Electronic equipment and camera module thereof
Through the side welding of the circuit board and the photosensitive chip, the camera is miniaturized and connected stability problems are solved, and the thinner and high-intensity camera module design is achieved, reducing costs.
Patent Information
- Application Number
- CN202323527997.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-22
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2033-12-22
AI Technical Summary
The existing camera structure has a large distance between the bottom of the blue glass bracket and the photosensitive chip, which makes it difficult to miniaturize the camera, and the connection method is at risk of loosening, affecting the structural strength and stability.
By setting the side welding of the circuit board to the photosensitive chip, the height of the camera module is reduced and the connection stability is improved, the structure is shock-resistant, and a low-cost and simple welding process is adopted.
The camera module is thinner, improves the stability and shock resistance of the connection, enhances structural strength and stability, and reduces production costs.
Smart Images
Figure CN222192474U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of camera structures, and specifically to an electronic device and a camera module thereof. Background Art
[0002] Conventional electronic device cameras basically contain a focusing lens, a photosensitive chip and a PCB (Printed Circuit Board) board that conducts the chip. The current mainstream CMOS (Complementary Metal-Oxide-Semiconductor) sensor is mainly bonded to the PCB board through gold wires; non-mainstream solutions include CSP (Chip Scale Package) chips, which add a protective cover above the photosensitive chip and are welded to the PCB board through solder balls. Regardless of which solution is used, the bottom of the blue glass bracket is at least 0.20mm away from the photosensitive area of the chip, making it difficult to miniaturize the camera. Utility Model Content
[0003] A first aspect of an embodiment of the present application provides a camera module, the camera module comprising a photosensitive chip, a circuit board, and a lens;
[0004] The photosensitive chip includes: a side edge and an upper surface and a lower surface that are arranged oppositely;
[0005] The side includes a first side and a second side that are oppositely arranged, and a third side and a fourth side that are oppositely arranged; the first side, the third side, the second side and the fourth side are connected end to end in sequence and the opposite ends are connected to the upper surface and the lower surface respectively;
[0006] The lens is mounted on a side away from the upper surface;
[0007] The circuit board is arranged on a side close to the lower surface and is pre-bonded to the lower surface;
[0008] The photosensitive chip and the circuit board are welded via the side edges.
[0009] In a second aspect, an embodiment of the present application provides an electronic device, which includes the camera module described in the above embodiment.
[0010] The camera module provided in the embodiment of the present application reduces the height of the camera module in the thickness direction of the photosensitive chip by arranging side welding between the circuit board and the photosensitive chip, thereby realizing the thinning of the camera module; and welding can improve the stability of the connection, has better firmness and shock resistance, and will not loosen due to heavy loads, vibrations or temperature changes, thereby effectively enhancing the structural strength and stability of the camera module, and at the same time, the welding cost is low, the processing is simple, and the cost is saved. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0012] Figure 1 It is a schematic diagram of the overall structure of an embodiment of a camera module of the present application;
[0013] Figure 2 yes Figure 1 Schematic diagram from another perspective;
[0014] Figure 3 This is a schematic diagram of the disassembled structure of an embodiment of the camera module of the present application;
[0015] Figure 4 This is a schematic diagram of the structural disassembly of the photosensitive chip and circuit board of the camera module of this application;
[0016] Figure 5 yes Figure 4 Schematic diagram from another perspective;
[0017] Figure 6 It is a schematic diagram of welding the first side of the photosensitive chip to the circuit board;
[0018] Figure 7 This is a schematic diagram of welding the second side of the photosensitive chip to the circuit board;
[0019] Figure 8 This is a schematic diagram of the welding of the third side of the photosensitive chip to the circuit board;
[0020] Fig. 9 This is a schematic diagram of the fourth side of the photosensitive chip being welded to the circuit board;
[0021] Fig.10 This is a schematic diagram of the first and second sides of the photosensitive chip being welded to the circuit board;
[0022] Fig.11 This is a schematic diagram of the first and third sides of the photosensitive chip being welded to the circuit board;
[0023] Fig.12 This is a schematic diagram of the first, second, and fourth sides of the photosensitive chip being welded to the circuit board;
