be set to be connected to the first signal channel S1 to guide the signal in the first signal channel S1 to the desired transmission angle. In this embodiment of the present application, the second signal channel S2 is connected to the first signal channel S1.

[0075] Figure 3A for Figure 2 The schematic diagram of the structure of the radio frequency device 1000 in the solder joint deployment mode is shown in FIG. Figure 3A As shown, the radio frequency device 1000 further includes an external metal structure W, wherein the external metal structure W has a second signal channel S2 therein.

[0076] The external metal structure W refers to the external structure of the package structure 200. The external metal structure W can be installed in the PCB board 100. For example, it can be mechanically connected to the PCB board 100 by means of appropriate connection technology. For example, the connection technology can include at least one of bonding, screw fastening, riveting, welding or soldering.

[0077] By using the devices deployed on the PCB board 100, a structure with metal transmission characteristics is selected to implement the second signal channel S2, extend the transmission distance of the electromagnetic wave transmission structure, and guide the signal in the first signal channel S1 to be transmitted to the required transmission angle.

[0078] Exemplarily, the external metal structure W can be an electrical component, such as a functional component that transmits signals with the PCB board 100, or a functional component that transmits signals with the IC die 21, or a functional component that transmits signals with other components installed in the PCB board 100 except the IC die 21.

[0079] Exemplarily, the external metal structure W may be a metal piece without any circuit function.

[0080] The second signal channel S2 can be manufactured by a subtractive process, for example, by at least one of milling, grinding, drilling or stamping the external metal structure W. Alternatively, the second signal channel S2 can be manufactured by an additive process, for example, by at least one of injection molding or 3D printing on the external metal structure W. In one example, the second signal channel S2 can be a metal tube. The metal tube can be made of metal or a metal alloy, for example, copper and / or brass. In another example, the second signal channel S2 can be made of plastic, ceramic material and / or dielectric material, and can have a metallized inner wall. In particular, it can be formed of an injection-molded plastic having a metallized inner wall. Here, the material of the injection-molded plastic can be at least one of the materials mentioned above for the encapsulating material.

[0081] from Figure 3A From the structure, it can be seen that a part of the second signal channel S2 is a channel horizontal to the surface of the PCB board, which realizes the connection with the first signal channel S1, and the other channel is a channel perpendicular to the surface of the PCB board 100, so that the signal of the IC bare chip 21 transmitted by the second signal channel S2 is away from the PCB board 100, providing a new option for the signal transmission direction.

[0082] See also Figure 3A The structure shown, the electromagnetic wave transmission structure is composed of a first signal channel S1 and a second signal channel S2, wherein:

[0083] The second solder joint Q2 in the first signal channel S1 is disposed adjacent to the edge of the package structure 200, and at least one row of solder joints adjacent to the second solder joint Q2 are all used as first solder joints Q1. The first end S11 of the first signal channel S1 is provided with the first solder joint Q1, and the second end S12 is not provided with the first solder joint Q1, therefore, the signal output end in the first signal transmission end is the second end S12.

[0084] The second signal channel S2 is perpendicular to the PCB board 100, wherein one end S21 of the second signal channel S2 is connected to the second end S12, and is used to receive the signal of the IC bare chip 21 output by the second end S12, and the other end S22 of the second signal channel S2 serves as the signal output end of the second signal channel S2, and the signal output end can be directly or indirectly connected to an antenna or other electrical devices.

[0085] From the extension direction of the second signal channel S2, it can be seen that the signal output angle of the second signal channel S2 is perpendicular to the PCB board 100 and away from the PCB board 100, which provides a new signal transmission angle compared with the signal transmission along the surface of the PCB board 100 in the first signal channel S1.

[0086] Figure 3B for Figure 2 Another structural schematic diagram of the RF device 1000 in the solder joint deployment mode is shown. Figure 3B As shown, Figure 3B The structure shown is Figure 3A The structures shown are different in that the extension direction of the second signal channel S2 is different.

