Missile-borne high-power-density power supply device

Abstract

The utility model provides a missile-borne high-power-density power supply device. The missile-borne high-power-density power supply device comprises a cover plate, a lower first cold plate, an upper first cold plate, a lower second cold plate and an upper second cold plate which are connected in sequence, heating modules are arranged between the lower first cold plate and the upper first cold plate and between the lower second cold plate and the upper second cold plate; a heat storage module is arranged between the lower first cold plate and the upper first cold plate; the bottom surface of the upper first cold plate is provided with a snakelike flow channel, a phase change material filling cavity and a heat conduction supporting column, and the bottom surface of the upper second cold plate is provided with an upper second cold plate snakelike flow channel; the upper side of the upper first cold plate is provided with a liquid cooling water inlet and a phase change material filling port, the lower side is provided with a liquid cooling water outlet, and the left side is provided with an upper first cold plate water outlet. By means of the double-layer water cooling system, the phase change heat absorption system and the special shell structure, stable and reliable operation of equipment in the working state is achieved.

Description

Technical Field

[0001] The utility model relates to a missile-borne high-power density power supply device, belonging to the technical field of electronic equipment. Background Art

[0002] At present, with the continuous changes in the international environment, the replacement of weapons and equipment is also an important part of the mission. Among them, power supply equipment is widely used in missile-borne devices, and has high requirements for the power supply's anti-interference performance, anti-vibration performance, lightweight design and heat dissipation performance. And with the rapid development of electronic equipment, various electronic devices have developed in the direction of lightweight, miniaturization and integration. The heat flux density of electronic devices is getting higher and higher, especially the power modules with high heat flux density. When working in a small space, it will produce a large loss. The loss is usually dissipated in the form of heat. If the power module cannot be cooled in time, it will affect the operation effect of the entire equipment, seriously reducing the performance of the missile-borne equipment and the reliability of the system. According to statistics, 55% of the failure rate of electronic equipment is caused by the temperature exceeding the maximum allowable temperature of the shell specified by the electronic equipment.

[0003] Therefore, the missile-borne power module is an important working component on the missile, providing electrical energy for each module in the missile-borne equipment. When the missile-borne equipment is running at high speed, the power module will be subject to mechanical interference such as impact and vibration, which will affect the working performance of the power supply. In addition, the internal functions of the missile-borne equipment are complex, and different functional modules have different working modes, which will also generate different electromagnetic interference sources. In a complex working environment, the power supply needs to have strong anti-interference capabilities. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a power supply device for missile-borne high-power density. The power supply device for missile-borne high-power density reasonably designs the structure of the power supply device so that it can be lightweight while having anti-interference performance, anti-vibration performance and high heat dissipation capability, thereby realizing stable operation of the equipment.

[0005] The utility model is realized through the following technical solutions.

[0006] The utility model provides a missile-borne high-power density power supply device, comprising a cover plate, a lower first cold plate, an upper first cold plate, a lower second cold plate, and an upper second cold plate connected in sequence; a heating module is arranged between the lower first cold plate, the upper first cold plate, and between the lower second cold plate and the upper second cold plate, and a heat storage module is arranged between the lower first cold plate and the upper first cold plate; a serpentine flow channel, a phase change material filling cavity and a heat-conducting support column are arranged on the bottom surface of the upper first cold plate, and an upper second cold plate serpentine flow channel is arranged on the bottom surface of the upper second cold plate; a liquid cooling water inlet and a phase change material filling port are arranged on the upper side of the upper first cold plate, a liquid cooling water outlet is arranged on the lower side, and an upper first cold plate water outlet is arranged on the left side; an upper first cold plate water inlet is arranged on one side of the top surface of the upper first cold plate, and an upper first cold plate water outlet is arranged on the other side; a lower second cold plate water outlet is arranged on one side of the bottom surface of the lower second cold plate, and a lower second cold plate liquid cooling flow channel starting point is arranged on the other side.

[0007] The heating modules are multiple power modules.

[0008] The end surface of the lower first cold plate and the top surface of the upper first cold plate are both provided with a plurality of square grooves and threaded holes, the square grooves are all of a closed structure, and are filled with thermal conductive adhesive.

[0009] The heating module is installed in the square groove by screws.

[0010] The cover plate, the lower first cold plate, the upper first cold plate, the lower second cold plate and the upper second cold plate are all made of aluminum alloy.

[0011] The cover plate, the lower first cold plate, the upper first cold plate, the lower second cold plate, and the upper second cold plate are connected by screws.

[0012] The heat storage module is a phase change material and is filled between the lower first cold plate and the upper first cold plate.

[0013] The lower first cold plate and the upper first cold plate, the lower second cold plate and the upper second cold plate are all upper and lower plate separated structures.

