Heat dissipation structure and laser industrial camera
By using heat conductors in laser industrial cameras for heat dissipation, the problem of thermal conductors being damaged by thermal gel entering the laser inside the laser is solved, and the stability of the laser luminous intensity and the heat dissipation effect are improved, ensuring the normal operation of the laser industrial camera.
Patent Information
- Application Number
- CN202420883862.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The existing laser industrial cameras use thermal gel combined with thermal silicone, causing thermal gel to enter the laser, destroying the diffuser, resulting in unstable luminous intensity.
Heat conductors are used to dissipate heat. By setting open grooves and grooves on the inner wall of the front shell, the heat conductor is sandwiched between the main board and the front shell to ensure that the heat conductors are in full contact with the shell. The heat on the main board is transferred to the shell through the heat conductor. , avoiding the damage of the laser by the thermal gel.
It ensures the stability of the laser luminous intensity, improves the heat dissipation effect, avoids the laser temperature being too high, and maintains the stability of the laser industrial camera.
Smart Images
Figure CN222191418U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical devices, in particular to a heat dissipation structure and a laser industrial camera. Background Art
[0002] Laser industrial camera is a high-performance image acquisition device, especially suitable for industrial applications. It uses laser light source for imaging and captures high-quality images through high-speed CMOS or CCD image sensors, and then transmits these images to computers for further analysis and processing.
[0003] The working principle of the laser industrial camera mainly includes three steps: emitting laser beams, receiving reflected beams, and calculating three-dimensional information. Through the built-in laser generator, the camera emits a laser beam, which will be reflected back after being irradiated on the surface of the object. The built-in receiver of the camera receives these reflected beams and records the time and intensity of the reflected beams. Using this information, the laser industrial camera can calculate the distance between the laser beam and the surface of the object, and obtain a large number of distance data points by continuously scanning the surface of the object. These data points can be combined into a three-dimensional point cloud to form a three-dimensional model of the object.
[0004] The temperature of the laser will affect the use of the laser. When the temperature of the laser is too high, it cannot work normally. The current heat dissipation method of the laser is to use thermal conductive gel and thermal conductive silicone together. It is necessary to open a gel groove near the laser in the front shell, place the thermal conductive gel in the gel groove, and fill the thermal conductive silicone between the PCB board and the front shell. However, the thermal conductive gel will enter the interior from the exhaust hole of the laser, causing damage to the diffuser of the laser, resulting in unstable luminous intensity of the laser. Utility Model Content
[0005] Therefore, the technical problem to be solved by the utility model is to overcome the defect that the current heat dissipation method of the laser in the prior art is to use thermally conductive gel and thermally conductive silicone together, and a gel groove needs to be opened in the front shell, and the thermally conductive gel is placed in the gel groove. The thermally conductive gel will enter the interior from the exhaust hole of the laser, causing damage to the diffuser of the laser, resulting in unstable luminous intensity of the laser, thereby providing a heat dissipation structure and a laser industrial camera.
[0006] In order to solve the above technical problems, the utility model provides a heat dissipation structure, comprising: a front shell, the front shell having a smooth inner wall, the inner wall having an open groove penetrating on both sides, the open groove being used to accommodate a laser;
[0007] A mainboard, mounted on the inner wall of the front shell, the mainboard being electrically connected to a laser;
[0008] A heat conducting sheet is sandwiched between the inner wall and the main board, and the heat conducting sheet has a first avoidance hole for passing the laser.
[0009] Optionally, the heat conductive sheet is a rectangular sheet, and the heat conductive sheet abuts against a side of the mainboard to which the laser is electrically connected.
[0010] Optionally, the length of the heat conducting sheet is the same as the length of the main board, and the width of the heat conducting sheet is the same as the width of the main board.
[0011] Optionally, the inner wall of the front shell has a groove corresponding to the chip on the mainboard, and the groove is connected to the opening groove.
[0012] Optionally, the mainboard is detachably mounted on the front shell via a fastener, and the heat conducting sheet has a second avoidance hole for passing the fastener.
[0013] Optionally, a positioning column extending toward the mainboard is provided on the inner wall of the front shell, the mainboard has a positioning hole matched with the positioning column, and the heat conducting sheet has a third avoidance hole for passing the positioning column.
[0014] Optionally, the positioning post is a cylindrical structure, and there are at least two positioning posts arranged at intervals.