[0087] Specifically, the second signal channel S2 is horizontally arranged along the surface of the PCB board 100, wherein one end S21 of the second signal channel S2 is connected to the second end S12 for receiving the signal of the IC bare chip 21 output by the second end S12, and the other end S22 of the second signal channel S2 serves as the signal output end of the second signal channel S2.

[0088] It can be seen from the extension direction of the second signal channel S2 that the signal output angle of the second signal channel S2 is horizontal transmission along the surface of the PCB board 100, which extends the transmission distance of the electromagnetic wave transmission structure.

[0089] exist Figure 3A and Figure 3B In the structure shown, the second solder joint Q2 is disposed adjacent to the edge of the package structure 200 , which can shorten the transmission distance of the signal in the first signal channel S1 , thereby effectively reducing the package area.

[0090] exist Figure 3A and Figure 3B In the structure shown, the electromagnetic wave transmission structure in the external metal structure W arranged adjacent to the packaging structure 200 is used as the second signal channel S2. By taking advantage of the positional advantage of the external metal structure W being adjacent to the packaging structure 200, the packaging area can be further reduced and the packaging cost can be reduced.

[0091] exist Figure 3A and Figure 3BIn the structure shown, the second solder joint Q2 can be disposed adjacent to the edge of the package structure 200, so that the first signal channel S1 can naturally form a semi-enclosed transmission space by means of the edge of the package structure 200. Figure 3C and Figure 3D shown.

[0092] Specifically, since the right side of the second solder joint Q2 is adjacent to the edge of the packaging structure 200, the right side of the second solder joint Q2 serves as the signal output end of the first signal channel S1. Therefore, there is no need to set any solder joints, and only space needs to be reserved for the left side of the second solder joint Q2. This reduces the packaging size of the first signal channel S1 in the X-axis direction of the packaging structure 200, thereby effectively reducing the packaging area occupied by the first signal channel S1 in the packaging structure 200.

[0093] in, Figure 3C and Figure 3D There are differences in the deployment of the first solder joint Q1 in the structures shown, where Figure 3C The first solder joints Q1 surrounding the second solder joints Q2 are arranged in an array, and Figure 3D The first solder joint Q1 surrounding the second solder joint Q2 is arranged along an arc. Both arrangements can form the first signal channel S1. The difference is that the number of solder joints used is different. Figure 3C The number of solder joints used is greater than Figure 3D The number of solder joints used.

[0094] In another implementation of the first signal channel S1 , the semi-enclosed transmission space may be realized by a PCB board 100 provided with a signal output terminal.

[0095] Figure 4 This is a schematic diagram of the second deployment of the welding points provided in the embodiment of the present application. Figure 4 As shown, the transmission space formed by the plurality of first solder joints Q1 is the first signal channel S1. Along the extension direction of the first signal channel S1, it can be seen that the first end S11 and the second end S12 are both provided with first solder joints Q1 for blocking signals, so that the signal cannot be output through the first end S11 and the second end S12.

[0096] A waveguide hole K is provided on the PCB board 100 , wherein one end of the waveguide hole K is located in and connected with the first signal channel S1 , so that the signal in the first signal channel S1 uses the waveguide hole K as a signal output end.

[0097] The waveguide hole K may be a metal tube, which may be made of metal or metal alloy, such as copper and / or brass. The waveguide hole K may be made of plastic, ceramic material and / or dielectric material, and may have a metallized inner wall.

[0098] Based on the signal transmission characteristics of the waveguide hole K, the signal of the first signal channel S1 can continue to be transmitted through the PCB board 100 using the waveguide hole K, thereby realizing an electromagnetic wave transmission structure.

[0099] A gap is left between the second soldering point Q2 and the first end S11 , and one end of the waveguide hole K is located between the second soldering point Q2 and the second end S12 .

[0100] Since the first signal channel S1 is a waveguide feeding method, the second welding point Q2 serves as a feeding point in the first signal channel S1, and the first end S11 serves as a short-circuit end that blocks the signal. Based on the working characteristics of the waveguide feeding method, the distance between the feeding point and the short-circuit end is approximately one-quarter of the wavelength. Therefore, a gap is left between the second welding point Q2 and the first end S11, so that the signal entering the first signal channel S1 through the second welding point Q2 is not transmitted to the first end S11.

