Circuit board assembly and electronic equipment

Abstract

The utility model relates to the field of circuit boards, aims to solve the problem that a connection bonding pad of a known stacked circuit board occupies a large area and influences arrangement of electronic components, and provides a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, a second circuit board and a connecting support. The second circuit board is overlapped on the first circuit board along the thickness direction of the first circuit board; the second circuit board is provided with a second hole. The connecting support is fixedly connected to the first circuit board and is provided with an extending section, the extending section is matched with the second hole, a second gap is formed between the extending section and the second hole, the second gap is filled with solder paste, and the extending section is connected with the hole wall of the second hole through the solder paste. The beneficial effects are that the first circuit board and the second circuit board are firmly and reliably combined, and the occupied board space is relatively small.

Description

Technical Field

[0001] The present application relates to the field of circuit boards, and in particular, to circuit board components and electronic devices. Background Art

[0002] In the prior art, stacked circuit boards are usually connected by pads. Since the connection strength of the pads is relatively low, a larger area of ​​the pads is often required to ensure the connection strength, which has a significant impact on the arrangement of electronic components on the circuit board. Utility Model Content

[0003] The present application provides a circuit board assembly and an electronic device to solve the problem that the connection pads of the conventional stacked circuit board occupy a large area and affect the arrangement of electronic components.

[0004] In a first aspect, an embodiment of the present application provides a circuit board assembly, comprising a first circuit board, a second circuit board and a connecting bracket. The second circuit board is overlapped with the first circuit board along the thickness direction of the first circuit board; the second circuit board is provided with a second hole. The connecting bracket is fixedly connected to the first circuit board, and the connecting bracket has an insertion section, the insertion section is matched with the second hole, and there is a second gap between the insertion section and the second hole, and the second gap is filled with solder paste, and the solder paste connects the insertion section and the hole wall of the second hole.

[0005] In the embodiment of the present application, a connecting bracket fixedly connected to the first circuit board is provided, and the extending section of the connecting bracket is fixedly coupled to the second circuit board in the second hole by solder paste, so that the connecting bracket and the second circuit board are firmly coupled, thereby enabling the first circuit board and the second circuit board to be reliably connected.

[0006] In a possible implementation, the first circuit board is provided with a first hole, and the second hole corresponds to the first hole along the thickness direction and is connected to each other. The connecting bracket further includes an extension section, which extends from the insertion section close to one end of the first circuit board into the first hole, and a first gap is provided between the first hole and the extension section, and the first gap is filled with solder paste, and the solder paste connects the extension section and the hole wall of the first hole.

[0007] In this embodiment, the dark field section of the connecting bracket is fixedly connected to the first circuit board in the second hole by solder paste, and the connecting bracket and the first circuit board are firmly connected, so that the first circuit board and the second circuit board can be reliably connected.

[0008] In a possible implementation, the connecting bracket further includes a first bending section, which is connected to an end of the extending section away from the extension section and is bent relative to the extending section to a surface of the second circuit board on a side away from the first circuit board.

[0009] In this embodiment, the first bending section is bent to the surface of the second circuit board on the side away from the first circuit board, which can limit the second circuit board from separating from the first circuit board in a direction away from the first circuit board.

[0010] In a possible implementation, the cross section of the first hole is larger than the cross section of the second hole, and the first hole and the second hole form a larger stepped hole on one side of the first hole.

[0011] In this embodiment, by forming the step hole, after filling with solder paste and soldering, the second circuit board is limited between the step of the solder paste and the first bending section of the connecting bracket, and the positioning and fixing is more reliable.

[0012] In a possible implementation, the second hole is a metallized hole, the hole wall of the second hole has a second metallized layer, the extending section is made of a metal material, and the solder paste is connected between the second metallized layer and the extending section by soldering; and / or,

[0013] The first hole is a metallized hole, the hole wall of the first hole has a first metallized layer, the extension section is made of metal material, and the solder paste is welded and connected between the first metallized layer and the extension section.

[0014] In this embodiment, the first hole / the second hole is a metallized hole, which is beneficial to improving the bonding strength between the solder paste and the hole wall.