[0015] A laser industrial camera, comprising: a rear shell, a middle frame and a heat dissipation structure according to any one of the above schemes, wherein a front shell of the heat dissipation structure is detachably connected to the middle frame and the rear shell in sequence;
[0016] A camera body is arranged in the middle frame, and a lens of the camera body passes through the mainboard, the heat conducting sheet and the front shell of the heat dissipation structure in sequence.
[0017] Optionally, the heat dissipation structure has a plurality of lasers distributed in a rectangular array.
[0018] Optionally, it further includes: an elastic light shielding ring, which is sandwiched between the lens and a fourth avoidance hole on the mainboard for passing the lens.
[0019] The technical solution of the utility model has the following advantages:
[0020] 1. The heat dissipation structure provided by the utility model only dissipates heat through the heat conductive sheet, which will not damage the diffuser of the laser, ensuring that the luminous intensity of the laser remains stable, and the heat on the mainboard can be transferred to the shell through the heat conductive sheet. Since the inner wall of the front shell is smooth, the heat conductive sheet can fully contact the inner wall of the front shell, and the heat dissipation effect is good, ensuring the normal operation of the laser.
[0021] 2. In the heat dissipation structure provided by the utility model, the chip on the mainboard squeezes the heat conductive sheet to cause deformation, and the deformed part of the heat conductive sheet can be embedded in the groove, providing space for the deformation of the heat conductive sheet, and can also assist the chip in heat dissipation, further improving the heat dissipation effect.
[0022] 3. The laser industrial camera provided by the utility model eliminates the thermal gel and only uses a thermal conductive sheet for heat dissipation, thereby avoiding damage to the diffuser of the laser and ensuring a good heat dissipation effect. The temperature of the laser will not be too high during use, thus maintaining the stability of the laser industrial camera. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0024] Figure 1 This is a front view of a laser industrial camera provided in the first embodiment of the utility model;
[0025] Figure 2 for Figure 1 Exploded diagram of
[0026] Figure 3 for Figure 2 Schematic diagram of the other side;
[0027] Figure 4 for Figure 1 A cross-sectional view of
[0028] Figure 5 for Figure 2 A magnified view of the motherboard;
[0029] Figure 6 for Figure 2 Enlarged view of the middle heat conducting sheet;
[0030] Figure 7 for Figure 4 A magnified image of area A;
[0031] Figure 8 for Figure 3 Magnified view of the mid-front shell.
[0032] Description of reference numerals:
[0033] 1. Front shell; 2. Inner wall; 3. Opening groove; 4. Laser; 5. Main board; 6. Heat conducting plate; 7. First avoidance hole; 8. Groove; 9. Second avoidance hole; 10. Positioning column; 11. Positioning hole; 12. Third avoidance hole; 13. Back shell; 14. Middle frame; 15. Camera body; 16. Elastic shading ring. DETAILED DESCRIPTION
[0034] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0035] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0037] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0038] like Figures 4 to 8 As shown, a specific implementation of the heat dissipation structure provided in this embodiment includes: a front shell 1, a main board 5 and a heat conductive sheet 6, the front shell 1 has a smooth inner wall 2, the inner wall 2 has an open groove 3 penetrating on both sides, the open groove 3 is a rectangular groove, the open groove 3 is used to accommodate the laser 4, the main board 5 is installed on the inner wall 2 of the front shell 1, the main board 5 is electrically connected to the laser 4, the heat conductive sheet 6 is clamped between the inner wall 2 and the main board 5, the heat conductive sheet 6 has a first avoidance hole 7 for passing the laser 4, and in this embodiment, the material of the heat conductive sheet 6 can be a silicone sheet.
[0039] The heat dissipation structure provided in this embodiment only dissipates heat through the heat conductive sheet 6, and will not damage the diffuser of the laser 4, ensuring that the luminous intensity of the laser 4 remains stable, and the heat on the mainboard 5 can be transferred to the shell through the heat conductive sheet 6. Since the inner wall 2 of the front shell 1 is smooth, the heat conductive sheet 6 can fully contact the inner wall 2 of the front shell 1, and the heat dissipation effect is good, ensuring the normal operation of the laser 4.