[0101] After the signal passes through the second solder joint Q2 and reaches the first signal channel S1, it bounces back through the first end S11 and is transmitted in the reverse direction to the second end S12. When passing through the waveguide hole K, it is directly transmitted.

[0102] By controlling the signal entering the first signal channel S1 through the second solder joint Q2 to neither be transmitted to the first end S11 nor to the second end S12, the signal entering the first signal channel S1 through the second solder joint Q2 can only be transmitted through the waveguide hole K located in the first signal channel S1.

[0103] Based on the structural features of the two ends of the first signal channel S1, by locating one end of the waveguide hole K of the PCB board 100 between the second solder joint Q2 and the second end S12, the signal in the first signal channel S1 is guided to the waveguide hole K for transmission, thereby improving the signal quality and signal strength.

[0104] Figure 5 for Figure 4 The schematic diagram of the structure of the radio frequency device 1000 in the solder joint deployment mode is shown in FIG. Figure 5 As shown, the electromagnetic wave transmission structure is composed of a first signal channel S1 and a waveguide hole K, wherein:

[0105] The second solder joint Q2 in the first signal channel S1 is electrically connected to the IC bare chip 21; the first end S11 and the second end S12 of the first signal channel S1 are both provided with the first solder joint Q1. Figure 5 In the structure shown, at least three rows of welding points adjacent to the second welding points Q2 are all used as the first welding points Q1.

[0106] The waveguide hole K vertically penetrates the PCB board 100, so that one end K1 of the waveguide hole K is located on the surface of the PCB board 100 adjacent to the packaging structure 200 and in the first signal channel S1, and the other end K2 is located on the surface of the PCB board 100 away from the packaging structure 200.

[0107] The signal of the IC bare chip 21 is transmitted to the first signal channel S1 through the second solder joint Q2 , passes through the PCB board 100 through one end of the waveguide hole K, and continues to be transmitted through the other end K2 of the waveguide hole K.

[0108] It can be seen from the setting position of the waveguide hole K that the signal output angle is toward one side of the PCB board 100 , which provides a new signal transmission angle compared with the first signal channel S1 being transmitted along the surface of the PCB board 100 .

[0109] exist Figure 5 In the structure shown, the second solder joint Q2 is arranged away from the edge of the packaging structure 200, which can provide sufficient deployment space for the first solder joint Q1 deployed at the first end S11 and the second end S12 of the first signal channel S1, and can also effectively shorten the transmission distance of the signal in the first signal channel S1, thereby effectively reducing signal loss. The waveguide hole K of the PCB board 100 is used as the signal output end to realize the signal transmission operation, which is simple to implement and has low operating cost.

[0110] Figure 6 for Figure 1 The schematic diagram of the structure of the packaging structure 200 in the radio frequency device 1000 is shown. Figure 6 As shown, the package structure 200 also includes a conductive unit, wherein the second solder joint Q2 can be connected to the IC bare chip 21 through the conductive unit, and the conductive unit can be vertically arranged between the IC bare chip 21 and the conductive unit. The electrical connection between the IC bare chip 21 and the second solder joint Q2 is achieved by utilizing the conductive property of the conductive unit. The conductive unit can be a metallized via, and the metal can be made of copper.

[0111] Figure 7 FIG. 1 is a schematic diagram of the structure of another radio frequency device 1000 provided in an embodiment of the present application. Figure 7 As shown, the radio frequency device 1000 includes a PCB board 100 and a packaging structure 200 encapsulating an IC bare chip 21; wherein the packaging structure 200 is mounted on the PCB board 100. The packaging structure 200 may also have an encapsulation material, a redistribution layer, and a plurality of solder joints.

[0112] Figure 7 and Figure 1The RF device 1000 shown is similar to the one shown in the figure, except that a conductive structure and an external signal channel S are provided on the side of the packaging structure 200 to realize lateral signal transmission of the packaging structure, and a signal channel for lateral signal transmission is realized by using a solder joint.