[0015] In a possible implementation, the first circuit board includes an overlapping area and a non-overlapping area, the overlapping area overlaps with the second circuit board, and the non-overlapping area extends out of the second circuit board along a first direction. The connecting bracket also includes an overlapping section and a connecting section, the overlapping section is located on a side of the non-overlapping area close to the second circuit board along the thickness direction, and the overlapping section is fixedly connected to the non-overlapping area; the connecting section is connected between the overlapping section and the extending section.

[0016] In this embodiment, the connection between the connecting bracket and the first circuit board is achieved by connecting the overlapping section and the non-overlapping area.

[0017] In a possible implementation manner, the circuit board assembly further includes a fastener connecting the non-overlapping area and the overlapping section.

[0018] In this embodiment, the non-overlapping area and the overlapping section can be conveniently connected by fasteners.

[0019] In a possible implementation, the overlapping section is provided with a threaded hole, the non-overlapping area is provided with a through hole, the fastener is a screw, and the fastener passes through the through hole and is threadedly connected to the threaded hole.

[0020] In this embodiment, the fastener can be conveniently fastened and removed through the threaded connection.

[0021] In a possible implementation, the connecting section includes a second bending section and a third bending section. The second bending section is vertically connected to the end of the extending section away from the first circuit board and extends along the first direction to the non-overlapping area. The third bending section is connected between the second bending section and the overlapping section.

[0022] In this embodiment, the connecting section includes a second bending section and a third bending section, which facilitates the transition connection between the extending section and the overlapping section. Moreover, for a connecting bracket made of a metal plate, after the overlapping section is fixedly connected to the non-overlapping area, the connecting bracket can be connected to the extending section and the second circuit board, so that the second circuit board is elastically pressed against the first circuit board, thereby improving the integrity of the second circuit board and the first circuit board.

[0023] In a possible implementation manner, the overlapping section and the non-overlapping area are connected by solder paste welding.

[0024] In this embodiment, the overlapping section and the non-overlapping area are connected by solder paste welding to further improve the bonding strength between the two.

[0025] In a possible implementation, the projection of the second hole in a plane perpendicular to the thickness direction is in the shape of an elongated strip, and the extending section is in the shape of a plate with a width direction parallel to a length direction of the second hole.

[0026] In this embodiment, the elongated second hole is used in conjunction with the plate-shaped extension section, so that the bonding area between the solder paste and the connecting bracket, and between the solder paste and the second hole can be greatly increased, and the bonding strength can be improved. At the same time, the cooperation between the elongated hole and the plate can also reliably limit the relative rotation of the first circuit board and the second circuit board around the connecting bracket, ensuring that the first circuit board and the second circuit board can maintain their relative positions to each other.

[0027] In a possible implementation manner, the connecting bracket is formed by bending a metal sheet.

[0028] In this embodiment, the connection bracket of the metal plate is conducive to improving the bonding strength between the connection bracket and the solder paste, and the plate has a larger bonding surface, which can also improve the bonding strength.

[0029] In a second aspect, an embodiment of the present application provides a circuit board assembly, including a first circuit board, a second circuit board, and a plurality of connecting brackets. The second circuit board is overlapped with the first circuit board along the thickness direction of the first circuit board; the second circuit board is provided with a plurality of second holes. The plurality of connecting brackets are arranged at intervals from each other; the connecting bracket is fixedly connected to the first circuit board, and the connecting bracket has an extension section, the extension section is matched with the second hole, and there is a second gap between the extension section and the second hole, and the second gap is filled with solder paste, and the solder paste connects the extension section and the hole wall of the second hole.

[0030] In the embodiment of the present application, the first circuit board and the second circuit board of the circuit board assembly are connected by a plurality of connecting brackets, and the connection reliability between the first circuit board and the second circuit board is relatively high.

[0031] In a third aspect, an embodiment of the present application provides an electronic device, comprising the aforementioned circuit board assembly.