[0024] Fig.13 This is a schematic diagram of the first, second, and third sides of the photosensitive chip being welded to the circuit board;
[0025] Fig.14 This is a schematic diagram of the first, second, third, and fourth sides of the photosensitive chip being welded to the circuit board;
[0026] Fig.15a It is a schematic diagram of the first and second sides of the photosensitive chip being welded to the circuit board through the bumps;
[0027] Fig.15b It is a schematic diagram showing that the first and second sides of the photosensitive chip are welded to the circuit board through bumps, and the welding points are spherical;
[0028] Fig.15c It is a schematic diagram showing that the first and second sides of the photosensitive chip are welded to the circuit board through bumps, and the welding points are irregularly shaped;
[0029] Fig.15d It is a schematic diagram showing that the first and second sides of the photosensitive chip are welded to the circuit board through bumps, and the welding point is another irregular shape;
[0030] Fig.15e It is a schematic diagram showing that the first side of the photosensitive chip is welded to the circuit board through a bump, and the welding point is another irregular shape;
[0031] Fig.16 It is a schematic diagram of the first side of the photosensitive chip being welded to the circuit board through the bump;
[0032] Fig.17 It is a schematic diagram of the second side of the photosensitive chip being welded to the circuit board through the bump;
[0033] Fig.18 It is a schematic diagram of the third side of the photosensitive chip being welded to the circuit board through the bump;
[0034] Fig.19 It is a schematic diagram of the fourth side of the photosensitive chip being welded to the circuit board through the bump;
[0035] Fig. 20 This is a schematic diagram of the first and third sides of the photosensitive chip being welded to the circuit board through bumps;
[0036] Fig.21 This is a schematic diagram of the second and fourth sides of the photosensitive chip being welded to the circuit board through bumps;
[0037] Fig. 22 It is a schematic diagram of the first, second and fourth sides of the photosensitive chip being welded to the circuit board through bumps;
[0038] Fig.23 It is a schematic diagram of the first, second and third sides of the photosensitive chip being welded to the circuit board through bumps;
[0039] Fig.24 It is a schematic diagram of the first, second, third and fourth sides of the photosensitive chip being welded to the circuit board through bumps;
[0040] Fig.25 yes Fig.24 A schematic diagram of another embodiment;
[0041] Fig.26 It is a schematic diagram of the structural composition block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION
[0042] The present application is further described in detail below in conjunction with the accompanying drawings and examples. It is particularly noted that the following examples are only used to illustrate the present application, but are not intended to limit the scope of the present application. Similarly, the following examples are only some embodiments of the present application rather than all embodiments, and all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0043] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can expressly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of the present application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.
[0044] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0045] As used herein, "electronic equipment" (or simply "terminal") includes, but is not limited to, devices configured to receive / send communication signals via a wireline connection (e.g., via a public switched telephone network (PSTN), a digital subscriber line (DSL), digital cable, a direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for a cellular network, a wireless local area network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; personal communication system (PCS) terminals that may combine a cellular radiotelephone with data processing, fax, and data communication capabilities; a PDA that may include a radiotelephone, a pager, Internet / Intranet access, a Web browser, a notepad, a calendar, and / or a global positioning system (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A mobile phone is an electronic device equipped with a cellular communication module.
[0046] Please also read Figure 1 to Figure 3 , Figure 1 1 is a schematic diagram of the overall structure of an embodiment of a camera module of the present application. Figure 2 yes Figure 1 Another perspective diagram, Figure 3 It is a schematic diagram of the disassembled structure of an embodiment of the camera module of the present application; it should be noted that the camera module in the present application can be used in any device that requires photography and videography, including but not limited to electronic devices or other functional devices, among which the electronic devices may include mobile phones, tablet computers, laptop computers, wearable devices, camcorders, cameras, etc. The application fields of the camera module are within the understanding of those skilled in the art and are not listed one by one here.