[0113] Specifically, Figure 7 In the structure shown, a plurality of first solder joints Q1 are arranged on a surface of the packaging structure 200 facing the PCB board 100, the packaging structure 200 is mounted on the PCB board 100, the first solder joints Q1 are connected to the PCB board 100, and the plurality of first solder joints Q1 are arranged to form a first signal channel S1 extending laterally along the PCB surface.

[0114] One end of the conductive structure 23 is connected to the IC bare chip 21 , and the other end is located in the external signal channel S3 , wherein the external signal channel S3 is also connected to the first signal channel S1 to form a signal transmission channel.

[0115] The IC bare chip 21 can output the signal to the external signal channel S3 through the conductive structure. Since the external signal channel S3 is connected to the first signal channel S1, the signal in the external signal channel S3 can be transmitted to the first signal channel S1, thereby realizing the normal transmission of the signal of the IC bare chip 21 in the first signal channel S1.

[0116] Based on the above content, it can be known that the conductive structure, the external signal channel S3 and the first signal channel S1 together constitute an electromagnetic wave transmission structure.

[0117] The conductive structure 23 may be horizontally arranged along the surface of the packaging structure 200 , and the conductive property of the conductive structure 23 may be utilized to realize electrical connection between the IC die 21 and the external signal channel S3 .

[0118] Among them, the conductive structure can be manufactured by a subtractive process, for example, the metal part in the packaging structure 200 is manufactured by at least one of milling, grinding, drilling or stamping. Alternatively, the conductive structure can be manufactured by an additive process, for example, by at least one of injection molding or 3D printing. In one example, the conductive structure can be a metal wire. The metal wire can be made of metal or a metal alloy, for example, copper and / or brass. In another example, the conductive structure can be made of plastic, ceramic material and / or dielectric material, and can have a metallized inner wall. In particular, it can be formed by injection molded plastic with a metallized inner wall. Here, the material of the injection molded plastic can be at least one of the materials mentioned above for the encapsulation material.

[0119] In an exemplary embodiment, the conductive structure 23 may be implemented by using a partial structure of a metal layer in the package structure 200 .

[0120] Specifically, the package structure 200 has a redistribution layer, wherein the redistribution layer includes a metal layer and conductor traces formed on the metal layer, and the conductor traces may extend substantially parallel to the surface of the package structure 200. Signal interconnection between the IC die 21 and the external signal channel S3 may be achieved by selecting one or at least two conductor traces as the conductor structure.

[0121] By utilizing the metal structure of the packaging structure 200 , hardware costs can be saved and the structural design of the packaging structure 200 can be simplified.

[0122] In an exemplary embodiment, the external signal channel S3 can be manufactured by a subtractive process, for example, by at least one of milling, grinding, drilling or stamping the metal structure deployed on the PCB board 100. Alternatively, the external signal channel S3 can be manufactured by an additive process, for example, by at least one of injection molding or 3D printing. In one example, the external signal channel S3 may include a metal tube. The metal tube may be made of a metal or a metal alloy, for example, copper and / or brass. In another example, the external signal channel S3 may be made of plastic, ceramic material and / or dielectric material, and may have a metallized inner wall. In particular, it can be formed by injection molded plastic having a metallized inner wall. Here, the material of the injection molded plastic may be at least one of the materials mentioned above for the encapsulation material.

[0123] Since both the first signal channel S1 and the external signal channel S3 are used to transmit signals, as long as any part of the two signal channels is connected, the first signal channel S1 and the external signal channel S3 can be connected.

[0124] In addition, an isolation channel 24 is disposed inside the packaging structure 200 , and the isolation channel 24 is used to isolate the signal of the external signal channel S3 .

[0125] Specifically, an isolation channel 24 is arranged on one side of the packaging structure 200 close to the external signal channel S3, and the lower end of the isolation channel 24 is connected to the first signal channel S1. The isolation channel 24, the first signal channel S1 and the external signal channel S3 together constitute a complete longitudinally extended signal channel.

