Breathable reinforcing plate
By designing breathable reinforcement boards in electronic products, using components such as thermal pads and reinforcement mesh to form conductive and breathable gaps, the problem of thermal energy dissipation of FPC flexible circuit boards is solved, and efficient heat dissipation and stable operation of components is achieved. .
Patent Information
- Application Number
- CN202420585960.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2034-03-25
AI Technical Summary
The reinforcement board of FPC flexible circuit board in existing electronic products is too dense, making it difficult to quickly dissipate heat energy, and the components are difficult to undergo normal heat exchange in a closed environment, resulting in the components being easily heated up after power on.
Design a breathable reinforcement plate, including a protective mechanism and a thermal conductivity mechanism, and conduction is formed by installing thermal pads, reinforcement mesh, main conductor refrigeration sheets, secondary semiconductor refrigeration sheets, main sleeves and secondary sleeves between the reinforcement plates to form conduction. And breathable gaps, combined with the cover, provide compression protection, ensuring rapid dissipation of heat energy and circulating air permeability of components.
It effectively improves the heat dissipation rate and breathability of the components, ensures the stable load-bearing and constant temperature operation of the components during use, and avoids the problem of overheating of the plate.
Smart Images
Figure CN222192640U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of reinforcement plates, in particular to a breathable reinforcement plate. Background Art
[0002] The reinforcing plates mainly include stainless steel reinforcing plates, aluminum foil reinforcing plates, polyester reinforcing plates, polyimide reinforcing plates, glass fiber reinforcing plates, polytetrafluoroethylene reinforcing plates, and polycarbonate reinforcing plates, and are widely used in FPC flexible circuit boards in electronic products.
[0003] At present, the reinforcing plate used in FPC flexible circuit boards in electronic products is used as a supporting platform for various components. When it is put into use, the long-term operation of the components with power on can easily cause the board to heat up quickly. However, the board used in FPC flexible circuit boards in existing electronic products is too dense, and it is difficult for the board to quickly dissipate the conducted heat energy. In addition, various components densely distributed on the board are difficult to exchange heat normally with the outside world in a relatively closed environment.
[0004] For the reinforcement plates used in FPC flexible circuit boards in electronic products, how to improve the heat dissipation rate of the board to various assembled components and at the same time enhance the air permeability of the board to various components are technical difficulties that need to be solved. Utility Model Content
[0005] The utility model aims to solve one of the technical problems existing in the prior art or related technology.
[0006] To this end, the technical solution adopted in this utility model is:
[0007] A breathable reinforcement plate includes a protective mechanism and a heat-conducting mechanism installed in the protective mechanism, wherein the protective mechanism includes a horizontally placed first reinforcement plate, a second reinforcement plate located directly below the first reinforcement plate, and four heat-conducting pads fixedly installed between the first reinforcement plate and the second reinforcement plate, and the heat-conducting mechanism includes a reinforcement net installed between the first reinforcement plate and the second reinforcement plate, a main semiconductor cooling plate fixedly installed in a rectangular transverse groove on one side of the reinforcement net, an auxiliary semiconductor cooling plate fixedly installed in a rectangular transverse groove on the other side of the reinforcement net, four main sleeves installed on the four corners of the reinforcement net, a plurality of auxiliary sleeves evenly installed inside the reinforcement net, a first cover movably installed on the top of the auxiliary sleeve and penetrating into the first reinforcement plate, and a second cover movably installed on the bottom of the auxiliary sleeve and penetrating into the second reinforcement plate.
[0008] In a preferred example, the utility model can be further configured as follows: flat rectangular slats are fixedly installed on four sides of the first reinforcement plate and the second reinforcement plate, and semicircular slots are opened at both ends of the rectangular slats, and holes symmetrically distributed along the vertical direction are opened inside the first reinforcement plate and the second reinforcement plate.
[0009] By adopting the above technical solution, four thermally conductive pads are used to fix and assemble the adjacent first reinforcement plates and the second reinforcement plates. At this time, a gap for conducting heat energy and improving the air permeability of the components is formed between the first reinforcement plate and the second reinforcement plate, and the gap is connected with the air grooves opened inside the four thermally conductive pads.
