Etching device for circuit board production

By using the atomized mesh plate to buffer the impact force of the water flow in the circuit board etching device, the problem of copper sheet damage caused by the direct impact of the etching liquid is solved, and a more efficient etching effect is achieved, and it is suitable for circuit board processing of various sizes.

CN222192684UActive Publication Date: 2024-12-17PANZHIHUA PANKE ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202323464076.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2023-12-19
Publication Date
2024-12-17
Estimated Expiration
2033-12-19

AI Technical Summary

Technical Problem

In the existing circuit board etching device, the etching liquid directly impacts the circuit surface, causing the copper sheet to fall off or be damaged, affecting the etching effect.

Method used

An etching device including a mounting frame, a conveyor belt and atomized mesh plate is designed to buffer the impact of water flow through the atomized mesh plate, reduce the impact on the copper sheet, and replace the atomized mesh plate and support frame of different sizes to adapt to the Different sizes of circuit boards.

Benefits of technology

It effectively reduces the peeling or damage of copper sheets, improves the etching effect, and is suitable for processing circuit boards of different sizes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an etching device for circuit board production, belonging to the technical field of circuit board etching, the etching device for circuit board production comprises a mounting rack and a conveyor belt arranged on the mounting rack, the mounting rack is sleeved with an etching box, the outer wall of the conveyor belt is fixedly provided with mounting blocks at equal intervals, and the mounting blocks are arranged on the mounting rack. A supporting frame is detachably fixed to the conveying belt through a mounting block, a circuit board containing groove is formed in the top end of the supporting frame, connecting grooves are symmetrically formed in the side walls of the supporting frame, a connecting plate is fixed to the supporting frame through the connecting grooves, positioning grooves communicated with the connecting grooves are formed in the outer wall of the supporting frame, and an atomization net plate is fixed to the connecting plate; the side wall of the connecting plate is fixedly provided with a connecting block which is inserted into the connecting groove in a matched mode, the connecting block is fixedly provided with an elastic frame which is connected with the positioning groove in a clamped mode, and the etching device for circuit board production greatly reduces the situation that a copper sheet falls off or is damaged when the copper sheet is influenced by impact force.
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Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board etching, and in particular relates to an etching device for circuit board production. Background Art

[0002] Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The main advantage of using circuit boards is that they greatly reduce wiring and assembly errors, and improve the level of automation and production labor rate. According to the number of layers of the circuit board, it can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards and other multi-layer circuit boards. Since printed circuit boards are not general terminal products, the definition of the name is slightly confusing. For example, the motherboard used in personal computers is called the mainboard, and cannot be directly called a circuit board. Although there are circuit boards in the motherboard, they are not the same. Therefore, when evaluating the industry, the two are related but cannot be said to be the same. Because there are integrated circuit parts loaded on the circuit board, the news media calls it an IC board, but in fact it is not equivalent to a printed circuit board. The printed circuit board we usually refer to is a bare board, that is, a circuit board without components. At present, the typical process of printed circuit board (PCB) processing adopts "graphic electroplating method". That is, a layer of lead-tin anti-corrosion layer is first pre-plated on the copper foil part of the outer layer of the board that needs to be retained, that is, the graphic part of the circuit, and then the remaining copper foil is corroded by chemical means, which is called etching. This type of pattern electroplating is characterized by the copper layer only existing under the lead-tin anti-corrosion layer. Another process method is to plate copper on the entire board, and the part outside the photosensitive film is only tin or lead-tin anti-corrosion layer. This process is called "full-board copper plating process". Compared with pattern electroplating, the biggest disadvantage of full-board copper plating is that copper must be plated twice everywhere on the board surface and it must be corroded away during etching.