[0126] Based on the structure of the packaging structure 200, it can be known that since the packaging structure 200 has a dielectric layer, the signal of the external signal channel S3 may leak through the dielectric layer of the packaging structure 200. Therefore, by setting an isolation channel 24 to isolate the signal of the external channel S3, the risk of signal leakage can be effectively reduced to ensure the normal operation of the IC bare chip 21 in the packaging structure.

[0127] from Figure 7 It can be seen from the structure shown that, based on the original structure of the packaging structure 200, the array arrangement of the solder joints is optimized, and a first signal channel S1 is formed by a plurality of first solder joints Q1. Since the external signal channel S3 is connected to the first signal channel S1, a signal transmission channel is formed, and the conductive structure is used as a transfer medium for signal transmission between the bare chip and the external signal channel S3. The electromagnetic wave transmission structure is realized by using the conductive structure 23, the external signal channel S3 and the first signal channel S1. Based on the characteristics of the interval arrangement of the solder joints, at least the first signal channel S1 in the above-mentioned electromagnetic wave transmission structure can transmit signals through the air medium, thereby reducing the transmission loss of the signal. In addition, by reusing the solder joints and appropriately reducing the number of solder joints as the transmission space of the first signal channel S1, a partial transmission structure in the electromagnetic wave transmission structure is realized without adding any hardware structure, and the hardware cost is low. By setting an isolation channel 24 to isolate the signal of the external signal channel S3, the risk of signal leakage can be effectively reduced, and the normal operation of the IC bare chip 21 in the packaging structure can be ensured.

[0128] Fig. 8A This is a schematic diagram of the third deployment of the welding points provided in the embodiment of the present application. Fig. 8A As shown, the first signal channel S1 surrounded by the first welding point Q1 has two ends in the signal transmission direction, namely a first end S11 and a second end S12. The first end S11 is surrounded by a first welding point Q1 for blocking the signal, and the second end S12 is not provided with the first welding point Q1 as a signal output end.

[0129] exist Fig. 8A In the structure shown, since a plurality of first solder joints Q1 for blocking signals are arranged on both sides along the extension direction of the first signal channel S1, the two ends of the signal transmission direction of the first signal channel S1 can be determined. Since the first end S11 is provided with the first solder joint Q1 for blocking signals, it means that the signal cannot be output through the first end S11; and the second end S12 is not provided with the first solder joint Q1 for blocking signals, it means that the signal can be output through the second end S12, and therefore, the second end S12 can be used as the signal output end of the first signal channel S1.

[0130] Due to the shielding of the packaging structure 200 and the PCB, the signal of the first signal channel S1 can only be transmitted in the transmission space between the packaging structure 200 and the PCB board 100 along the horizontal direction of the surface of the PCB board 100. Furthermore, since the second end S12 of the first signal channel S1 formed by the plurality of first solder joints Q1 is not provided with the first solder joint Q1, the signal in the first signal channel S1 can only be transmitted between the packaging structure 200 and the PCB board 100 to the second end S12 in the first signal channel S1.

[0131] exist Fig. 8AIn the structure shown, a first signal channel can be formed adjacent to the edge of the packaging structure 200, so that the first signal channel S1 can naturally form a semi-enclosed transmission space by virtue of the edge position of the packaging structure 200. For details, see Figure 8B Since the first signal channel S1 is adjacent to the edge of the packaging structure 200 , the right side of the first signal channel S1 serves as the signal output end of the first signal channel S1 , so that the packaging size of the first signal channel S1 in the X-axis direction of the packaging structure 200 is reduced, thereby effectively reducing the packaging area occupied by the first signal channel S1 in the packaging structure 200 .

[0132] Among them, the external signal channel S3 is realized by the external metal structure W deployed on the PCB board 100.

[0133] The external metal structure W is an external structure of the package structure 200. The external metal structure W can be installed in the PCB board 100. For example, it can be mechanically connected to the PCB board 100 by means of an appropriate connection technology. For example, the connection technology may include at least one of bonding, screw fastening, riveting, welding or soldering.