[0010] In a preferred example, the utility model can be further configured as follows: the thermal pad is L-shaped as a whole, and evenly distributed air grooves are opened inside the thermal pad, and the arc-shaped ends at both ends of the thermal pad are adapted to the semicircular slots of the rectangular strips.
[0011] By adopting the above technical solution, four thermally conductive pads are respectively installed on the sides of the first reinforcement plate and the second reinforcement plate. After the combination, the rectangular strips installed on the sides of the first reinforcement plate and the second reinforcement plate can cooperate with the four thermally conductive pads to conduct heat energy.
[0012] In a preferred example, the utility model can be further configured as follows: the reinforcing mesh is made of stainless steel material.
[0013] By adopting the above technical solution, utilizing the structure and strength of the reinforcing net itself, and cooperating with the reinforcing net to bear the pressure of the combined first reinforcing plate and the second reinforcing plate, when various components penetrate into the interior of the combined first cover and the second cover, the components welded to a fixed state can obtain sufficiently stable load-bearing during use.
[0014] In a preferred example, the utility model can be further configured as follows: the tops of the main semiconductor refrigeration plate and the auxiliary semiconductor refrigeration plate are both connected with two terminal posts that penetrate to the outside of the second reinforcement plate, and pressure-bearing gaskets are installed outside the two adjacent terminal posts.
[0015] By adopting the above technical solution, the terminal posts on the top of the main conductor cooling plate and the auxiliary semiconductor cooling plate are passed through to the top of the second reinforcement plate. At this time, the top and bottom of the main conductor cooling plate and the auxiliary semiconductor cooling plate will be respectively attached to the surface of the first reinforcement plate and the second reinforcement plate. At the same time, the reinforcement net is used to bridge the gap between the first reinforcement plate and the second reinforcement plate, so as to ensure that the plate can quickly conduct the heat energy generated after the operation of the component.
[0016] In a preferred example, the utility model can be further configured as follows: the first cover and the second cover are overall T-shaped structures, and the circular column head at the top of the first cover is adapted to pass through the concave hole at the top of the second reinforcement plate, and the circular column head at the bottom of the second cover is adapted to pass through the concave hole at the bottom of the first reinforcement plate.
[0017] By adopting the above technical solution, the first cover and the second cover are respectively penetrated along the concave holes on the outside of the second reinforcement plate and the first reinforcement plate. At this time, the bottom end of the first cover and the top end of the second cover can be inserted into the two end holes of the auxiliary sleeve. As the pole inside the component penetrates into the inside of the first cover and the second cover after combination, the first cover and the second cover can cooperate with the auxiliary sleeve to provide anti-crack protection for the hole walls inside the second reinforcement plate and the first reinforcement plate.
[0018] By adopting the above technical solution, the beneficial effects achieved by the utility model are as follows:
[0019] 1. The utility model provides notches for welding points inside the first reinforcement plate and the second reinforcement plate, installs four open and breathable thermally conductive pads between the first reinforcement plate and the second reinforcement plate, and installs a reinforcing net in the gap between the first reinforcement plate and the second reinforcement plate. When the main conductor cooling fins and the auxiliary semiconductor cooling fins are fixedly installed in the rectangular transverse grooves reserved on both sides of the reinforcing net, as the temperature of the components continues to rise after welding, the main conductor cooling fins and the auxiliary semiconductor cooling fins can cooperate with the reinforcing net to quickly dissipate the heat energy on the combined first reinforcement plate and the second reinforcement plate, and at the same time cooperate with the four thermally conductive pads to connect with the gap between the first reinforcement plate and the second reinforcement plate, so that the components can form a stable breathable state through the plate body.