[0047] The camera module 100 in this embodiment includes but is not limited to the following structures: a lens 110, a housing 160, an upper spring 170, a carrier 180, a coil 190, a base 191, a magnet 192, a lower spring 193, a blue glass bracket 194, a blue glass 195, a photosensitive chip 120 and a circuit board 130.
[0048] Optionally, please also refer to Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structural disassembly of the photosensitive chip and circuit board of the camera module of this application. Figure 5 yes Figure 4 Schematic diagram from another perspective; optionally, the photosensitive chip 120 includes: a side 1203 and an upper surface 1201 and a lower surface 1202 that are arranged oppositely; the side 1203 includes a first side 12031 and a second side 12032 that are arranged oppositely, and a third side 12033 and a fourth side 12034 that are arranged oppositely; the first side 12031, the third side 12033, the second side 12032 and the fourth side 12034 are connected end to end in sequence and the opposite ends are respectively connected to the upper surface 1201 and the lower surface 1202; the lens 110 is installed on the side away from the upper surface 1201; the circuit board 130 is arranged on the side close to the lower surface 1202 and is pre-bonded to the lower surface 1202.
[0049] Optionally, please also refer to Figure 6 to Figure 14 , Figure 6 This is a schematic diagram of the first side of the photosensitive chip being welded to the circuit board. Figure 7 This is a schematic diagram of the second side of the photosensitive chip being welded to the circuit board. Figure 8 This is a schematic diagram of the soldering of the third side of the photosensitive chip to the circuit board. Fig. 9 This is a schematic diagram of the fourth side of the photosensitive chip being welded to the circuit board. Fig.10 This is a schematic diagram of the first and second sides of the photosensitive chip being welded to the circuit board. Fig.11 This is a schematic diagram of the first and third sides of the photosensitive chip being welded to the circuit board. Fig.12 This is a schematic diagram of the first, second, and fourth sides of the photosensitive chip being welded to the circuit board. Fig.13 This is a schematic diagram of the first, second, and third sides of the photosensitive chip being welded to the circuit board. Fig.14 It is a schematic diagram of welding the first, second, third and fourth sides of the photosensitive chip to the circuit board, and the circuit board 130 is welded to the side 1203 of the photosensitive chip 120.
[0050] Optionally, see Figure 6 to Figure 9 Optionally, the photosensitive chip 120 and the circuit board 130 are welded through one side; optionally, the photosensitive chip 120 and the circuit board 130 are welded through a first side 12031; optionally, the photosensitive chip 120 and the circuit board 130 are welded through a second side 12032; optionally, the photosensitive chip 120 and the circuit board 130 are welded through a third side 12033; optionally, the photosensitive chip 120 and the circuit board 130 are welded through a fourth side 12034.
[0051] Optionally, see Fig.10and Fig.11 Optionally, the photosensitive chip 120 and the circuit board 130 are welded through two sides; optionally, the photosensitive chip 120 and the circuit board 130 are welded through the first side 12031 and the second side 12032, optionally, the photosensitive chip 120 and the circuit board 130 are welded through the first side 12031 and the third side 12033, optionally, the photosensitive chip 120 and the circuit board 130 are welded through the first side 12031 and the fourth side 12034, optionally, the photosensitive chip 120 and the circuit board 130 are welded through the second side 12032 and the third side 12033, optionally, the photosensitive chip 120 and the circuit board 130 are welded through the second side 12032 and the fourth side 12034, optionally, the photosensitive chip 120 and the circuit board 130 are welded through the third side 12033 and the fourth side 12034.
[0052] Optionally, see Fig.12 and Fig.13 Optionally, the photosensitive chip 120 and the circuit board 130 are welded through three sides; optionally, the photosensitive chip 120 and the circuit board 130 are welded through the first side 12031, the second side 12032 and the third side 12033; optionally, the photosensitive chip 120 and the circuit board 130 are welded through the first side 12031, the second side 12032 and the fourth side 12034; optionally, the photosensitive chip 120 and the circuit board 130 are welded through the first side 12031, the third side 12033 and the fourth side 12034; optionally, the photosensitive chip 120 and the circuit board 130 are welded through the second side 12032, the third side 12033 and the fourth side 12034.