[0134] Exemplarily, the external metal structure W can be an electrical component, such as a functional component that transmits signals with the PCB board 100, or a functional component that transmits signals with the IC die 21, or a functional component that transmits signals with other components installed in the PCB board 100 except the IC die 21.

[0135] Exemplarily, the external metal structure W may be a metal piece without any circuit function.

[0136] By utilizing the devices deployed on the PCB board 100 and selecting a structure with metal transmission characteristics to implement the external signal channel S3, a partial transmission channel of the electromagnetic wave transmission structure is constructed, and the hardware cost is low.

[0137] Specifically, the external metal structure W has a hollow structure. Since the hollow structure can provide a transmission space for the signal, the external signal channel S3 can be realized by using the hollow structure, which is simple and convenient to realize.

[0138] Fig. 9 for Figure 7 Another structural schematic diagram of the radio frequency device 1000 is shown. Fig. 9As shown, since a plurality of first solder joints Q1 for blocking signals are disposed on both sides along the extension direction of the first signal channel S1, the signal transmission direction of the first signal channel S1 can be determined. Since the first end S11 is provided with the first solder joint Q1 for blocking signals, it means that the signal cannot be output through the first end S11; and the second end S12 is not provided with the first solder joint Q1 for blocking signals, it means that the signal can be output through the second end S12, therefore, the second end S12 can be used as the signal output end of the first signal channel S1.

[0139] Further, in Fig. 9 In the structure shown, the first signal channel S1 further has a communication end S13 disposed between the first end S11 and the second end S12, and the communication end S13 is used to achieve communication between the first signal channel S1 and the external signal channel S3.

[0140] Among them, the external signal channel S3 is a signal channel perpendicular to the PCB surface, wherein the two ends of the signal transmission direction of the external signal channel S3 are respectively the third end S31 and the fourth end S32, wherein the third end S31 is surrounded by a metal structure for blocking the signal, and the fourth end S32 is connected to the connecting end S13.

[0141] Specifically, in the scenario where the conductive structure receives the signal of the IC bare chip 21, the third end S31 of the external signal channel S3 is surrounded by an external metal structure W for blocking the signal, and the fourth end S32 of the external signal channel S3 serves as the signal output end of the external signal channel S3. The conductive structure 23 transmits the received signal to the third end S31 of the external signal channel S3, and passes through the third end S31 of the external signal channel S3 to the connecting end S13 of the first signal channel S1, so that the signal enters the first signal channel S1.

[0142] Since the signal output end in the first signal channel S1 is the second end S12 of the first signal channel S1 , the signal is output through the second end S12 of the first signal channel S1 , thereby realizing the output operation of the signal in the electromagnetic wave transmission structure.

[0143] Fig.10 for Fig. 9 The structure diagram of the isolation channel 24 in the radio frequency device 1000 is shown. Fig.10 As shown, the isolation channel 24 includes a first isolation unit 241 and a second isolation unit 242 that are connected.

[0144] The first isolation unit 241 is used to isolate the signal from leaking in a direction away from the external signal channel S3.

[0145] Specifically, the first isolation unit 241 is a metal structure perpendicular to the surface of the PCB 100, one end of which is connected to each first solder joint Q1, and the other end of which is connected to one end of the second isolation unit 242;

[0146] The second isolation unit 242 is used to isolate the signal from leaking in a direction away from the first signal channel S1.

[0147] Specifically, the second isolation unit 242 is a metal structure parallel to the PCB surface, and the other end of the second isolation unit 242 is located on the side of the packaging structure 200 .

[0148] From the above content, it can be seen that by setting a metal structure in the direction of signal leakage, signal transmission is blocked, the signal isolation effect is achieved, and the possibility of signal leakage is reduced.

[0149] Furthermore, the first isolation unit 241 is a metallized through hole in the packaging structure 200 , which is simple to implement in the packaging structure 200 and has low cost.

[0150] Furthermore, the second isolation unit 242 is a metal structure formed by a part of the metal in the metal layer in the packaging structure 200. By reusing the metal layer in the packaging structure 200, the signal isolation effect is achieved with low cost.

[0151] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0152] In addition, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include at least one of the features.