[0003] The patent with application number 202122305543.2 discloses an etching device for printed circuit board production, including a fuselage, a controller, a conveying device, a fixing frame, a circuit board, a spraying device, a wastewater tank, a liquid storage tank and a water pump. A controller is provided in the middle of the front side of the fuselage, a display screen is provided above the controller, a baffle is provided on the left and right sides of the fuselage, a conveying device is provided in the fuselage, the conveying device passes through the right baffle into the fuselage and passes out from the left baffle, a conveying plate is provided on the upper surface of the conveying device, and a row of evenly spaced fixing frames are provided on the conveying plate. Due to the provision of a high-pressure water pump and a high-pressure nozzle, the high-pressure nozzle sprays etching liquid on the circuit board at high speed at all times, and the etching liquid that has not reacted subsequently washes away the etching liquid that has reacted.

[0004] The above technical solution only flushes the circuit board embedded in the fixing frame through a high-pressure nozzle, and washes away the reacted etching liquid during the flushing process. Since the etching liquid directly impacts the surface of the circuit surface, the etched copper sheet is easily affected by the impact force during the flushing process and may fall off or be damaged, thereby affecting the etching effect of the circuit board. Utility Model Content

[0005] (1) Technical issues to be resolved

[0006] In view of the shortcomings of the prior art, the purpose of the utility model is to provide an etching device for circuit board production, which aims to solve the problem in the prior art that the etching liquid directly impacts the surface of the circuit surface, resulting in the etched copper sheet being easily affected by the impact force during the flushing process and falling off or being damaged, thereby affecting the etching effect of the circuit board.

[0007] (2) Technical solution

[0008] In order to solve the above technical problems, the utility model provides an etching device for circuit board production, which includes a mounting frame and a conveyor belt arranged on the mounting frame, the mounting frame is sleeved with an etching box, the outer wall of the conveyor belt is equidistantly fixed with mounting blocks, and the conveyor belt is detachably fixed with a support frame through the mounting blocks, the top of the support frame is provided with a circuit board accommodating groove, and the side walls of the support frame are symmetrically provided with connecting grooves, and a connecting plate is fixed through the connecting groove, wherein the outer wall of the support frame is provided with a positioning groove connected to the connecting groove, an atomizing mesh plate is fixed on the connecting plate, and the side walls of the connecting plate are fixed with connecting blocks that are fitted and plugged in the connecting groove, and an elastic frame that is clamped with the positioning groove is fixed on the connecting block.

[0009] When the etching device for circuit board production of the present technical solution is used, a circuit board accommodating groove is provided at the top of the support frame, and a connecting groove is provided on the side wall of the support frame. The connecting blocks on the two connecting plates are inserted into the connecting groove and squeeze the elastic frame on the side wall of the connecting block to deform until the connecting block is completely inserted into the connecting groove. The side wall of the elastic frame is engaged with the positioning groove, so that the connecting plate and the atomizing screen are fixed on the side wall of the support frame. The etching liquid of the spray disc contacts the surface of the atomizing screen after being sprayed out, and the atomized etching liquid is generated to rinse the etched circuit board surface. Most of the impact force of the water flow is buffered by the atomizing screen, thereby greatly reducing the copper sheet from being damaged. The impact force affects the situation of falling off or damage; the elastic frame is squeezed from the side wall of the support frame to be removed from the positioning groove, and the connecting frame is slidably inserted in the connecting groove, thereby replacing the atomizing screen plates with different apertures, and at the same time, the mounting block at the top of the conveyor belt is matched and inserted in the mounting groove at the top of the support frame, and the elastic plates in the telescopic grooves at both ends of the mounting block push the fastening blocks to be matched and inserted in the fastening grooves, so that the support frame remains fixed at the top of the conveyor belt. After the fastening blocks are squeezed from the side wall of the support frame to be removed from the fastening groove, the support frame is slid and disassembled from the top of the conveyor belt, thereby replacing the support frame with circuit board accommodating grooves of different sizes, which is suitable for etching processing of circuit boards of different sizes.

[0010] Preferably, legs are fixed on both sides of the bottom end surface of the mounting frame, and a motor for driving the conveyor belt is installed on the side wall of the mounting frame.