[0032] The electronic device in the embodiment of the present application adopts the aforementioned circuit board assembly, the stacked connection of the circuit board assembly is firm and reliable, and the circuit board assembly occupies a small board space. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0034] Figure 1 A front view of an electronic device according to an embodiment of the present application;

[0035] Figure 2 for Figure 1 a side view of an electronic device;

[0036] Figure 3 A structural diagram of a circuit board assembly according to an embodiment of the present application;

[0037] Figure 4 for Figure 3 A cross-sectional view of the circuit board assembly along line AA;

[0038] Figure 5 for Figure 4 An expanded view of a circuit board assembly (solder paste not shown);

[0039] Figure 6 A cross-sectional view of a circuit board assembly according to another embodiment of the present application;

[0040] Figure 7 A structural diagram of a circuit board assembly according to another embodiment of the present application;

[0041] Figure 8 for Figure 7 A cross-sectional view of the circuit board assembly along line BB;

[0042] Fig. 9 for Figure 8 An expanded view of a circuit board assembly (solder paste not shown);

[0043] Fig.10 A structural diagram of a circuit board assembly according to another embodiment of the present application;

[0044] Fig.11 This is a structural diagram of a circuit board assembly according to another embodiment of the present application.

[0045] Description of main component symbols:

[0046] Electronic devices 100

[0047] Circuit Boards 101

[0048] Circuit board assembly 10

[0049] The first circuit board 11

[0050] Overlapping area 111

[0051] Non-overlapping area 112

[0052] The second circuit board 12

[0053] Connecting brackets 13a, 13b

[0054] Extension section 131

[0055] Extension 132

[0056] The first bending section 133

[0057] Connecting section 134

[0058] The second bending section 135

[0059] The third bending section 136

[0060] Overlapping section 137

[0061] Solder paste 14a, 14b, 14c

[0062] The first metallization layer 15

[0063] The second metallization layer 16

[0064] Fastener 17

[0065] First direction X

[0066] Second Line of Defense

[0067] Thickness direction Z

[0068] The first hole K1

[0069] The second hole K2

[0070] Threaded hole K3

[0071] Through hole K4

[0072] The first gap f1

[0073] The second gap f2

[0074] Gap between boards f3 DETAILED DESCRIPTION

[0075] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0076] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a centered element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may also be a centered element. When an element is considered to be "set on" another element, it may be directly set on the other element or there may also be a centered element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "or / and" used herein includes any and all combinations of one or more related listed items.

[0078] Some embodiments of the present application are described in detail. In the absence of conflict, the following embodiments and features of the embodiments can be combined with each other.

[0079] Example

[0080] See also Figure 1 and Figure 2 This embodiment provides an electronic device 100, which may be, for example, a mobile phone, a tablet computer, a wearable electronic device 100 (such as a smart watch, smart glasses, etc.), a laptop computer, etc. The electronic device 100 has a circuit board 101 therein, which is used for data processing and other functions of the electronic device 100. These circuit boards 101 may be, for example, a main board or a circuit board 101 that implements other data processing functions.

[0081] Some electronic devices 100 may not be able to accommodate a circuit board 101 with a large surface area due to limited installation space or other reasons (such as design reasons). In these scenarios, by stacking multiple circuit boards 101 along the thickness direction Z, the thickness space of the electronic device 100 can be utilized, thereby reducing the occupation of the circuit board 101 on the surface space of the electronic device 100 (i.e., the space in the plane perpendicular to the thickness direction Z of the electronic device 100).

[0082] like Figure 2 As shown in FIG. 1 , two circuit boards 101 are provided in the electronic device 100 , and the two circuit boards 101 are at least partially overlapped in the thickness direction Z. The circuit boards 101 may have electronic components (such as resistors, capacitors, diodes, etc.) arranged on one side or both sides, which is not limited here.

[0083] In some known technologies, the two circuit boards are stacked and connected by welding the pads between them. However, the connection strength of the pad welding is relatively low. In order to ensure the reliability of the connection between the circuit boards, a larger area or a larger number of pads are often required, which results in a lower utilization rate of the circuit board surface space and a greater impact on the layout of the electronic components on the circuit board.

[0084] In view of this, the present embodiment provides a circuit board assembly 10, which can realize the stacking of two or more circuit boards, the circuit connection strength between the circuit boards is high, the connection is reliable, and the connection area occupies less board space, and the board space utilization rate of the circuit board is high. The circuit board assembly 10 in the present embodiment will be exemplarily introduced below.