[0014] The beneficial effect of the utility model is that the equipment can be stably and reliably operated in a working state through a double-layer water cooling system, a phase change heat absorption system, and a special shell structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is a schematic diagram of the internal structure of the utility model;

[0017] Figure 3 yes Figure 1 Schematic diagram of the end structure of the first middle and lower cold plate;

[0018] Figure 4 yes Figure 1 A schematic diagram of the bottom structure of the first cold plate in the middle upper part;

[0019] Figure 5 yes Figure 1 Schematic diagram of the top surface structure of the first cold plate in the middle upper part;

[0020] Figure 6 yes Figure 1 Schematic diagram of the bottom structure of the second cold plate in the middle and lower part;

[0021] Figure 7 yes Figure 1 Schematic diagram of the bottom structure of the second cold plate in the middle upper part;

[0022] In the figure: 1-cover plate, 2-lower first cold plate, 3-upper first cold plate, 4-lower second cold plate, 5-upper second cold plate, 6-thermal conductive glue, 7-power module, 8-square groove, 9-threaded hole, 10-liquid cooling water inlet, 11-phase change material filling port, 12-upper first cold plate water inlet, 13-serpentine flow channel, 14-phase change material filling cavity, 15-upper first cold plate water outlet, 16-liquid cooling water outlet, 17-thermal conductive support column, 18-lower second cold plate water outlet, 19-lower second cold plate water inlet; 20-starting point of liquid cooling flow channel of upper second cold plate, 21-serpentine flow channel of upper second cold plate, 22-end point of liquid cooling flow channel of upper second cold plate. DETAILED DESCRIPTION

[0023] The technical solution of the utility model is further described below, but the scope of protection required is not limited to the description.

[0024] Example 1

[0025] like Figures 1 to 7 As shown, a power supply device for missile-borne high power density includes a cover plate 1, a lower first cold plate 2, an upper first cold plate 3, a lower second cold plate 4, and an upper second cold plate 5 connected in sequence; a heating module is arranged between the lower first cold plate 2 and the upper first cold plate 3 and between the lower second cold plate 4 and the upper second cold plate 5, and a heat storage module is arranged between the lower first cold plate 2 and the upper first cold plate 3; a serpentine flow channel 13, a phase change material filling cavity 14 and a heat conductive support column 17 are arranged on the bottom surface of the upper first cold plate 3, and a heat storage module is arranged between the lower first cold plate 2 and the upper first cold plate 3. An upper second cold plate serpentine flow channel 21 is provided on the bottom surface of the cold plate 5; a liquid cooling water inlet 10 and a phase change material filling port 11 are provided on the upper side of the upper first cold plate 3, a liquid cooling water outlet 16 is provided on the lower side, and an upper first cold plate water outlet 15 is provided on the left side; an upper first cold plate water inlet 12 is provided on one side of the top surface of the upper first cold plate 3, and an upper first cold plate water outlet 15 is provided on the other side; a lower second cold plate water outlet 18 is provided on one side of the bottom surface of the lower second cold plate 4, and a lower second cold plate liquid cooling flow channel starting point 19 is provided on the other side.

[0026] The heating modules are multiple power modules 7 .

[0027] The end surface of the lower first cold plate 2 and the top surface of the upper first cold plate 3 are both provided with a plurality of square grooves 8 and threaded holes 9. The square grooves 8 all adopt a closed structure to minimize electromagnetic interference between different power modules 7 and the external environment. The square grooves 8 are filled with thermal conductive adhesive 6 to make the heating module in close contact with the shell, and heat is evenly transferred to the shell through 5 contact surfaces, thereby improving the thermal conductivity and heat dissipation efficiency and avoiding the phenomenon of abnormal operation of the power supply device caused by local accumulation of heat.

[0028] The heating module is installed in the square groove 8 by screws to improve the vibration resistance of the power supply device.

[0029] The cover plate 1, the lower first cold plate 2, the upper first cold plate 3, the lower second cold plate 4, and the upper second cold plate 5 are all made of aluminum alloy, which makes the overall weight lighter, helps the heating module to conduct heat and dissipate heat, and also has the function of electromagnetic shielding, which can provide a good working environment for the heating module.

[0030] The cover plate 1, the lower first cold plate 2, the upper first cold plate 3, the lower second cold plate 4, and the upper second cold plate 5 are connected by screws.

[0031] The heat storage module is a phase change material, which is filled between the lower first cold plate 2 and the upper first cold plate 3 and combined with liquid cooling to improve the control capability of the temperature rise of the power module 7 .