[0020] 2. The utility model fixes and installs a plurality of auxiliary sleeves distributed in a matrix inside the reinforcing net, and installs a first cover and a second cover symmetrically distributed along the vertical direction in the end holes at the top and bottom of the auxiliary sleeves. At this time, the first cover and the second cover respectively provide pressure protection for the exposed hole walls inside the first reinforcement plate and the second reinforcement plate. At this time, the assembled first reinforcement plate and the second reinforcement plate cooperate with the reinforcing net to quickly dissipate the heat energy on the components, and can also provide the ability of circulating ventilation for adjacent components. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the utility model when in use;
[0022] Figure 2 It is a schematic diagram of the protection mechanism of the utility model;
[0023] Figure 3 For this utility model Figure 2 The enlarged schematic diagram of point A in the middle;
[0024] Figure 4 It is a schematic diagram of the heat conduction mechanism of the utility model;
[0025] Figure 5 For this utility model Figure 4 A magnified schematic diagram of point B in the middle.
[0026] Reference numerals:
[0027] 100, protection mechanism; 110, first reinforcement plate; 120, second reinforcement plate; 130, thermal conductive pad;
[0028] 200, heat conduction mechanism; 210, reinforcing net; 220, main semiconductor cooling plate; 230, auxiliary semiconductor cooling plate; 240, main sleeve; 250, auxiliary sleeve; 260, first cover; 270, second cover. DETAILED DESCRIPTION
[0029] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.
[0030] It should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present invention.
[0031] A breathable reinforcement plate provided by some embodiments of the utility model is described below in conjunction with the accompanying drawings.
[0032] Embodiment 1:
[0033] Combination Figure 1-Figure 5 As shown, the utility model provides a breathable reinforcement plate, which includes a protection mechanism 100 and a heat conduction mechanism 200 installed in the protection mechanism 100.
[0034] The protection mechanism 100 includes a first reinforcement plate 110 , a second reinforcement plate 120 , and a thermally conductive pad 130 . The thermally conductive mechanism 200 includes a reinforcing mesh 210 , a main semiconductor cooling plate 220 , an auxiliary semiconductor cooling plate 230 , a main sleeve 240 , an auxiliary sleeve 250 , a first cover 260 , and a second cover 270 .
[0035] Specifically, the second reinforcement plate 120 is located directly below the first reinforcement plate 110, four thermally conductive pads 130 are fixedly installed between the first reinforcement plate 110 and the second reinforcement plate 120, the reinforcement net 210 is installed between the first reinforcement plate 110 and the second reinforcement plate 120, the main semiconductor cooling plate 220 is fixedly installed in the rectangular transverse groove on one side of the reinforcement net 210, the auxiliary semiconductor cooling plate 230 is fixedly installed in the rectangular transverse groove on the other side of the reinforcement net 210, four main sleeves 240 are installed on the four corners of the reinforcement net 210, and multiple auxiliary sleeves 250 are evenly installed inside the reinforcement net 210. The first cover 260 that penetrates into the first reinforcement plate 110 is movably installed on the top of the auxiliary sleeve 250, and the second cover 270 that penetrates into the second reinforcement plate 120 is movably installed on the bottom of the auxiliary sleeve 250.
[0036] By installing four open and breathable thermal pads 130 between the first reinforcement plate 110 and the second reinforcement plate 120, and installing a reinforcing net 210 in the gap between the first reinforcement plate 110 and the second reinforcement plate 120, when the main conductor cooling sheet 220 and the auxiliary semiconductor cooling sheet 230 are fixedly installed in the rectangular transverse grooves reserved on both sides of the reinforcing net 210, as the temperature of the components continues to rise after welding, the main conductor cooling sheet 220 and the auxiliary semiconductor cooling sheet 230 can cooperate with the reinforcing net 210 to quickly dissipate the heat energy on the combined first reinforcement plate 110 and the second reinforcement plate 120, and at the same time At the same time, the gaps between the four thermally conductive pads 130 and the first reinforcement plate 110 and the second reinforcement plate 120 are connected, and the first cover 260 and the second cover 270 distributed vertically symmetrically are installed in the end holes at the top and bottom of the auxiliary sleeve 250. At this time, the first cover 260 and the second cover 270 will respectively provide pressure protection for the exposed hole walls inside the first reinforcement plate 110 and the second reinforcement plate 120. At this time, the assembled first reinforcement plate 110 and the second reinforcement plate 120 cooperate with the reinforcement net 210 to quickly dissipate the heat energy on the components, and provide the ability of circulation and ventilation to the adjacent components.