[0011] Furthermore, a water inlet pipe with a U-shaped structure is fixed to the side wall of the etching box, and a spray plate extending into the etching box is installed at the top end of the water inlet pipe.

[0012] Furthermore, the spray disc corresponds to the atomizing screen, and baffles are embedded and fixed at both ends of the etching box.

[0013] Furthermore, a mounting groove is provided at the bottom end of the support frame, and the mounting block is inserted into the mounting groove.

[0014] Furthermore, both ends of the support frame are provided with fastening grooves connected with the mounting grooves, and both ends of the mounting block are provided with telescopic grooves.

[0015] Furthermore, an elastic plate is embedded and fixed in the telescopic slot, and a fastening block is elastically mounted via the elastic plate, and one end of the fastening block extending out of the telescopic slot is inserted into the fastening slot.

[0016] (3) Beneficial effects

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. The utility model has a circuit board accommodating groove at the top of the support frame, and a connecting groove on the side wall of the support frame. The connecting blocks on the two connecting plates are matched and inserted in the connecting grooves, and the elastic frame on the side wall of the connecting block is squeezed to deform until the connecting block is completely inserted into the connecting groove. The side wall of the elastic frame is engaged with the positioning groove, so that the connecting plate and the atomizing mesh plate are fixed on the side wall of the support frame. The etching liquid of the spray disc contacts the surface of the atomizing mesh plate after being sprayed, and the atomized etching liquid is generated to rinse the etched circuit board surface. Most of the impact force of the water flow is buffered by the atomizing mesh plate, thereby greatly reducing the situation where the copper sheet is affected by the impact force and falls off or is damaged.

[0019] 2. The elastic frame is squeezed out of the positioning groove by the side wall of the support frame, and the connecting frame is slidably inserted in the connecting groove to replace the atomizing screen plates with different apertures. At the same time, the mounting block at the top of the conveyor belt is inserted into the mounting groove at the top of the support frame. The elastic plates in the telescopic grooves at both ends of the mounting block push the fastening blocks to be inserted into the fastening grooves, so that the support frame is kept fixed at the top of the conveyor belt. After the fastening blocks are squeezed out of the fastening grooves from the side walls of the support frame, the support frame is slid and disassembled from the top of the conveyor belt, so as to replace the support frame with circuit board accommodating grooves of different sizes, which is suitable for etching processing of circuit boards of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a schematic diagram of the structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the split structure of the support frame of the utility model;

[0023] Figure 3 For the utility model Figure 2 A schematic diagram of the structure enlargement in the middle;

[0024] Figure 4 It is a schematic diagram of the cross-sectional structure of the support frame of the utility model.

[0025] The markings in the attached drawings are: 1. mounting frame; 2. support leg; 3. spray disc; 4. water inlet pipe; 5. motor; 6. conveyor belt; 7. baffle; 8. etching box; 9. support frame; 10. positioning slot; 11. circuit board accommodating slot; 12. connecting slot; 13. connecting plate; 14. atomizing mesh plate; 15. elastic frame; 16. connecting block; 17. fastening slot; 18. mounting block; 19. telescopic slot; 20. fastening block; 21. elastic plate; 22. mounting slot. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] This specific embodiment is an etching device for circuit board production, and its structural schematic diagram is as follows Figure 1 As shown, the etching device for circuit board production includes a mounting frame 1 and a conveyor belt 6 arranged on the mounting frame 1, an etching box 8 is sleeved on the mounting frame 1, mounting blocks 18 are fixed to the outer wall of the conveyor belt 6 at equal intervals, and the conveyor belt 6 is detachably fixed to a support frame 9 through the mounting blocks 18, a circuit board accommodating groove 11 is opened at the top of the support frame 9, and connecting grooves 12 are symmetrically opened on the side walls of the support frame 9, and a connecting plate 13 is fixed through the connecting groove 12, wherein a positioning groove 10 connected to the connecting groove 12 is opened on the outer wall of the support frame 9, an atomizing mesh plate 14 is fixed on the connecting plate 13, and a connecting block 16 that is inserted into the connecting groove 12 is fixed on the side wall of the connecting plate 13, and the connecting block 11 is fixed to the side wall of the connecting plate 13. 6 is fixed with an elastic frame 15 engaged with the positioning groove 10, the connecting blocks 16 on the two connecting plates 13 are matched and inserted in the connecting groove 12, and the elastic frame 15 squeezes the side wall of the connecting block 16 to deform until the connecting block 16 is completely inserted into the connecting groove 12, and the side wall of the elastic frame 15 is engaged with the positioning groove 10, so that the connecting plate 13 and the atomizing mesh plate 14 are kept fixed on the side wall of the support frame 9, and the etching liquid of the spray disc 3 contacts the surface of the atomizing mesh plate 14 after being sprayed, and generates atomized etching liquid to rinse the etched circuit board surface, and most of the impact force of the water flow is buffered by the atomizing mesh plate 14, thereby greatly reducing the situation where the copper sheet is affected by the impact force and falls off or is damaged.