[0032] The lower first cold plate 2 and the upper first cold plate 3 are a separate structure of upper and lower plates. The liquid cooling channel and the phase change material filling cavity are machined between the upper and lower plates, and finally the upper and lower plates are sealed by welding. The processing difficulty is small and the cost is low. In the cavity structure, the liquid cooling channel and the phase change material are in direct contact. At the same time, heat-conducting support columns 17 are distributed at different positions of the phase change material filling cavity, which helps to fully contact the shell structure with the phase change material, improve the heat transfer and heat dissipation efficiency of the power module 7, limit the temperature rise, absorb and store the excess heat in the phase change material, and the heat-conducting support column 17 strengthens the structural strength of the square groove 8 for placing the power module 7 to avoid damage to the product.

[0033] The lower second cold plate 4 and the upper second cold plate 5 are upper and lower plate separated structures, and a liquid cooling channel is machined between the upper and lower plates, and finally the upper and lower plates are sealed by welding.

[0034] Specifically, the liquid-cooling channels of the upper first cold plate 3 and the lower second cold plate 4 are connected through through holes to form a double-layer liquid-cooling channel, which can effectively dissipate heat for the heating modules in different square grooves 8, and help the modules to work stably. The welding method of the double-layer water-cooling channel is simple and low-cost. The design enhances the heat dissipation performance of the power supply device, reduces the complexity of the structure, and reduces the weight of the structure.

[0035] Example 2

[0036] like Figure 1 and 2 As shown, the structure of the utility model is compact and the power modules 7 are evenly distributed.

[0037] like Figure 3 As shown, the end surface of the lower first cold plate 2 is provided with a plurality of square grooves 8, and threaded holes 9 for fixing different power modules 7 are provided in the square grooves 8, which play a role in improving the vibration resistance. The square grooves 8 separate and place the power modules 7, reducing mutual interference between the power modules 7.

[0038] like Figure 4 As shown, the upper first cold plate 3 is provided with a liquid cooling water inlet 10, a phase change material filling port 11, a liquid cooling water outlet 16, a serpentine flow channel 13, a heat conductive support column 17, a phase change material filling cavity 14, an upper first cold plate water outlet 115, and an upper first cold plate water inlet 12; the bottom surface of the upper first cold plate 3 is sealed with the lower first cold plate 2 by welding, and the structure is simple and the manufacturing cost is low.

[0039] Furthermore, after welding and sealing, liquid phase change fluid is added into the phase change material filling cavity 14 through the phase change material filling port 11, and heat conductive support columns 17 are distributed in the cavity, which can not only improve the thermal conductivity of the power module 7, but also improve the mechanical properties of the square groove 8.

[0040] like Figure 5 As shown, a total of 8 square grooves 8 are designed on the top surface of the upper first cold plate 3 and are evenly distributed on the top surface of the upper first cold plate 3 , so the vibration resistance is good.

[0041] like Figure 6 As shown, the lower second cooling plate 4 is provided with 8 square grooves 8, and all are fixed by screw connection. The lower second cooling plate 4 and the upper second cooling plate 5 (as shown in FIG. Figure 7 As shown in the figure, the upper second cold plate serpentine flow channel 21 is sealed by welding, and the lower second cold plate water inlet 19 and the lower second cold plate water outlet 18 are designed, both of which are through-hole designs, and the upper ends are directly connected to the upper first cold plate water outlet 15 and the upper first cold plate water inlet 12, respectively, and the lower ends are connected to the upper first cold plate water outlet 15 and the upper first cold plate water inlet 12, respectively. Figure 7The starting point 20 of the upper second cold plate liquid cooling channel and the end point 22 of the upper second cold plate liquid cooling channel are directly connected to form a conducting cavity. The travel path of the liquid cooling channel fluid is: liquid cooling water inlet 10 - serpentine channel 13 on the left side of the upper first cold plate 3 - upper first cold plate water outlet 15 - lower second cold plate water inlet 19 - starting point 20 of the upper second cold plate liquid cooling channel - upper second cold plate serpentine channel 21 - end point 22 of the upper second cold plate liquid cooling channel - lower second cold plate water outlet 18 - upper first cold plate water inlet 12 - upper first cold plate serpentine channel 13 on the right side of the upper first cold plate 3 - liquid cooling water outlet 16, thereby forming a double-layer channel structure to maximize the heat dissipation effect of the power supply device.

[0042] like Figure 5 and 6 As shown, thermal conductive adhesive 6 is poured into the square grooves 8 of the upper first cold plate 3 and the lower second cold plate 4, which helps to evenly dissipate heat for the power module 7. After solidification, the thermal conductive adhesive 6 has high bonding strength and is elastic, with good resistance to vibration and impact. The cavity structure has good sealing performance, which effectively isolates electromagnetic interference between different power modules 7.