[0040] like Figures 4 to 6 As shown, in the heat dissipation structure provided in this embodiment, the heat conductive sheet 6 is a rectangular sheet, and the heat conductive sheet 6 abuts against the side of the mainboard 5 electrically connected to the laser 4. The structure of the heat conductive sheet 6 is a regular shape, which is relatively simple to manufacture and can also achieve a good heat conduction effect. In addition, as an alternative implementation, the heat conductive sheet 6 can also be circular or other polygonal, and a placement groove with the same shape and size as the mainboard 5 can be opened on the heat conductive sheet 6, and the mainboard 5 can be embedded in the placement groove.
[0041] like Figure 2 , Figure 3 As shown, in the heat dissipation structure provided by this embodiment, the length of the heat conductive sheet 6 is the same as the length of the main board 5, the width of the heat conductive sheet 6 is the same as the width of the main board 5, and the heat conductive sheet 6 can cover all positions of the main board 5, and the contact area between the two is maximized to ensure the heat conduction effect of the heat conductive sheet 6. In addition, as an alternative implementation, the length of the heat conductive sheet 6 can also be greater than the length of the main board 5, the width of the heat conductive sheet 6 can be greater than the width of the main board 5, and the excess part of the heat conductive sheet 6 can be bent toward the main board 5 to overlap with the side of the main board 5, thereby further increasing the contact area.
[0042] like Figure 8 As shown, in the heat dissipation structure provided by this embodiment, the inner wall 2 of the front shell 1 has a groove 8 corresponding to the chip on the mainboard 5, and the groove 8 is connected to the opening groove 3. The chip on the mainboard 5 squeezes the heat conductive sheet 6 to cause deformation, and the deformed part of the heat conductive sheet 6 can be embedded in the groove 8, providing space for the deformation of the heat conductive sheet 6, and can also assist the chip in dissipating heat, further improving the heat dissipation effect.
[0043] like Figure 5 , Figure 6 , Figure 8As shown, in the heat dissipation structure provided by this embodiment, the mainboard 5 is detachably mounted on the front shell 1 by means of fasteners, the heat conducting sheet 6 has a second avoidance hole 9 for passing the fastener, and the front shell 1 has a threaded hole. The fastener can be a bolt, and the bolt passes through the mainboard 5 and the second avoidance hole 9 and is threadedly connected with the threaded hole to achieve the fixation of the mainboard 5 and the heat conducting sheet 6. This connection method only requires opening holes on the mainboard 5 and the heat conducting sheet 6, and no other structures need to be designed. The connection is simple and convenient. In addition, as an alternative embodiment, the mainboard 5 can also be connected to the front shell 1 by snapping or bonding.
[0044] like Figure 5 , Figure 6 , Figure 8 As shown, in the heat dissipation structure provided by the present embodiment, a positioning column 10 extending toward the mainboard 5 is provided on the inner wall 2 of the front shell 1, the mainboard 5 has a positioning hole 11 matching with the positioning column 10, and the heat conducting plate 6 has a third avoidance hole 12 for passing through the positioning column 10. When installing the mainboard 5, the heat conducting plate 6 and the mainboard 5 are first pre-installed along the positioning column 10, and after the position is correct, they can be fastened by fasteners, thereby ensuring the correctness and convenience of the installation process of the heat conducting plate 6 and the mainboard 5, without repeatedly determining whether the installation positions of the two are correct, and the installation is more convenient.
[0045] like Figure 8 As shown, in the heat dissipation structure provided in this embodiment, the positioning column 10 is a cylindrical structure, and the positioning column 10 has at least two spaced apart arrangements. In this embodiment, the number of the positioning columns 10 is two, and the cylindrical structure only needs to determine the correct position, and there is no restriction on the angle. The installation angle of the heat conducting sheet 6 and the mainboard 5 can be restricted by multiple cylindrical structures, and the manufacturing is simpler. In addition, as an alternative embodiment, the positioning column 10 can also be a rectangular column or a polygonal column.
[0046] In addition, if Figures 1 to 3 As shown, the present embodiment further provides a laser industrial camera, comprising: a rear shell 13, a middle frame 14 and the above-mentioned heat dissipation structure, the front shell 1 of the heat dissipation structure is detachably connected to the middle frame 14 and the rear shell 13 in sequence, a camera body 15 is arranged in the middle frame 14, and the lens of the camera body 15 passes through the main board 5, the heat conducting plate 6 and the front shell 1 in sequence. In the present embodiment, the rear shell 13, the middle frame 14 and the front shell 1 are connected by bolts, and the middle position of the main board 5, the heat conducting plate 6 and the front shell 1 is hollow.