[0053] Optionally, see Fig.14 Optionally, the photosensitive chip 120 and the circuit board 130 are welded through four sides: a first side 12031 , a second side 12032 , a third side 12033 and a fourth side 12034 .
[0054] The camera module 100 provided in the embodiment of the present application reduces the height of the camera module in the thickness direction of the photosensitive chip by setting the circuit board 130 to be welded with the side 1203 of the photosensitive chip 120. Optionally, the height of the camera module 100 can be reduced by at least 0.15mm, optionally, the height of the camera module 100 can be reduced by 0.2mm, and optionally, the height of the camera module 100 can be reduced by 0.18mm, thereby achieving the thinning of the camera module 100. Moreover, welding can improve the stability of the connection, has better firmness and shock resistance, and will not loosen due to heavy loads, vibrations or temperature changes, thereby effectively enhancing the structural strength and stability of the camera module 100. At the same time, the welding cost is low, the processing is simple, and the cost is saved.
[0055] Optionally, the photosensitive chip 120 and the circuit board 130 are welded via a pad 140. There may be multiple pads 140, and the multiple pads 140 are evenly distributed on the sides to which they belong, so as to achieve uniform welding of the photosensitive chip 120 and the circuit board 130. In some embodiments, the shape of the pad 140 may be circular, square, or oval. In other embodiments, the shape of the pad 140 may be other shapes, which are not specifically limited here.
[0056] Optionally, the material of the pad 140 is metal. Optionally, the material of the pad 140 may be copper, which has good electrical conductivity. Optionally, the material of the pad 140 may be iron, which has good heat resistance.
[0057] Please continue reading Fig.10 Optionally, the photosensitive chip 120 and the circuit board 130 are welded via a plug-in pad 1401 , the extension direction of the plug-in pad 1401 is toward the lower surface 1202 , and the plug-in pad 1401 is inserted into the photosensitive chip 120 to achieve welding of the photosensitive chip 120 and the circuit board 130 .
[0058] Please refer to 15a~15e, Fig.15a This is a schematic diagram of the first and second sides of the photosensitive chip being soldered to the circuit board through bumps. Fig.15b This is a schematic diagram showing that the first and second sides of the photosensitive chip are welded to the circuit board through bumps, and the welding points are spherical. Fig.15c This is a schematic diagram showing that the first and second sides of the photosensitive chip are welded to the circuit board through bumps, and the welding points are irregular in shape. Fig.15d This is a schematic diagram showing that the first and second sides of the photosensitive chip are welded to the circuit board through bumps, and the welding point is another irregular shape. Fig.15e It is a schematic diagram showing that the first side of the photosensitive chip is welded to the circuit board through a bump, and the welding point is another irregular shape; optionally, the side 1203 includes a bump 12035, and the extension direction of the bump 12035 is the same as the extension direction of the upper surface 1201; the photosensitive chip 120 and the circuit board 130 are welded through a pad 140, and the pad 140 is arranged at one end of the bump 12035 facing the lower surface 1202. Optionally, in some embodiments, the welding point 150 can be a trapezoid, a spherical, or an irregular shape, and in other embodiments, the welding point 150 can be other shapes, as long as the connection between the photosensitive chip 120 and the circuit board 130 can be achieved, and no specific limitation is made here.