[0085] See also Figure 3-Figure 5 This embodiment provides a circuit board assembly 10, including a connecting bracket 13a and two circuit boards, the two circuit boards are a first circuit board 11 and a second circuit board 12, and the connecting bracket 13a is used to connect the first circuit board 11 and the second circuit board 12.

[0086] The second circuit board 12 is superimposed on the first circuit board 11 along the thickness direction Z of the first circuit board 11. The first circuit board 11 may be partially overlapped or completely overlapped. In this embodiment, the thickness direction Z of the first circuit board 11 is consistent with the thickness direction Z of the electronic device 100. The electrical connection between the first circuit board 11 and the second circuit board 12 can be achieved by the overlapping area of ​​the two, or by an additionally provided electrical connection structure, such as a flexible printed circuit (FPC), etc., which is not limited here.

[0087] The first circuit board 11 is provided with a first hole K1, and the second circuit board 12 is provided with a second hole K2, and the second hole K2 corresponds to and is connected to the first hole K1 along the thickness direction Z. The shapes of the first hole K1 and the second hole K2 can be circular holes, bar holes, rectangular holes, or holes of other shapes, which are not limited here.

[0088] The connecting bracket 13a includes an extending section 131, an extension section 132 and a first bent section 133. The extending section 131 is matched with the second hole K2, the extension section 132 extends from an end of the extending section 131 close to the first circuit board 11 into the first hole K1, and the first bent section 133 is connected to an end of the extending section 131 away from the extension section 132, and is bent relative to the extending section 131 to a surface of the second circuit board 12 away from the first circuit board 11.

[0089] There is a first gap f1 between the first hole K1 and the extension section 132, and the first gap f1 is filled with solder paste 14a, and the solder paste 14a connects the extension section 132 and the hole wall of the first hole K1. There is a second gap f2 between the extension section 131 and the second hole K2, and there is a second gap f2 between the extension section 131 and the second hole K2, and the second gap f2 is filled with solder paste 14b, and the solder paste 14b connects the extension section 131 and the hole wall of the second hole K2.

[0090] In this embodiment, the extension section 132 of the connecting bracket 13a is fixed in the first hole K1 of the first circuit board 11 by the solder paste 14a, so that the connecting bracket 13a and the first circuit board 11 can be fixedly connected; at the same time, the extension section 131 of the connecting bracket 13a is fixed in the second hole K2 by the solder paste 14b, so that the connecting bracket 13a and the second circuit board 12 can be fixedly connected, so that the first circuit board 11 and the second circuit board 12 can be reliably connected. Compared with the surface pad welding of the known technology, the connection mode of the solder paste 14a / 14b and the first circuit board 11 / the second circuit board 12 extends into the thickness range of the first circuit board 11 / the second circuit board 12, and the bonding strength is high. In addition, by providing the first hole K1 / the second hole K2, it is beneficial to increase the bonding area of ​​the solder paste 14a / 14b and the first circuit board 11 / the second circuit board 12, thereby also improving the bonding strength.

[0091] like Figure 3As shown in the figure, the projection of the second hole K2 in the plane perpendicular to the thickness direction Z is in the shape of an elongated strip. Correspondingly, the extension section 131 is in the shape of a plate with a width direction parallel to the length direction of the second hole K2. In this embodiment, the projection of the first hole K1 in the plane perpendicular to the thickness direction Z is also in the shape of an elongated strip, and correspondingly, the extension section 132 is in the shape of a plate with a width direction parallel to the length direction of the second hole K2. By using the elongated first hole K1 and the second hole K2 to cooperate with the plate-shaped extension section 132 and the extension section 131, the bonding area between the solder paste 14a / 14b and the connecting bracket 13a, and between the solder paste 14a / 14b and the first hole K1 and the second hole K2 can be greatly increased, and the bonding strength can be improved. At the same time, the cooperation between the elongated hole and the plate can also reliably limit the relative rotation of the first circuit board 11 and the second circuit board 12 around the connecting bracket 13a, ensuring that the first circuit board 11 and the second circuit board 12 can maintain their relative positions to each other.