[0153] In the description of the present application, “plurality” means at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0154] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0155] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0156] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0157] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A radio frequency device, comprising a packaging structure encapsulating an IC bare chip, It is characterized in that A plurality of first solder joints are arranged on the surface of the packaging structure, and the plurality of first solder joints are arranged to form a first signal channel extending along the surface of the packaging structure; At least one second solder joint is also arranged on the surface of the packaging structure, and the second solder joint is located in the first signal channel; The second solder joint is connected to the IC bare chip and is used to transmit the signal to the first signal channel.

2. The radio frequency device according to claim 1, It is characterized in that The radio frequency device further comprises a PCB board, wherein the packaging structure is mounted on the PCB board via the first solder joint.

3. The radio frequency device according to claim 1 or 2, Features: The first signal channel surrounded by the first welding points has two ends in the signal transmission direction, namely a first end and a second end. The first end is surrounded by a first welding point for blocking signals, and the second end is not surrounded by the first welding point as a signal output end.

4. The radio frequency device according to claim 3, Features: A gap is left between the second welding point and the first end, so that the signal passes through the second welding point and enters the first signal channel and then is transmitted to the second end.

5. The radio frequency device according to claim 1 or 2, Features: The radio frequency device further includes an external metal structure, wherein the external metal structure has a second signal channel therein, and wherein the second signal channel is in communication with the first signal channel.

6. The radio frequency device according to claim 2, Features: The first signal channel surrounded by the first welding points has two ends in the signal transmission direction, namely a first end and a second end, and the first end and the second end are both surrounded by first welding points; The PCB board is provided with a waveguide hole, and one end of the waveguide hole is located in and connected with the first signal channel.

7. The radio frequency device according to claim 6, Features: A gap is left between the second soldering point and the first end, and one end of the waveguide hole is located between the second soldering point and the second end.

8. A radio frequency device, comprising a packaging structure encapsulating an IC bare chip, It is characterized in that A plurality of first solder joints are arranged on the surface of the packaging structure, and the plurality of first solder joints are arranged to form a first signal channel extending along the surface of the packaging structure; An external signal channel is arranged on the side of the packaging structure, an isolation channel is arranged in the packaging structure on one side close to the external signal channel, the lower end of the isolation channel is connected to the first signal channel, and the isolation channel, the first signal channel and the external signal channel together constitute a complete longitudinally extending signal channel; A conductive structure is also provided in the packaging structure, one end of which is connected to the IC bare chip, and the other end of which extends into the longitudinally extending signal channel.

9. The radio frequency device according to claim 8, Features: The conductive structure is a partial structure in a metal layer in a packaging structure.

10. The radio frequency device according to claim 8, It is characterized in that The radio frequency device further comprises a PCB board, wherein the packaging structure is mounted on the PCB board via the first solder joint.

11. The radio frequency device according to claim 10, Features: The radio frequency device also includes an external metal structure, wherein the external metal structure has a hollow structure therein, wherein the hollow structure constitutes the external signal channel, and the hollow structure is open on one side facing the packaging structure and is connected to the isolation channel in the packaging structure.

12. The radio frequency device according to claim 11, Features: The isolation channel comprises a first isolation unit and a second isolation unit, wherein: The first isolation unit is a metal structure perpendicular to the surface of the PCB, one end of which is connected to each first solder joint, and the other end of which is connected to one end of the second isolation unit; The second isolation unit is a metal structure parallel to the surface of the PCB, and the other end of the second isolation unit is located at a side of the packaging structure.

13. The radio frequency device according to claim 12, Features: The first isolation unit is a metallized through hole in the packaging structure; The second isolation unit is a metal structure formed by a portion of metal in the metal layer in the packaging structure.

14. The radio frequency device according to claim 13, Features: The first signal channel also has a communication end disposed between the first end and the second end; The external signal channel is a signal channel perpendicular to the PCB surface, wherein the two ends of the signal transmission direction of the external signal channel are respectively a third end and a fourth end, wherein the third end is surrounded by a metal structure for blocking the signal, and the fourth end is connected to the connecting end.

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