[0028] like Figure 1 and Figure 2As shown, legs 2 are fixed on both sides of the bottom end surface of the mounting frame 1, and a motor 5 for driving a conveyor belt 6 is installed on the side wall of the mounting frame 1, a water inlet pipe 4 with a U-shaped structure is fixed to the side wall of the etching box 8, a spray disc 3 extending into the etching box 8 is installed on the top of the water inlet pipe 4, the spray disc 3 corresponds to the atomizing screen 14, and baffles 7 are embedded and fixed at both ends of the etching box 8, the baffle 7 blocks the atomized water, thereby greatly reducing the situation of atomized water floating out, the etching liquid of the spray disc 3 contacts the surface of the atomizing screen 14 after being sprayed, and generates atomized etching liquid to rinse the etched circuit board surface, and most of the impact force of the water flow is buffered by the atomizing screen 14, thereby greatly reducing the situation of the copper sheet being affected by the impact force and falling off or damaged.

[0029] like Figure 3 and Figure 4 As shown, the bottom end of the support frame 9 is provided with a mounting groove 22, and the mounting block 18 is inserted into the mounting groove 22. Both ends of the support frame 9 are provided with fastening grooves 17 connected to the mounting groove 22. Both ends of the mounting block 18 are provided with telescopic grooves 19. An elastic plate 21 is embedded and fixed in the telescopic groove 19, and a fastening block 20 is elastically installed through the elastic plate 21. One end of the fastening block 20 extending out of the telescopic groove 19 is inserted into the fastening groove 17, and the elastic frame 15 is squeezed from the side wall of the support frame 9 to move out of the positioning groove 10. , and the connecting frame is slidably inserted from the connecting groove 12, thereby replacing the atomizing screen plates 14 with different apertures. At the same time, the mounting block 18 at the top of the conveyor belt 6 is fitted and inserted into the mounting groove 22 at the top of the support frame 9, and the elastic plates 21 in the telescopic grooves 19 at both ends of the mounting block 18 push the fastening block 20 to fit and insert into the fastening groove 17, so that the support frame 9 is kept fixed at the top of the conveyor belt 6. After the fastening block 20 is squeezed from the side wall of the support frame 9 and removed from the fastening groove 17, the support frame 9 is slid and disassembled from the top of the conveyor belt 6.

[0030] The schematic diagram of the split structure of the support frame 9 of the etching device for circuit board production is as follows Figure 2 As shown, its Figure 2 The enlarged schematic diagram of the structure at A is as follows Figure 3 As shown, the cross-sectional structure diagram of the support frame 9 is as follows Figure 4 shown.