[0059] See also Figure 16 to Figure 25 , Fig.16 This is a schematic diagram of the first side of the photosensitive chip being welded to the circuit board through the bumps. Fig.17 This is a schematic diagram of the second side of the photosensitive chip being welded to the circuit board through the bumps. Fig.18 This is a schematic diagram of the third side of the photosensitive chip being welded to the circuit board through the bump. Fig.19 This is a schematic diagram of the fourth side of the photosensitive chip being welded to the circuit board through the bump. Fig. 20 This is a schematic diagram of the first and third sides of the photosensitive chip being soldered to the circuit board through bumps. Fig.21 This is a schematic diagram of the second and fourth sides of the photosensitive chip being welded to the circuit board through bumps. Fig. 22 This is a schematic diagram of the first, second, and fourth sides of the photosensitive chip being soldered to the circuit board through bumps. Fig.23 This is a schematic diagram of the first, second, and third sides of the photosensitive chip being soldered to the circuit board through bumps. Fig.24 This is a schematic diagram of the first, second, third, and fourth sides of the photosensitive chip being soldered to the circuit board through bumps. Fig.25 yes Fig.24 Schematic diagram of another embodiment; Optionally, one of the side edges may include a protrusion 12035: the first side edge 12031 may include a protrusion 12035, or the second side edge 12032 may include a protrusion 12035, or the third side edge 12033 may include a protrusion 12035, or the fourth side edge 12034 may include a protrusion 12035; Optionally, two of the side edges may include a protrusion 12035: the first side edge 12031 and the second side edge 12032 may include a protrusion 12035, or the first side edge 12031 and the third side edge 12033 may include a protrusion 12035, or the first side edge 12031 and the fourth side edge 12034 may include a protrusion 12035, or the second side edge 12032 and the third side edge 12033 may include a protrusion 12035, or the second side edge 12032 and the fourth side edge 12034 may include a protrusion 12035; 035, or the third side 12033 and the fourth side 12034 may include a protrusion 12035; optionally, three of the side edges may include a protrusion 12035: the first side edge 12031, the second side edge 12032 and the third side edge 12033 may include a protrusion 12035, or the first side edge 12031, the second side edge 12032 and the fourth side edge 12034 may include a protrusion 12035, or the first side edge 12031, the second side edge 12032 and the fourth side edge 12034 may include a protrusion 12035 031, the third side 12033 and the fourth side 12034 may include a protrusion 12035, or the second side 12032, the third side 12033 and the fourth side 12034 may include a protrusion 12035; optionally, all four sides may include a protrusion 12035: the first side 12031, the second side 12032, the third side 12033 and the fourth side 12034 may include a protrusion 12035.
[0060] Optionally, please continue to refer to 15a to 15d, the photosensitive chip 120 and the circuit board 130 are welded through the mounting pad 1402, and the mounting pad 1402 is mounted on the end of the bump 12035 facing the lower surface 1202 to achieve welding of the photosensitive chip 120 and the circuit board 130. Optionally, in some embodiments, the mounting pad 1402 can be square, circular, or polygonal, and in other embodiments, the mounting pad 1402 can be other shapes, which are not specifically limited here.
[0061] Optionally, see Fig.15e , Figure 23 to Figure 25 Optionally, there may be one or more bumps 12035; in an implementation where there is one bump 12035, optionally, bump 12035 is located in the middle of the side to which it belongs; optionally, bump 12035 is located in the middle of the side and extends to both ends, and mounting pads 1402 are evenly spaced at one end of bump 12035 facing lower surface 1202; in an implementation where there are multiple bumps 12035, multiple bumps 12035 are evenly distributed on the side to which they belong, and the number of mounting pads 1402 corresponds to the number of bumps 12035; so as to achieve uniform welding of photosensitive chip 120 and circuit board 130.
[0062] The camera module provided in the embodiment of the present application reduces the height of the camera module in the thickness direction of the photosensitive chip by arranging side welding between the circuit board and the photosensitive chip, thereby realizing the thinning of the camera module; and welding can improve the stability of the connection, has better firmness and shock resistance, and will not loosen due to heavy loads, vibrations or temperature changes, thereby effectively enhancing the structural strength and stability of the camera module, and at the same time, the welding cost is low, the processing is simple, and the cost is saved.
[0063] See also Fig.26 , Fig.26 It is a schematic diagram of the structural composition block diagram of an embodiment of an electronic device of the present application. The electronic device can be a foldable mobile phone, a tablet computer, a laptop computer, a wearable device, a video camera, a camera, etc. The diagram of this embodiment takes a mobile phone as an example. The structure of the electronic device 10 may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940, a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the circuit board 130 in the aforementioned embodiment) and a power supply 990, etc. Among them, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960 and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to provide power to the entire electronic device 10.