[0047] The laser industrial camera provided in this embodiment eliminates the thermal conductive gel and only uses the thermal conductive sheet 6 for heat dissipation, thereby avoiding damage to the diffuser of the laser 4 and ensuring a good heat dissipation effect. During use, the temperature of the laser 4 will not be too high, thereby maintaining the stability of the laser industrial camera.
[0048] like Figure 5 As shown, in the laser industrial camera provided in this embodiment, the lasers 4 have a plurality of lasers distributed in a rectangular array. The plurality of lasers 4 can irradiate farther, thereby determining the shape of objects farther away, and achieving a higher use effect.
[0049] like Figure 5 As shown, the laser industrial camera provided in this embodiment also includes: an elastic light shielding ring 16, which is sandwiched between the lens and the fourth avoidance hole on the main board 5 for passing the lens, and the fourth avoidance hole is the hollow part in the middle of the main board 5. The material of the elastic light shielding ring 16 can be rubber, which can fix and buffer the lens, prevent the lens from shaking, and ensure the shooting effect. In addition, as an alternative implementation, the elastic light shielding ring 16 can also be omitted, and elastic parts such as sponges and air bags can be filled between the lens and the fourth avoidance hole.
[0050] The heat dissipation principle of the laser industrial camera provided in this embodiment is as follows:
[0051] When in use, the heat of the laser 4 and the mainboard 5 is transferred to the shell through the heat conductive sheet 6, and then transferred to the outside through the shell. Since the inner wall 2 of the shell is smooth, the design of the gel groove is cancelled, and all positions of the heat conductive sheet 6 can contact with the inner wall 2 of the shell, ensuring the contact area, thereby ensuring the heat dissipation effect.
[0052] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the present utility model.
Claims
1. A heat dissipation structure, characterized in that: include: A front shell (1), the front shell (1) having a smooth inner wall (2), the inner wall (2) having an open groove (3) penetrating on both sides, the open groove (3) being used to accommodate a laser (4); A main board (5) is mounted on the inner wall (2) of the front shell (1), and the main board (5) is electrically connected to a laser (4); A heat conducting plate (6) is sandwiched between the inner wall (2) and the main board (5), and the heat conducting plate (6) has a first avoidance hole (7) for passing the laser (4).
2. The heat dissipation structure according to claim 1, characterized in that: The heat conducting sheet (6) is a rectangular sheet, and the heat conducting sheet (6) abuts against a side surface of the main board (5) that is electrically connected to the laser (4).
3. The heat dissipation structure according to claim 2, characterized in that: The length of the heat conducting sheet (6) is the same as the length of the main board (5), and the width of the heat conducting sheet (6) is the same as the width of the main board (5).
4. The heat dissipation structure according to claim 1, characterized in that: The inner wall (2) of the front shell (1) has a groove (8) corresponding to the chip on the main board (5), and the groove (8) is connected to the opening groove (3).
5. The heat dissipation structure according to any one of claims 1 to 4, characterized in that: The main board (5) is detachably mounted on the front shell (1) via a fastener, and the heat conducting sheet (6) has a second avoidance hole (9) for passing the fastener.
6. The heat dissipation structure according to claim 5, characterized in that: A positioning column (10) extending toward the main board (5) is provided on the inner wall (2) of the front shell (1); the main board (5) has a positioning hole (11) matching with the positioning column (10); and the heat conducting sheet (6) has a third avoidance hole (12) for passing through the positioning column (10).
7. The heat dissipation structure according to claim 6, characterized in that: The positioning post (10) is a cylindrical structure, and has at least two positioning posts (10) arranged at intervals.
8. A laser industrial camera, characterized in that: include: A rear shell (13), a middle frame (14), and a heat dissipation structure according to any one of claims 1 to 7, wherein the front shell (1) of the heat dissipation structure is detachably connected to the middle frame (14) and the rear shell (13) in sequence; A camera body (15) is arranged in the middle frame (14), and a lens of the camera body (15) passes through the main board (5), the heat conducting sheet (6) and the front shell (1) of the heat dissipation structure in sequence.
9. The laser industrial camera according to claim 8, characterized in that: The heat dissipation structure has a plurality of lasers (4) distributed in a rectangular array.
10. The laser industrial camera according to claim 8, characterized in that: Also includes: An elastic light shielding ring (16) is sandwiched between the lens and a fourth avoidance hole on the main board (5) for passing through the lens.