[0092] In this embodiment, the connecting bracket 13a can be made of a metal plate (such as a stainless steel plate) bent into an L shape, wherein the extending section 131 and the extension section 132 together serve as one side of the L shape, and the first bent section 133 is bent relative to the extending section 131 to serve as the other side of the L shape. The extending section 131 and the extension section 132 do not need to have a clear dividing line, and the two are divided by the positions after being fixed to the first circuit board 11 and the second circuit board 12. The first bent section 133 can abut the second circuit board 12 to limit the second circuit board 12 from detaching from the first circuit board 11 in a direction away from the first circuit board 11, thereby improving the reliability of the connection. There can also be a gap between the first bent section 133 and the second circuit board 12, and solder paste 14a / 14b is set in the gap for welding to improve the connection reliability. Flexible materials can also be padded in the gap to play a buffering and protective role.

[0093] In this embodiment, the first hole K1 is a metallized hole, the hole wall of the first hole K1 has a first metallized layer 15 , the extension section 132 is made of metal material, and the solder paste 14 a is welded and connected between the first metallized layer 15 and the extension section 132 .

[0094] In this embodiment, the second hole K2 is a metallized hole, the hole wall of the second hole K2 has a second metallized layer 16 , the extending section 131 is made of metal material, and the solder paste 14 b is welded and connected between the second metallized layer 16 and the extending section 131 .

[0095] The metallization of the first hole K1 and the second hole K2 can adopt a conventional circuit board metallization hole process, which is not described here. The solder paste 14a / 14b can be first coated on the first hole K1 / the second hole K2, or it can be pre-coated on the surface of the connecting bracket 13a. After the connecting bracket 13a is matched to the first hole K1 and the second hole K2, the solder paste 14a / 14b is cured and welded to the connecting bracket 13a and the first metallization layer 15 / the second metallization layer 16 through a welding process, completing the connection between the metal bracket and the first circuit board 11 and the second circuit board 12.

[0096] In this embodiment, there may be an inter-board gap f3 between the first circuit board 11 and the second circuit board 12, which is used to accommodate the structure of electrical connection between the first circuit board 11 and the second circuit board 12 or some structures protruding from the board surface. In this case, the solder paste 14a in the first gap f1 and the solder paste 14b in the second gap f2 can be combined into one at the gap between the boards to improve the integrity of the structure.

[0097] See also Figure 6 In another embodiment, the cross section of the first hole K1 is larger than the cross section of the second hole K2, and the first hole K1 and the second hole K2 form a larger stepped hole on one side of the first hole K1. By forming the stepped hole, after the solder paste 14a / 14b is filled and soldered, the second circuit board 12 is limited between the step of the solder paste 14a / 14b and the first bending section 133 of the connecting bracket 13a, and the positioning and fixing is more reliable.

[0098] Figure 7-Figure 9 A circuit board assembly 10 according to another embodiment of the present application is shown. The circuit board assembly 10 includes a first circuit board 11 , a second circuit board 12 , a connecting bracket 13 b and a fastener 17 .

[0099] The first circuit board 11 includes an overlapping area 111 and a non-overlapping area 112 . The overlapping area 111 overlaps with the second circuit board 12 , and the non-overlapping area 112 extends out of the second circuit board 12 along the first direction X.

[0100] The second circuit board 12 is provided with a second hole K2 . The second hole K2 may be a strip-shaped hole with a length direction along a second direction, and the second direction is perpendicular to the first direction X and perpendicular to the thickness direction Z of the first circuit board 11 .

[0101] The connecting bracket 13 b includes an extending section 131 , an overlapping section 137 and a connecting section 134 .

[0102] The extending section 131 cooperates with the second hole K2, and there is a second gap f2 between the extending section 131 and the second hole K2. The second gap f2 is filled with solder paste 14b, and the solder paste 14b connects the hole wall of the extending section 131 and the second hole K2, thereby realizing the mutual fixed connection between the connecting bracket 13b and the second circuit board 12.

[0103] The overlapping section 137 is located on the side of the non-overlapping area 112 close to the second circuit board 12 along the thickness direction Z, and the overlapping section 137 is fixedly connected to the non-overlapping area 112. By connecting the overlapping section 137 to the non-overlapping area 112, the connection bracket 13b and the first circuit board 11 can be connected.