[0043] Example 3

[0044] The utility model is made of aluminum alloy, and has a total of 22 power modules 7. After the 280V±40V DC is converted, it outputs +28V, +5V, -28V and -5V DC. The maximum output power is 20KW, and the power loss is 1.1KW. The loss is dissipated through heat energy. When the power supply device is working, the liquid cooling system is first connected. The power module 7 conducts heat uniformly to the surrounding of the cold plate through the heat conductive glue 6. Part of the heat is directly dissipated through the shell, and the other part of the heat is dissipated through the water cooling channel, that is: the liquid cooling water inlet 10-the first The heat is dissipated by the following method: serpentine flow channel 13 on the left side of the cold plate 3 - water outlet 15 of the upper first cold plate - water inlet 19 of the lower second cold plate - starting point 20 of the liquid cooling flow channel of the upper second cold plate - serpentine flow channel 21 of the upper second cold plate - end point 22 of the liquid cooling flow channel of the upper second cold plate - water outlet 18 of the lower second cold plate - water inlet 12 of the upper first cold plate - serpentine flow channel 13 on the right side of the upper first cold plate 3 - liquid cooling water outlet 16. At the same time, the phase change materials in the lower first cold plate 2 and the upper first cold plate 3 absorb and store the excess heat, thereby reducing the heating level of the power module 7.

[0045] Furthermore, the working environment of the power supply device is complex, and large vibrations and electromagnetic interference will occur. By threading the power module 7 and utilizing the high adhesion of the thermal conductive adhesive 6 after solidification, the elastomer has good vibration and impact resistance. Therefore, the power module 7 has good vibration resistance, and the cavity structure of the power module 7 has good sealing, which can effectively avoid internal and external electromagnetic interference.

[0046] To sum up, the utility model has a compact structure, a large heat flux density, and the shell material is made of aluminum alloy structure, which has good heat dissipation performance, high structural stability, and strong anti-interference ability, and can realize stable and reliable operation of the equipment under working conditions; it has a unique power module cavity structure, which enhances the anti-interference performance of the power supply device, and at the same time, the module and the shell are connected by screws, and its vibration resistance is strong; each cavity structure is filled with thermal conductive glue, so that the heat generated by the power module is transferred to the power cold plate through the 5 contact surfaces of the cavity for heat dissipation. At the same time, the cold plate interval provides a strong guarantee for improving the heat dissipation efficiency of the power supply device through the double-layer serpentine liquid cooling channel and the coupling effect of phase change materials.

Claims

1. A missile-borne high power density power supply device, comprising a cover plate (1), a lower first cold plate (2), an upper first cold plate (3), a lower second cold plate (4), and an upper second cold plate (5) connected in sequence, characterized in that: A heating module is provided between the lower first cold plate (2) and the upper first cold plate (3) and between the lower second cold plate (4) and the upper second cold plate (5); a heat storage module is provided between the lower first cold plate (2) and the upper first cold plate (3); a serpentine flow channel (13), a phase change material filling cavity (14) and a heat conductive support column (17) are provided on the bottom surface of the upper first cold plate (3); an upper second cold plate serpentine flow channel (21) is provided on the bottom surface of the upper second cold plate (5); the upper first cold plate (3 ) is provided with a liquid cooling water inlet (10) and a phase change material filling port (11) on the upper side, a liquid cooling water outlet (16) on the lower side, and an upper first cold plate water outlet (15) on the left side; an upper first cold plate water inlet (12) is provided on one side of the top surface of the upper first cold plate (3), and an upper first cold plate water outlet (15) is provided on the other side; a lower second cold plate water outlet (18) is provided on one side of the bottom surface of the lower second cold plate (4), and a lower second cold plate liquid cooling flow channel starting point (19) is provided on the other side.

2. The missile-borne high power density power supply device according to claim 1, characterized in that: The heating modules are a plurality of power modules (7).

3. The missile-borne high power density power supply device according to claim 1, characterized in that: The end surface of the lower first cold plate (2) and the top surface of the upper first cold plate (3) are both provided with a plurality of square grooves (8) and threaded holes (9); the square grooves (8) are all of a closed structure, and the square grooves (8) are filled with thermal conductive adhesive (6).

4. The missile-borne high power density power supply device according to claim 3, characterized in that: The heating module is installed in the square groove (8) by means of screws.

5. The missile-borne high power density power supply device according to claim 1, characterized in that: The cover plate (1), the lower first cold plate (2), the upper first cold plate (3), the lower second cold plate (4) and the upper second cold plate (5) are all made of aluminum alloy.

6. The missile-borne high power density power supply device according to claim 1, characterized in that: The cover plate (1), the lower first cold plate (2), the upper first cold plate (3), the lower second cold plate (4), and the upper second cold plate (5) are connected by screws.

7. The missile-borne high power density power supply device according to claim 1, characterized in that: The heat storage module is a phase change material and is filled between the lower first cold plate (2) and the upper first cold plate (3).

8. The missile-borne high power density power supply device according to claim 1, characterized in that: The lower first cold plate (2) and the upper first cold plate (3), the lower second cold plate (4) and the upper second cold plate (5) are all upper and lower plate separated structures.

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