[0031] Working principle: When in use, the connection blocks 16 on the two connection plates 13 are matched and inserted into the connection grooves 12, and the elastic frame 15 on the side wall of the connection block 16 is squeezed to deform until the connection block 16 is completely inserted into the connection groove 12, and the side wall of the elastic frame 15 is engaged with the positioning groove 10, so that the connection plate 13 and the atomizing screen 14 are fixed on the side wall of the support frame 9. After being sprayed, the etching liquid of the spray disc 3 contacts the surface of the atomizing screen 14, and generates atomized etching liquid to rinse the etched circuit board surface. Most of the impact force of the water flow is buffered by the atomizing screen 14. The motor 5 is started to drive the conveyor belt 6 to rotate, so that the circuit boards at different positions on the conveyor belt 6 are etched. When etching circuit boards of different sizes, When the conveyor belt 6 is moved, the elastic frame 15 is squeezed out of the positioning groove 10 from the side wall of the support frame 9, and the connecting frame is slidably inserted into the connecting groove 12, thereby replacing the atomizing screen 14 with different apertures. At the same time, the mounting block 18 at the top of the conveyor belt 6 is fitted and inserted into the mounting groove 22 at the top of the support frame 9, and the elastic plates 21 in the telescopic grooves 19 at both ends of the mounting block 18 push the fastening block 20 to fit and insert in the fastening groove 17, so that the support frame 9 is kept fixed at the top of the conveyor belt 6. After the fastening block 20 is squeezed out of the fastening groove 17 from the side wall of the support frame 9, the support frame 9 is slid and disassembled from the top of the conveyor belt 6, thereby replacing the support frame 9 with the circuit board accommodating groove 11 of different sizes, which is suitable for etching processing of circuit boards of different sizes.

[0032] All technical features in this embodiment can be freely combined according to actual needs.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. An etching device for circuit board production, the etching device for circuit board production comprising a mounting frame (1) and a conveyor belt (6) arranged on the mounting frame (1), It is characterized in that The mounting frame (1) is sleeved with an etching box (8), the outer wall of the conveyor belt (6) is equidistantly fixed with mounting blocks (18), and the conveyor belt (6) is detachably fixed with a support frame (9) through the mounting blocks (18), the top of the support frame (9) is provided with a circuit board accommodating groove (11), and the side wall of the support frame (9) is symmetrically provided with connecting grooves (12), and a connecting plate (13) is fixed through the connecting groove (12), wherein the outer wall of the support frame (9) is provided with a positioning groove (10) connected to the connecting groove (12), an atomizing mesh plate (14) is fixed to the connecting plate (13), and the side wall of the connecting plate (13) is fixed with a connecting block (16) that fits in the connecting groove (12), and an elastic frame (15) that is clamped with the positioning groove (10) is fixed to the connecting block (16).

2. An etching device for circuit board production according to claim 1, It is characterized in that Support legs (2) are fixed on both sides of the bottom end surface of the mounting frame (1), and a motor (5) for driving a conveyor belt (6) is installed on the side wall of the mounting frame (1).

3. An etching device for circuit board production according to claim 2, It is characterized in that A water inlet pipe (4) with a U-shaped structure is fixed to the side wall of the etching box (8), and a spray plate (3) extending into the etching box (8) is installed at the top end of the water inlet pipe (4).

4. An etching device for circuit board production according to claim 3, It is characterized in that The spray disc (3) corresponds to the atomizing screen plate (14), and baffles (7) are embedded and fixed at both ends of the etching box (8).

5. An etching device for circuit board production according to claim 1, It is characterized in that The bottom end of the support frame (9) is provided with a mounting groove (22), and the mounting block (18) is inserted into the mounting groove (22).

6. An etching device for circuit board production according to claim 5, It is characterized in that Both ends of the support frame (9) are provided with fastening grooves (17) that are in communication with the mounting groove (22), and both ends of the mounting block (18) are provided with telescopic grooves (19).

7. An etching device for circuit board production according to claim 6, It is characterized in that An elastic plate (21) is embedded and fixed in the telescopic groove (19), and a fastening block (20) is elastically mounted via the elastic plate (21); one end of the fastening block (20) extending out of the telescopic groove (19) is inserted into the fastening groove (17).

Citation Information

Patent Citations

  • Etching device for printed circuit board production

    CN216217814U