[0104] The connecting section 134 is connected between the extending section 131 and the overlapping section 137. In this embodiment, the connecting section 134 includes a second bending section 135 and a third bending section 136. The second bending section 135 is vertically connected to the end of the extending section 131 away from the first circuit board 11 and extends to the non-overlapping area 112 along the first direction X. The third bending section 136 is connected between the second bending section 135 and the overlapping section 137.

[0105] In this way, the first circuit board 11 and the second circuit board 12 are connected to the connecting bracket 13 b respectively, so that the first circuit board 11 and the second circuit board 12 can be connected to each other.

[0106] In this embodiment, the fastener 17 connects the non-overlapping area 112 and the overlapping section 137. Optionally, the overlapping section 137 is provided with a threaded hole K3, the non-overlapping area 112 is provided with a through hole K4, the fastener 17 is a screw, and the fastener 17 is inserted through the through hole K4 and is threadedly connected to the threaded hole K3. During installation, the position of the connecting bracket 13b can be determined by fastening the fastener 17 first, and then soldering of the solder paste 14b can be performed, which is more convenient.

[0107] In other embodiments, the overlapping section 137 and the non-overlapping area 112 may also be fixed to each other by snapping or other connection methods.

[0108] In this embodiment, optionally, the overlapping section 137 and the non-overlapping area 112 are further connected by welding through solder paste 14 c to further improve the connection reliability between the overlapping section 137 and the non-overlapping area 112 .

[0109] See also Fig.10 In another embodiment, the first circuit board 11 is also provided with a first hole K1, the connecting bracket 13b includes an extension section 132 extending from the insertion section 131 away from the second circuit board 12, the extension section 132 extends into the first hole K1, a first gap f1 is provided between the first hole K1 and the extension section 132, the first gap f1 is filled with solder paste 14a, and the solder paste 14a connects the extension section 132 and the hole wall of the first hole K1. With this structure, the first circuit board 11 and the second circuit board 12 are more reliably connected.

[0110] also, Figure 7-10 In the embodiment shown, the shapes of the first hole K1 and the second hole K2 can also be Figure 3-Figure 6In the embodiment shown, for example, a long strip hole may be provided, and the corresponding connecting bracket 13b is formed by bending a metal plate. The first hole K1 and the second hole K2 may also be metallized holes, which will not be described in detail here.

[0111] See also Fig.11 In another embodiment, the first circuit board 11 and the second circuit board 12 can be connected by a plurality of connecting brackets 13a or 13b. For example, when the first circuit board 11 and the second circuit board 12 are large in size, the connection reliability can be further ensured by connecting with a plurality of connecting brackets 13a or 13b. Fig.11 The first circuit board 11 and the second circuit board 12 shown in the figure are connected by two different connecting brackets, one of which is connected by the above-mentioned Figure 3-Figure 6 The connecting bracket 13a shown in the figure, and the other one adopts the above Figure 7-10 The connecting bracket 13b is shown.

[0112] In other embodiments, multiple Figure 3-Figure 6 The structure or multiple Figure 7-10 The structure shown is used to achieve the stacking connection of the circuit board assembly 10, which is not limited here.

[0113] In other embodiments, except for the embodiment of the present invention, Figure 3-Figure 11 In addition to the various connection methods shown, the first circuit board 11 and the second circuit board 12 may also be additionally provided with a pad welding connection method in the known technology.

[0114] In addition, it should be noted that the stacking method of the circuit board assembly 10 of this embodiment can also be applied to the connection of three or more circuit boards. For example, for three stacked circuit boards, the extension section 132 of the connecting bracket 13a can be extended into the holes of more circuit boards and connected by solder paste welding, thereby realizing the stacking of more than three circuit boards. Of course, this connection method can also be used to connect each adjacent circuit board of any number of circuit boards, thereby realizing the interconnection of all circuit boards.

[0115] Based on the above description, the circuit board assembly 10 in this embodiment is connected by soldering of holes (such as the first hole K1 and the second hole K2) and the connecting bracket 13a / 13b with solder paste, which can ensure the connection reliability between the connecting bracket 13a / 13b and the circuit board (such as the first circuit board 11 and the second circuit board 12). Compared with the pad welding structure of the known technology, it occupies less board space and has a high circuit board connection strength.