[0064] Specifically, the RF circuit 910 is used to receive and send signals; the memory 920 is used to store data instruction information; the input unit 930 is used to input information, which may specifically include a touch panel 931 and other input devices 932 such as operation buttons; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting user approach signals, distance signals, etc.; the speaker 961 and the microphone (or microphone) 962 are connected to the processor 980 through the audio circuit 960 for receiving and sending sound signals; the wifi module 970 is used to receive and transmit wifi signals, and the processor 980 is used to process data information of the electronic device 10. For the specific structural features of the electronic device, please refer to the relevant description of the above embodiment, which will not be described in detail here.
[0065] The electronic device provided in the embodiment of the present application includes a camera module. The camera module reduces the height of the camera module in the thickness direction of the photosensitive chip by arranging side welding between the circuit board and the photosensitive chip, thereby realizing the thinning of the camera module and further realizing the thinning of the electronic device. Moreover, welding can improve the stability of the connection, and has better firmness and shock resistance. It will not loosen due to heavy loads, vibrations or temperature changes, thereby effectively enhancing the structural strength and stability of the camera module, and further ensuring the reliability of the connection of the camera module of the electronic device. At the same time, the welding cost is low, the processing is simple, and the cost is saved, thereby reducing the cost of the electronic device.
[0066] The above descriptions are only some embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Any equivalent device or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A camera module, characterized in that: The camera module includes a photosensitive chip, a circuit board, and a lens; The photosensitive chip includes: a side edge and an upper surface and a lower surface that are arranged oppositely; The side includes a first side and a second side that are oppositely arranged, and a third side and a fourth side that are oppositely arranged; the first side, the third side, the second side and the fourth side are connected end to end in sequence and the opposite ends are connected to the upper surface and the lower surface respectively; The lens is mounted on a side away from the upper surface; The circuit board is arranged on a side close to the lower surface and is pre-bonded to the lower surface; The photosensitive chip and the circuit board are welded via the side edges.
2. The camera module according to claim 1, characterized in that: The photosensitive chip and the circuit board are welded via one of the sides: the first side, or the second side, or the third side, or the fourth side.
3. The camera module according to claim 1, characterized in that: The photosensitive chip is welded to the circuit board through the two sides: the first side and the second side, or the first side and the third side, or the first side and the fourth side, or the second side and the third side, or the second side and the fourth side, or the third side and the fourth side.
4. The camera module according to claim 1, characterized in that: The photosensitive chip is welded to the circuit board through the three sides: the first side, the second side and the third side, or the first side, the second side and the fourth side, or the first side, the third side and the fourth side, or the second side, the third side and the fourth side.
5. The camera module according to claim 1, characterized in that: The photosensitive chip and the circuit board are welded via the four sides: the first side, the second side, the third side and the fourth side.
6. The camera module according to any one of claims 2 to 5, characterized in that: The photosensitive chip is welded to the circuit board via a plug-in pad, the extension direction of the plug-in pad is toward the lower surface, and the plug-in pad is inserted into the photosensitive chip to achieve welding of the photosensitive chip and the circuit board.
7. The camera module according to any one of claims 2 to 5, characterized in that: The side edge includes a convex block, and the extension direction of the convex block is the same as the extension direction of the upper surface; The photosensitive chip is welded to the circuit board via a pad, and the pad is arranged at one end of the bump facing the lower surface.
8. The camera module according to claim 7, characterized in that: The number of the bumps can be one or more; in the scheme where there is one bump, the bump is located in the middle of the side to which it belongs, or the bump is located in the middle of the side and extends to both ends, and the soldering pads are evenly spaced at one end of the bump facing the lower surface; in the scheme where there are multiple bumps, multiple bumps are evenly distributed on the side to which they belong, and the number of soldering pads corresponds to the number of bumps; so as to achieve uniform welding of the photosensitive chip and the circuit board.
9. The camera module according to claim 8, characterized in that: The photosensitive chip and the circuit board are welded via mounting pads, and the mounting pads are mounted on one end of the bump facing the lower surface to achieve welding of the photosensitive chip and the circuit board.
10. An electronic device, characterized in that: The electronic device comprises the camera module according to any one of claims 1 to 9.