[0037] Embodiment 2:
[0038] Combination Figure 1-Figure 3 As shown, on the basis of the first embodiment, flat rectangular slats are fixedly installed on the four sides of the first reinforcement plate 110 and the second reinforcement plate 120, and semicircular slots are provided at both ends of the rectangular slats, and holes symmetrically distributed along the vertical direction are provided inside the first reinforcement plate 110 and the second reinforcement plate 120, the thermal pad 130 is an overall L-shaped structure, and evenly distributed air grooves are provided inside the thermal pad 130, and the arc-shaped ends at both ends of the thermal pad 130 are adapted to the semicircular slots of the rectangular slats.
[0039] Four thermally conductive pads 130 are used to fix and assemble the adjacent first reinforcement plate 110 and the second reinforcement plate 120. At this time, a gap for conducting heat energy and improving the air permeability of the components will be formed between the first reinforcement plate 110 and the second reinforcement plate 120. With the connection of the gaps by the air grooves opened inside the four thermally conductive pads 130, a convection state will be formed inside and outside the plate. The four thermally conductive pads 130 are respectively installed on the sides of the first reinforcement plate 110 and the second reinforcement plate 120. At this time, the rectangular strips installed on the sides of the first reinforcement plate 110 and the second reinforcement plate 120 after assembly can cooperate with the four thermally conductive pads 130 to conduct heat energy, and finally provide heat dissipation for the poles of the components immersed in the gaps of the first reinforcement plate 110 and the second reinforcement plate 120, thereby effectively ensuring that the plate can provide heat dissipation capacity and air permeability for various assembled components.
[0040] Embodiment three:
[0041] Combination Figure 2-Figure 5 As shown, on the basis of Example 1, the reinforcing mesh 210 is made of stainless steel material, the tops of the main semiconductor refrigeration plate 220 and the auxiliary semiconductor refrigeration plate 230 are connected with two terminal posts which penetrate to the outside of the second reinforcement plate 120, and pressure-bearing gaskets are installed on the outside of the two adjacent terminal posts, the first cover 260 and the second cover 270 are T-shaped as a whole, and the circular column head at the top of the first cover 260 is adapted to penetrate into the concave hole at the top of the second reinforcement plate 120, and the circular column head at the bottom of the second cover 270 is adapted to penetrate into the concave hole at the bottom of the first reinforcement plate 110.
[0042] By utilizing the structure and strength of the reinforcing net 210 itself and cooperating with the reinforcing net 210 to bear the pressure of the first reinforcing plate 110 and the second reinforcing plate 120 after the combination, when various components penetrate into the interior of the first cover 260 and the second cover 270 after the combination, the components welded to the fixed state can obtain sufficiently stable bearing when in use, and the terminal posts at the top of the main conductor cooling plate 220 and the auxiliary semiconductor cooling plate 230 are penetrated to the top of the second reinforcing plate 120. At this time, the top and bottom of the main conductor cooling plate 220 and the auxiliary semiconductor cooling plate 230 will be respectively attached to the surface of the first reinforcing plate 110 and the second reinforcing plate 120, and at the same time, the reinforcing net 210 is used to cross the first reinforcing plate 110 and the second reinforcing plate 120, so as to ensure that the plate can quickly conduct the heat energy generated by the operation of the components, thereby ensuring that various components are operated in a relatively constant temperature state;
[0043] The first cover 260 and the second cover 270 cooperate to penetrate along the concave holes on the outside of the second reinforcement plate 120 and the first reinforcement plate 110 until they are fixed. At this time, the bottom end of the first cover 260 and the top end of the second cover 270 can be inserted into the two end holes of the auxiliary sleeve 250. As the pole inside the component penetrates into the inside of the first cover 260 and the second cover 270 after assembly, the first cover 260 and the second cover 270 can cooperate with the auxiliary sleeve 250 to provide anti-crack protection for the hole walls inside the second reinforcement plate 120 and the first reinforcement plate 110, thereby ensuring the safety of the first reinforcement plate 110 and the second reinforcement plate 120 bodies.