[0116] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A circuit board assembly, characterized in that: include: a first circuit board; A second circuit board is overlapped with the first circuit board along the thickness direction of the first circuit board; the second circuit board is provided with a second hole; A connecting bracket is fixedly connected to the first circuit board, and the connecting bracket has an extension section, the extension section cooperates with the second hole, and a second gap is formed between the extension section and the second hole, the second gap is filled with solder paste, and the solder paste connects the extension section and the hole wall of the second hole.

2. The circuit board assembly according to claim 1, characterized in that: The first circuit board is provided with a first hole, and the second hole corresponds to the first hole along the thickness direction and is connected to each other; The connecting bracket also includes an extension section, which extends from the insertion section near one end of the first circuit board into the first hole. There is a first gap between the first hole and the extension section. The first gap is filled with solder paste, and the solder paste connects the extension section and the hole wall of the first hole.

3. The circuit board assembly according to claim 2, characterized in that: The connecting bracket further includes a first bending section, which is connected to one end of the extending section away from the extending section and is bent relative to the extending section to a surface of the second circuit board on a side away from the first circuit board.

4. The circuit board assembly according to claim 2, wherein: The cross section of the first hole is larger than the cross section of the second hole, and the first hole and the second hole form a larger stepped hole on one side of the first hole.

5. The circuit board assembly according to claim 2, wherein: The second hole is a metallized hole, the hole wall of the second hole has a second metallized layer, the insertion section is made of a metal material, and the solder paste is connected between the second metallized layer and the insertion section by welding; and / or, The first hole is a metallized hole, the hole wall of the first hole has a first metallized layer, the extension section is made of a metal material, and the solder paste is connected between the first metallized layer and the extension section by welding.

6. The circuit board assembly according to claim 1, characterized in that: The first circuit board comprises an overlapping area and a non-overlapping area, the overlapping area overlaps with the second circuit board, and the non-overlapping area extends out of the second circuit board along a first direction; The connecting bracket also includes an overlapping section and a connecting section, wherein the overlapping section is located on the side of the non-overlapping area close to the second circuit board along the thickness direction, and the overlapping section is fixedly connected to the non-overlapping area; the connecting section is connected between the overlapping section and the extending section.

7. The circuit board assembly according to claim 6, characterized in that: The circuit board assembly also includes a fastener connecting the non-overlapping area and the overlapping section.

8. The circuit board assembly according to claim 7, characterized in that: The overlapping section is provided with a threaded hole, the non-overlapping area is provided with a through hole, the fastener is a screw, and the fastener penetrates through the through hole and is threadedly connected to the threaded hole.

9. The circuit board assembly according to claim 6, characterized in that: The connecting section includes a second bending section and a third bending section; The second bending section is vertically connected to an end of the extending section away from the first circuit board and extends along the first direction to the non-overlapping area; The third bending section is connected between the second bending section and the overlapping section.

10. The circuit board assembly according to claim 7, characterized in that: The overlapping section and the non-overlapping area are connected by solder paste welding.

11. The circuit board assembly according to claim 1, characterized in that: The projection of the second hole in a plane perpendicular to the thickness direction is in the shape of a long strip; The extending section is in the shape of a plate with a width direction parallel to a length direction of the second hole.

12. The circuit board assembly according to claim 1, wherein: The connecting bracket is formed by bending a metal plate.

13. A circuit board assembly, characterized in that: include: a first circuit board; A second circuit board is overlapped with the first circuit board along the thickness direction of the first circuit board; the second circuit board is provided with a plurality of second holes; A plurality of connecting brackets are arranged at intervals from each other; the connecting brackets are fixedly connected to the first circuit board, and the connecting brackets have an extension section, the extension section cooperates with the second hole, and a second gap is formed between the extension section and the second hole, the second gap is filled with solder paste, and the solder paste connects the extension section and the hole wall of the second hole.

14. An electronic device, characterized in that: include: The circuit board assembly according to any one of claims 1 to 13.

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