[0044] The working principle and use process of the utility model are as follows: a plurality of auxiliary sleeves 250 are fixedly installed in the slots reserved inside the reinforcing net 210 in advance, and four main sleeves 240 are respectively installed in the holes on the four sides of the reinforcing net 210, and then the main semiconductor cooling sheet 220 and the auxiliary semiconductor cooling sheet 230 are respectively installed in the rectangular transverse grooves reserved on both sides of the reinforcing net 210, at this time, the first reinforcing plate 110 and the second reinforcing plate 120 are fixedly installed on the top and bottom of the reinforcing net 210 through four thermal pads 130, and then a plurality of first covers 260 and a plurality of second covers 270 are assembled along the ports of the plurality of auxiliary sleeves 250;
[0045] During use, when the component is welded to the outside of the first reinforcement plate 110 and the second reinforcement plate 120 along the combined first cover 260 and the second cover 270, the exposed poles on the component can be welded along the inner cavity of the first cover 260 and the second cover 270. At this time, the combined first cover 260 and the second cover 270 can provide pressure protection for the component poles while preventing the component from being squeezed by external force and causing cracks to the exposed groove side walls of the first reinforcement plate 110 and the second reinforcement plate 120. At this time, the reinforcing mesh 210 placed horizontally between the first reinforcement plate 110 and the second reinforcement plate 120 can provide heat dissipation protection for the operation of the component. At the same time, the first reinforcement plate 110 and the second reinforcement plate 120 with a built-in cavity structure can also improve the air permeability of the entire plate.
[0046] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. A breathable reinforcement plate, characterized in that: It comprises a protection mechanism (100) and a heat conduction mechanism (200) installed in the protection mechanism (100); The protection mechanism (100) comprises a first reinforcing plate (110) placed horizontally, a second reinforcing plate (120) located directly below the first reinforcing plate (110), and four heat-conducting pads (130) fixedly installed between the first reinforcing plate (110) and the second reinforcing plate (120); The heat conduction mechanism (200) comprises a reinforcing net (210) installed between a first reinforcing plate (110) and a second reinforcing plate (120), a main semiconductor cooling plate (220) fixedly installed in a rectangular transverse groove on one side of the reinforcing net (210), a secondary semiconductor cooling plate (230) fixedly installed in a rectangular transverse groove on the other side of the reinforcing net (210), four main sleeves (240) installed on four corners of the reinforcing net (210), a plurality of secondary sleeves (250) uniformly installed inside the reinforcing net (210), a first cover (260) movably installed on the top of the secondary sleeve (250) and penetrating into the first reinforcing plate (110), and a second cover (270) movably installed on the bottom of the secondary sleeve (250) and penetrating into the second reinforcing plate (120).
2. A breathable reinforcement plate according to claim 1, characterized in that: Flat rectangular strips are fixedly installed on the four sides of the first reinforcing plate (110) and the second reinforcing plate (120), and semicircular slots are opened at both ends of the rectangular strips, and holes symmetrically distributed along the vertical direction are opened inside the first reinforcing plate (110) and the second reinforcing plate (120).
3. A breathable reinforcement plate according to claim 1, characterized in that: The thermal conductive pad (130) is in an L-shaped structure as a whole, and evenly distributed air grooves are provided inside the thermal conductive pad (130), while arc-shaped ends at both ends of the thermal conductive pad (130) are adapted to fit into the semicircular slots of the rectangular strip.
4. A breathable reinforcement plate according to claim 1, characterized in that: The reinforcing mesh (210) is made of stainless steel.
5. A breathable reinforcement plate according to claim 1, characterized in that: The tops of the main semiconductor refrigeration plate (220) and the auxiliary semiconductor refrigeration plate (230) are both connected to two terminal posts that penetrate to the outside of the second reinforcement plate (120), and pressure-bearing gaskets are installed outside the two adjacent terminal posts.
6. A breathable reinforcement plate according to claim 1, characterized in that: The first cover (260) and the second cover (270) are in a T-shaped structure as a whole, and the circular column head at the top of the first cover (260) is adapted to pass through the concave hole at the top of the second reinforcement plate (120), while the circular column head at the bottom of the second cover (270) is adapted to pass through the concave hole at the bottom of the first reinforcement plate (110).